Abstract: Apparatus for maintaining the condition of cutting fluids in a machine tool sump and for the removal of tramp oil from the cutting fluid has a pump to draw cutting fluid from the machine tool sump and transfer the fluid to an auxiliary tank where the fluid outlet is directed to drive a turbine wheel for rotation of a shaft and simultaneously aerate the cutting fluid. Drums on the shaft are partially submerged so as to be wetted by the tramp oil content. Wiper blades bear against the drum surfaces to strip the tramp oil from the drums as they rotate. A collecting trough is positioned below the wiper contact line to receive the tramp oil as it is stripped from the drum and drain it off to a waste container. In this manner, the cutting fluid is in constant circulation, even when the machine tool is idle.

Abstract: A modified chemical-mechanical polishing apparatus is described. The apparatus includes: (i) a polishing pad 104 providing a surface against which a surface of an integrated circuit substrate 116 is polished; (ii) an anode 103 on which the polishing pad is secured, the anode including an electrolyzable conductive material; and (iii) a voltage source 106 electrically connecting the anode to the integrated circuit substrate in such a way that when a voltage is applied from the voltage source in the presence of slurry 114 admixed with an electrolyte composition on the polishing pad, an electrolytic cell results in which the conductive material deposits on the surface of the integrated circuit substrate. A process of depositing a conductive material on and polishing a surface of an integrated circuit substrate simultaneously is also described.

Abstract: An apparatus for calibrating the centering of polishing heads in a polishing machine that is equipped with a plurality of spindles onto which polishing heads are mounted and a method for using such apparatus are disclosed. In the apparatus, a calibration disc is provided which has a hollow shaft mounted at a center of the bottom surface of the disc. A centering pin slidingly engaging an elongated cavity in the hollow shaft such that its protruded tip portion may be adjusted by using a locking device such as a set screw for different calibration procedures. The present invention novel apparatus can be used to calibrate the positioning of a polishing head mounted in a spindle with a pedestal in a load cup that is equipped with a center alignment aperture. The calibration can be conducted not only in the X, Y direction (or in the circumferential direction) of the spindle movement, but also in the Z direction (or a sweep direction) of the traversing spindle that occurs during a polishing operation.

Abstract: A machine is provided to make possible many precision operations on wood and some metals on a miniature scale for miniaturists, modelers and hobbyists. Said machine, as seen in FIG. 25 comprises a base,200, an x-y table,212,224, a y only table,212, a stationary table,212 (when locked) an elevator 225 or z axis mechanism and a modular over-arm assembly 250 for accurately positioning and holding standard hand tools such as a hand drill, hand grinder, moto-tool, flexible shaft type tools and heat gun to perform operations otherwise impossible with such tools.

Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a turntable having a polishing surface thereon, and a top ring for holding a workpiece to be polished and pressing the workpiece against the polishing surface on the turntable. A pusher is disposed in a position for transferring the workpiece to and from the top ring, and has a workpiece support which can be lifted to a position close to the top ring for transferring the workpiece to and from the top ring. When the workpiece support receives a polished workpiece and is lowered, a cleaning liquid is ejected substantially simultaneously from three cleaning nozzle units that are disposed in respective three positions to clean the upper and lower surfaces of the workpiece and the lower surface of the top ring.

Abstract: A polishing apparatus for polishing semiconductor wafers has a space divided into a plurality of rooms cleaned to different degrees. A storage unit for storing semiconductor wafers is disposed in one of the rooms. A polishing unit for chemically and mechanically polishing a semiconductor wafer supplied from the storage unit is disposed in another one of the rooms. A delivery gate is disposed between the storage unit and the polishing unit and has a temporary storage chamber defined therein for temporarily storing a semiconductor wafer therein.

Abstract: A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a pair of cassette trays, a pair of grinding assemblies, a pair of optical assemblies, a pair of primary cleaning assemblies, a pair of secondary cleaning assemblies, a pair of inversion assemblies, a pair of workhead assemblies, a bumping assembly, and a loader assembly attached thereto. The workhead and loader assemblies are used to transport drill bits between the cassette trays and other assemblies in a selected sequence which is controlled and coordinated by a programmable control device. The control device is electrically interfaced to each of the assemblies and allows the cutting tip re-sharpening and locating ring repositioning processes to be conducted simultaneously on at least two drill bits.

Abstract: A probe apparatus according to the present invention comprises a stage carrying an object of inspection thereon and rotatable and movable in the horizontal and vertical directions, a probe located over the stage and adapted to be brought into contact with the object of inspection on the stage in order to subject the object to electrical inspection, a polisher carrying section attached to the stage and capable of carrying thereon a polisher for polishing the probe, a storage mechanism for storing the polisher, and a transportation mechanism for transporting the polisher between the storage mechanism and the polisher carrying section.

Abstract: In order to reclaim defective articles, wafers carried in from a loading unit are transported to a wafer stocker unit, a polishing unit, a pre-rinsing unit, a rinsing unit, a spin dehydrating unit and a drying unit in the named order, and in a defect inspecting device, defective articles are sorted and the remainder are taken out as products out of an unloading unit. The defective articles are classified in a discriminating device in conformity with the kinds of the defects thereof, and are returned to the polishing unit, the rinsing unit or the drying unit through a return duct.

Abstract: A de-marking apparatus and method are provided for de-marking a marked packaged integrated circuit (IC). The de-marking apparatus comprises a de-marking head for removing a thin layer of material from the marked surface. The apparatus may also include mechanisms for feeding, transferring and conveying the marked ICs to and from the de-marking head, and washing, drying, and receiving the de-marked ICs in an automated fashion. The method includes physically removing package material from a marked IC surface and producing a surface reflectivity suitable for re-marking with a laser beam.

Abstract: A semiconductor wafer chamfer polishing method for polishing chamfers formed on the edges of semiconductor wafers includes rotating a semiconductor wafer; pressing a polishing cloth against a chamfer of the semiconductor wafer with sufficient pressure to elastically deform the polishing cloth, while supplying polishing fluid to the chamfer; sliding the polishing cloth along an incline of the chamfer from an outer edge toward a center of the semiconductor wafer so as to form a bulge portion of the polishing cloth which contacts an outer surface of the semiconductor wafer, thereby polishing the outer surface along with the chamfer of the semiconductor wafer.

Abstract: A precision polishing apparatus has a first hermetically sealed chamber provided with polishing means, a third hermetically sealed chamber capable of communicating with the first hermetically sealed chamber through a second hermetically sealed chamber, first and second opening-closing means for alternately placing the first and the third hermetically sealed chamber in communication with with the second hermetically sealed chamber, and atmosphere pressure control means for controlling the atmosphere pressure of the first and the second hermetically sealed chamber so that the atmosphere pressure of the first hermetically sealed chamber may become lower than the atmosphere pressure of the second hermetically sealed chamber when at least the first opening-closing means is opened.

Abstract: A robotic transport apparatus is capable of providing an effective waterproofing function of working components without using mechanical seals. The robotic transport apparatus includes a robot body, an arm assembly extendably attached to the robot body, and a workpiece holding section attached to the arm assembly. A pan member for waterproofing of the robot body is provided above the robot body and has an area not smaller than the workpiece holding section.

Abstract: An apparatus for polishing and cleaning a semiconductor wafer (3028) is disclosed to substantially improve the efficiency of chemical-mechanical polishing. The apparatus reduces contamination to a clean room during fabrication of VLSI circuits. The apparatus includes a table (3026) supporting the wafer, and a polishing pad (3024) disposed on a surface of the wafer. The polishing pad performs chemical-mechanical polishing on the surface of the wafer. Further, at least one cleaning head (3042, 3044, 3046) is provided for cleaning the surface of the wafer. The wafer and the cleaning head are housed in a chamber (30). A guiding means (32) is used for guiding the cleaning head over the wafer to clean the surface of the wafer.

Abstract: A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.

Abstract: A polishing apparatus polishes a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus includes a storage cassette for storing workpieces to be polished, at least two polishing units each having at least a turntable with a polishing cloth mounted thereon and a top ring for supporting a workpiece and pressing the workpiece against the polishing cloth, and a cleaning unit for cleaning a workpiece which has been polished by either one of the polishing units in such a state that the workpiece is removed from the top ring. The polishing apparatus further includes a transfer robot for transferring a workpiece between two of the storage cassette, the polishing units and the cleaning unit.

Abstract: A polishing facility integrates separate components of polishing such as wafer transport, polishing, cleaning and drying in one standardized facility to provide efficient polishing operation at low cost. The facility is designed to deal with a variety of different types of wafers, including different types of surface film, and is designed also to enables quick and low cost upgrading of the facility to meet advancing requirements of customers. The polishing facility can be placed within a cleanroom to provide efficient handling of polished wafers for further processing and fabrication tasks. Individual work component of polishing is arranged in one block having its own power supply and signal lines, and is controlled by a central controller having a dedicated software program for each work component.

Abstract: A glass plate working machine includes table 20 on which glass plate 22 is placed, breaking unit 3 for forming a cutting line on glass plate 22 placed on table 20, and pressing the glass plate in the vicinity of a portion of the glass plate 22 formed with the cutting line to break that portion off; and moving unit 67 connected to the breaking unit 3 for moving same linearly along a surface of glass plate 22 placed on table 20. Breakage by breaking unit 3 and movement by moving unit 67 are controlled by a numerical control unit.

Abstract: Provided is a polishing apparatus which comprises a polishing mechanism for polishing a wafer taken out from a cassette, an attaching-detaching device for attaching to and detaching the wafer from the polishing mechanism, a device for cleaning the polished wafer, and a transportation device for transporting the wafer between the cassette, polishing mechanism, attaching-detaching device, and cleaning device. These devices are arranged individually in compartments. A working chamber is divided into a plurality of compartments by means of partitioning devices. A device for polishing a workpiece is set in one of the compartments. The apparatus is also provided with communication devices for internally connecting the adjacent compartments which are divided by the partitioning devices. The apparatus may further comprise devices for individually controlling the respective internal pressures of the compartments or a device for generating an air flow in the form of a laminar flow in each of the compartments.

Abstract: There is disclosed a wafer-polishing apparatus suitably designed to carry out a chemical mechanical polishing operation. The apparatus includes a lower polishing plate assembly, a first rotating mechanism for rotating the first polishing plate assembly, an upper polishing plate assembly, a second rotating mechanism for rotating the upper polishing plate assembly, a pressing mechanism, a conveying mechanism and a discharging mechanism. The lower polishing plate assembly includes a lower polishing plate, a polishing pad, a porous sheet interposed between the lower polishing plate and the polishing pad. The porous sheet has a thickness of 0.5 to 3 mm, and is formed of a foaming resin. The upper polishing plate assembly includes an upper polishing plate, a plate-like chuck and a backing pad, a pressure reducing unit, and a cleaning unit.

Abstract: A machine for multiple treatment of ski soles includes a plurality of tools on the upper part of a frame and oriented so that their working face is their bottom face. The tools are offset transversely relative to each other. Arrangements for holding and moving the skis hold them with their sliding soles facing upwards and move them under the tools with longitudinal reciprocating movement in translation in the lengthwise directions of the skis, with transverse movement in translation to align the skis selectively with transversely offset tools, and with vertical movement in translation to move the skis selectively into contact with or away from the tools. This machine allows easy selection of the treatments to be applied, whilst significantly improving the quality of work, in particular of grinding or sanding.

Abstract: A honing tool comprises an hexagonally shaped mandrel having a cylindrical bore extending centrally therethrough. Six similar tool holders are each provided with a pair of spaced cylindrical gear racks having rack gear teeth formed thereon and integrally attached to an elongate tool support. A metal tool carrier to which is suitably bonded a tool, such as an abrasive cutting stone or a wiper is removably attached to a respective tool support by a clamp screw. The gear racks of each tool holder are slidably mounted in respective bearings holes in the mandrel. Gear teeth on the racks mesh with gear teeth formed on a splined shaft rotatably mounted in the mandrel bore. Thus, rotation of the shaft counterclockwise relative to the mandrel extend all of the tools outwardly to extended positions.

Abstract: A process and apparatus for loosening adhesive from a drum and abrading labels, paint, and adhesive from the drum with high speed brushes. The drums are heated with an open flame to loosen the adhesive before the labels, paint, and adhesive are abraded from the drums with the brushes. A "soft-touch" pneumatic controller is connected to the brushes to maintain optimum contact of the brushes with the drum and to prevent premature wearing of the brushes. The drum is moved horizontally relative to the brushes during the brushing process to prevent stripes of paint being left on the drum by the brushes.

Abstract: A machine tool having a frame, a turret on the frame having a spindle for holding an operating tool, structure on at least one of the frame and turret for operating the spindle to effect machining of a workpiece by an operating tool held by the spindle, and first structure on at least one of the frame and turret for communicating fluid in a flow path from a pressurized supply to a workpiece to be machined by an operating tool held by the spindle to effect deburring/washing of the workpiece.

Abstract: The cutting process is executed after the grinding process and for one semiconductor ingot, one grinding device and one inner diameter saw slicing machine are used to perform grinding process and cutting process respectively. During the grinding process, the entirety of the cylindrical body portion of the semiconductor ingot is cylindrically ground, a portion of the tail end is cylindrically ground, the orientation flat position is determined and an orientation flat is formed by surface grinding. During the cutting process the tail portion is cut off and a sample for lifetime measurement is taken and a wafer sample is cut off from the end of the cylindrical body portion on the tail side. The semiconductor ingot is reversed in the direction of the axis and the head portion of the semiconductor ingot is cut off and a wafer sample is cut off from the cylindrical body portion on the head side.

Abstract: An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to compensate for locations on the polishing pad surface having linear velocities that are directly related to their respective radii. A desired contact force is maintained between the end effector and the polishing pad surface.

Abstract: To simplify and to shorten the cutting of a glass sheet (3) with the help of a cutting tool (11) and the removal of a coating applied on glass sheet (3) with the help of a grinding tool (12), the scratching of glass sheet (3) and the removal of the coating in strips lying on both sides of the scratch lines, running parallel to the latter, is performed in a single operation. In the device proposed for this purpose, cutting tool (11) and grinding tool (12) are mounted on a common support (8) movable on a beam (5) over a supporting surface (2) for glass sheet (3). Grinding tool (11) is fastened to an auxiliary support (17), which can be pivoted around axis (10) of cutting tool (11) oriented perpendicular to supporting surface (2). Grinding tool (12) and cutting tool (11) can be raised from glass sheet (3) independently of one another and mounted on the latter. Further, a suctioning of the dust accumulating during removal of the coating from glass sheet (3) is provided.

Abstract: A glass plate working machine includes table 20 on which glass plate 22 is placed, breaking unit 3 for forming a cutting line on glass plate 22 placed on table 20, and pressing the glass plate in the vicinity of a portion of the glass plate 22 formed with the cutting line to break that portion off; and moving unit 67 connected to the breaking unit 3 for moving same linearly along a surface of glass plate 22 placed on table 20. Breakage by breaking unit 3 and movement by moving unit 67 are controlled by a numerical control unit.

Abstract: The open end of the nozzle 42 is positioned close to and facing the surface of the metal base 20 on the side were the portion of the semiconductor ingot is to be cut off. An electromagnetic valve 46 is provided in the passage through which compressed air is supplied to the nozzle 42. The initial position of the blade 19 is detected by the detector 50U and the counter 52 measures the distance the blade 19 travels downward from the detected position and then the comparator 56 detects the point at which the measured value matches the value set on the numeric value setting device 54. The electromagnetic valve 46 is opened to emit compressed air from the nozzle 42 after this detection, until the detection of the lower limit position of the blade 19 by the detector 50D.