Abstract: Systems and methods for isolating a membrane during fabrication. The membrane is connected to a substrate wafer using a plurality of magnets of uniform dimensions formed into two or more magnet stack beams. The magnet stack beams provide a gap between the wafer and the membrane. The wafer connected to the membrane by the magnet stack beams is received by a substrate holder so that a space is present between the membrane and the substrate holder. The membrane is rinsed by immersing, soaking, and withdrawing the substrate holder and the wafer connected to the membrane by the magnet stack beams using a rinse bath solution.

Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.

Abstract: A method for cleaning a cross-flow filter (20), comprising the steps of: A) providing a cross-flow filter (20), wherein the cross-flow filter (20) comprises a filter membrane (21) and is configured to remove a liquid permeate stream and the filter membrane (21) comprises a first side facing the permeate stream and a second side opposite the first side, the second side facing the feed stream, and wherein at least some of the deposits (1010) to be removed are located on the second side of the filter membrane (21); B) applying a back-flushing liquid stream through the filter membrane (21). Prior to applying the back-flushing liquid stream in Step B), permeate located on the first side of the filter membrane (21) is at least partially displaced from the first side of the filter membrane (21) by a gas, wherein the gas that is in contact with the back-flushing liquid stream has a pressure of >1 bar at least during Step B).

Abstract: A polishing composition of the present invention is to be used for polishing an object including a portion containing a high-mobility material and a portion containing a silicon material. The polishing composition comprises an oxidizing agent and abrasive grains having an average primary particle diameter of 40 nm or less. The polishing composition preferably further contains a hydrolysis-suppressing compound that bonds to a surface OH group of the portion containing a silicon material of the object to function to suppress hydrolysis of the portion containing a silicon material. Alternatively, a polishing composition of the present invention contains abrasive grains, an oxidizing agent, and a hydrolysis-suppressing compound. The polishing composition preferably has a neutral pH.

Abstract: An optical device includes a structured light generation unit and a beam splitter assembly. The structured light generation unit generates a structured light. The beam splitter assembly is arranged in a travelling path of the structured light. The beam splitter assembly includes a semi-transmissive semi-reflective structure. A portion of the structured light is transmitted through the semi-transmissive semi-reflective structure of the beam splitter assembly and projected on a projection surface. Consequently, a first structured light pattern is formed on the projection surface. Another portion of the structured light is reflected by the semi-transmissive semi-reflective structure of the beam splitter assembly and projected on the projection surface along a different path. Consequently, a second structured light pattern different from the first structured light pattern is formed on the projection surface. The number of structured light patterns or the projected area is correspondingly adjusted.

Abstract: A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.

Abstract: Systems and methods for finish portions of parts for gas turbine engines are provided. More specifically, systems and methods for finishing flow elements (e.g., stator vanes and turbine blades) or gas turbine engines are provided. The systems and methods may employ grit blasting, fluidic machining, and/or super polishing. Moreover, the flow elements may be inspected and/or evaluated between the one or more processing steps.

Abstract: The polishing composition has a pH of 7 or more and is used in applications for polishing a silicon substrate. The polishing composition contains abrasive grains and a water-soluble polymer. The water-soluble polymer is a copolymer including a first monomer unit having a characteristic value P of 50-100 inclusive, and a second monomer unit having a characteristic value P of at least ?100 and less than 50. The characteristic value P is the result of subtracting an adsorption coefficient S2 of the abrasive grains obtained through a specific standard test B from a wettability coefficient S1 of the silicon substrate obtained through a specific standard test A.

Abstract: According to one embodiment, a memory device includes a first electrode, a first resistance change layer, a first insulating section, a second electrode and an intermediate layer. The first resistance change layer is provided on the first electrode. The first insulating section is provided on the first resistance change layer. The second electrode is provided on the first resistance change layer. The second electrode is in contact with the first resistance change layer. The intermediate layer is provided between the second electrode and the first insulating section. The intermediate layer is in contact with the second electrode and the first insulating section.

Abstract: The present invention provides a slurry for chemical mechanical polishing comprising water-soluble clathrate compound (a), polymer compound (b) having an acidic group optionally in a salt form as a side chain, polishing abrasive grain (c) and water (d), wherein the content of the water-soluble clathrate compound (a) is 0.001 mass %-3 mass % of the total amount of the slurry, the polymer compound (b) has a weight average molecular weight of not less than 1,000 and less than 1,000,000, and the content of the polymer compound (b) is 0.12 mass %-3 mass % of the total amount of the slurry, and a polishing method for substrate using the slurry.

Abstract: [Problem] Provided is a polishing composition which is suitable for polishing a polishing object having a metal wiring layer and capable of diminishing the step defect while maintaining a high polishing rate. [Solution] Provided is a polishing composition used in polishing a polishing object having a metal wiring layer, which contains a metal corrosion inhibitor, a complexing agent, a surfactant, and water and in which the solid surface energy of the polishing object surface after polishing the polishing object using the polishing composition is 30 mN/m or less, and the surfactant is preferably an anionic surfactant.

Abstract: Disclosed herein is a device comprising a pair of bellows pumps configured for efficient mixing at a microfluidic scale. By moving a fluid sample and particles in suspension through an aperture between the paired bellows pump mixing chambers, molecular collisions leading to binding between the particles and ligands in the sample are enhanced. Such devices provide an alternative for mixing that does not use a vent and can be used with a variety of particles in suspension such as magnetic beads to capture or purify useful cells and molecules.

Abstract: The present invention provides a slurry for chemical mechanical polishing, containing abrasive grain (a), compound (b) having an amino group having a pKa of more than 9, and not less than 3 hydroxyl groups, and water.

Abstract: A chemical-mechanical polishing composition includes colloidal silica abrasive particles dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive particles include an aminosilane compound or a phosphonium silane compound incorporated therein. The composition may be used to polish a substrate including a silicon oxygen material such as TEOS.

Abstract: A chemical-mechanical polishing concentrate includes at least 10 weight percent of a colloidal silica abrasive particle dispersed in a liquid carrier having a pH in a range from about 1.5 to about 7. The colloidal silica abrasive includes an aminosilane compound or a phosphonium silane compound incorporated therein. The concentrate may be diluted with at least 3 parts water per one part concentrate prior to use.

Abstract: Slurry compositions and chemically activated CMP methods for polishing a substrate having a silicon carbide surface using such slurries. In such methods, the silicon carbide surface is contacted with a CMP slurry composition that comprises i) a liquid carrier and ii) a plurality of particles having at least a soft surface portion, wherein the soft surface portion includes a transition metal compound that provides a Mohs hardness <6, and optionally iii) an oxidizing agent. The oxidizing agent can include a transition metal. The slurry is moved relative to the silicon carbide comprising surface, wherein at least a portion of the silicon carbide surface is removed.

Abstract: An apparatus for manufacturing a polishing pad includes a housing including a body, an interconnection portion, and a discharging portion, and a stirrer located in the housing, the stirrer mixing a polishing pad composition and a pore forming material with each other. A diameter of the discharging portion is in a range of about 9 mm to about 16 mm.

Abstract: A method includes forming a first gate above a semiconductor substrate, forming a hard mask on the first gate, and forming a contact etch stop layer (CESL) on the hard mask. No hard mask is removed between the step of forming the hard mask and the step of forming the CESL. The method further includes forming an interlayer dielectric (ILD) layer over the CESL, and performing one or more CMP processes to planarize the ILD layer, remove the CESL on the hard mask, and remove at least one portion of the hard mask.

Abstract: Polishing pads with alignment marks are described. Methods of fabricating polishing pads with alignment marks are also described.

Abstract: Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.

Abstract: Both sides of a large diameter semiconductor wafer are polished by the following ordered steps: a) polishing the wafer backside on a polishing pad containing a fixed abrasive, a polishing agent solution free of solids being introduced between the wafer backside and the polishing pad; b) stock polishing the wafer frontside on a polishing pad which contains a fixed abrasive, a polishing agent solution free of solids being introduced between the wafer frontside of and the polishing pad; c) removing microroughness and microdamage from the wafer frontside by polishing the frontside on a polishing pad, a polishing agent solution containing abrasives being introduced between the wafer frontside and the polishing pad; and d) final polishing of the wafer frontside by polishing the frontside on a polishing pad containing no fixed abrasive, a polishing agent solution containing abrasives being introduced between the wafer frontside and the polishing pad during the polishing step.

Abstract: Cutting fluids for brittle materials, e.g., silicon ingot, comprise, in weight percent: A. 70-99% polyalkylene glycol (PAG), e.g., polyethylene glycol; B. 0.01-10% PAG-grafted polycarboxylate; and C. 0-30% water. These cutting fluids are used with abrasive materials, e.g., silicon carbide (SiC), to form cutting slurries. The slurry is sprayed on the cutting tool, e.g., a wire saw, to cut a brittle work piece, e.g., a silicon ingot.

Abstract: An object of the invention is to provide a polishing pad that achieves a high polishing rate and has high thickness precision so that the break-in time (dummy polishing time) can be shortened, and to provide a method for producing same. The invention is directed to a polishing pad including a base material layer and a polishing layer provided on the base material layer, wherein the polishing layer includes a thermoset polyurethane foam having roughly spherical interconnected cells with an average cell diameter of 35 to 200 ?m, and the polishing layer has a storage modulus E? (40° C.) of 130 to 400 MPa at 40° C., a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (60° C.) at 60° C. [E?(30° C.)/E?(60° C.)] of 1 to less than 2.5, and a ratio of storage modulus E? (30° C.) at 30° C. to storage modulus E? (90° C.) at 90° C. [E?(30° C.)/E?(90° C.)] of 15 to 130.

Abstract: A deburring device includes a barrel with a granulated polishing member filled therein. The barrel is configured by a case formed with an opening hole, and drop prevention member which is fixed to the case and prevents the polishing member from being dropped from the opening hole. A gap into which a tubular end section of a workpiece is inserted is formed between the opening hole of the case and the drop prevention member.

Abstract: A finishing apparatus and method for surface finishing workpieces. A tub is rotatable about vertical axis and operable to hold and rotate abrasive media completely submerged in water or other liquid. One or more manipulators, each supporting a spindle operable for supporting and rotating a workpiece about a spindle axis of the spindle with the workpiece at least partially submerged in the abrasive media and operable for holding spindle axis normal to and spaced apart from the vertical axis with the spindle horizontal in the tub during the surface finishing process while the tub is rotating. Manipulators are independently operable to present one of the workpieces for loading and unloading on and off spindle while tub is rotating and continuing to process the other workpieces submerged in the media and water. A rake includes a plate and means for lifting the plate up and down vertically through the abrasive media.

Abstract: Titanium-containing articles having improved surface finishes and methods for changing the surface of titanium containing articles, for example by removing overstock, are provided. One example method includes passing a fluid at high pressure across a surface of an titanium aluminide alloy-containing article, for example, a turbine blade, at high linear speed and deforming the surface of the titanium aluminide alloy-containing article, and removing material from the surface of the titanium aluminide alloy-containing article. Though aspects of the invention can be used in fabricating high performance turbine blades, the methods disclosed can be applied to the treatment of any titanium-containing article for which it is difficult to obtain an improved surface finish.

Abstract: A system for refurbishing at least one article attached to an assembly includes a refurbishing vessel that contains at least one wall and at least one open portion; means for providing an abrasive media to the vessel, wherein the abrasive media is caused to flow around the surfaces of the at least one article when the vessel is positioned on the at least one article; means for conformably sealing the at least one open portion against the flow of abrasive media, wherein a seal is created that conforms to the contours of the at least one article and prevents the abrasive media from escaping between the at least one article and the at least one wall; and means for removing the abrasive media from the vessel.

Abstract: A method and apparatus is presented. A structure having an interior channel is formed using additive manufacturing equipment. A viscous media containing abrasive particles is sent through the interior channel using abrasive flow machining equipment to form a desired surface roughness for the interior channel.

Abstract: Methods of treating the polymeric surfaces of a stent with a fluid including a solvent for the surface polymer are disclosed.

Abstract: A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing at least one trimming apparatus including a trimming disk, a plurality of trimming bodies and an outer toothing. The upper and lower working disks are rotated. The trimming apparatus is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. The working layers and the trimming body are brought into contact so as to release abrasive substances from the trimming bodies and so as to effect material removal from the working layers. The direction of the drives of the grinding apparatus is changed at least twice during trimming.

Abstract: A method of preparing an edge-strengthened article comprises polishing of an edge of an article having a first edge strength using magnetorheological finishing, wherein after the polishing the article has a second edge strength and the second edge strength is greater than the first edge strength.

Abstract: In order to avoid using anti-stick paints, based on polytetrafluoroethylene or the like, on parts of cheesemaking machines which are to be in contact with hot curds (pastafilata), their surfaces are sandblasted with preferably virgin white corundum powder having a granulometry of about 180 mesh. Surprisingly, surfaces so treated are non-stick for the purposes mentioned above.

Abstract: A polishing composition containing a silica, an acid, a surfactant, and water, wherein (a) the acid has solubility in water at 25° C. of 1 g or more per 100 g of an aqueous saturated solution; (b) the surfactant is a sulfonic acid represented by the formula (1) or (2), or a salt thereof; and (c) the polishing composition has a pH of a specified range; and a polishing process of a substrate using the polishing composition are provided. The polishing composition is suitably used, for example in polishing a substrate for disk recording media such as magnetic disks, optical disks and opto-magnetic disks.

Abstract: Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source of fluid and a second flow controller that has a second fluid input coupled to a second source of fluid. A controller is provided for generating an output signal to and thereby controlling discharges from the first and second flow controllers. A variable resistor is coupled between an output of the controller and an input of the second flow controller whereby the output signal of the controller and the resistance of the variable resistor may be selected to selectively control discharge of fluid from the first and second flow controllers.

Abstract: A die for extrusion molding includes a first face, a second face, a raw material supply section, a molding section, and a treated surface. The second face is provided opposite the first face. The molding section has a second through hole that extends from the second face toward the first face so as to communicate with a first through hole. The treated surface is provided on an inner wall surface of the second through hole to have a structure such that a material for the die is machined to form the material into a die shape and to provide a machining-affected layer on the inner wall surface of the second through hole in the molding section, an oxidized layer is provided by heating the machining-affected layer to oxidize the machining-affected layer so as to convert the machining-affected layer into the oxidized layer, and the oxidized layer is removed.

Abstract: In one embodiment, a system for extending cutting tool life includes a vise, a jig provided in the vise adapted to hold or support a magnetic cutting tool insert, a magnet holder positioned above the jig that can be rotated, a magnet held in proximity to the jig by the magnet holder, and a mixture including abrasive particles that extends between the magnet and the jig, the mixture being supported by a magnetic field generated by the magnet, wherein when the magnet holder rotates, the magnet and the mixture of magnetic and abrasive particles rotate to finish a surface of the tool insert.

Abstract: A workpiece having a multiple-phase working surface, and a lapping process for producing the surface, the process including: (a) providing a system including: (i) a workpiece having a multiple-phase working surface having a first continuous solid phase, and a second solid phase, intimately dispersed within the continuous phase in the multiple-phase working surface, the continuous phase having a hardness exceeding a hardness of the second phase by a Mohs Hardness of at least 0.

Abstract: A method useful for polishing a large number of miniature components such as multi-layer electronic components, within a high speed barrel polishing device, is disclosed. In various embodiments of the present invention, a vertical planetary ball mill or other barrel polishing device is modified to rotate polishing containers having a modified interior cavity structure. This interior cavity provides a smooth, gradually curved interior sidewall that improves circulation within the container during high-speed vertical polishing rotation. The improved circulation results in polishing for a larger number of components placed within the container and in less time than existing polishing container structures. In further embodiments, the containers are rotated around a generally tilted axis positioned at an angle between entirely vertical and horizontal positions. Rotation about a tilted axis further reduces collisions and increases relative polishing movement within the container.

Abstract: The disclosure relates to the cleaning of rods made of metal, particularly to the method of reclamation of used standard length rods, such as pump rods already used in the mechanical deep-pumping extraction of oil, as well as to the product made with the help of the mentioned method. The method of remanufacturing of standard length rods includes cleaning the rod with non-toxic particles which are able to undergo sublimation to eliminate environmental contamination and to assist in workplace safety.

Abstract: A method for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpiece includes providing the grinding apparatus including the upper and lower working disks and providing at least one carrier including an outer toothing. The upper and lower working disks are rotated. The carrier is moved between the rotating working disks using a rolling apparatus and the outer toothing on cycloidal paths relative to working layers of the working disks. Loose abrasives are added to a working gap formed between the working layers. A carrier, without workpieces inserted therein, is moved in the working gap so as to effect material removal from the working layers.

Abstract: The disclosure relates to the cleaning of rods made of metal, particularly to the method of reclamation of used standard length rods, such as pump rods already used in the mechanical deep-pumping extraction of oil, as well as to the product made with the help of the mentioned method. The method of remanufacturing of standard length rods includes cleaning the rod with cryogenic liquids to eliminate environmental contamination and to assist in workplace safety.

Abstract: A wet sanding adjuvant is comprised of a composition comprising: (1) an alkali metal or ammonium salt of an alkoxylated alkyl sulfate; (2) an alkali metal or ammonium salt of an alphaolefin sulfonate; (3) a cellulose derivative selected from the group consisting of hydroxyalkyl cellulose, a carboxyalkyl cellulose and combinations thereof. The adjuvant is used in a method of removing a coating from a surface comprising the steps of: (1) contacting a coated surface with a composition according to the invention to form a wet surface on the coating; (2) abrading the wet surface with an abrasive; (3) removing the composition from the surface.

Abstract: The present invention provides a polishing composition for a magnetic disk substrate that can reduce scratches and surface roughness of a polished substrate without impairing the productivity, and a method for manufacturing a magnetic disk substrate using the polishing composition. The polishing composition for a magnetic disk substrate includes colloidal silica having a ?CV value of 0 to 10% and water.

Abstract: A nanocomposite fluid includes a fluid medium; and a nanoparticle composition comprising nanoparticles which are electrically insulating and thermally conductive. A method of making the nanocomposite fluid includes forming boron nitride nanoparticles; dispersing the boron nitride nanoparticles in a solvent; combining the boron nitride nanoparticles and a fluid medium; and removing the solvent.

Abstract: A system, fixture and method for media finishing a cluster of airfoils are provided. The fixture may include a base having a first end and a second end, a receptacle disposed on the base and configured to receive the stator cluster, and at least one mock airfoil disposed at each of the first and second ends of the base in alignment with the airfoils of the cluster.

Abstract: A composition comprising a fluid, and a material dispersed in the fluid, the material made up of particles having a complex three dimensional surface area such as a sharp blade-like surface, the particles having an aspect ratio larger than 0.7 for promoting kinetic boundary layer mixing in a non-linear-viscosity zone. The composition may further include an additive dispersed in the fluid. The fluid may be a thermopolymer material. A method of extruding the fluid includes feeding the fluid into an extruder, feeding additives into the extruder, feeding a material into the extruder, passing the material through a mixing zone in the extruder to disperse the material within the fluid wherein the material migrates to a boundary layer of the fluid to promote kinetic mixing of the additives within the fluid, the kinetic mixing taking place in a non-linear viscosity zone.

Abstract: Systems and processes for improved laser machining, such as micro machining, of a workpiece. Systems and processes involve directing at a first surface of the workpiece a laser beam and wherein at least the laser-irradiated region of the first surface of the workpiece is immersed in a liquid, and delivering to the liquid-immersed and laser-irradiated workpiece surface region at least a first ultrasound output from a first ultrasound device. The ultrasound output and the laser beam desirably impact the workpiece first surface substantially simultaneously.

Abstract: The present invention is a wafer polishing method including simultaneously polishing both surfaces of a wafer by pressing and rubbing the wafer, while holding the wafer with: a lower turn table having a flat polishing-upper-surface rotationally driven; an upper turn table having a flat polishing-lower-surface rotationally driven, the upper turn table being arranged with facing to the lower turn table; and a carrier having a wafer-holding hole for holding the wafer, wherein the polishing is performed while measuring a thickness of the wafer through a plurality of openings provided between a rotation center and an edge of the upper turn table or the lower turn table, and switching a polishing slurry with a polishing slurry having a different polishing rate during the polishing of the wafer. As a result, there is provided a wafer polishing method that can manufacture a wafer having a high flatness and a high smoothness at high productivity and high yield.

Abstract: The invention provides a chemical-mechanical polishing composition containing (a) abrasive particles, (b) a polymer, and (c) water, wherein (i) the polymer possesses an overall charge, (ii) the abrasive particles have a zeta potential Za measured in the absence of the polymer and the abrasive particles have a zeta potential Zb measured in the presence of the polymer, wherein the zeta potential Za is a numerical value that is the same sign as the overall charge of the polymer, and (iii) |zeta potential Zb|>|zeta potential Za|. The invention also provides a method of polishing a substrate with the polishing composition.

Abstract: Embodiments of abrasive jet piercing and/or cutting devices are described herein. In some embodiments, a piercing device includes a holding or positioning device coupling a mixing tube to a secondary tube. The holding device has one or more passages extending to at least an intermediate portion of the piercing device. The one or more passages allow air to contact or mix with an abrasive waterjet as it travels through the piercing device. In some embodiments, a cutting device includes two plates configured so as to form a slot between the two plates. The cutting device can be placed directly on a workpiece, and an abrasive waterjet can be directed at the workpiece through the slot. An abrasive waterjet system utilizing the piercing and cutting devices disclosed herein can pierce holes and cut slots in materials that have reduced hole diameters and kerf widths, respectively.