Abstract: An apparatus and associated method are disclosed for the treatment of a surface through the projection of an abrading material against the surface. The abrading material is fed from a hopper to a centrifugal blast wheel which projects the abrading material toward the surface, the blast wheel rotated by a blast motor. A controllably positionable valve is disposed between the hopper and the blast wheel to regulate a rate at which the abrading material passes from the hopper to the blast wheel. During operation, a target current to be applied to the blast motor is determined by a control circuit, the target current indicative of a desired rate of abrasion of the surface. The control circuit then measures the current applied to the blast wheel and controls the position of the valve in relation to the target current and the measured current.

Abstract: A tool is provided for polishing, planarizing, cleaning or otherwise processing silicon wafers or other workpieces. It comprises a cylindrical roller mounted on a spindle above a platform or workstation on which a wafer is mounted. The roller is movable into and out of contact with the wafer, and is rotatable to polish the wafer. The wafer may also be rotatable and translatable on the platform. The roller has a linear region of contact with the wafer during processing operations.

Abstract: A semiconductor wafer is held by a wafer mount plate, which is loosely inserted into a housing. An air chamber is formed between the wafer mount plate and the housing. A retainer ring encloses the semiconductor wafer, and the semiconductor wafer as well as the retainer ring contacts with a polishing pad. An roughness is formed at the bottom of the retainer ring so as to dress the polishing pad. Polishing liquid is supplied to the inside of the retainer ring. Thus, the polishing pressure can be uniformly applied and the polishing liquid can be uniformly supplied on the whole surface of the semiconductor wafer, and the polishing for the semiconductor wafer and the dressing for the polishing pad can be performed at the same time.

Abstract: A chemical mechanical polishing apparatus is provided which is capable of polishing an essentially non-streaked mirrored surface in a highly efficient manner, and which is capable of achieving a degree of flatness of +/-0.1 mm or less.

Abstract: An apparatus for evenly polishing or planarizing the surfaces of workpieces includes a distributor with a reservoir and a plurality of conduits for uniformly guiding a fluid across a surface of a polishing material. The apparatus is configured to couple to a polishing machine that processes surfaces of workpieces such as semiconductor wafers and computer discs. The reservoir receives a fluid from an exterior source and the fluid is pooled in the reservoir before passing down the conduits to the polishing material. When multiple conduits are employed, the conduits are evenly spaced around the distributor to facilitate uniform application of fluid to a number of locations on the polishing material.

Abstract: A polishing pad (34) with a poromeric structure polishes two dissimilar materials (56, 58). By using a relatively softer pad. and conditioning, relatively constant times can be used for polishing the dissimilar materials (56, 58). This makes polishing more predictable and increases the number of substrates that can be polished using a single polishing pad (34). Polishing pads (34) are typically changed when other maintenance is performed on the polisher rather than when the polishing rate becomes too low.

Abstract: The invention provides an apparatus and method for continuously delivering ice particulates at high velocity onto a substrate for treating the surface of the substrate. The apparatus includes a refrigerated curved surface that is brought into contact with water to form a thin, substantially uniform, ice sheet on the surface. This ice sheet is of such thickness as to contain stresses so that the sheet is predisposed to fracture into particulates. A doctor-knife is mounted to intercept a leading edge of the ice sheet and to fragment the ice sheet to produce ice particulates. These ice particulates enter into at least one ice-receiving tube that extends substantially along the length of the doctor-knife. Once in the tube, the ice particulates are fluidized by a constant flow of air and are carried into a hose for delivery through an ice-blasting nozzle under pressure.

Abstract: An ice blasting cleaning system including an ice maker that creates ice particles, at least one separator that separates snow from the ice particles, a hopper into which the ice particles enter, and a blasting gun that receives the ice particles and propels them toward the surface to be cleaned. The separator may be for example, an air blower, an ice breaker plate set at a steep angle, a heated or a cooled ice breaker plate, or a rotating brush. The present invention also includes an ice blasting cleaning method for cleaning a surface using ice particles as the cleaning agent. The method includes creating ice particles and snow, separating the ice particles from the snow, the ice particles entering a hopper, and propelling the ice particles toward the surface to be cleaned.

Abstract: A blasting apparatus has two or more pressured tanks and a switching member for selecting one of the pressured tanks from which particles are to be fed to an ejection portion, thereby which enabling a continuous blasting operation. The blasting apparatus has a particle supply valve which uses a valve rod and piston arrangement for preventing leakage of particles. Such a valve arrangement enables airtightness to be retained within pressurized chambers of the valve housing for a long period of time.

Abstract: A recovery device for a polishing agent and deionizing water for a polishing machine is disclosed. Especially, a recovery device fitted to a drain conduit of a waste polishing agent produced from a chemical-mechanical polishing (CMP) machine to recover the used polishing agent and/or the deionizing water used in the procedure of polishing. The recovery device comprises essentially an electromagnetic valve controlled by a control electronic unit which receives the signals from the chemical mechanical polishing (CMP) machine.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a polishing section for polishing a surface of a workpiece, a cleaning section for cleaning the workpiece which has been polished, a first liquid leakage sensor provided in the polishing section for detecting a liquid leakage which occurs in the polishing section, and a second liquid leakage sensor provided in the cleaning section for detecting a liquid leakage which occurs in the cleaning section. The polishing apparatus further includes a controlling device for stopping the supply of liquid to the polishing section or the cleaning section in which the liquid leakage occurs when either one of the first and second liquid leakage sensors detects the liquid leakage.

Abstract: A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is delivered through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. Slurry extraction holes are interspersed between the slurry delivery holes to facilitate the removal of slurry from the polishing pad surface. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.

Abstract: Methods and apparatus for measuring and controlling the flow rates of processing solutions to a CMP machine during the polishing and planarization process. The apparatus comprises a processing solution source, a processing solution dispensing system for applying the solution to the CMP machine, a mechanism for transferring the processing solution from the solution source to the dispensing system, and a metering or sensing system for accurately measuring the amount of processing solution actually dispensed to the CMP machine. Preferably, the metering system comprises a coriolis mass flow meter and a controller for controlling its operation. The metering system may interface with the CMP machine controller in a feed-back loop configuration so that the actual flow rates of the solutions may be controlled in real time.

Abstract: A polishing pad made of a flexible material includes a first major surface, a second major surface, and a large number of holes. The first major surface is urged by a rotatable polishing target member to polish a polishing target surface of the urged polishing target member by using a slurry. The second major surface is adhered to a rotatable platen. The large number of holes extend between the first and second major surfaces and serve as slurry reservoirs. The holes have a larger opening area on the second major surface than that on the first major surface. A polishing apparatus is also disclosed.

Abstract: A blasting apparatus has two more pressure tanks (1)(11), and a switching member (20) for selecting one pressure tank from which particles are to be fed to the ejection portion from the at least two pressure tanks, which enables to carry out a continuous blasting operation. The blasting apparatus has a particle supply valve (200) which uses a sliding member (207) and a piston (208) instead of a rubber partition wall, thereby preventing particles and compressed air from being leaked. Further, in a particle separator (300) provided in the blasting apparatus, there is provided a separator container into which reusable particle and particle dust obtained after a blasting operation are blown and then diffused by a diffusion member (310), thereby enabling to separate particle dust and reusable particles with a high separation accuracy.

Abstract: An ice blasting cleaning system including an ice maker that creates ice particles, a hopper into which the ice particles enter, at least one mist nozzle that introduces a mist of water and air into the hopper, and a blasting gun that receives the ice particles and propels them toward the surface to be cleaned. In one embodiment, the ice maker includes a sizer that determines the size of the ice flakes produced. An ice blasting cleaning method includes the steps of creating ice particles that enter a hopper in which they are sprayed with mist and propelling the ice particles toward the surface to be cleaned.

Abstract: A polishing apparatus and method is disclosed, whereby fluid is delivered at dissimilar flow rates and pressures across a wafer. The fluid is delivered either directly to the wafer or through a polishing pad. Changing the fluid delivery allows the removal properties of the fluid to polish material from the wafer surface based on the location of that material relative to the center of the wafer. The fluid delivery system and the polishing pad oscillate relative to a rotating wafer. The radius of oscillation is relatively small compared to the size of the wafer to allow removal along one or more concentric rings and/or circles across the wafer.

Abstract: A lapping apparatus and a method for effectively utilizing a regenerated abrasive fluid in the lapping process of works such as semiconductor wafers or quartz wafers without causing any damage such as scratches to the works.A work lapping method using a regenerated abrasive fluid prepared from a used abrasive fluid and a new abrasive fluid, which comprises the steps of preliminarily lapping a work using the regenerated abrasive fluid to a predetermined stock removal of the work, and finally lapping the preliminarily lapped work using the new abrasive fluid.

Abstract: A slurry managing system for a wire saw is disclosed. The wire saw includes a wire that has a plurality of wire lines extending in parallel to one another. The wire is supplied with slurry containing abrasive grains in dispersing liquid to cut a workpiece so as to simultaneously produce a multiplicity of wafers. A mixer device mixes the slurry prior to supplying of the slurry to the wire saw. A first supplying device supplies the grains to the mixer device. A second supplying device supplies the dispersing liquid to the mixer device. A first adjusting device adjusts the amount of the grains supplied to the mixer device from the first supplying device. A second adjusting device adjusts the amount of the liquid supplied to the mixer device from the second supplying device.

Abstract: A blasting apparatus has two more pressure tanks (1)(11), and a switching member (20) for selecting one pressure tank from which particles are to be fed to the ejection portion from the at least two pressure tanks, which enables to carry out a continuous blasting operation. The blasting apparatus has a particle supply valve (200) which uses a sliding member (207) and a piston (208) instead of a rubber partition wall, thereby preventing particles and compressed air from being leaked. Further, in a particle separator (300) provided in the blasting apparatus, there is provided a separator container into which reusable particle and particle dust obtained after a blasting operation are blown and then diffused by a diffusion member (310), thereby enabling to separate particle dust and reusable particles with a high separation accuracy.

Abstract: A slurry recycling system for a chemical-mechanical polishing apparatus includes an annular-shaped wafer polishing platen which rotates about a non-rotating center core. A slurry dispensing system housed in the center core directs a slurry mist radially into the path of a moving wafer. The recycling system is positioned at the periphery of the platen and is controlled by an end point monitoring and control system which uniquely provides instantaneous wafer removal rate data to regulate a slurry recycling valve.

Abstract: An apparatus for and method of conditioning a polishing pad suitable for in-situ use, is described. The apparatus consists of a wedge-shaped conditioning plate whose width varies as a function of its length and whose exact geometry is a function of the radial effects of the polishing process effecting conditioning of the polishing pad. The conditioning plate rests on the polishing pad and is surrounded by a loose-fitting frame that holds the conditioning plate stationary with respect to the rotating polishing table, preventing lateral movement of the conditioning plate, but allowing the plate to move in the vertical direction so that it can rest flat on the polishing pad.

Abstract: The specification discloses an apparatus and method for forming and projecting a continuous flow of frozen particles for the purpose of abrasive cleaning of substrate surfaces. The device utilizes a cryogenic fluid/dry air mixture that interacts with atomized water to form ice crystals. The crystals are projected through a blast nozzle to be directed at a substrate surface. The ice crystals, of a size range below one hundred micrometers, are produced within the apparatus just prior to the nozzle rather than being conveyed to the nozzle by a hose.

Abstract: A polishing machine comprising a frame, an upper and a lower working wheel each having opposing working surfaces, at least one of the working wheels being rotatably supported by the frame and driven by driving means, with a plurality of runner wheels being located between the working surfaces of the upper and the lower working wheel, the runner wheels having aperatures for the accommodation of work pieces and a toothing at the circumference thereof, an outer and an inner circular row of equally spaced pins, the pins being retained by a respective pin ring, the toothing of the runner wheels engaging the outer and the inner row of pins for the forward and rotating movement of the runner wheels if at least one of the row of pins is rotated, second driving means for the rotating row of pins, a source for the supply of working fluid and/or rinsing fluid between the working surfaces, interception means on the outer and the inner side of the working wheels, with the outer of the interception means being formed by a

Abstract: A new Wax Container Hand Buffer for buffing and polishing a vehicle by hand thereby producing an even finish and a high finish. The inventive device includes a cylindrical handle, the cylindrical handle includes a wax reservoir which can be access through a reservoir cap on the cornice of the cylindrical handle, a circular base secured to the end of the cylindrical handle opposite of the reservoir cap, and a buffer pad removably secured around the circular base by a concentric string fastener.

Abstract: An impeller wheel has at least one lateral disk and an impeller cage connected centrally on a first face of the lateral disk. Blasting material to be distributed with the impeller wheel is introduced in an axial feeding direction into a central area of the impeller cage. Radial blades are connected to the first face of the lateral disk. Guide blades are connected to the first face of the lateral disk and positioned between the radial blades. The radial blades have radially inner ends spaced at a first distance from a center of the lateral disk and the guide blades have radially inner ends spaced at a second distance from the center of the lateral disk. The second distance is greater than the first distance. The impeller cage is embodied as an auxiliary impeller wheel having auxiliary blades. The auxiliary blades have a greater axial length than the radial blades.

Abstract: A system for polishing a semiconductor wafer, the system comprising a platen subassembly defining a polishing area; a polishing head selectively supporting a semiconductor wafer and holding a face of the semiconductor wafer in contact with the platen subassembly to polish the wafer face; and means for heating the wafer while the wafer face is being polished.

Abstract: Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

Abstract: In a polishing method of polishing a surface of a wafer by pressing the wafer, which is rotating in the same direction as a rotating table, against the polishing table while continuously flowing a polishing agent onto the polishing table, run-off of the polishing agent is suppressed by continuously blowing air from the outside of the polishing table toward the polishing table. A wafer polishing apparatus for practicing the above method includes a polishing table having rotating means, polishing agent supplying means for supplying a polishing agent onto the polishing table, wafer holding means, having rotating means and vertical drive mechanism, for holding a wafer to oppose the polishing table, and air blowing means for blowing air from the outside of the table polishing toward the polishing table.

Abstract: A polishing tool having a polishing wheel that forms a set of pockets wherein the pockets receive a stream of water and are formed such that a high hydrostatic pressure builds in the pockets as the polishing tool rotates in a high precision grinding machine and addresses a surface of a substrate. The high hydrostatic pressure removes material from the surface of the substrate while preserving the precise thickness variation control of the high precision grinding machine.

Abstract: A polishing apparatus for polishing a surface of an object such as a semiconductor wafer includes a turntable having a polishing cloth mounted on an upper surface thereof, a top ring for holding and pressing the object against the polishing cloth, and a plurality of radially arranged nozzles for supplying a polishing solution, containing abrasive material, of different concentrations that differ along a radial direction of the polishing cloth.

Abstract: Recycled slurry is continuously blended with the slurry in use to provide a consistent polishing rate while consuming or discarding a small fraction of the slurry flowing continuously across the polishing pad. The slurry is recovered in a catch ring and fed to a recycle loop to blend the recovered slurry with fresh slurry, rejuvenating chemicals, or water; test the blend; filter the blend; and return the blend to the polishing pad. The volume returned to the pad slightly exceeds the volume recovered, causing the catch ring to overflow. Rinse water is recycled in the same fashion to keep the polishing pad wet between polishing cycles.

Abstract: An apparatus and method for improving planarity of chemical-mechanical polishing of substrates are provided. The apparatus includes a platen having a planar surface upon which a polishing pad is removably affixed. The pad has an exposed planar surface, and a carrier removably holds the substrate against the planar surface. The apparatus includes a slurry distribution system and a slurry removal system. The slurry distribution system provides slurry to an instantaneous interface area of the substrate and planar surface through the platen and pad, while the slurry removal system removes slurry from the instantaneous interface area through the pad and the platen, notwithstanding rotation of the platen and/or substrate, as well as linear movement of the substrate relative to the rotating platen.

Abstract: A receiving side handle is provided for receiving and supporting a liquid rubbing compound dispenser from a hand-held buffing machine of the type having a threaded side handle bore. The receiving side handle is interchangeable with original equipment threaded side handles. In this way, the receiving side handle retrofits hand-held buffing machines to enable a buffing machine operator to dispense liquid rubbing compound on a surface while maintaining an uninterrupted grip on a retrofitted buffing machine. The receiving side handle includes a handle frame attached to a threaded rod for mounting the handle frame to a hand-held buffing machine. In addition, the receiving side handle includes a coupling structure defined by a portion of the handle frame, the coupling structure being provided for receiving and coupling a liquid compound dispenser to the handle frame.

Abstract: An improved system for generating an abrasive fluid jet is shown and described. In a preferred embodiment, abrasive is fed from a bulk hopper into an air isolator having a baffle that limits the flow of air and abrasive through the air isolator, thereby venting air from the abrasive. An on/off device having a rod coupled to a stopper is provided within the air isolator, the rod being selectively raised and lowered in a vertical direction. A discharge orifice is provided in a bottom surface of the air isolator, the stopper covering the discharge orifice when the rod is in a lowered position, thereby preventing the discharge of abrasive from the air isolator.A metering disk is provided adjacent the discharge orifice, an orifice in the metering disk being aligned with the discharge orifice, such that abrasive exiting the air isolator flows through the metering disk.

Abstract: An improved blast cleaning system and an improved method of blast cleaning using solid carbon dioxide pellets is provided. A compressed air source--preferably an air compressor--is used to produce a compressed air or carrier gas stream which is cooled to the desired temperature by injection of a cryogen--preferably liquid nitrogen--before the solid carbon dioxide pellets are introduced into the carrier gas stream. Solid carbon dioxide pellets are then added to the cooled compressed air stream and then propelled towards the surface to be cleaned. Using a compressed air stream which is precooled to the desired operating temperature helps to minimize the sublimation of the carbon dioxide pellets. The use of the precooled compressed air stream also allows greater control of the hardness, size, density, impact forces, stripping rates, and stripping efficiencies of the carbon dioxide pellets. An improved method of transporting solid carbon dioxide pellets which can be used for nonblasting applications (e.g.

Abstract: An apparatus for reconditioning the protective coating of a digital recording disc is provided. The apparatus includes a turntable configured to receive a digital disc, a first motor for rotating the turntable, a turntable support for attaching the turntable to a base, a buffing element, a second motor for rotating the buffing element, a buffing element support for attaching the buffing element to the base, and a protective housing. A method for reconditioning a digital recording disc is also provided. The method involves placing a digital disc on a turntable, rotating the turntable, applying a cutting medium to the disc, rotating a buffing element, and removing material from the disc.

Abstract: Blast cleaning with at least two types of abrasives employing a blasting apparatus having at least a first and a second closed blasting pot connected to a conveying line and the conveying line and each blasting pot are connected to a source of compressed gas by a differential pressure metering system. The differential pressure metering system provides a differential pressure between each blasting pot and the conveying line enabling blasting media in each pot to pass from each pot through a variable size orifice to the conveying line. Each blasting pot can be operated independently of each other enabling varying proportions of different types of blast media to be released in the conveying line and blasted from a nozzle to clean a solid surface.

Abstract: The present invention uses a surface plate 8 made of carbon fiber reinforced plastics which is installed on a turntable 4, and an emery cloth 6 is adhered on the surface of the surface plate 8. This surface plate 8 is detachably installed on the turntable 4 by means of key blocks 22 or screws 26. If the turntable 4 is made of carbon fiber reinforced plastics, the entire weight of a polishing machine can be reduced.

Abstract: A polishing tool includes a tool body and a polishing member which is mounted rotatably on the tool body and which has a central hole unit formed through the polishing member. The working surface of the polishing member has a plurality radially extending slots which are spaced apart from each other in an angularly equidistant relation and which extend from the inner periphery of the working surface to the outer periphery of the working surface. A plurality of flat working surface sections are defined on the working surface of the polishing member by the slots. When a slurry consisting of a lubricating liquid and abrasive grains flows onto the working surface of the polishing member via the central hole unit and when the polishing member is rotated on the tool body, each of the abrasive grains moves across all of the slots and from the inner periphery of the working surface to the outer periphery of the working surface, by hydrodynamic effect, so as to polish positively and effectively the workpiece.

Abstract: An improved slurry blasting process is disclosed wherein a liquid carrier medium such as water contains a dispersed water-soluble particulate abrasive to enhance blast cleaning efficiency and wherein the liquid carrier comprises a saturated solution such as the dissolved particulate abrasive so as to minimize the dissolution of the particulate abrasive therein. Slurry blasting at relatively low pressures below 500 psi and at room temperature provides effective and cost efficient cleaning of substrates. The slurry can be recovered and continuously reused. A recrystallization agent can be added to the slurry to increase abrasive particulate growth in the saturated solution.

Abstract: A method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.

Abstract: In the texturing unit of this invention a data storage disk is gripped between a pair of opposed, counter-rotating cylindrical abrasive mandrels, which are covered with soft, porous pads. The frictional force between the disk and the pads raises the edge of the disk against a pair of driven rollers which impart a rotational motion to the disk. A texture pattern of uniform grooves, having controlled peak heights and valley depths, is formed simultaneously on both sides of the disk. A system for delivering an abrasive slurry to the pads includes a closed loop in which the slurry is recirculated and a dispense section of that loop, from which a blast of pressurized air periodically expels the slurry through applicators and onto the pads. The continuous recirculation of the slurry prevents settling.A unique feature is that the groove length may be controlled by adjusting the ratio between the rotational speeds of the disk and mandrels.