Abstract: A device for polishing the peripheral edge part of a semiconductor wafer includes a wafer stage for holding the wafer, a wafer stage unit including devices for rotating the wafer stage, causing the wafer stage to undergo a rotary reciprocating motion within the same plane as the surface of the wafer stage, and moving the wafer stage parallel to the surface, a notch polishing part for polishing the notch on the wafer and a bevel polishing part for polishing the beveled part of the wafer. Pure water is supplied to the wafer to prevent it from becoming dry as it is transported from the notch polishing part to the bevel polishing part.

Abstract: Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table.

Abstract: The invention relates to a machining device (5) comprising a workpiece (8) and at least one machining tool (23, 40, 41) and a measuring device (1, 22) and a seat (20) for the workpiece (8) to be machined. The workpiece (8) has a reference surface (26, 32, 33) that is disposed on the workpiece (8) and interacts with the machining device (5) in such a manner that a contour can be produced on this reference surface (26, 32, 33) using the machining tool (23, 40, 41) and that the contour (34, 35, 50) can be detected by the measuring device (1, 22) after machining. The method for controlling a machining device (5) comprises the following steps: introducing a contour (34, 35, 50) into the workpiece (8) to be machined in the longitudinal direction of advance of the machining tool (23, 40, 41); measuring the contour (34, 35, 50) in the workpiece (8) produced by machining; adjusting the machining plan while taking into consideration the determined tool geometry.

Abstract: In a grinding machine comprising conductive grinding wheels, the invention presents a truing technique capable of truing grindstone surfaces of grinding wheels at high precision in a short time. For example, in the case of truing flat annular grindstone surfaces (10a, 10a) of a pair of mutually opposite grinding wheels (1, 2) simultaneously, an electro-discharge truing electrode (20) is disposed oppositely between the grindstone surfaces (10a, 10a) of the two grinding wheels (1, 2), and while traversing relatively parallel along the both grindstone surfaces (10a, 10a), the grindstone surfaces (10a, 10a) are trued without making contact by the electro-discharge action between the electro-discharge truing electrode (20) and both grindstone surfaces (10a, 10a).

Abstract: A substrate holding apparatus prevents a substrate from slipping out and allows the substrate to be polished stably. The substrate holding apparatus has a top ring body for holding and pressing a substrate against a polishing surface, and a retainer ring for pressing the polishing surface, the retainer ring being disposed on an outer circumferential portion of the top ring body. The retainer ring includes a first member made of a magnetic material and a second member having a magnet disposed on a surface thereof which is held in abutment against the first member.

Abstract: Various forms of knife guides are provided for knife sharpeners to minimize damage to the knife blade. One of the forms of knife guides comprises non-contact optical arrangements which includes a light source, at least one light detector and an indicator that monitors and displays the intensity of light reflected from the blade surface.

Abstract: A pad for CMP operations includes a guide plate having a plurality of holes therein and being affixed to a compressible under-layer; and a plurality of pressure-sensing and process monitoring polishing elements each affixed to the compressible under-layer and passing through a corresponding hole in the guide plate so as to be maintained in a substantially vertical orientation with respect to the compressible under-layer but being translatable in a vertical direction with respect to the guide plate.

Abstract: A lens layout block device comprising a seal feeding device that supplies an elastic seal to a seal sticking position (A5). The elastic seal is loaded in a tape loading part in the form of a seal tape covered by a mount and a protective sheet and wound in a roll shape and fed by driving a motor. The protective sheet is separated by a protective sheet separating mechanism. At the seal sticking position (A5), a sensor detects the leading edge of a positioning hole in the mount and stops the conveyance of the seal tape after the seal tape is fed from the detection position for a specified time. The stop position is determined as the reference sticking position of the elastic seal and a lens holder is pressed against the elastic seal from above. The mount is pulled down by the seal separating mechanism to separate the mount from the elastic seal.

Abstract: A belt sanding system comprising a segmented sanding block including a plurality of individually controllable segments and one or more sanding belt deflecting rollers, a plurality of sensing elements corresponding to the plurality of segments, and a device for interconnecting the plurality of sensing elements, interconnecting the plurality of sensing elements with the segmented sanding block, and effecting lateral movement of the plurality of sensing elements as the segmented sanding block is rotated to an oblique alignment relative to the feed direction.

Abstract: The present invention provides an initial position setting method of grinding wheels, before starting a grinding operation, in a vertical double disc surface grinding machine for surface grinding the upper and lower grinding surfaces of a work-piece simultaneously by rotation-driving a pair of grinding wheels by a grinding wheel rotation drive motor and moving the grinding wheels up and down by a grinding wheel vertical drive motor.

Abstract: A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree of freedom and an actuator operates the gripper. A controller is linked to the gantry and gimbal unit motors, the gripper unit actuator, and actuators associated with a series of work stations for carrying out processing operations such as lapping and grinding. The controller controls movement of the gripper unit from a start position to pick up a workpiece and move it along a programmed path between the processing stations, and controls operation of actuators at each processing station to process workpieces according to stored program instructions. A user input device provides optional operator control of the movement and processing for system training purposes.

Abstract: An element for detecting an amount of lapping of a stacked structure that includes a substrate and a magnetic field detecting sensor is provided. The element comprises: a resistive film that is arranged on a lapping surface of the stacked structure, the resistive film being exposed at the lapping surface together with the magnetic field detecting sensor, wherein the resistive film has a resistance value that varies depending on the amount of lapping; and a pad for measuring the resistance value, wherein the pad is formed on a surface of the stacked structure, the surface being other than the lapping surface, and wherein the pad is electrically connected to one end of the resistive film. Another end of the resistive film is electrically connected to the substrate.

Abstract: The present invention is a planarization apparatus for planarizing a coating film applied on a substrate before the coating film is hardened, including a contact body such as a brush or sponge brought into contact with a front surface of the coating film on the substrate; and a contact body drive mechanism for pressing the contact body against the front surface of the coating film and moving the contact body along the front surface of the coating film. The contact body is pressed against the coating film before it is hardened, and moved along the front surface of the coating film, whereby the coating film can be planarized to a predetermined film thickness. According to the present invention, the coating film can be planarized without using the CMP apparatus.

Abstract: A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool and the workpiece, such that a constant force is exerted on the other of the grinding tool and the workpiece by the at least one of the grinding tool and the workpiece. Also disclosed is a grinding apparatus including: a moving device operable to move at least one of the grinding tool and the workpiece relative to the other of the grinding tool and the workpiece, at least in an infeed direction that increases a depth of cut of the grinding tool into the workpiece; and a controller which controls the moving device, such that the at least one of the grinding tool and the workpiece is pressed against the other of the grinding tool and the workpiece, with a constant force.

Abstract: The present invention relates to a hand held label removal apparatus, which provides a safe and easy removal of otherwise hard to remove labels that are affixed to various types of containers such as carton packaging, plastic products and similar materials. The distinctive features of the device include high productivity, the ability to remove various parts of the label as well as the label in its entirety, is completely safe and ecologically harmless. The invention comprises of a flat grinding circlet or a face mill, which is put in a circular motion by an electric motor. The design of the invention ensures that the area of the label that is being processed is insulated from the outside environment and byproducts formulated as a result of the label removal process are evacuated by the vacuum method such as a standard vacuum cleaner hose connected to a vacuum cleaner.

Abstract: An elongated work is attached to an elongated holding surface opposed to a flat abrasive surface in a grinding device. The holding member is supported on a spherical receiving body so that the holding member changes its attitude around the spherical receiving body. The change of the attitude of the holding member reliably enables the work to uniformly contact with the flat abrasive surface. When relative movement is induced between the work and the flat abrasive surface, a chamfer is formed on the work with a high accuracy. The work is prevented from suffering from generation of microcracks and chipping. In addition, if the work moves on the flat abrasive surface only in one direction, the probability of generation of microcracks and chipping is considerably reduced.

Abstract: Methods of refining using a plurality of refining elements are discussed. A refining apparatus having refining elements that can be smaller than the workpiece being refined are disclosed. New refining methods, refining apparatus, and refining elements disclosed. Methods of refining using frictional refining, chemical refining, tribochemical refining, and electrochemical refining and combinations thereof are disclosed. A refining apparatus having magnetically responsive refining elements that can be smaller than the workpiece being refined are disclosed. The refining apparatus can supply a parallel refining motion to the refining element(s) for example through magnetic coupling forces. The refining apparatus can supply multiple different parallel refining motions to multiple different refining elements for example solely through magnetic coupling forces to improve refining quality and versatility. A refining chamber can be used. New methods of control are refining disclosed.

Abstract: A method of polishing diamonds held by a tang (100) having a predefined axis (160) orthogonal to polishing surface (110). The axis (160) returns to its original spatial orientation with respect to the polishing surface (110) at the end of each facet of the diamond (122) polishing.

Abstract: A technique of the present invention utilizes qualification characteristics from a single wafer for qualifying a semiconductor manufacturing tool. Generally speaking, the technique commences with the processing of a wafer by the manufacturing tool. During processing, one or more qualification characteristics required to properly qualify the tool are measured using an in situ sensor or metrology device. Subsequently, the manufacturing tool is qualified by adjusting one or more parameters of a recipe in accordance with the qualification characteristics measured from the wafer to target one or more manufacturing tool specifications. In some embodiments, the tool to be qualified includes a bulk removal polishing platen, a copper clearing platen and a barrier removal polishing platen.

Abstract: A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least one honing operation on a workpiece. The honing installation also comprises a conveyor system for conveying workpieces to and from work stations. There is also a control device for controlling the honing installation. Each of the work stations is directly connected to the conveyor system. This configuration allows a flexible control of the honing process.

Abstract: A contour follower includes a plurality of sensors spaced around a waterjet nozzle, each of the sensors being configured to measure a distance between a working surface and a first plane, perpendicular to a longitudinal axis of the nozzle. The sensors may include hall-effect sensors lying in the first plane and magnets lying in a second plane, parallel to the working surface. A detecting circuit processes signals from the sensors to determine an angle of the working surface, relative to the first plane, and a distance between an aperture of the nozzle and the working surface. A collision detection sensor provides a signal in the event the device approaches to within a selected distance of an obstruction in the plane of the working surface. A shield plate blocks and dampens secondary spray-back of cutting fluid occurring at low angles above the working surface.

Abstract: A data set (D) is provided for machine control of a grinding machine to determine time-efficient, collision-free travel paths. The data set has a collision parameter of “0” or “1” in each separate coordination point (X, Y, Z, A) as well as for each combination of the separated tool types (WZI) and workpiece types (WSJ). The collision parameter indicates if the constellation assigned to the corresponding coordination point (X, Y, Z, A), which means the relative position of workpiece (11) and tool (3), does or does not result in a collision or spatial overlapping of the tool and the workpiece. The data base (D) forms a lookup table that can be used to check given paths or expansions or the step-by-step layout of paths. The computation of time-efficient paths can be performed within a few seconds, even at limited computing capacities.

Abstract: A probe cleaning system automatically detects a surface of a probe cleaning device during a cleaning process by providing a predetermined finish on the surface of the probe cleaning device. The predetermined finish can include a textured or machined finish or a marking, such that the predetermined finish provides contrast against the surface. Cameras in the system automatically focus on the surface, with the predetermined finish. This in-focus condition is related to a distance between probes and the surface. Once an in-focus condition is determined, the system performs an automated cleaning process by interacting the probes with the probe cleaning device.

Abstract: A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree of freedom and an actuator operates the gripper. A controller is linked to the gantry and gimbal unit motors, the gripper unit actuator, and actuators associated with a series of work stations for carrying out processing operations such as lapping and grinding. The controller controls movement of the gripper unit from a start position to pick up a workpiece and move it along a programmed path between the processing stations, and controls operation of actuators at each processing station to process workpieces according to stored program instructions. A user input device provides optional operator control of the movement and processing for system training purposes.

Abstract: A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semiconductor wafer with respect to a polishing pad is measured during an initial stage and a first reference range of the thickness change of the slurry film is preferably set to determine a replacement time corresponding to the abrasion amount of the polishing pad. A conditioning condition of the polishing pad conditioning can also be set, and a second displacement of the semiconductor wafer with respect to the polishing pad can be measured when the surface of the semiconductor wafer is polished by the polishing pad. The first displacement is then preferably compared with the second displacement to calculate the thickness change of the slurry film formed between the polishing pad and the semiconductor wafer.

Abstract: Various embodiments of the present invention pertain to enabling location specific burnishing of a disk. According to one embodiment, the smoothness of a disk is evaluated by gliding over a disk to determine if there is an asperity on the disk. If there is an asperity on the disk, a location of the asperity is stored to enable location specific burnishing of the disk.

Abstract: A system for abrading and scoring glass. An abrading/scoring station includes a table for supporting a large sheet of glass on a generally flat support. A first tool support moves an abrading tool for abrading a coating material from the glass. A second tool support moves a scoring or cutting tool that scores a region of the glass. By coordinating a movement of the first and second tool supports with respect to a piece of glass, a controller causes the respective tools to first abrade and then score controlled paths on the piece of glass while avoiding contact between the first and second tool supports and their respective tools.

Abstract: A blasting system for the removal of coatings or paint from an underlying surface uses an optical device to position the blasting nozzle an appropriate stand-off distance from the surface. The blasting media can use a variety of blasting media including abrasives, water, and various specialty blasting media. The preferred optical system is mounted to or integral with the blasting nozzle, and uses a diode laser, a beam splitter and a reflecting mirror to generate a reference beam and a gauge beam. Alternatively, two diode lasers can be used to generate the reference beam and gauge beam respectively. The reference beam propagates in a fixed forward direction, but the direction of the gauge beam is adjustable. The user adjusts the orientation of the gauge beam so that the image of the beam on the surface aligns with the image of the reference beam on the surface when the blasting nozzle is positioned at the appropriate stand-off distance from the surface.

Abstract: A polishing apparatus comprises a polishing table having a polishing surface and a top ring for holding a substrate to be polished, in which the substrate when held by the top ring is pressed against the polishing surface of the polishing table and thus polished. A capacitance type sensor and/or an eddy-current type sensor is disposed at one or more location(s) in the vicinity of the top ring. The capacitance type sensor detects escaping of the substrate to be polished based on a change in capacitance between the capacitance type sensor and a top surface of the polishing table. The eddy-current type sensor detects escaping of the substrate to be polished based on a change in electrical resistance between the eddy-current type sensor and the top surface of the polishing table.

Abstract: During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal position of the workpiece (3) initially set cannot be maintained as a result of the progression of the grinding process and the changes caused by said process in the diameter and contour of the workpiece (3). The invention provides a solution to said problem, whereby height adjustment and/or the oblique position of the support guide (4) are automatically modified in accordance with the progression of the grinding process and during said grinding process with the purpose of achieving operationally optimal readjustment. The progression of the grinding process can be detected using measuring techniques, e.g. by measuring the diameter of the workpiece (3) or its deviation from roundness and using said measurement as output variable for adjusting the support guide (4).

Abstract: A magnetic device having a magnetic feature, the magnetic feature including a magnetic portion comprising a magnetic material, a region of non-magnetic material adjacent to the magnetic portion, and a stop layer disposed above the region of non-magnetic material, defining a planar upper boundary of the magnetic portion.

Abstract: A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree of freedom and an actuator operates the gripper. A controller is linked to the gantry and gimbal unit motors, the gripper unit actuator, and actuators associated with a series of work stations for carrying out processing operations such as lapping and grinding. The controller controls movement of the gripper unit from a start position to pick up a workpiece and move it along a programmed path between the processing stations, and controls operation of actuators at each processing station to process workpieces according to stored program instructions. A user input device provides optional operator control of the movement and processing for system training purposes.

Abstract: Workpiece headstock for a machine tool, especially for a grinding machine, with a spindle (6); with a clamping device (7), which is connected to the spindle (6) and which is used to clamp a workpiece (8) to be machined; and with a spindle drive (9), where, a loosenable alignment interface (14) is provided between two sections of the spindle (6), between the spindle (6) and the clamping device (7), or between two sections of the clamping device (7); where, after the alignment interface (14) has been loosened and while the workpiece headstock (1) otherwise remains stationary, the clamping device (7) and thus the workpiece (8) clamped in it can be aligned in a plane perpendicular to the spindle axis (15), as a result of which any existing offset between the workpiece axis (17) and the spindle axis (15)—i.e.

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: The grinding machine (10) according to the invention serves in particular for the machining or production of tools. It comprises a machine bed 11 and a workpiece spindle (14) arranged thereon, which receives the workpiece (13) to be machined, as well as a grinding station (19) arranged next to the workpiece, the station having a grinding spindle for the reception of a grinding tool (20), and is provided with a workpiece guide system (23) arranged at the machine bed for the support of the workpiece at the grinding location (21).

Abstract: In an apparatus for machining workpieces, in particular workpieces provided with cutting teeth, such as bandsaw blades or circular-saw blades for example, comprising a base (12), a machining device (18) displaceable relative to the base (12) and having at least one machining tool (20) rotationally drivable about a drive axis, and a clamping device (14) for securing the workpiece to be machined, the machining device (18) being designed with a multiaxis arrangement (24), by means of which the machining tool (20) can be positioned in different machining positions relative to the workpiece to be machined, it is provided that the multiaxis arrangement (24) is received within a support frame (26) open on at least one side and coupled to the base (12).

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: A machine tool for machining a part by on-head and continuous grinding tool profiling includes a part holder support driven into rotation by first driving means around a first axis in a vertical plane, a machining system provided with a grinding tool for machining the part, and a knurl for profiling the grinding tool. The first driving means are incorporated into a cradle driven into rotation by second driving means along a second axis perpendicular to the vertical plane. The machining system includes a bearing structure translationally mobile along three axes equipped with a main spindle for rotating the grinding tool, and a rotating device bound to the bearing structure and provided with a secondary spindle integral with the knurl moving around the axis of rotation of the grinding pool.

Abstract: Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the planarizing pad, a sub-pad under the planarizing pad, or the table. The force sensor array can include shear and/or normal force sensors, and can be configured in a grid pattern, concentric pattern, radial pattern, or a combination thereof.

Abstract: The vacuum suction holding apparatus of the present invention has a vacuum duct which is disposed inside a polishing head, with one end of this vacuum duct being opened in the attachment surface and the other end thereof being connected to a vacuum source. A polishing body is held by suction on the attachment surface of the polishing head by sucking air through the vacuum duct. The apparatus further has an orifice which is disposed in the vacuum duct, a first pressure sensor and a second pressure sensor which detect the pressure inside the vacuum duct at positions before and after the orifice, and a judgment device which judges whether or not the polishing body is held by suction on the polishing head on the basis of the pressure difference before and after the orifice detected by these two pressure sensors.

Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

Abstract: A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. The eddy current monitoring system or the optical monitoring system can be used to determine the substrate edge. A focusing optic can be used to improve the accuracy of the optical monitoring system in detecting the edge of the substrate.

Abstract: Detecting the deviation of the grinding wheel position from the amount of work deformation after grinding, and correctly adjusting the grinding wheel position, it provides both-side grinding techniques for making the work excellent in flatness and parallelism. When the feeding operation of grinding wheels (1,2) is completed, the distances from hydrostatic pads (20, 21) to the surface and back of work (W) are measured at three points, and the deformation amount of work (W) is detected from the results of measurement at the three points by using air gauge sensors (Sa, Sb, Sc), and in case the calculated amount of deformation exceeds the specified value, the moving adjustment of grinding wheels (1, 2) is performed in accordance with the amount of deformation so that work (W) is flat without deformation when the feeding operation of grinding wheels (1, 2) is completed.

Abstract: The invention relates to a method for machining a workpiece surface, wherein an area to be machined of the workpiece surface is machined under the influence of a polishing operation and wherein, during the machining, the displacement of the area to be machined relative to a reference area rigidly coupled to the workpiece surface is monitored by means of interferometry. The invention further relates to a machining apparatus, comprising a polishing tool and a measuring tool, while the measuring tool comprises an interferometer. Preferably, the polishing tool comprises a fluid jet polishing device.

Abstract: A method and apparatus are used for truing grindstones. Grinding wheels are arranged in a manner such that the respective grindstone surfaces are disposed apart from each other to define a space therebeween and respective ones of the grindstone surfaces are positioned in respective planes with the planes extending parallel to each other. Each grinding wheel is composed of a conductive grindstone having abrasive grains bound by a conductive binding material. An electrode discharge is applied from an electro-discharge truing electrode disposed in the space between the grindstone surfaces in a non-contacting relationship with the grindstone surfaces. The electrode discharge occurs in respective gaps formed between the electro-discharge truing electrode and the grindstone surfaces. The electro-discharge electrode is moved relative to the grindstone surfaces while applying the electrode discharge so that the grindstone surfaces are trued thereby.

Abstract: The present invention relates to a polishing method for polishing a workpiece by pressing the workpiece, to be polished, against a fixed abrasive and bringing the workpiece into sliding contact with the fixed abrasive. The polishing method includes a first step of polishing the workpiece while supplying a polishing liquid which contains an anionic surface-active agent and does not contain abrasive particles, and a second step of polishing the workpiece while supplying a polishing liquid which contains a cationic surface-active agent and does not contain abrasive particles.

Abstract: A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

Abstract: The present invention relates to a modified radial motion method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears, which is capable of modifying a locus of a cutter center into a curve, without changing a head cutter's geometry, by providing modified radial motion of the head cutter cooperating with rotation of a cradle. The modified radial motion method in accordance with the present invention completely solves the contradictions caused by the existing lengthwise curvature modification methods, which is able to increase the adjustability of the gear set without reducing the tooth contact.

Abstract: A substrate polishing apparatus polishes a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table against which a substrate is pressed and a light-emitting and light-receiving device to emit measurement light from the polishing table to the substrate and to receive reflected light from the substrate for measuring a film on the substrate. The substrate polishing apparatus also has a fluid supply passage for supplying a fluid for measurement, through which the measurement light and the reflected light pass, to a fluid chamber provided at a light-emitting and light-receiving position of the polishing table, and a fluid supply control device for controlling supply of the fluid for measurement to the fluid chamber.

Abstract: A chemical mechanical polishing apparatus and method can use an in-situ monitoring system. A measurement of a position of a carrier head and a sinusoidal first function can be used to define a second function that associates measurements from the series with positions on the substrate. For each measurement in a series from the in-situ monitoring system, the second function can be used to determine a position on the substrate where the measurement was taken. In addition, a measurement of the position of the carrier head, a time when the measurement of the substrate property is made, and a phase correction representing lag resulting from a processing delay in generating the measurement of the position of the carrier head can be used in determining a position on the substrate where a measurement of a substrate property was taken.