Abstract: A glass-plate working apparatus (1) includes a grinding means (7) for grinding a peripheral edge (6) of a glass plate (2); and a grinding supporting means (9) for supporting the glass plate (2) whose peripheral edge (6) is to be ground by the grinding means (7), wherein the grinding supporting means (9) includes a grinding supporting table (101), a plurality of suction cups (102) which are held on the grinding supporting table (101) by being attached by suction to the grinding supporting table (101) and suck and hold the glass plate (2) by sucking the glass plate (2) whose peripheral edge (6) is to be ground, and an arranging means (103) for disposing the plurality of suction cups (102), respectively, at positions corresponding to the shape of the glass plate (2) to be ground.

Abstract: A wall polishing machine comprises a handle. The handle comprises at least two longitudinally arranged rod components. Each of the rod components is disposed with a dust guiding pipe therein. In any pair of adjacent rod components, the dust guiding pipe of a first rod component is exposed from the first rod component and has an outwardly exposed end which is inserted into a second rod component to connect to the dust guiding pipe of the second rod component, and secure connection is attained by means of a clamping component. As the handle is designed as being formed by at least two longitudinally arranged rod components connected via a clamping component, each of the rod components can be packed after being disassembled when the machine is not in use, therefore offering convenience in storage and carrying to users.

Abstract: A method of surface grinding a Zr-rich bulk amorphous alloy article includes providing a substrate; providing a first surface grinder for rough surface grinding; and providing a second surface grinder for finish surface grinding. During the rough surface grinding, the rotating speed is in the range from 20 r/min to 30 r/min, the grinding time period is from 3 minutes to 12 minutes, and the grinding pressure is from 1 kg/cm2 to 2 kg/cm2, and a first pump circularly conveys a first lubricant to a first rotating abrasive wheel. During the finish surface grinding, the rotating speed is in the range from 30 r/min to 40 r/min, the grinding time period is from 5 minutes to 7 minutes, and the grinding pressure is from 1 kg/cm2 to 2 kg/cm2, and a second pump circularly conveys a second lubricant to a second rotating abrasive wheel.

Abstract: An operating method improves the running behavior of gearwheels negatively noticed upon gearwheel testing and is performed by a burnishing device. The gearwheels that were rejected from the production process may be optimized rapidly and in a targeted way so that they may be returned back into the production process. The tooth flanks of a gearwheel to be machined are, in a first method step, mechanically freed of particles adhering to the surfaces of the tooth flanks or slight protrusions protruding therefrom using a first gearwheel machining tool having a machining wheel coated with an abrasive agent. Subsequently, in a second method step in a second gearwheel machining tool known as a burnishing machine, the gearwheel is chucked between gearwheel-shaped rolling tools, the so-called burnishing wheels, and rolled without material abrasion.

Abstract: The present invention is a hand-held device that integrates and enables one or more or a combination of functions of spraying, cleaning, drying, waxing, polishing and shining of a floor or a surface including that of a vehicle. The present invention has one or more brushes rotated by one or more electric motors powered by a power source or a built-in and/or removable and/or rechargeable battery pack or by water pressure and is capable of discharging, dispersing or spraying one or more or a combination of air, water, steam, compressed air, pressurized water, pressurized steam, hot air, detergent, waxing agent and polishing agent. The discharging, dispersing or spraying of one or more or a combination of these materials through select nozzles along with the rotation of the brush or brushes enables multiple functions to be accomplished in a single pass of the device over the surface.

Abstract: A novel removal device for removing adherent of the present invention has a process tank communicated respectively with a loading port through which an article-to-be-processed, which is composed of a film-like or sheet-like mold base having an adherent adhered thereon in a layer form, is loaded, and with the base discharge path through which the base removed from the adherent is output, and houses therein the article-to-be-processed; a spindle disposed in the process tank, and rotationally driven by a drive motor; a plurality of rotating blades, each of which having the base end fixed to the spindle, and having the top end located inside the process tank; a large number of openings provided to the process tank so as to allow therethrough passage of the adherent; and a plurality of receiving components consecutively disposed below the process tank along the longitudinal direction of the process tank, wherein the individual receiving components have suction hoses respectively at the lower ends thereof, which ar

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: For complex CMP processes requiring the removal of different dielectric materials, possibly in the presence of a polysilicon material, a slurry material may be adapted at the point of use by selecting an appropriate pH value and avoiding agglomeration of the abrasive particles. The in situ preparation of the slurry material may also enable a highly dynamic adaptation of the removal conditions, for instance when exposing the polysilicon material of gate electrode structures in replacement gate approaches.

Abstract: A cut section checking/aligning unit simultaneously checks cut sections of unit liquid crystal display panels that are separated from within first and second base substrates and aligns the unit liquid crystal display panels to a reference position. A grinding unit grinds edges of the unit liquid crystal display panels. The cut section checking/aligning unit and the grinding unit are integrated within a grinding device.

Abstract: The present invention provides a method of separating nickel bearing sulphides from mined ores or concentrates of mined ores that contain talc particles is disclosed. The method comprises adjusting the Eh of a slurry of mined ores or concentrates of mined ores and making particles of nickel bearing sulphides less hydrophobic than talc particles and floating the nickel bearing sulphide particles from the slurry.

Abstract: A method and device for cleaning cymbals in which a cymbal is secured to a rotatable device, the rotatable device is rotated, and a cleaning agent is applied to the rotating cymbal after which an abrasive member is translated radially over the surface of the rotating cymbal thereby cleaning the cymbal. The device for cleaning a cymbal has a housing and a rotatable motor therein. The motor has an upstanding threaded shaft onto which a cymbal is secured with a cooperating threaded fastener. A regulator controls the speed of rotation. As the cymbal rotates within the housing, the cleaning agent is applied and an abrasive member is translated radially over the surface of the rotating cymbal.

Abstract: A semiconductor process includes polishing a substrate with a slurry in an enclosure. Polishing the substrate is stopped. First mist is injected into the enclosure, such that the first mist has at least about 80% of saturation of a liquid or gaseous solvent in a carrier within the enclosure.

Abstract: A multi-head centerless belt grinder for removing material from a workpiece includes a common base and a plurality of grinding heads spaced apart from one another and mounted to the common base. Each grinding head includes a moveable work rest blade, a moveable regulating wheel and a moveable grinding belt positioned by servomotors to centerless grind the workpiece along a common axis of rotation. The grinder is programmable for rapid machine changeover and set-up typically within 2-5 minutes to accommodate a large range of workpiece diameters. This feature results in improved productivity and output as well as greater flexibility for scheduling numerous workpiece diameters within a normal eight-hour work shift. A trough may extend beneath and between each of the grinding heads to more efficiently collect and transfer grinding swarf generated during the grinding process to a filter operable to separate solids within the swarf from coolant.

Abstract: A grinding device (30) for grinding an object (31) at high accuracy has a support table (32) on which the object (31) is supported and fixed, a vertically movable rotating shaft (34) arranged above the support table, a drive device (35) for vertically moving the rotating shaft, a drive device (36) for rotating the rotating shaft, an elastic body (37) fixed to a base section of the rotating shaft, an annular grind stone (38) provided to a bottom of the elastic body, ultrasonic vibrators (39) arranged on the elastic body, and a transmission unit (41) for transmitting electric energy to the ultrasonic vibrators, in which the elastic body is an annular elastic body and a connection plate (42) is provided between the annular elastic body and the base section of the rotating shaft under such condition that the connection plate and the annular elastic body are connected by connection means (45) having alternately arranged connection sections and space sections and each ultrasonic vibrator is arranged at a predetermi

Abstract: An abrasive waterjet apparatus comprising a water jet fluid flow circuit, a positive displacement pump connected to the water jet fluid flow circuit, a pressure fluctuation equalising device (24) for said circuit, and an abrasive cutting nozzle assembly. The pressure fluctuation equalising device (24) comprises a high pressure chamber (27?) connected to the waterjet fluid flow circuit, a low pressure chamber (29), and a moveable pressure equalising member (20, 21) that separates said chambers. In order to equalise pressure fluctuations in the waterjet fluid flow circuit, the moveable pressure equalising member (20, 21) is arranged to alter the volume of the high pressure chamber (27?).

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Abstract: A grinding machine (10) composed of a support table (12) for supporting an object (11) to be ground, a rotating shaft (13a) vertically arranged above the support table, and a grinding tool (40) connected to a lower end of the rotating shaft in parallel with the support table, in which the grinding tool is composed of a grind stone-holding member (32) on which a circular ultrasonic vibrators (31a, 31b) electrically connectable to an electric source are fixed and a circular grind stone (33) attached to a lower end of a periphery of the grind stone-holding member, in which the grind stone-holding member of the grinding tool has a continuous or discontinuous circular air space area (36) composed of multiple circular air space regions which are composed of circularly formed or arranged discontinuous air spaces between a position of the circular ultrasonic vibrator and a position at which the grind stone-holding member is connected to the rotating shaft, whereby the multiple circular air space area keeps an ultraso

Abstract: A chemical-mechanical polishing apparatus including a table top, a transfer station mounted on the table top, a plurality of polishing stations mounted on the table top, a plurality of washing stations, and a plurality of carrier heads supported by a support member rotatable about an axis. Each washing station is located between a first polishing station and either a second polishing station or the transfer station, and the transfer station and the plurality of polishing stations are arranged at approximately equal angular intervals about the axis.

Abstract: A device for restoring a light permeability of headlight lenses of motor vehicles has a holder, a working layer attached to the holder and adapted to clean and polish a surface of a headlight lense when the device is moved relative to the latter, and a sponge-like element located between the holder and the working layer and formed so that it applies an elastic biasing action to the working layer to provide a cleaning and polishing action by the working layer and at the same time to absorb a liquid required for the cleaning and polishing action.

Abstract: Embodiments of the present invention provide a polishing module configured to use in a polishing system. The polishing module comprises a base member, two polishing stations disposed on the base member, one load cup, and a carousel having three polishing heads.

Abstract: A hand-held machine tool has an electric drive motor (3), arranged in a housing (2), for driving a tool (5), wherein a dust collecting container (7) is connected to the housing and has in its wall a container connector (8), which can be pushed axially onto a blow-out connector (6) in the housing. When the connection is disconnected, the wall (11) of the dust collecting container and an assigned wall (15) on the housing are in contact by way of at least one common supporting point, wherein the supporting point is displaced in the axial direction when the dust collecting container rotates about a longitudinal axis (9) of the container connector.

Abstract: A wafer grinding and tape attaching apparatus and method, the method includes providing a wafer to a chuck table, grinding a back side of the wafer, providing a wafer ring having dicing tape and attaching the dicing tape to the back side of the ground wafer.

Abstract: A welding robot (1) comprising a stand (2) pivotally receiving a trunk-forming portion (3) having one end (5) of an articulated arm (6) pivotally mounted thereon, the arm having an opposite end (7) provided with a clamp (8) fitted with welding electrodes, the robot including an electrode grinder (9) mounted on a portion (3) of the robot that is situated in a zone that is accessible to the clamp.

Abstract: A bevel/backside polymer removing method removes multi-layered bevel/backside polymers adhering to a bevel surface and a backside of a target substrate. The multi-layered bevel/backside polymers include an inorganic layer and an organic layer. The bevel/backside polymer removing method includes mechanically destroying the multi-layered bevel/backside polymers and heating residues of the multi-layered bevel/backside polymers mechanically destroyed.

Abstract: Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.

Abstract: An eyeglass lens processing apparatus includes; a drilling tool for forming a hole in an eyeglass lens; a first movement mechanism part that relatively moves the drilling tool relative to the lens; a target lens shape input section that inputs data of a two-dimensional target lens shape of the lens; a hole-position input section that inputs data of a position of a hole to be formed in a refractive surface of the lens, which is designated on a two-dimensional coordinate system of the input target lens shape; a measurement part that measures a shape of the refractive surface of the lens; a calculation section that corrects at least part of the input hole-position data into hole-position data along the measured refractive surface shape of the lens and determines hole processing data based on the corrected hole-position data; and a control section that controls the first movement mechanism part based on the determined hole-processing data.

Abstract: A polishing machine for optical elements includes: —a spindle arranged to rotationally drive an optical element; —a polishing tool mobile relative to the spindle; —a front face provided with a door enabling the access to the spindle and to the polishing tool. The polishing tool is mounted on a body which is rotationally mounted on sliding members by way of a first axis, the sliding members being substantially perpendicular to the front face.

Abstract: A method of changing the crystallographic orientation of a single crystal body is disclosed that includes the steps of characterizing a crystallographic orientation of the single crystal body and calculating a misorientation angle between a select crystallographic direction of the single crystal body and a projection of the crystallographic direction along a plane of a first exterior major surface of the single crystal body. The method further includes removing material from at least a portion of the first exterior major surface to change the misorientation angle.

Abstract: A machine for finishing an object comprising feed members to feed the object along a reference plane (P1), and at least a work station provided with a tool which contacts the object in a work zone (Z) near the reference plane (P1). The machine comprises two lateral supporting walls arranged substantially orthogonal both to the reference plane (P1) and also to the median plane (P2), which support the work station laterally, in order to define with the work station a modular structure able to be selectively associated with other modular structures along the direction of feed of the object.

Abstract: To grind a peripheral surface of a rotated work (10), by a rotary grindstone (22) rotated by a wheel spindle 21, a rotary brush (40) is mounted to one side of the rotary grindstone (22), so that it is rotated along with the rotary grindstone (22). Subsequently to the grinding of the work (10) by the rotary grindstone (22), the rotary grindstone (22) and the work (10) are moved axially relative to each other, and a ground surface of the work (10) is brushed by the rotary brush (40), whereby the polishing of the ground surface of the work (10) is achieved. Thus, the shifting of the work as well as an exclusive deflashing device and an exclusive polishing device are not required, which can contribute to a reduction in machining cost.

Abstract: A CMP apparatus and process reduces material re-deposition due to pH transitions. The CMP process reduces the re-deposition of material by performing a water rinse between CMP stages. A CMP apparatus, which performs CMP process, may reduce re-deposition by including a water rinse between two CMP stages that utilize different pH slurries.

Abstract: The present invention provides a blade sharpening device designed for sharpening a blade for a uniform sharpening of the edge thereof. The blade sharpening device contains a base having a guide slidably movable relative to the base. The guide includes a material that receives an impression of a blade defining a blade contour. A blade holder is attached to the base for securing the blade while being sharpened. A carriage contains an elongated structure for interacting with the material of the guide which has received an impression of the blade defining a blade contour. The guide defines a sharpening path substantially aligning with the blade contour. The carriage also has an abrasive surface for sharpening the blade. In operation, the guide and carriage direct the movement of the abrasive surface along the contour of the blade for a uniform sharpening of the edge thereof.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring re-positioning processes to be conducted simultaneously on at least two drill bits.

Abstract: The invention relates to a machining machine for lenses, which comprises a first workpiece drive, configured as the transport receptacle and having a workpiece spindle, a workpiece changer for exchanging workpieces between the workpiece drive and a workpiece stock, and a machining station for machining a workpiece. The workpiece spindle of the workpiece drive can be rotated about an axis of rotation (c1). The workpiece drive can be swiveled about a first swiveling axis (b1) which is arranged at a right angle to the axis of rotation (c1). The work piece drive can be rotated about an axis of rotation (k) which is arranged at a right angle to the first swiveling axis (b1). The machining machine according to the invention is characterized in that at least one further workpiece drive is provided and has a spindle that can be rotated about a respective axis of rotation (c1, c2).

Abstract: A self-propelled mobile marking removal system which comprises a mobile vehicle assembly including a chassis, a high pressure liquid pump in fluid connection with a liquid reservoir contained within said chassis, said high pressure liquid pump is further in fluid connection with a blast head, said blast head having at least one high pressure nozzle for delivering liquid at high pressure to a marked surface, a waste removal hose fluidly coupled with said blast head and a sump for collection of liquid and debris, said blast head positionable along a left or a right side of said chassis, a mechanical abrasion means, said mechanical abrasion means positionable along a left or a right side of said chassis in front of said blast head, said mechanical abrasion means is constructed and arranged to substantially remove marking material protruding above said marked surface and said blast head constructed and arranged to substantially remove any marking material extending below said marked surface.

Abstract: A draining device for removing processing water attached to a lens includes: a first lens holding shaft to which a cup attached to a refractive surface of the lens as a processing jig can be fitted; and a rotating unit which rotates the first lens holding shaft to remove the water by centrifugal force.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base, a first wash station disposed on the base adjacent to the first of the four polishing station, and a carousel rotatable about a carousel axis and supported by the base, wherein the carousel comprises six substrate heads alignable to any of the four polishing stations, the two load cups and the first wash station.

Abstract: A system for processing a conductive surface on a front surface of a wafer to form a metallic interconnect structure is disclosed. The system for processing comprises an electrochemical mechanical processing (ECMPR) module configured to form a substantially planarized conductive layer on the front surface of the wafer, a chamber within the ECMPR module configured to remove conductive material from an edge region of the wafer, a CMP module configured to receive the wafer from the ECMPR module and polish the planarized conductive layer on the surface of the wafer to form the metallic interconnect structure, and a robot configured to transfer the wafer from the ECMPR module to the chemical mechanical polish (CMP) module. In one aspect of the invention, the ECMPR module deposits conductive material on the front surface of the wafer. The ECMPR module removes at least a portion of the conductive layer from the front surface of the wafer.

Abstract: A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface roughness produced by the electroerosion.

Abstract: A system and a method of forming copper interconnect structures in a surface of a wafer is provided. The method includes a step of performing a planar electroplating process in an electrochemical mechanical deposition station for filling copper material into a plurality of cavities formed in the surface of the wafer. The electroplating continues until a planar layer of copper with a predetermined thickness is formed on the surface of the wafer. In a following chemical mechanical polishing step the planar layer is removed until the copper remains in the cavities, insulated from one another by exposed regions of the dielectric layer.

Abstract: Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier.

Abstract: The present invention relates to an apparatus and method for polishing semiconductor substrates with improved throughput and reduced foot print. One embodiment of the present invention provides an apparatus for polishing a substrate. The apparatus comprises a base, four polishing stations disposed on the base, two load cups disposed on the base and a carousel supported by the base. The carousel comprises six substrate heads and is rotatable about a carousel axis. Each of the six substrate heads is configured to align with any one of the four polishing stations and the two load cups.

Abstract: The invention provides a burr removal apparatus for laser beam machine which removes burrs formed on the top surface of a workpiece. When, for example, pilot holes PH are produced in a workpiece W by a laser machining tool 60, molten particles scatter to form whisker-like burrs Wb on the top surface of the workpiece. A whisker-like burr removal apparatus 700 has a machining head 710 which is raised and lowered by a cylinder 720. It removes the whisker-like burrs Wb with a machining tool 730.

Abstract: The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a washing station, and a marking station.

Abstract: A draining device for removing processing water attached to a lens includes: a first lens holding shaft to which a cup attached to a refractive surface of the lens as a processing jig can be fitted; and a rotating unit which rotates the first lens holding shaft to remove the water by centrifugal force.

Abstract: A polishing apparatus is used for chemical mechanical polishing a copper (Cu) layer formed on a substrate such as a semiconductor wafer and then cleaning the polished substrate. The polishing apparatus has a polishing section having a turntable with a polishing surface and a top ring for holding a substrate and pressing the substrate against the polishing surface to polish a surface having a semiconductor device thereon, and a cleaning section for cleaning the substrate which has been polished. The cleaning section has an electrolyzed water supply device for supplying electrolyzed water to the substrate to clean the polished surface of the substrate while supplying electrolyzed water to the substrate.

Abstract: A substrate processing apparatus is used for removing surface irregularities occurring on a peripheral portion (a bevel portion, an edge portion, and a notch) of a substrate, such as a semiconductor wafer, and films deposited as a contaminant on the peripheral portion of such a substrate. The substrate processing apparatus includes an edge-portion polisher for pressing a polishing tape against an edge portion of a substrate and causing relative movement between the polishing tape and the substrate to polish the edge portion of the substrate, and a bevel-portion polisher for pressing a polishing tape against a bevel portion of the substrate and causing relative movement between this polishing tape and the substrate to polish the bevel portion of the substrate.

Abstract: The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) for supplying a semiconductor wafer (6) to be polished to the processing section and receiving a polished semiconductor wafer (6), and a cleaning chamber (20) disposed between the processing section and the receiving section and defined by partitions (102, 103) with shutters (22, 24) which separate the processing section and the receiving section from each other.

Abstract: An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.