Abstract: Simultaneous double-side grinding of a plurality of semiconductor wafers involves positioning each wafer freely in a cutout of one of plural carriers which rotate on a cycloidal trajectory, wherein the wafers are machined between two rotating ring-shaped working disks, each disk having a working layer of bonded abrasive, wherein the form of the working gap between working layers is determined during grinding and the form of the working area of at least one disk is altered such that the gap has a predetermined form. The wafers, during machining, may temporarily overhang the gap. The carrier is optionally composed only of a first material, or is completely or partly coated with the first material such that during machining only the first material contacts the working layer, and the first material does not reduce the machining ability of the working layer.

Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

Abstract: A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical, direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

Abstract: A visual feedback system and method for airfoil polishing is disclosed. In one aspect there is a system for providing visual feedback during a polishing operation of a workpiece. In this system there is a model having a representation of a desired shape of the workpiece. A scanning system generates a representation of a current shape of the workpiece while in-process during the polishing operation. A comparator compares the current shape of the workpiece to the desired shape of the workpiece. An illumination system highlights the workpiece with visible light during the polishing operation. The highlighting of the workpiece with visible light is a function of the comparison between the current shape and the desired shape. The illumination system highlights a portion of the workpiece that needs additional polishing to conform to the desired shape.

Abstract: The invention relates to a machining device (5) comprising a workpiece (8) and at least one machining tool (23, 40, 41) and a measuring device (1, 22) and a seat (20) for the workpiece (8) to be machined. The workpiece (8) has a reference surface (26, 32, 33) that is disposed on the workpiece (8) and interacts with the machining device (5) in such a manner that a contour can be produced on this reference surface (26, 32, 33) using the machining tool (23, 40, 41) and that the contour (34, 35, 50) can be detected by the measuring device (1, 22) after machining. The method for controlling a machining device (5) comprises the following steps: introducing a contour (34, 35, 50) into the workpiece (8) to be machined in the longitudinal direction of advance of the machining tool (23, 40, 41); measuring the contour (34, 35, 50) in the workpiece (8) produced by machining; adjusting the machining plan while taking into consideration the determined tool geometry.

Abstract: In the method of precisely polishing a work, torque of a sun gear and an internal gear are kept constant and a load applied to a carrier is reduced and maintained. The method comprises the steps of: changing a rotational speed of at least one of the sun gear, the internal gear, an upper polishing plate and a lower polishing plate; measuring rotation torque of a driving motor of at least one of the sun gear and the internal gear; detecting the minimum rotation torque measured in the measuring step; and adjusting the rotational speed of at least one of the sun gear, the internal gear, the upper polishing plate and the lower polishing plate so as to make the rotation torque thereof equal to the minimum rotation torque or running rotation torque, the running rotation torque being greater by a prescribed value than the minimum rotation torque.

Abstract: A polishing apparatus is provided for polishing wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) 201 and the wafer held by a holding member (top ring) 52 and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring 52 for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag 202 for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

Abstract: An apparatus for grinding a threaded portion of a workpiece, is provided. The threaded portion has a spiral groove formed therein. The apparatus includes a motor, a grinding cord, a detector and a controller. The motor has a rotary portion for rotating the threaded portion of the workpiece about an axis. The grinding cord is configured for being looped around the threaded portion of the workpiece with a middle part thereof engagingly received in a given portion of turns of the spiral groove for grinding the thread portion of the workpiece. The detector is for detecting a rotating cycle of the rotary portion. The controller is communicatively coupled to the detector for controlling the rotary portion to selectively rotate in a first rotating direction or in a reverse second rotating direction based on the received signal from the detector.

Abstract: A blank and method for the production of dental shaped bodies in machining equipment having at least two tools located in the machining chamber of the machining equipment, including a corpus of tooth restoration material, from which the shaped body can be carved by means of at least one of at least two tools by material removal. The blank exhibits at least two gages, each of which is in the form of a recess, the geometry of which is such that the tool selected for the cutting operation can be recognized by means of at least one of the gages by reference to its outer contour, the at least two gages being disposed on the blank in such a way that they can be simultaneously engaged by the at least tools when the blank is clamped in the machining equipment for carving purposes.

Abstract: A manufacturing method of a spectacle lens improving a manufacturing yield and a production efficiency is provided. The manufacturing method of the spectacle lens in which necessary information for a frame machining of a spectacle lens (progressive-power lens 20) including spectacle rim related information is obtained, and both surfaces of a convex surface and a concave surface are edge/polish machined from a spectacle lens blanks.

Abstract: A polishing apparatus polishes wafers at a high yield rate even if roll-off exists. The polishing apparatus polishes a wafer by applying a pressure between a polishing member (polishing pad) and the wafer held by a holding member (top ring) and moving the polishing member relative to the wafer. The polishing apparatus includes a top ring for holding the wafer, a pressure adjusting mechanism for adjusting a supporting pressure with which the wafer is supported on a supporting surface by a retainer ring, and a control unit for controlling the pressure adjusting mechanism to bring the supporting pressure to a desired pressure based on a roll off quantity of the wafer. The top ring comprises an air bag for pressing the wafer against the polishing pad, a retainer ring which surrounds the wafer, and an air bag for pressing the retainer ring.

Abstract: Processing a wafer using a double side grinder having a pair of grinding wheels. Warp data is obtained by a warp measurement device for measuring warp of a wafer as ground by the double side grinder. The warp data is received and a nanotopography of the wafer is predicted based on the received warp data. A grinding parameter is determined based on the predicted nanotopography of the wafer. Operation of the double side grinder is adjusted based on the determined grinding parameter.

Abstract: Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having a matrix and abrasive particles attached to the matrix, and sensing a parameter indicative of frictional force at an interface between the workpiece and the surface of the fixed-abrasive medium. This method continues by moving at least one of the workpiece and the fixed-abrasive medium relative to each other in a direction transverse to the interface based on the parameter. For example, the workpiece and/or the fixed-abrasive medium can be vibrated or oscillated to reduce the frictional force and/or maintain a desired relative velocity between the workpiece and the fixed-abrasive medium.

Abstract: A method of processing a semiconductor wafer using a double side grinder of the type that holds the wafer in a plane with a pair of grinding wheels and a pair of hydrostatic pads. The method includes measuring a distance between the wafer and at least one sensor and determining wafer nanotopology using the measured distance. The determining includes using a processor to perform a finite element structural analysis of the wafer based on the measured distance.

Abstract: A holding device (1) holds a lens (6) at its lens edge (5) with the aid of an adhesive connection (16, 17). The adhesive connection (16, 17) is applied only at one adhesive point or only at two spaced apart adhesive points (16, 17). A transport arrangement handles lenses (6) during hard coating in a dip trough. The transport arrangement includes a dip frame with receptacles for holding devices for lenses (6). Each holding device (1) provided with a lens (6) is positioned on the dip frame in such a manner that the lens (6) is positioned above its holding device (1). A method is provided for finishing lenses (6) wherein the lenses (6) are subjected to various sequential finishing steps of a finishing process and the lenses (6) are cemented to the same holding device during finishing. The application of adhesive is only at one adhesive point or at two spaced apart adhesive points (16, 17).

Abstract: Measuring apparatus (50) of geometrical parameters of cylinders, rolls and similar elements (11), used for the rolling of flat products operating on a machine for the grinding of said cylinders with an autonomous movement, i.e. with a movement independent of the translation movement of the grinding wheel or other parts, characterized in that it comprises at least four sensors (54, 55), situated on a surface orthogonal to the cylinder (11) or roll and in that at least two of said sensors are situated in opposite positions.

Abstract: Provided is a substrate polishing apparatus that includes a polishing unit and a pad supporting member. The polishing unit includes a polishing pad polishing a substrate seated on a substrate supporting member, and a pad driving member moving the polishing pad. The pad supporting member is disposed at a side of the substrate supporting member to support a portion of a polishing surface the polishing pad without contacting the substrate when an edge of the substrate seated on the substrate supporting member is polished. Accordingly, the substrate polishing apparatus prevents the polishing pad from being inclined to the outer side of a substrate while an edge of the substrate is polished, thereby improving polishing efficiency and preventing the breakage of a substrate during a polishing process.

Abstract: In a two-step processing mode in which a cup for attaching a lens to a chuck axis is changed from a large diameter cup to a small diameter cup on the way of processing, a roughing path data computing unit for computing first roughing path data larger than the target lens shape data by a predetermined finishing margin, and second roughing path data having a radius vector larger by at least ?a than at least radius vector data of the large diameter cup; and a processing controller for roughing the peripheral edge of the lens based on the second roughing path data in response to a processing start signal, thereafter stopping the processing and further resuming the processing. The processing controller performs, when a processing resuming signal is inputted, processing control of either roughing and finishing, or finishing without roughing.

Abstract: The present invention relates to an apparatus (10) for processing and measuring workpieces, in particular plate-shaped or cylindrical workpieces, which are provided with cutting teeth (S), with a machine base (12), a processing and measuring device (14) which can be moved relative to the machine base (12), and a workpiece positioning device (16) which can be moved relative to the machine base (12), wherein the processing and measuring device (14) has a pivoting head (26) which can be moved relative to the machine base (12) such that it can pivot about a pivot axis (E1), wherein a processing tool (28) and a measuring probe (30) are provided on the pivoting head (26). In this case provision is made for the processing tool (28) to project from one side of the pivoting head (26) and for the measuring probe (30) to project from the side of the pivoting head (26) which is opposite with respect to the pivot axis (E1).

Abstract: The present invention is a polishing head in which a rubber film is formed in a boot shape in such a manner that a position where the rubber film is held by a mid plate is distantly positioned from a work holding portion; an end portion of the boot shaped rubber film is formed in O-ring shape so that the rubber film is held by the mid plate with decreasing an area of contact between the mid plate and the rubber film as much as possible. As a result, there is provided a polishing head with rubber chuck method in which an occurrence of a surface defect, such as a scratch, on a surface of the work is suppressed as much as possible and the work can be uniformly and stably polished to the outer periphery.

Abstract: In a wheel spindle device wherein a plurality of grinding wheels are attached in a juxtaposed relation to a wheel spindle rotatably carried on a wheel head of a grinding machine, a reference position for specifying a position in the circumferential direction of the grinding wheel is provided on a core member of each of the grinding wheels, and a plurality of inclined grooves at predetermined angular intervals are formed on a grinding surface of each grinding wheel to be inclined relative to the circumferential direction of each grinding wheel. In order that the fluctuations in the dynamic pressure and the grinding resistance between respective grinding wheels and workpiece portions ground therewith do not grow as a combined or synergy effect, the inclined grooves on each grinding wheel are shifted in angular phase from those on another grinding wheel, so that grinding efficiency and accuracy can be enhanced.

Abstract: A work piece handling apparatus moves workpieces with a plurality of independently movable load cups that have combined multiple axes of motion. The apparatus can load and unload work pieces from a wet process station and move work pieces between wet process stations and maintain wet chemistry delivery to the workpiece without involving a robot. A method of work piece handling using the apparatus provides a significant throughput improvement by reducing the inherent time lag of pneumatic systems and eliminating multiple steps involving the robot during inter-station wafer transfer.

Abstract: A belt grinding machine tool with an operating head comprising an endless abrasive belt wound and stretched between at least two spaced rollers arranged parallel one another, of which a first is a driving roller and a second is a tensioning roller being supported to be adjustable in a direction which is substantially perpendicular to its axis of rotation. A device is provided for controlling the position of the abrasive belt which consists of at least a position sensor for sensing the position of the abrasive belt and at least an actuator for adjusting the position of the tensioning roller, in dependence of the position of the abrasive belt being sensed by the position sensor. The position sensor is a fork shaped optical sensor, or an optical sensor having an operatively equivalent shape, and the actuator is an electric drive.

Abstract: A contour follower includes a plurality of sensors spaced around a waterjet nozzle, each of the sensors being configured to measure a distance between a working surface and a first plane, perpendicular to a longitudinal axis of the nozzle. The sensors may include hall-effect sensors lying in the first plane and magnets lying in a second plane, parallel to the working surface. A detecting circuit processes signals from the sensors to determine an angle of the working surface, relative to the first plane, and a distance between an aperture of the nozzle and the working surface. A collision detection sensor provides a signal in the event the device approaches to within a selected distance of an obstruction in the plane of the working surface. A shield plate blocks and dampens secondary spray-back of cutting fluid occurring at low angles above the working surface.

Abstract: A polishing pad used in a CMP step in the manufacture of a semiconductor integrated circuit device is relatively expensive; thus, it is necessary to avoid a wasteful exchange of the pad. Accordingly, it is important to measure the abrasion amount of this pad precisely. However, in ordinary measurement thereof through light, the presence of a slurry hinders the measurement. In measurement thereof with a contact type sensor, a problem that pollutants elute out is caused. In a CMP step in the invention, the height position of a dresser is measured while the dresser operates, thereby detecting the abrasion amount or the thickness of a polishing pad indirectly. In this way, the time for exchanging the polishing pad is made appropriate.

Abstract: Apparatus and methods are provided to polish a notch of a substrate. The invention includes a polishing head adapted to apply a polishing tape against the notch of the substrate, including: a plunger; and an actuator, wherein the actuator is adapted to move the plunger with respect to the polishing tape. Numerous other aspects are provided.

Abstract: A grinding wheel having a convex grinding surface is attached to a wheel spindle that is contactlessly supported by a casing through a controlled type axial magnetic bearing and controlled type radial magnetic bearings and that is rotated by an electric motor. A groove of a workpiece is ground by causing relative displacement of the casing. After the axial positioning of the casing is performed, the casing is radially displaced. Then, the groove is ground. The stiffness value of the axial magnetic bearing 6 is set to be lower than a normal value before the casing is radially displaced. After it is detected that the grinding surface of the grinding wheel touches the entire groove of the workpiece and that the grinding of the entire surface of the workpiece is started, the stiffness value is set back to the normal value.

Abstract: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.

Abstract: In one aspect of the present invention, an outer diameter (O.D.) centerless grinding machine for use in grinding a diamond workpiece has a grinding wheel positioned parallel to a regulating wheel which is adapted to press a cylindrical workpiece into the grinding wheel as the regulating wheel rotates. Electronic equipment may be adapted to adjust a pressure of the regulating wheel against the grinding wheel. Also, a carrier may be adapted to house the workpiece, the carrier being attached to a translation mechanism adapted to move the carrier between the wheels such that the workpiece is in contact with both wheels.

Abstract: The honing feed system and method utilizes feedback from various sources during rapid feeding of the honing tool while rotating and stroking, to detect initial contact with a bore surface, to slow the feed to a normal honing rate, involving conditioning the feedback signals to eliminate noise factors such as the stroking movement and forces generated to rotate and feed the tool unopposed.

Abstract: A superfinish machine and a method for operating a superfinish machine are proposed, wherein monitoring an endless polishing band of the superfinish machine is possible.

Abstract: A method for abrasive material removal that includes the steps of establishing an optimum force profile relating to the force or contact pressure applied by a processing tool on a workpiece. The actual force generated during the metal removal operation is monitored and compared to the optimum force profile. Based on the comparison of the actual force with the optimum force profile machine parameters are adjusted such that the actual force generated follows the established optimum force profile.

Abstract: An improved grinder/polisher includes a base having a bowl, a rotating drive plate and a drive plate drive that is adapted to support a platen. The grinder/polisher includes a head configured to support a specimen holder. The head has a first drive for rotational drive of the specimen holder and a second drive for moving the specimen holder toward and away from the drive plate. The head includes a load cell operably connected to the first drive and a counter operably connected to the second drive. The counter is configured to determine movement and the extent of movement of the head toward and away from the drive plate. The grinder/polisher includes a control panel mounted within a housing and including a microprocessor controlled control system having a touch panel or screen.

Abstract: A collision detection sensor for a waterjet system provides a signal in the event the device approaches to within a selected distance of an obstruction in the plane of the working surface. An annular pressure switch lying in a first plane provides the signal when radial pressure is applied to a perimeter of the pressure switch via an annular trigger skirt, the trigger skirt applying the radial pressure in response to a collision of the device with an obstacle.

Abstract: A calibration device provided for use with a high-pressure fluid jet apparatus includes a body configured to be coupled to the high-pressure fluid jet apparatus, and a light-emitting device positioned toward the first end of the body and configured to project light on a target element at a location substantially identical to a location at which the high-pressure fluid jet contacts the target element during operation with fluid, allowing calibration of the high-pressure fluid jet apparatus before operation with fluid.

Abstract: An automatic insulation block milling machine is disclosed. The machine combines a series of operations into a single, automatic, production-line machine. Blocks of rigid insulation material, such as cellular glass blocks, are fed into the automated machine. The blocks are first placed on an automatic programmed moving conveyor belt and are first cut on a pre-determined angle developed from the horizontal and vertical centerline of the block. This cut is made by an angled, vertical band saw mounted with its blade in the center of the moving conveyor, thus producing one angled side on each of the two cut blocks. The remaining three primary sides of the cut blocks are machined to create curved sectional blocks that are used to cover the outer surface of large bore pipe systems or other cylindrical items such as tanks.

Abstract: A grindstone contact sensing technology capable of sensing the contact position of the honing grindstone with the inner circumference of the work at high precision. A servo motor for driving the spindle rotation, and a servo motor for driving the depth of cut are provided and used respectively as spindle rotation drive source for rotating and driving the rotary spindle having the honing tool and depth-of-cut drive source for moving the honing grindstone at a specified depth of cut, and the contact position of the honing grindstone with the inner circumference of the work is sensed from various electrical information (rotating speed, torque, current value, stagnant pulses, etc.) obtained from the operations of both the servo motors.

Abstract: A double side grinder comprises a pair of grinding wheels and a pair of hydrostatic pads operable to hold a flat workpiece (e.g., semiconductor wafer) so that part of the workpiece is positioned between the grinding wheels and part of the workpiece is positioned between the hydrostatic pads. At least one sensor measures a distance between the workpiece and the respective sensor for assessing nanotopology of the workpiece. In a method of the invention, a distance to the workpiece is measured during grinding and used to assess nanotopology of the workpiece. For instance, a finite element structural analysis of the workpiece can be performed using sensor data to derive at least one boundary condition. The nanotopology assessment can begin before the workpiece is removed from the grinder, providing rapid nanotopology feedback. A spatial filter can be used to predict the likely nanotopology of the workpiece after further processing.

Abstract: A substrate polishing apparatus includes a substrate holding mechanism having a head for holding a substrate to be polished, and a polishing mechanism including a polishing table with a polishing pad mounted thereon. The substrate held by the head is pressed against the polishing pad on the polishing table to polish the substrate by relative movement of the substrate and the polishing pad. The substrate polishing apparatus also includes a substrate transfer mechanism for delivering the substrate to be polished to the head and receiving the polished substrate. The substrate transfer mechanism includes a substrate to-be-polished receiver for receiving the substrate to be polished, and a polished substrate receiver for receiving the substrate which has been polished.

Abstract: A factory, an apparatus, and methods of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. Changes or improvements to cost of manufacture of a workpiece using in-process cost of manufacture information, tracked in-process cost of manufacture information, or cost of manufacture parameters are discussed. Appreciable changes to quality or cost of manufacture of a workpiece using tracking, using in-process tracked information, networks including a multiplicity of apparatus, and using in situ finishing information are discussed. A factory, apparatus, and methods to change or improve process control are discussed. A factory, apparatus, and methods to change or improve real-time process control are discussed. A factory, apparatus, and methods to change or improve predictive control are discussed. The workpieces can be tracked individually or by process group such as a process batch.

Abstract: A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a polishing surface while pressing the surface to be polished of the workpiece held by a holding device against the polishing surface and moving the workpiece and the polishing surface relative to each other, attracting the workpiece after the processing to the holding device while supplying the liquid to the polishing surface at a decreased flow rate, thereby detaching the workpiece from the polishing surface, and lifting up the holding device together with the workpiece on confirmation of detachment of the workpiece from the polishing surface and attachment of the workpiece to the holding device.

Abstract: Systems and methods for performing one or more measurements of a substrate at one or more radii along the substrate are described. Thickness measurements taken at various radii along the substrate can be averaged together to obtain an average value that reflects an overall substrate thickness. A more accurate measurement of the overall substrate thickness can be obtained by performing multiple measurements and averaging the measurements together. Using the average value, polishing can be adjusted to ensure that the substrate achieves a desired planarized thickness profile.

Abstract: A method of dividing, along lattice pattern-like dividing lines, a wafer which has the lattice pattern-like dividing lines and a polymer film on the front surface of a substrate and is processed to allow for division along the dividing lines, the method comprising a frame holding step for putting the wafer on the surface of an adhesive tape mounted on an annular frame; a wafer cooling step for cooling the wafer that is affixed to the surface of the adhesive tape mounted on the annular frame; and a diving step for dividing the wafer along the dividing lines by expanding the adhesive tape to which the cooled wafer is affixed.

Abstract: An eyeglass lens processing apparatus includes: a processing tool which processes a peripheral edge of the lens and includes a roughing tool, a beveling tool and a bevel-modifying tool; a selection unit which is used to select a high curve beveling mode for forming a bevel in the lens fitted into a high curve frame having a protrusion portion; a modifying portion data input unit inputs data of a portion to be modified so as to prevent an interference between the lens and the protrusion portion; a calculation unit which obtains bevel-modifying data on the basis of a bevel path and data of the modifying portion; and a processing control portion which performs the beveling to the lens by the beveling tool in accordance with the beveling data, and removes a part of the bevel shoulder and/or the bevel slope by the bevel-modifying tool in accordance with the bevel-modifying data.

Abstract: The present invention provides a polishing apparatus for polishing a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The invention relates to a method for error response when an error occurs in response to a motion, particularly of a drive mechanism in a machine, the motion taking place while using at least one master axis and at least one cam disk having at least one input and one output and being controlled by the master axis, in which, in response to the occurrence of the error at the least one input of the at least one cam disk, current process variables that are present are used for the initiation and the execution of the error response. The invention also relates to a corresponding computer system.

Abstract: An apparatus is described for reworking a steel edge of a ski (1), comprising at least one grinding apparatus (16) made of a cup-like grinding wheel (18) which is driven by a motor (17) and comprises a rotational axis extending transversally to the direction of feed (10), a bearing block (15) arranged on a feed carriage (9) which forms an oscillating axis (b) for the grinding device (16) extending transversally to the direction of feed (10) and perpendicular to the rotational axis of the grinding wheel (18), a guide means (8) for the feed carriage (9) which is held in a transverse carriage (6) movable transversally to the direction of feed and is rotatable about an axis (a) extending in the direction of feed, and an adjusting device for the angular position of the guide means (8) of the feed carriage (9).

Abstract: A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a turntable, while a sensor tip contacts the edge of a polishing pad positioned on the turntable. This provides an assessment of radial displacement of the polishing pad edge at this measurement point relative to the side of the turntable. Based on one or more such measurements, the polishing pad may be found acceptably positioned, may be trimmed, or may be replaced. The method and system reduce or eliminate the occurrence of a defect pattern found to be related to side unloading of semiconductor wafers from a CMP turntable.

Abstract: The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water from the tray, the overflow outlets being formed in a peripheral wall of the tray and arranged in the circumferential direction at regular intervals. The workpiece, which is horizontally fed on a surface of the water stored in the tray, is received and floated by surface tension of the water. Then, the workpiece is centered in the tray by water flows radially overflowing from the tray via the overflow outlets.

Abstract: The invention relates to a calibration tool (40) for a machine for milling an ophthalmic lens, comprising two lens holder shafts supported on a carriage, and means for moving said shafts. The calibration tool (40) includes a holder (68) mountable on the lens holder shafts, at least one piezoelectric element (92) attached to the holder (68), and at least one sensor member (72) supported on the holder (68) and comprising a sensing area (124) and at least one bearing surface (132, 134) for exerting pressure on the piezoelectric element (92) when the sensing area (124) contacts a surface of the milling machine (2) so that said element generates a contact detection signal. The invention is useful for calibrating milling machines.