Abstract: An apparatus for slurry distribution during semiconductor wafer polishing operations. The slurry is gravity fed or fed under pressure and broadcast under an angle across the entire face of the polishing pad by either a rotating slurry nozzle arrangement or by a rotating slurry shaft arrangement. This as opposed to the conventional slurry supply lines, which are stationary in design.

Abstract: A CMP slurry is formulated with a single component oxidizer capable of oxidizing a metal undergoing planarization and yielding a complexing agent which complexes with the oxidized metal thereby minimizing overetching. Embodiments include CMP Cu with a fixed abrasive pad or an abrasive containing slurry, employing a peroxy acid, e.g., peroxy benzoic acid, or a polyethylene glycol peroxy acid. In another embodiment, a single component is employed which dissociates in the slurry into an oxidizer and complexing agent, such as an amine-peroxy acid, e.g., urea peroxy acid.

Abstract: The present invention is directed to an apparatus and method for flow regulation of planarization fluids to a semiconductor wafer planarization machine. In one embodiment, the regulating system includes a fluid storage tank with an acoustic fluid level sensor. The storage tank is connected to a fluid delivery line that delivers planarization fluid to the storage tank through a flow control valve and delivers a regulated flow of planarization fluid to a planarization machine through a flow sensor. A gas supply system is connected to the storage tank to provide system pressurization. Regulation of the fluid flow is achieved by a control system in which the flow sensor and the acoustic fluid level sensor comprise feedback elements in a closed feedback system to independently control the pressure in the storage tank and the fluid admitted by the control valve. In an alternate embodiment, the fluid level sensor is comprised of capacitive proximity sensors located outside the wall of the storage tank.

Abstract: A valve particularly for use within a chemical-mechanical polishing (CMP) system for controlling the supply of slurry and de-ionized water streams while allowing for the constant recirculation of those streams. The valve includes a body having a bore with first and second inlet and outlet port openings for the slurry and water streams, and a third outlet port opening selectably couplable with the first and second inlet ports. A spool or other valve element is slidably received within the bore for axial movement therein, and is positionable within the bore in a null orientation closing the third outlet port to the first and second inlet ports. The spool is movable from the null orientation to a first operating orientation opening the third outlet port path to the first inlet port, and to a second operating orientation opening the third outlet port to the second inlet port.

Abstract: A polishing plant including a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus discharges a waste liquid from the cleaning apparatus are provided as separate plural drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment of waste liquids can be efficiently conducted.

Abstract: An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ionized water is used to flush the apparatus. The desired safe low pressure of the de-ionized water may be maintained by opposed one-way check valves. The flushing system prevents the slurry from clogging or becoming stagnant, and prevents valves and pumps within the apparatus from malfunctioning. Moreover, the low pressure de-ionized water will not contaminate the higher pressure slurry even in the event of a system malfunction.

Abstract: In a chemical-mechanical polishing machine (101) where a polishing head (100) holds a wafer (150) against a polishing pad (140), a retaining ring (300) that surrounds the wafer (150) has an open chamber (350) to distribute pressurized slurry (144) to the polishing pad (140) and to the periphery (153) of the wafer (150).

Abstract: A rotary union is provided for chemical/mechanical polishing of silicon wafers, especially silicon wafers containing chemically sensitive integrated circuit structures. A rotary union is provided with a union rotor and union stator, coupled at the free end of a support spindle carrying a CMP polishing table. In the preferred embodiment the rotary union is joined to a coolant union forming the lower end of the support spindle. A passageway through the union rotor extends past the bottom end of the coolant union rotating part to avoid contact of fluid transmitted through the passageway formed in the union rotor, with the rotating part of the coolant union.

Abstract: The object of the present invention is to provide a polishing apparatus that can supply a polishing solution having a non-varying distribution of abrading particles sizes at a steady rate. An apparatus (20) for delivering a polishing solution to a polishing apparatus (22) is disclosed. The apparatus (20) comprises: a solution passage for transporting the polishing solution; and an ultrasonic vibrator (72) being provided in at least one location of the solution passage.

Abstract: The present invention provides a slurry delivery system comprising a slurry conduit couplable to a wall of the slurry tank, and configured to receive a slurry therein and deliver a stream of the slurry against an inner wall of the slurry tank. Thus, the system inhibits drying of a slurry within the slurry tank and minimizes agglomeration on the sides of the slurry tank that results from slurry drying on the sides of the slurry tank's wall when the slurry level within the tank rises and falls. This minimization of agglomeration reduces the agglomerates within the slurry supply, which in turn, reduces the number of contaminants and scratches affecting the overall quality of the semiconductor wafer substrate.

Abstract: A slurry dispensing unit for a chemical mechanical polishing apparatus equipped with multiple slurry dispensing nozzles is disclosed. The slurry dispensing unit is constructed by a dispenser body that has a delivery conduit, a return conduit and a U-shape conduit connected in fluid communication therein between for flowing continuously a slurry solution therethrough and a plurality of nozzles integrally connected to and in fluid communication with a fluid passageway in the delivery conduit for dispensing a slurry solution. The multiple slurry dispensing nozzles may either have a fixed opening or adjustable openings by utilizing a flow control valve at each nozzle opening.

Abstract: A first supply unit sprays and supplies abrasive slurry containing abrasive grains into a mixing unit. A second supply unit sprays and supplies additive into the mixing unit. A third supply unit sprays and supplies pure water into the mixing unit. The mixing unit mixes the mist of abrasive slurry, the mist of additive and the mist of pure water to prepare polishing solution, and supplies the polishing solution onto the major surface of a polishing stage.

Abstract: The present invention relates to an apparatus for producing a polishing solution mainly comprising pure water and abrasive grains, which apparatus comprises:

Abstract: A method for cutting a rare earth alloy according to the present invention includes the steps of: a) supplying slurry containing abrasive grains onto a wire; and b) machining the rare earth alloy with the abrasive grains, interposed between the wire and the rare earth alloy, by running and pressing the wire against the rare earth alloy. The slurry contains, as a main component, oil in which the abrasive grains are dispersed, and the viscosity of the slurry at 25° C. is in the range from 92 to 175 mPa.sec.

Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface thereon, a top ring for pressing a workpiece to be polished against the polishing surface, and a dresser for dressing the polishing surface on the polishing table. The dresser comprises a dressing element provided on a surface of the dresser for dressing the polishing surface by sliding contact with the polishing surface, and an ejection nozzle provided on the surface of the dresser for ejecting a fluid supplied from a fluid source toward the polishing surface.

Abstract: During grinding and polishing of an optical element made of a crystalline material such as fluorite, tarnish and a reaction with diamond polishing abrasive grains included in processing liquid are prevented. To this end, processing liquid supplied to a processing region of a surface to be processed and processing liquid supplied to a non-processing region are divided.

Abstract: A polishing liquid supply apparatus supplies a polishing liquid to a polishing unit. The polishing liquid supply apparatus includes a supply tank for storing a polishing liquid having a predetermined concentration, and a polishing liquid pipe for delivering the polishing liquid from the supply tank to a polishing liquid supply nozzle in the polishing unit. The polishing liquid supply apparatus further includes an additive tank for storing an additive having a predetermined concentration, and an additive supply pipe for adding the additive supplied from the additive tank to the polishing liquid stored in the supply tank or to the polishing liquid in a polishing liquid passage including the polishing liquid pipe.

Abstract: A granule dishwashing apparatus with easily removable granule collectors and method of use. The dishwashing apparatus consists primarily of a treatment chamber, a tank, one or more granule collectors and one or more pumping devices. Soiled articles are placed in the treatment chamber to be washed with a mixture consisting of liquid and granules that is sprayed at the articles under high pressure. The mixture falls toward the tank after impacting the articles, passing through the granule collector(s). A liquid only portion is separated from the mixture at some point using the granule collector(s) so that the articles can be rinsed. At any point following a cleaning cycle, the granule collector(s) can be removed to add more granules and to simplify the cleaning of the apparatus. In a multiple collector system, the granule collectors are connected to actuators so that the collectors can be placed in a release mode or a collect mode depending on the function desired.

Abstract: An apparatus to induce very small bubbles of gas into a stream of deionized water without allowing large bubbles to be entrained is disclosed for use in Chemical Mechanical Polishing for semiconductor manufacture. The apparatus includes a cylinder possessing a central axis positioned vertically, a gas inlet, a deionized water inlet positioned essentially above the gas inlet, a deionized water with gas outlet positioned essentially above the deionized water inlet and a vent outlet positioned essentially above the deionized water with gas outlet. The apparatus introduces an essentially gaseous composition into the cylinder through the gas inlet into deionized water in the cylinder. The gas travels through the deionized water inlet to a level in the cylinder above the position of the deionized water with gas outlet, wherein the gaseous composition is further constrained to enter as bubbles with a predetermined size range in the deionized water through the deionized water inlet.

Abstract: An apparatus and method for abrasive flow machining the orifice of a workpiece by using an abrasive media whereby the apparatus may accommodate abrasive media having a range of viscosities by modifying the diameters of pistons and cylinders in positive displacement pumps within the apparatus.

Abstract: A polishing apparatus and a polishing method can effectively prevent large diameter particles from being fed with slurry to an object to be polished. A large-diameter particle screener blocks or disperses large diameter particles from entering the slurry. Then, slurry free from large diameter particles is taken up from a slurry container by an intake pipe and fed to the object to be polished.

Abstract: An apparatus is disclosed wherein polishing slurry is supplied to a polishing pad affixed to a polishing platen to thereby polish semiconductor wafers. This apparatus is provided with at least one slurry-supply mechanism for supplying a controlled amount of polishing slurry to an intermediate region between outer end and central regions of a semiconductor wafer and to the central region per se. Control is made such that the amount of flow of polishing slurry supplied to the intermediate region of the semiconductor wafer is larger than that supplied to the central region thereof.

Abstract: A slurry dispensing carrier ring for confining a semiconductor wafer to a polishing pad in a chemical mechanical polishing machine. The slurry dispensing ring has a diameter and a lower surface substantially parallel to the plane defined by the diameter and an inner radius surface substantially orthogonal to the plane defined by the diameter. The inner radius surface is adapted to confine the semiconductor wafer. An outer radius surface is located opposite the inner radius surface. An upper surface is located opposite the lower surface. A slurry dispense hole extends through the carrier ring from the upper surface to the lower surface, wherein the slurry dispense hole is adapted to flow a slurry used for chemical mechanical polishing from the chemical mechanical polishing machine to the lower surface so that the slurry contacts the semiconductor wafer confined within the inner radius surface.

Abstract: Apparatus to prepare an airstream laden with particles of solid dry ice. A rotor has passages which sequentially pass a source of particles and a source of air under pressure to prepare the airstream and send it to a nozzle. The rotor is held between pads whose force against the rotor is a function of air supply pressure. The speed of the rotor and of the particle feed are controllable, and the air feed persists after particle feed has stopped for a period of time sufficient to clear particles from the rotor.

Abstract: In the controlled application of fluid polishes to polishing wheels (16) a controlled nozzle head is used which has a polish chamber (12), a nozzle (14) and a valve body (10), the polish being fed to the polish chamber (12) from an external supply tank (2). In order to reduce the apparatus cost, the wasting of polish and the contamination of the surrounding area by fast adaptation of the metering properties, the polish is fed to the nozzle head (1) by means of an external high-pressure pump (21). The nozzle head (1) is moved transversely across at least one polishing wheel (16), and the valve body (10) is controlled, regardless of the supply pressure of the high-pressure pump (21), by at least one external control dependent upon the movement of the nozzle head (1). In a metering apparatus especially appropriate for this use the valve body (10) is controlled by signals which issue from cams which are arranged parallel to the line of movement of the nozzle head.

Abstract: An apparatus and method for conditioning the polishing pad of CMP system by employing a multi-zone conditioner, or dresser. The conditioner comprises a plurality of rollers or disks, which can be well tuned to make down-pressure and rolling speed of the rollers or disks to the extent as desirable. The conditioner further comprises driving means for rotating the polishing rollers or disks. It can make a better uniformity of the pad conditioning and improve the profile of the polished wafers. The apparatus and method for conditioning the polishing pad can be especially used to compensate the uniformity of the incoming films, or the pre-CMP films.

Abstract: This invention relates to a polishing machine for polishing an article such as a semiconductor wafer. A movable arm is located at a liquid supply position for supplying a liquid such as a polishing liquid onto a polishing surface of a turntable. The arm is also adapted to be moved to and held at a retracted position radially outside the polishing surface. At the liquid supply position, liquid supply nozzles supported on the arm are brought into a condition such that the nozzles are close to a position on the polishing surface where the liquid is to be supplied, whereby the liquid is accurately supplied onto the position. Holding the arm at the retracted position makes it easy to conduct a maintenance work for the polishing surface and so on.

Abstract: A manufacturing system of semiconductor devices, which comprises a dispersing equipment for dispersing inorganic oxide with water, a filtrating equipment provided behind the dispersing equipment for filtrating the slurry sent from the dispersing equipment, a supplying equipment provided behind the filtrating equipment for supplying the slurry sent from the filtrating equipment to a CMP polishing equipment, and the CMP polishing equipment provided behind the supplying equipment for polishing semiconductor devices by using the slurry supplied from the supplying equipment. According to the present invention, it is possible to supply slurry to the CMP polishing equipment at the right time in the right quantity. Accordingly, it is possible to eliminate the cost incurred by performing the strict quality control of the slurry during the storage.

Abstract: A polisher includes a turntable with a polishing surface provided on the top surface of the turntable, an article carrier for holding an article to be polished in such a manner that the article is brought into contact with the polishing surface to polish the article, and a slurry dispenser for receiving and dispensing slurry to the polishing surface. The dispenser includes a slurry dispensing member for dispensing slurry to the polishing surface. The slurry dispensing member includes a contact surface facing and substantially contacting the polishing surface, and a slurry dispensing opening including at least one hole provided in the contact surface to dispense the slurry to the polishing surface therethrough. The opening is sized in such a manner that the opening covers substantially an area of the polishing surface which is to be brought into engagement with the article by relative movement between the article and the polishing surface.

Abstract: A chip saw in which chips are brazed onto the peripheral edge thereof is clamped, and is rotated while bringing a rotational brush into contact with a honing-subjected portion of the peripheral edge. A liquid, which has dustproof oil and abrasive powder, provided with abrasive properties is supplied to a part in which the rotational brush is in contact with the honing-subjected portion. Therefore, the work efficiency of honing process is improved, and sawdust is not generated. This makes it possible to easily take countermeasures against environmental problems and effectively use resources. In addition, the liquid can be easily recycled.

Abstract: An apparatus and method for re-surfacing compact discs. The method is a two-step method in which the disc to be re-surfaced is first placed on a shaft. A resilient pad supports an abrasive medium and is positioned so the abrasive medium overlaps only the protective layer of the CD. The disc and abrasive material are rotated in opposite directions at about the same speed to remove deeper blemishes in a wet operation. Subsequent polishing is accomplished in a similar manner using a polishing compound instead of an abrasive. The re-surfacing and polishing apparatus each have motor driven shafts which are parallel and spaced apart and support the CD and pad in a cabinet. A transparent cover extends across the top of the cabinet.

Abstract: A polishing apparatus including a turntable having an upper polishing surface, at least one carrier for carrying an article with a surface to be polished in such a manner that the surface is engaged with the upper polishing surface of the turntable, and at least one slurry supply nozzle provided for the carrier and adapted to supply a slurry on the polishing surface of the turntable at a predetermined slurry supply point upstream of a line connecting the center axes of the turntable and the carrier in the direction of rotation of the turntable while the turntable and the carrier are rotated around their respective center axes with the surface of the article kept in engagement with the polishing surface. The nozzle is preferably positioned such that an angle is formed between the line connecting the center axis of the turntable and the center axis of the carrier and a line connecting the center axis of the carrier and the predetermined slurry supply point is in the range of from 5 degrees to 40 degrees.

Abstract: A polishing apparatus for polishing a substrate. The polishing apparatus has a slurry delivery system for delivering slurry to the apparatus; a porous polishing pad having an upper surface at which the substrate is polished; and a rotating platen upon which the porous pad lies. The rotating platen has a recess which has a first portion in communication with the delivery means for delivering slurry into the first portion. The recess further has a second portion extending under the polishing pad. Slurry is delivered from the first portion to the second portion and to the upper surface of the pad where it aids in the polishing of the substrate. Preferably, the first portion of the recess is situated such that the slurry delivered to the top surface returns to the first portion for removal or reuse due to the rotational force of the rotating platen.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: A polishing apparatus for polishing a workpiece such as a semiconductor wafer to a flat mirror finish includes a turntable with a polishing cloth mounted on an upper surface thereof and a top ring for polishing a semiconductor wafer to a flat mirror finish by placing the semiconductor wafer between the turntable and the top ring and pressing the semiconductor wafer under a certain pressing force. A presser ring is vertically movably provided around the top ring. A pressing device presses the presser ring against the polishing cloth under a variable pressing force, and the presser ring is supported by the top ring through a bearing.

Abstract: An apparatus for polishing a semiconductor wafer is provided comprising a wafer carrier to provide a force against a wafer and a rotating polishing pad during the polishing operation and a polishing slurry dispenser device disposed to dispense the slurry toward the pad preferably as a stream or more preferably drops toward the pad surface and a curtain of air to intersect the slurry at or near the polishing pad surface. The wafer is polished using less slurry than a conventional polishing apparatus while still maintaining the polishing rates and polishing uniformity of the prior art polishing apparatus. A preferred dispenser is an elongated housing having a slurry tube and air tube therein each tube having a plurality of spaced apart slurry openings and air openings along its longitudinal axis which tube is preferably positioned radially over at least one-half the diameter of the polishing pad.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A method and apparatus for controlling the coherence of a high-pressure fluid jet directed toward a selected surface. In one embodiment, the coherence is controlled by manipulating a turbulence level of the fluid forming the fluid jet. The turbulence level can be manipulated upstream or downstream of a nozzle orifice through which the fluid passes. For example, in one embodiment, the fluid is a first fluid and a secondary fluid is entrained with the first fluid. The resulting fluid jet, which includes both the primary and secondary fluids, can be directed toward the selected surface so as to cut, mill, roughen, peen, or otherwise treat the selected surface. The characteristics of the secondary fluid can be selected to either increase or decrease the coherence of the fluid jet. In other embodiments, turbulence generators, such as inverted conical channels, upstream orifices, protrusions and other devices can be positioned upstream of the nozzle orifice to control the coherence of the resulting fluid jet.

Abstract: Slurry is provided to the surface of the polishing pad by pumping the slurry up through a central port, or by dripping the slurry down onto the surface of the polishing pad from a slurry feed tube. A slurry wiper, which may have one or more flexible members, sweeps the slurry evenly and thinly across the polishing pad. A control system coordinates the distribution of slurry to the polishing pad with the motion of the carrier head.

Abstract: An apparatus and method of conditioning a CMP polishing pad to ensure consistent polishing throughout the polishing process. In particular, the apparatus consists of a translatable wedge-shaped conditioning plate, having a three point adjustable contact to ensure proper alignment with the polishing pad; a high pressure conditioning spray nozzle to clean the polishing pad and conditioning assembly throughout polishing; and a slurry dispensing nozzle to enhance planarization of the wafer. Further, the frequency of oscillation may be varied by the operator to prevent grooves from forming in the polishing pad.

Abstract: The invention provides an apparatus and method for continuously delivering ice particulates at high velocity onto a substrate for treating the surface of the substrate. The apparatus includes a refrigerated curved surface that is brought into contact with water to form a thin, substantially uniform, ice sheet on the surface. This ice sheet is of such thickness as to contain stresses so that the sheet is predisposed to fracture into particulates. A doctor-knife is mounted to intercept a leading edge of the ice sheet and to fragment the ice sheet to produce ice particulates. These ice particulates enter into at least one ice-receiving tube that extends substantially along the length of the doctor-knife. Once in the tube, the ice particulates are fluidized by a constant flow of air and are carried into a hose for delivery through an ice-blasting nozzle under pressure.

Abstract: A polishing liquid supply apparatus for supplying a polishing liquid to a chemical mechanical polishing apparatus includes a polishing liquid supply system including a polishing liquid tank for storing the polishing liquid; and a polishing liquid supply path for supplying the polishing liquid from the polishing liquid tank to the chemical mechanical polishing apparatus. The polishing liquid supply system is structured so as to shield the polishing liquid therein from external air.

Abstract: An apparatus for polishing wafers includes a polishing table with a heating device. A conduit connects a tank holding a liquid polishing agent to a distributor for feeding the liquid polishing agent to the polishing table. A heat exchanger is disposed along the conduit between the tank and the distributor for heating the liquid polishing agent. The heat exchanger is independent of said heating device. A method for heating a polishing agent is also provided.

Abstract: The present invention relates to a novel supply system for chemicals which permits the preparation of solid-containing suspensions, which are required, inter alia, for polishing wafers or in semiconductor production, directly at the point of use.

Abstract: A semiconductor device manufacturing apparatus. The semiconductor device manufacturing apparatus includes: a tank having an inlet and an outlet, for storing a chemical solution; a pump interposed between the inlet and outlet of the tank, for circulating the chemical solution contained in the tank; a filter interposed between the pump and the inlet of the tank; at least one main body connected to an outlet of the filter; a pumping cycle sensor for changing the pumping operation of the pump into a pulse signal; and a controller for measuring the cycle time of the pulse signals generated by the pumping cycle sensor to determine the level of deterioration of the filter.

Abstract: Systems for abrasive action include machinery for creating a vacuum and positive pressure to enable flow control while providing adequate vacuum to both retrieve and capture the spent abrasive material and the abraded material. A first embodiment includes a vacuum and boost operation facilitated by the use of a foot control for high control of abrasion, cleaning and polishing. A second embodiment is for use with human tissue and includes a vacuum only system with filtered air. A third embodiment includes vacuum with automatic boost for skilled medical personnel use and uses a minimum vacuum level to trigger a pre-set boost operation. The system utilizes air filtration, ultra violet, heat oven sterilization and secure waste storage. A manual contact tool is used closely with the area to be abraded supplanting any other control other than the pressing of the manual contact tool against the surface to be abraded, to create sufficient vacuum to trigger boost operation.

Abstract: This invention is related to the cleaning of surfaces using the hydroblasting technique, where the surface to be cleaned is exposed to a cleaning fluid mixture of liquid and abrasives which is ejected under high pressure. More particularly, this invention is related to hydroblasting apparatus and methods for providing abrasive hydroblasting cleaning fluid which do not require the direct pumping of the abrasive component of the mixture thereby greatly increasing the operating life of the high pressure hydroblasting pump. A single reactor technique is disclosed for making, and delivering under pressure, abrasive hydroblasting cleaning fluid made by nucleation of hydrolyzed solution. A multiple tube embodiment of the invention is also disclosed, as well as supplemental nucleation means and means for controlling the temperature of the nucleation process.

Abstract: A chemical mechanical polishing machine and a fabrication process using the same. The chemical mechanical polishing machine comprises a retainer ring having a plurality of slurry passages at the bottom of the retainer ring. The retainer ring further comprises a circular path. By conducting the slurry through the slurry passages and the circular, a wafer is planarized within the chemical mechanical polishing machine.

Abstract: Systems for abrasive action include machinery for creating a vacuum and positive pressure to enable flow control while providing adequate vacuum to both retrieve and capture the spent abrasive material and the abraded material. A first embodiment includes a vacuum and boost operation facilitated by the use of a foot control for high control of abrasion, cleaning and polishing. A second embodiment is for use with human tissue and includes a vacuum only system with filtered air. A third embodiment includes vacuum with automatic boost for skilled medical personnel use and uses a minimum vacuum level to trigger a pre-set boost operation. The system utilizes air filtration, ultra violet, heat oven sterilization and secure waste storage. A manual contact tool is used closely with the area to be abraded supplanting any other control other than the pressing of the manual contact tool against the surface to be abraded, to create sufficient vacuum to trigger boost operation.