Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: A system and method for rinsing and cleaning a wafer carrier and a semiconductor wafer mounted thereon during a chemical mechanical planarization (CMP) process is provided. The system includes a head spray assembly that comprises a plurality of spray nozzles positioned therein. The head spray assemble is moveably positionable between a park position and a spray position. The spray position is adjacent the wafer carrier such that liquid discharged from the spray nozzles is in liquid communication with the wafer carrier, the semiconductor wafer and the interior of the head spray assembly. The system provides aggressive and uniform cleaning and rinsing while containing and collecting the liquid discharged from the spray nozzles and the materials rinsed from the wafer carrier and semiconductor wafer.

Abstract: A polishing apparatus includes a plurality of polishing fluid supply openings terminating in the polishing surface of a polishing table, and a plurality of grooves which are formed in the polishing surface and arranged so as not to be in direct communication with the polishing fluid supply openings. The polishing apparatus further includes a polishing fluid supply system for supplying a polishing fluid to the surface of the substrate through the openings. The grooves may extend at right angles so as to define a plurality of lands therebetween, and the polishing fluid supply openings are formed through the lands.

Abstract: A method for in-situ cleaning a polishing pad and a wafer surface simultaneously during copper chemical mechanical polishing and an apparatus for carrying out such method are disclosed. The method is carried out by dispensing an acid-containing solution onto a top surface of a polishing pad while the wafer is rotated against the polishing pad without any slurry solution being dispensed. The acid-containing solution may be advantageously formed by diluting an acid such as citric acid, HCOOH, CH3COOH, HNO3, H2SO4 and HF to a concentration of less than 10 wt. % acid, preferably less than 5 wt. % acid, and more preferably less than 1 wt. % acid. The acid-containing solution may be dispensed onto a top surface of the polishing pad for a time period between about 30 sec. and about 300 sec.

Abstract: A method for sharpening the cutting knives of a knife ring chipper, which includes a knife ring and a number of knife units, the units in turn containing knives and holding plates. The knife ring is removed from the knife ring chipper, the knife units of the knife ring chipper are removed from the knife ring and the knife units are disassembled. The dull knives are moved to a first buffer station and are stored and then moved to a grinder and sharpened. The sharpened knives are moved to a second buffer station and are stored, and the sharpened knives are then mounted onto holding plates in knife units. The knife units are incorporated into a knife ring and the knife ring is incorporated into a knife ring chipper.

Abstract: The electro-chemical machining apparatus of this invention is designed to smoothing a metal film by efficiently reducing initial rough surface and removing excessive metal film with reduced damages to the metal film. For this end, the electro-chemical machining apparatus performs electro-chemical machining of an object to be machined having a metal film on the surface to be machined. Such apparatus has a means for holding the object to be machined, a wiper for wiping the surface of the object to be machined, a means for supplying electrolytic solution onto the surface of the object to be machined, a first electrode disposed at a position opposed to the surface of the object to be machined, a second electrode disposed at a peripheral portion on the surface of the object to be machined, and a power supply for causing electrical current to flow between the second electrode on the surface of the object to be machined and the first electrode.

Abstract: A polishing apparatus is used for polishing a plate-like workpiece, such as a semiconductor wafer or a glass substrate. The polishing apparatus has a polishing table having a polishing surface thereon, a plurality of workpiece holders each for holding a workpiece and pressing the workpiece against the polishing surface, and a dresser for dressing the polishing surface by pressing a desired position of the polishing surface.

Abstract: An apparatus performs at least one of cleaning and drying a semiconductor wafer while rotating the semiconductor wafer. The apparatus has a rotating mechanism for rotating the semiconductor wafer, and a sensor for detecting a reference position such as a notch or an orientation flat of the semiconductor wafer. The semiconductor wafer may be stopped from rotating to align the reference position with a predetermined position based on an output signal from the sensor.

Abstract: A wafer cleaning apparatus is capable of preventing a failure affecting the overall apparatus, even if a sealing property of a sealing member is damaged. A cleaning chamber for cleaning a wafer by a cleaning device while rotating the wafer is separated by a partition member from a power section, e.g. an air cylinder, for driving each member in the cleaning chamber. Power of the power section is transmitted to the cleaning chamber by extending a power transmission member, e.g. a connecting rod, connected to the power section into the cleaning chamber through an opening formed on the partition member. A dam 31 is provided in the opening of the partition member so as to surround the power transmission member and to protrude into the cleaning chamber.

Abstract: A lens pad is provided for use on a lens clamp. The lens pad comprises a lens-engaging surface which, in turn, has a lens-facing recess located substantially centrally thereon. The lens-engaging surface thus is annular. Alternatively, the lens-engaging surface is more resilient toward a center thereof than toward a periphery thereof. Forces exerted by the lens pad against a surface of a lens when the lens pad is pressed against the surface therefore are less concentrated than such forces would be if the lens-engaging surface had no recess or variation in resiliency. Also provided is a clamp pad assembly. The clamp pad assembly includes a lens pad and a rotatable body for rotatably connecting the lens pad, at least indirectly, to a clamp arm. The clamp pad assembly also may include a swivel member which is pivotally mounted to the rotatable body for rotation therewith and for pivoting with respect thereto, in which case, the lens pad is mounted to the swivel member for rotation and pivoting therewith.

Abstract: A polishing plant including a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus discharges a waste liquid from the cleaning apparatus are provided as separate plural drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment of waste liquids can be efficiently conducted.

Abstract: An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ionized water is used to flush the apparatus. The desired safe low pressure of the de-ionized water may be maintained by opposed one-way check valves. The flushing system prevents the slurry from clogging or becoming stagnant, and prevents valves and pumps within the apparatus from malfunctioning. Moreover, the low pressure de-ionized water will not contaminate the higher pressure slurry even in the event of a system malfunction.

Abstract: A rotary drive device of a polishing device such as a polishing table, a table for CMP or a rotary drive device of a polisher which is used to flatten an end face of a semiconductor wafer or an end face of liquid crystal glass, wherein disposed is a traction drive type reduction gear, which comprises: an externally contacting shaft formed in a ring-shaped hollow cylinder and arranged at the center; a plurality of intermediate shafts which are equidistantly disposed at the circumference of the externally contacting shaft, and at least one of which is an input shaft; and an internally contacting cylinder with which the intermediate shafts internally contact, and under free conditions, the externally contacting shaft formed in a hollow cylinder has a diameter which is a little bit larger than a diameter of an imaginary circle which externally contacts with a plurality of intermediate shafts whereby pressing load is created by means of deformation of the hollow cylinder.

Abstract: The present invention provides exemplary cluster tool systems and methods for processing wafers, such as semiconductor wafers, including exemplary grinding methods and apparatus which provide generally uniform laser marking dot depth. One method of processing wafers prior to device formation includes providing a wafer having first and second surfaces with thickness variations therebetween. The method includes laser marking the first wafer surface, and grinding the first and second wafer surfaces. The grinding removes a portion of the first wafer surface to maintain the laser marking at a uniform depth.

Abstract: The substrate processing system has a factory interface module, a chemical mechanical polisher, a cleaner, a particle monitor and a substrate transfer system disposed as an integrated system. The factory interface module may includes a chamber a storage station located in a chamber of the module to hold a plurality of substrates in a substantially horizontal position. The storage station may hold pad break-in wafers for pad preconditioning and/or monitor wafers for defects monitoring. The particle monitor may have a port coupled to the factory interface module.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus, includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

Abstract: A system for polishing a semiconductor substrate. Specifically, the system includes one or more polishing modules and a cleaning module. A rail is disposed between the polishing modules and the cleaning module. The rail has a first end disposed proximate a transfer station disposed on the polishing module and a second end disposed proximate the cleaning module. A robot is movably disposed on the rail. The robot is adapted to transfer a substrate between the transfer station and the cleaning module. Additional embodiments of the invention include having the cleaning module in an orientation perpendicular to an orientation of the rail and having the cleaning module in an orientation perpendicular to an orientation of the rail.

Abstract: An integral machine for polishing, cleaning, rinsing and drying workpieces such as semiconductor wafers. A load/unload station has a plurality of platforms for receiving cassettes of wafers to be processed. A dry end-effector of a robot retrieves wafers from the cassettes and transfers them to an index table. A transfer apparatus having wafer carrier elements picks up wafers from the index table, moves the wafers to a polishing table for polishing, and returns the wafers to the index table for further processing. A flipper moves the polished wafers to a cleaning station. The cleaning station includes scrub stations, a rinsing station and a spin dryer station, and a connective system of water tracks. A wet end-effector of the robot transfers rinsed wafers to the spin dryer station. The dry end-effector of the robot moves dried wafers from the spin dryer station back to the cassette of origination.

Abstract: A chemical-mechanical polishing (CMP) method includes applying a solid abrasive material to a substrate, polishing the substrate, flocculating at least a portion of the abrasive material, and removing at least a majority portion of the flocculated portion from the substrate. Applying solid abrasive material can include applying a CMP slurry or a polishing pad comprising abrasive material. Such a method can further include applying a surfactant comprising material to the substrate to assist in effectuating flocculation of the abrasive material. Such surfactant comprising material may be cationic which includes, for example, a quaternary ammonium substituted salt. Also, for example, the surfactant comprising material may be applied during polishing, brush scrubbing, pressure spraying, or buffing.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.

Abstract: Apparatus and method for cleaning, rinsing and drying work pieces such as semiconductor wafers. The apparatus can be combined, in an integrated apparatus, with a CMP machine. The apparatus includes one or more brush boxes with water tracks to convey work pieces to and from the brush boxes. Each brush box and its associated water track provide for the containment of cleaning agents such as HF used in the cleaning process so that different cleaning agents used in different brush boxes are kept segregated. The efficiency of the brush box is enhanced by providing for movement of work pieces back and forth through the brush box. Thus work pieces can make more than one pass through a brush box.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by the top ring and having a plurality of stages positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces. The polishing apparatus further includes a plurality of support tables removably held by the respective stages of the rotary transporter for supporting the workpieces, and a pusher for transferring the workpiece between the support table and the top ring.

Abstract: A method and apparatus for mechanically and/or chemical-mechanically planarizing and cleaning microelectronic substrates. In one embodiment, a processing medium for planarizing and finishing a microelectronic substrate has a planarizing section with a first body composed of a first material and a finishing section with a second body composed of a second material. The first body may have a relatively firm planarizing surface to engage the substrate, and the first body supports abrasive particles at the planarizing surface to remove material from the substrate during a planarizing cycle. The second body may have a relatively soft buffing or finishing surface clean the abrasive particles and other matter from the substrate during a finishing cycle. The planarizing and finishing sections may be fixedly attached to a backing film, or they may be attached to one another along abutting edges with or without the backing film.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The polishing apparatus further includes a rotary transporter disposed in a position which can be accessed by said top rings and having a plurality of portions positioned on a predetermined circumference from a center of rotation of the rotary transporter for holding the workpieces.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least three cleaning apparatuses for cleaning polished workpieces, and a transfer structure for transferring the polished workpieces between at least three cleaning apparatuses. The transfer structure comprises a plurality of robots and is capable of changing transfer routes between the three cleaning apparatuses.

Abstract: A polishing apparatus and a polishing method can effectively prevent large diameter particles from being fed with slurry to an object to be polished. A large-diameter particle screener blocks or disperses large diameter particles from entering the slurry. Then, slurry free from large diameter particles is taken up from a slurry container by an intake pipe and fed to the object to be polished.

Abstract: The present invention further provides exemplary methods and apparatus for grinding wafers, and preparing wafers for such grinding. One method (740) includes providing (745) a cut wafer having initial thickness variations between first and second wafer surfaces. A curable liquid, which in one embodiment is a liquid polymer, is applied (750) to the first wafer surface and cured (755) to form a substantially smooth outer surface. The wafer is positioned (760) on a grinding tool to expose the second wafer surface to a grinder for subsequent grinding operations. As a result, waves or undulations in the wafer first surface are not transferred to the wafer second surface during or after grinding.

Abstract: A method is suitable for cleaning substrates, after polishing, that require a high degree of cleanliness, such as semiconductor wafers, glass substrates, or liquid crystal displays. The method comprises polishing a substrate using an abrasive liquid containing abrasive particles, and cleaning a polished surface of the substrate by supplying a cleaning liquid having substantially the same pH as the abrasive liquid or similar pH to the abrasive liquid so that a pH of the abrasive liquid attached to the polished surface of the substrate is not rapidly changed.

Abstract: A polishing apparatus that can effectively and efficiently remove potassium and other alkaline metals comprises integrally a polishing unit for polishing an object by means of a polishing agent and a cleaning unit for cleaning the polished object. The polishing unit and the cleaning unit have means for isolating the internal atmosphere from the external atmosphere and the cleaning unit has a means for cleaning the polished object by bringing hot pure water or steam of pure water into contact with the polished object. With a cleaning method hot pure water is brought into contact with the polished object without drying it after having been polished by such a polishing apparatus.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

Abstract: An end face polishing apparatus in which whereas a jig board mounted with a rod-like member is supported by an apparatus main body by a supporting mechanism, a polishing board mounted with a polishing member for polishing the rod-like member is supported by the apparatus main body rotatably and pivotably by a drive mechanism for polishing the rod-like member mounted to the jig board by the supporting mechanism by pressing the rod-like member to the rotating and pivoting polishing board, wherein the polishing member is mounted to the polishing board attachably thereto and detachably therefrom, further comprising an automatic interchanging device for interchanging the polishing member which is mounted to the polishing board and which has been used with the polishing member which is stored at a predetermined position and which is to be used by which the operational performance is promoted.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage, A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A method for restoring a used semiconductor substrate or wafer, the method comprising using a PVA scrubbing means to remove particles or residues on the surface of the substrate or wafer such that the substrate or wafer may return to their respective virgin state for reuse, the method may further comprising a procedure of acid stripping for removing deposits on the surface of the substrate or wafer before the procedure of scrubbing, or a procedure of CMP for polishing the substrate or wafer before the procedure of scrubbing, or a procedure of cleaning the substrate or wafer after the procedure of scrubbing.

Abstract: A surface machining apparatus comprises a suction transfer device that is capable of transferring a ground thin wafer held thereon without damaging it. After the wafer is ground at two different grinding stages, the suction transfer device transfers the wafer from a chuck table to a cleaning stage. A holding surface of a suction disc in the suction transfer device is composed of a porous member having substantially the same diameter as the wafer, so that the entire surface of the wafer can be held on the holding surface of the suction disc.

Abstract: The present invention describes an apparatus for removing scratches from a photographic element. The apparatus includes an application device for applying a wax composition to a surface of a moving photographic web; and a buffing device for buffing the surface of the web having the applied wax composition. The present invention is also a method for removing scratches from a photographic element. The method includes the steps of providing a moving photographic web, applying the wax composition to a surface of the photographic web, and rubbing the wax composition with sufficient force thereby removing the residual wax composition to produce a refinished surface substantially free of all defects and scratches.

Abstract: The present invention provides methods and apparatus which permit the in-process, in-situ, substantially real time measurement of the actual thickness of a surface layer of a workpiece, e.g., a semiconductor wafer. A probe is disposed proximate the outer perimeter of a polishing pad on a CMP table such that the probe establishes optical contact with the wafer surface as a portion of the wafer extends beyond the outer perimeter of the polishing pad. A reflected signal received by the probe is analyzed to calculate the thickness of the surface layer. Alternatively, the reflective characteristics of the semiconductor layers may affect the nature of the reflected signal; changes in the reflected signal can be detected to indicate when a metallic layer has been removed from an oxide layer.

Abstract: A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.

Abstract: An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ionized water is used to flush the apparatus. The desired safe low pressure of the de-ionized water may be maintained by opposed one-way check valves. The flushing system prevents the slurry from clogging or becoming stagnant, and prevents valves and pumps within the apparatus from malfunctioning. Moreover, the low pressure de-ionized water will not contaminate the higher pressure slurry even in the event of a system malfunction.

Abstract: In order to measure a thickness of a surface to be polished of a material to be polished for a short time, two-dimensional images are obtained from a light reflected from the surface to be polished of the material to be polished, a location at which a thickness is to be observed is specified by the obtained two-dimensional images, and thickness measurement is carried out.

Abstract: The present invention provides a method and apparatus for delivering one or more rinse agents to a surface, such as a polishing pad surface and preferably one or more polishing fluids. The invention also provides a method of cleaning one or more surfaces, such as a polishing pad surface and a substrate surface, by delivering a spray of one or more rinse agents to the surface and, preferably, causing the rinse agent to flow across the surface from a central region to an outer region where unwanted debris and material is collected.

Abstract: A polishing plant includes a polishing apparatus having a top ring for holding a workpiece and a turn table for polishing a surface of the workpiece held by the top ring. A cleaning apparatus has cleaning machines for cleaning the workpiece polished by the polishing apparatus. At least one drainage pipe connected to the polishing apparatus discharges a waste liquid from the polishing apparatus, and at least one drainage pipe connected to the cleaning apparatus to discharges a waste liquid from the cleaning apparatus are provided as separate plural of drainage pipe lines, depending on the type of waste liquid. By use of the polishing plant of the present invention, treatment waste liquids can be efficiently conducted.

Abstract: Apparatus for maintaining the condition of cutting fluids in a machine tool sump and for the removal of tramp oil from the cutting fluid has a pump to draw cutting fluid from the machine tool sump and transfer the fluid to an auxiliary tank where the fluid outlet is directed to drive a turbine wheel for rotation of a shaft and simultaneously aerate the cutting fluid. Drums on the shaft are partially submerged so as to be wetted by the tramp oil content. Wiper blades bear against the drum surfaces to strip the tramp oil from the drums as they rotate. A collecting trough is positioned below the wiper contact line to receive the tramp oil as it is stripped from the drum and drain it off to a waste container. In this manner, the cutting fluid is in constant circulation, even when the machine tool is idle.

Abstract: An alternative method and device for accessing the circuit region on a flip chip die are provided. The new method and device provide increased accuracy for accessing the electrical contacts within the circuit region. Such a method and device is necessary in order to analyze and resolve flaws among the electrical contacts between a flip chip die and the chip package. The new method and device is precise enough to avoid adding defects upon approach to the contact intended for analysis. Specific regions of the electrical contact can be isolated for study. The technique is equally efficient for mass fabrication design testing and analysis.

Abstract: A processing apparatus for efficiently discharging both polishing liquid flowing out a surface plate and mist of polishing liquid produced through polishing with the use of simple measures, is composed of a drain receiver which is provided in proximity with the outer periphery of the surface plate, and which serves as both recovery means for recovering the polishing liquid flowing out from the surface plate and a suction means for sucking up the mist of polishing liquid produced through polishing, a common discharge pipe connecting the drain receiver to a gas-liquid separating mans, for simultaneously transferring both polishing liquid and mist of polishing liquid into the gas-liquid separating means therefrom, and a suction pump and a liquid processing means connected to the gas-liquid separating means.

Abstract: An apparatus is provided with a wafer polishing tool, a source of slurry, and a source of low pressure de-ionized water. The slurry is supplied to the tool for chemical-mechanical planarization. Periodically, the slurry source is shut off and the de-ionized water is used to flush the apparatus. The desired safe low pressure of the de-ionized water may be maintained by opposed one-way check valves. The flushing system prevents the slurry from clogging or becoming stagnant, and prevents valves and pumps within the apparatus from malfunctioning. Moreover, the low pressure de-ionized water will not contaminate the higher pressure slurry even in the event of a system malfunction.