Of Tool Or Work Holder Position Patents (Class 451/9)
  • Patent number: 6848971
    Abstract: An electronic hollow grinder bevel angle indicator wherein a microprocessor calculates the grinding bevel angle that will be obtained when a tool is placed flat upon a tool rest and presented to the periphery of a rotating grinding wheel. The calculated bevel angle is the acute angle of intersection between the tool rest plane and a plane tangent to the grinding wheel periphery at the line of intersection between the grinding wheel periphery and the tool rest plane. The microprocessor also calculates the air-gap between the tool rest and grinding wheel, and warns the operator when the air gap exceeds a specified safety threshold.
    Type: Grant
    Filed: March 24, 2003
    Date of Patent: February 1, 2005
    Inventor: David Burke Doman
  • Patent number: 6846224
    Abstract: Surface planarization equipment of a semiconductor wafer safely transfers wafers to an unloading cassette. In addition to the unloading cassette, the surface planarization equipment includes a loading cassette configured to hold wafers awaiting surface planarization, an index table including a plurality of first rotary vacuum wafer chucks that receive wafers from the loading cassette, at least one grinding head disposed above the index table and operative to perform a planarization process on the wafers supported by the chucks, a cleaning and drying unit including a second wafer rotary vacuum chuck receiving the wafers from the index table after the planarization process is completed and from which the cleaned and dried wafers are transferred to the unloading cassette. A position detector includes one or more sensors disposed beside respective ones of the vacuum chucks to stop the chucks at desired positions.
    Type: Grant
    Filed: May 19, 2003
    Date of Patent: January 25, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Soo-Jin Ki
  • Patent number: 6843706
    Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: January 18, 2005
    Assignee: Ebara Corporation
    Inventors: Manabu Tsujimura, Norio Kimura
  • Patent number: 6835115
    Abstract: A grinding method for single-disc cylindrical grinding of elongated objects, such as cylindrical paper machine rollers, in which method the object to be grounded is rotated about its axis and a grinding stone is rotated and its position on the surface of the object being ground is adjusted so that the grinding point of the grinding stone is held substantially at a constant distance from the center axis of the object being ground regardless of the deflection of the object. In the method, the position of the grinding stone is adjusted using an oscillating positioning controller synchronized with the rotation of the roller and receiving feedback from a measured quantity that bears a linear correlation to the change of position of the surface being ground.
    Type: Grant
    Filed: July 18, 2003
    Date of Patent: December 28, 2004
    Assignee: Rolltest Oy
    Inventor: Teppo Syrjänen
  • Patent number: 6832947
    Abstract: The invention is directed to chemical-mechanical polishing pads comprising a transparent window comprising a polymer resin having a first index of refraction and an inorganic material having a second index of refraction. The transparent window has a light transmittance of about 10% or more at a wavelength of about 200 nm to about 10,000 nm. The difference between the first index of refraction and the second index of refraction is about 0.3 or less at the wavelength.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: December 21, 2004
    Assignee: Cabot Microelectronics Corporation
    Inventor: Monis J. Manning
  • Patent number: 6811466
    Abstract: A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. The eddy current signals are detected, and may be used to update one or more polishing parameters for a chemical mechanical polishing system. The substrate holder may be located in a number places; for example, in a substrate transfer system, a factory interface module, a cleaner, or in a portion of the chemical mechanical polishing system away from the polishing stations. Additional probes may be used.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: November 2, 2004
    Assignee: Applied Materials, Inc.
    Inventors: Boguslaw A Swedek, Nils Johansson, Andreas Norbert Wiswesser, Manoocher Birang
  • Patent number: 6802760
    Abstract: Vending apparatus for optical disk restoration has a housing for receiving the disk form a customer; a disk inspection device to determine whether the disk is correctly positioned for polishing and providing a signal indicative of disk position, a disk perforation detecting device providing a signal indicative of any perforation in a reflective layer of the disk; and a device for ejecting a perforated disk from the housing. A user interface requests and receives payment from a customer in response to a signal by the detecting device that the reflective layer is imperforate and provides a signal indicating receipt of correct payment. Polishing wheels polish, with slurry, an exposed light receiving surface of a data carrying protective layer of the disk to ameliorate scratches in response to a signal from the user interface of correct payment and a device ejects a polished disk from the housing to a customer.
    Type: Grant
    Filed: March 19, 2003
    Date of Patent: October 12, 2004
    Inventor: Steven G. Goldstein
  • Patent number: 6796878
    Abstract: There is provided an NC machine tool with tiltable spindle unit capable of being used both as vertical and inclined spindle type machine tools without restrictions on stroke and capable of easily carrying out tool measurement, alignment of a work piece with a tool, and truing. The NC machine tool includes: a spindle unit having a spindle serving both as a vertical spindle and an inclined spindle; and a tilting mechanism having a turning shaft for pivotably supporting the spindle unit on a vertical plane. The turning shaft has a center line of rotation which is arranged in the vicinity of a top end of a tool on a center line of the tool.
    Type: Grant
    Filed: July 1, 2002
    Date of Patent: September 28, 2004
    Assignee: Toshiba Kikai Kabushiki Kaisha
    Inventors: Masaaki Mitsuzono, Kenji Miura, Yutaka Tsukita
  • Patent number: 6786803
    Abstract: An onboard electronic lapping guide for lapping a magneto-resistive head having a magneto-resistive sensor element disposed for electrical communication with a pair of sensor electrical leads. The lapping guide includes an electronic lapping guide resistive element disposed for electrical communication with the sensor electrical leads. The resistive element has a predetermined height in a lapping direction and is adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping. A lapping method and a method of forming the onboard electronic lapping guide are also disclosed.
    Type: Grant
    Filed: November 19, 2002
    Date of Patent: September 7, 2004
    Assignee: International Business Machines Corporation
    Inventors: Linden J. Crawforth, Douglas J. Werner, Benjamin L. Wang, Timothy J. Minvielle
  • Patent number: 6786799
    Abstract: A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: September 7, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6783427
    Abstract: A polishing apparatus comprises: a housing defining a chamber wherein articles to be polished are subject to polishing and cleaning operations; partition walls for dividing the chamber of the housing into a plurality of sections; and, an air exhaust device. The exhaust device comprises: air exhaust conduits which are fluidly connected to the sections in the housing to exhaust air from the sections; valves for closing and opening the air exhaust conduits, respectively; and, a controller for independently controlling the valves to regulate air flows exhausted through the conduits. The conduits have inlet openings located in a vicinity of spaces where any air pollutant is generated in the sections in the housing.
    Type: Grant
    Filed: October 22, 2002
    Date of Patent: August 31, 2004
    Assignee: Ebara Corporation
    Inventors: Soichi Isobe, Tadakazu Sone, Takuji Hayama, Manabu Tsujimura
  • Patent number: 6780082
    Abstract: A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: August 24, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6773338
    Abstract: A polishing head and a chemical mechanical polishing apparatus having the polishing head including a plate having vacuum holes for transferring vacuum pumping force; a porous film having holes corresponding to the vacuum holes and attached to a lower surface of the plate; a retainer ring attached to the lower surface of the plate at an edge portion thereof and having a sloped surface; a clamp ring attached to the lower surface of the plate adjacent the retainer ring for clamping the retainer ring; an adjusting ring having a sloped surface parallel and in contact with the sloped surface of the retainer ring, the adjusting ring being installed between the retainer ring and the plate; and a diameter adjusting device for adjusting a diameter of the adjusting ring by moving the adjusting ring along the sloped surface of the retainer ring, thereby adjusting a height of the retainer ring.
    Type: Grant
    Filed: February 4, 2003
    Date of Patent: August 10, 2004
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Cheol-Ju Yun, Young-Min Kim
  • Patent number: 6769958
    Abstract: A belt wear optimizing system for a wood surface treating apparatus with a plurality of individual work stations arranged serially along an endless conveyor. Each station includes a working abrasive head along with an elevation control for adjustably positioning the contact surface of each abrasive head at a desired working distance from the opposed surface of the workpiece traveling along the endless conveyor. An incoming workpiece thickness detector is positioned at the infeed end, and additional workpiece thickness detectors are positioned downstream from each work station, with each being positioned to measure the thickness of the workpiece after it has passed through its preceding individual work station.
    Type: Grant
    Filed: August 21, 2002
    Date of Patent: August 3, 2004
    Inventor: Howard W. Grivna
  • Patent number: 6755719
    Abstract: An end surface polishing device and an end surface polishing method capable of controlling the polishing amount of the rod-shaped members and shortening the polishing processing time are disclosed. The end surface polishing device for polishing a rod-shaped member attached to a holder in a pushing way, with a polishing member attached to a polishing plate provided on a main body and supported in a rotational and slidable way, is provided with distance detecting means for detecting the relative position of the holder and the polishing plate and measuring means for measuring the actual polishing length of the rod-shaped member supported by the holder, from the position detected by the distance detecting means.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: June 29, 2004
    Assignee: Seiko Instruments Inc.
    Inventors: Kisaburou Yoshida, Kouji Minami
  • Patent number: 6736698
    Abstract: A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: May 18, 2004
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6733363
    Abstract: A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.
    Type: Grant
    Filed: February 13, 2001
    Date of Patent: May 11, 2004
    Assignee: Micron Technology, Inc.,
    Inventor: Scott E. Moore
  • Patent number: 6722944
    Abstract: An apparatus for and process of attaching a lens holder to an uncut lens for a spectacle lens which enables efficient attachment of the lens holder at a position without the processing interference when the lens holder is attached to a progressive multifocal lens or a multifocal lens. The lens holder can be attached to the uncut lens at a position set outside of a range of processing interference when the positions of hidden marks or an edge of a segment are obtained by inputting and processing an image of the uncut lens by the apparatus for image processing, the obtained positions of the hidden marks or the edge of the segment, data of the spectacle frame and lens holder buildup area shape are processed and the lens holder is attached to the uncut lens.
    Type: Grant
    Filed: October 29, 2001
    Date of Patent: April 20, 2004
    Assignee: Hoya Corporation
    Inventors: Hisanori Akiyama, Masahiro Jinbo, Norihisa Tanaka, Masahiko Samukawa
  • Patent number: 6711829
    Abstract: A method for measuring the diameter and eccentricity of a crankpin of a crankshaft which is ground on a grinding machine. A reference plate is provided on a headstock, which is disposed on a table to support the crankshaft. A measurement apparatus having a probe is disposed on a wheel head. Through movements of the table and the wheel head, the probe is first brought into contact with a reference surface of the reference plate, and is then brought into contact with the outer circumferential surface of the crankpin at outermost and innermost points. The distances between the reference surface and the outermost and innermost points are measured, and the diameter and eccentricity of the crankpin are calculated on the basis of the measured distances and the position of the reference surface.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: March 30, 2004
    Assignee: Toyoda Koki Kabushiki Kaisha
    Inventors: Shoichi Sano, Masahiro Ido, Kikutoshi Okada
  • Patent number: 6712668
    Abstract: A pipe electropolishing system (10, 10a) for in place polishing of a pipe (28) has provision for detecting the instant position of a cathode (14) within the pipe (28) such as cable marks (52) and cable mark sensor (50), an infrared camera (60), heat sensing crayon marks (64), thermisters (66), and capacitance sensors (68), used individually or in combination. According to the inventive in place electropolishing method (80) when it is determined that the cathode is in a nonuniform portion (70) of the pipe (28), then increased polishing action is provided as by increasing the voltage using a variable power supply (30a) and/or by slowing down the progress of the cathode (14) using a variable speed cable puller (18).
    Type: Grant
    Filed: December 6, 2000
    Date of Patent: March 30, 2004
    Assignee: Therma Corporation, Inc.
    Inventor: Thomas A. Lorincz
  • Patent number: 6705924
    Abstract: A carrier head for a chemical mechanical polishing system includes a substrate sensing mechanism. The carrier head includes a base and a flexible member connected to the base to define a chamber. A lower surface of the flexible member provides a substrate receiving surface. The substrate sensing mechanism includes a sensor to measure a pressure in the chamber and generate an output signal representative thereof, and a processor configured to indicate whether the substrate is attached to the substrate receiving surface in response to the output signal.
    Type: Grant
    Filed: February 10, 2003
    Date of Patent: March 16, 2004
    Assignee: Applied Materials Inc.
    Inventor: Sasson Somekh
  • Patent number: 6705921
    Abstract: A tilt control assembly for controlling the tilt of a cutting tool head has a first eccentric support and a second support, with both of the first and second supports connected to the head along an axis of the head. To adjust the position of the head, the first eccentric support may be rotated.
    Type: Grant
    Filed: September 9, 2002
    Date of Patent: March 16, 2004
    Inventor: John D. Shepherd
  • Patent number: 6702649
    Abstract: The current positioning data of a machining tool with regard to a reference surface of a workpiece or of a body connected to the workpiece, is determined. The tool and the workpiece to be machined are relatively moveable toward and away from one another, and the rotary speed of a drive motor for the tool is set to a starting rotary speed which is so low that, when the tool comes into contact with the reference surface, its rotary speed is measurably reduced, the reference surface is moved past the tool before the tool is in contact and while the tool is in contact. As a result, the braking moments in the bearings are increased, and the drive motor comes to a stop quicker.
    Type: Grant
    Filed: January 30, 2002
    Date of Patent: March 9, 2004
    Assignee: Sirona Dental Systems GmbH
    Inventor: Franz Basler
  • Patent number: 6699103
    Abstract: The present invention is a device for relief grinding a blade having a radially outer edge of an elongated length and first and second faces, with the first and second faces extending generally radially from a reel axis. The device includes a rotatable grinding shaft, a grinding wheel, a grinding wheel guide assembly, a guide finger, and a first non-sliding stabilizer.
    Type: Grant
    Filed: February 12, 2003
    Date of Patent: March 2, 2004
    Assignee: Foley-Belsaw Company
    Inventors: James H. Dieck, Gregory A. Veenendall
  • Publication number: 20040033762
    Abstract: A carrier head has a base, a flexible membrane, and a valve in the carrier head that forms part of a substrate detection system. The valve includes a valve stem that contacts an upper surface of the flexible membrane so that if a substrate is attached to the lower surface of the flexible membrane when the first chamber is evacuated, the valve is actuated to generate a signal to the substrate detection system.
    Type: Application
    Filed: August 12, 2003
    Publication date: February 19, 2004
    Applicant: Applied Materials, Inc., a Delaware corporation
    Inventors: Hung Chih Chen, Ming Kuei Tseng, Steven Zuniga
  • Patent number: 6685538
    Abstract: A machine for machining a volume, in particular an inlay, by automatic duplicating, includes an abrasive disc having a rotatable drive, a support for a blank of the volume, the disc and the blank being rotatable, a rotatable duplicator support a touch-sensing probe capable of being urged into contact with the duplicator outer surface, there being relative displacement between the blank support and the disc and between the duplicator support and the touch-sensing probe so as to enable the disc and the touch-sensing probe to remain permanently in contact with the blank and the duplicator, and a mobile carriage having at least two degrees of freedom on which are mounted the support for the blank and for the duplicator, the carriage commanding and controlling the drive of the rotatable disc and the duplicator support.
    Type: Grant
    Filed: August 14, 2001
    Date of Patent: February 3, 2004
    Inventor: Pierre Farre
  • Patent number: 6682403
    Abstract: A grinding machine is disclosed comprising a main frame, a wheelhead, a worktable (16), a headstock (12) and tailstock (14) carried by the worktable (16). A computer is supplied with data indicative of at least one operational parameter of the grinding proces, and the wheelfeed is under the control of signals generated by the computer. Two small diameter grinding wheels (22, 24) are mounted on two parallel spindels mounted on a support member (32) and are independently driven by two motors (28, 30) mounted at the other ends of the spindles. The support member (32) is pivotally joined to the wheelhead. The headstock (12) includes a workpiece drive (20) for rotating the workpiece during a grinding, and its speed of rotation is also controlled by signals generated by the computer. The length of the spindles positions each of the motors (28, 30) axially clear of the tailstock assembly when the wheels (22, 24) are aligned to engaged regions of a workpiece nearest to the headstock (22).
    Type: Grant
    Filed: April 26, 2002
    Date of Patent: January 27, 2004
    Assignee: Unova IP CORP
    Inventor: Michael Laycock
  • Patent number: 6672944
    Abstract: An initial position setting method for grinding work apparatus includes: a grind stone 11; a pair of lens rotating shafts 14, 14 which are capable of approaching and drawing apart each other along a normal line of the grind stone 11; a ditch excavation grind stone 23 and chamfering grind stones 24, 25. A measurement standard 70 with a predetermined shape is adapted to be held by the lens rotating shafts 14, 14. The ditch excavation grind stone 23 and the chamfering grind stones 24, 25 are adapted to be moved to the predetermined position.
    Type: Grant
    Filed: September 20, 2002
    Date of Patent: January 6, 2004
    Assignee: Kabushiki Kaisha Topcon
    Inventors: Yasuhito Eto, Kenichi Watanabe, Yoshiyuki Hatano
  • Patent number: 6672941
    Abstract: A method to planarize the surface of a semiconductor substrate having shallow trench isolation (STI) reduces erosion of a silicon nitride planarization stop layer, reduces dishing of large areas of the shallow trench isolation, and prevents under polishing of the surface of the semiconductor substrate that will leave portions of the silicon dioxide that fills the shallow trenches covering the silicon nitride planarization stop exposed, is described. The method to planarize the surface of a semiconductor substrate having shallow trenches begins by chemical/mechanical planarization polishing at a first product of platen pressure and platen speed to planarize the semiconductor substrate. Polishing at a first product of platen pressure and platen speed will cause a high rate of material removal with low selectivity to increase production throughput. The silicon nitride stop layer will be examined to determine an end point exposure of the silicon nitride stop layer.
    Type: Grant
    Filed: October 26, 2000
    Date of Patent: January 6, 2004
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Chen-Hua Yu, Syun-Ming Jang
  • Patent number: 6659843
    Abstract: A programmable dicing saw is operable with movement of its spindle and work surface for aligning a dicing blade juxtaposed between flanges on the spindle and dicing a substrate along a predetermined blade path. By locating the center of the substrate, an efficient movement of the blade relative to the substrate center rather than the work surface center saves time. Locating the center of the blade includes aligning opposing substrate edges and edge location data entry into a processor for calculation of the substrate center and control based on the substrate center.
    Type: Grant
    Filed: February 13, 2002
    Date of Patent: December 9, 2003
    Inventors: John N. Boucher, David E. Bajune
  • Patent number: 6652358
    Abstract: In a double side simultaneous grinding machine, in which a plate-like workpiece is held and ground simultaneously on both a front surface and a back surface using a pair of grinding stones provided oppositely at both sides of the workpiece, a relative position between at least one of the center of thickness of the plate-like workpiece and the center of the holding means for holding the workpiece, and the center between stone surfaces of the pair of grinding stones is controlled during grinding. In a double side simultaneous grinding method, the generation of warpage of the plate-like workpiece is suppressed and degradation of warpage is prevented. Thereby, the plate-like workpiece can be processed to have high flatness on both sides. Further, the plate-like workpiece can be ground while a degree of warpage is controlled so that the workpiece is processed to have a warpage of a desired degree.
    Type: Grant
    Filed: December 29, 2000
    Date of Patent: November 25, 2003
    Assignee: Shin-Etsu Handotai Co., Ltd.
    Inventors: Shunichi Ikeda, Sadayuki Okuni, Tadahiro Kato
  • Patent number: 6648728
    Abstract: The present invention aims at make automatic real-time measurement of the removal rate in during polishing. For achieving the aim, a polishing system is provided with a sensor 1 for measuring a friction generated between a polishing pad and a workpiece during the polishing. The information processor of the polishing system evaluates the polishing efficiency of the polishing pad 5 on the basis of a fluctuation in the removal rate which is successively obtained from a friction successively detected by the sensor and a predetermined function. The result of the evaluation is used for the determination of the execution timing of a dressing process for the polishing pad, the calculation of the removal from the workpiece, and the like.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: November 18, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Hiroyuki Kojima, Tetsuo Ohkawa, Hidemi Sato
  • Patent number: 6645047
    Abstract: An automatic gage head positioning system especially adapted for CNC grinding of reciprocating engine crankshaft journals. The system incorporates an actuated four-bar linkage mechanism for accurately controlling the path of a gage device between disengaged and gaging positions. A lost motion rotational coupling is provided to enable the gage to follow the position of the crankshaft journal during machining. A counterspring assembly positioned in the gage system base partially opposes gravity to provide precise control of the actuation force between the gage and the workpiece journal.
    Type: Grant
    Filed: March 20, 2000
    Date of Patent: November 11, 2003
    Assignee: Control Gaging, Inc.
    Inventor: Karl J. Liskow
  • Patent number: 6638142
    Abstract: A device is proposed for sharpening knives in meat-processing machines, which enables a more precise movement of the sharpening tool (4) against the knife to be sharpened (2), in particular automatic control of this process. This is achieved according to the invention by providing a sensor for determining contact between the sharpening tool (4) and the knife (2).
    Type: Grant
    Filed: April 11, 2001
    Date of Patent: October 28, 2003
    Assignee: Knecht Mashinenbau GmbH
    Inventors: Manfred Knecht, Peter Heine
  • Patent number: 6632124
    Abstract: An optical monitoring system for a two-step polishing process which generates a reflectance trace for each of plurality of radial zones. The CMP apparatus may switch from a high-selectivity slurry to a low-selectivity slurry when any of the reflectance traces indicate initial clearance of the metal layer, and polishing may halt when all of the reflectance traces indicate that oxide layer has been completely exposed.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: October 14, 2003
    Assignee: Applied Materials Inc.
    Inventors: Bret W. Adams, Boguslaw A. Swedek, Rajeev Bajaj, Savitha Nanjangud, Andreas Norbert Wiswesser, Stan D. Tsai, David A. Chan, Fred C. Redeker, Manoocher Birang
  • Patent number: 6629875
    Abstract: The wafer edge processing unit may be a stand alone unit or may be incorporated in existing grinding machines. The processing unit employs a plurality of tapes which are coated with differing grades of grit to sequentially polish the edge of a rotating wafer or to remove an edge bead from a processed wafer or the other substrate. The tapes are mounted on a backing block which is rotated to move the tapes from a line contact with the top bevel of the wafer to a line contact with the bottom bevel of the wafer. Fresh surfaces of the tapes are presented to successive wafers by rotating the spools on which the tapes are mounted. The wafer may be moved in small increments along a Y-axis and/or an X-axis relative to a tape during polishing to improve the polishing operation.
    Type: Grant
    Filed: December 19, 2000
    Date of Patent: October 7, 2003
    Assignee: Accretech USA, Inc.
    Inventor: Robert E. Steere, III
  • Patent number: 6626736
    Abstract: A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish, and allows a polishing pad to be automatically replaced without stopping rotary or circulatory motion of a polishing table. The polishing apparatus comprises a polishing table for making rotary or circulatory motion, a top ring vertically movably disposed above the polishing table for removably holding a workpiece to be polished, a pair of rolls rotatable about their own axes and movable in unison with the polishing table, and a polishing pad which is wound on one of the rolls and supplied over an upper surface of the polishing table toward the other of the rolls.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: September 30, 2003
    Assignee: Ebara Corporation
    Inventors: Manabu Tsujimura, Norio Kimura
  • Patent number: 6623333
    Abstract: A method is provided for controlling a wafer polishing process. The method includes determining a polishing characteristic for a particular type of device from a set of measurements obtained from a wafer having a device of the particular type, and updating the polishing characteristic in response to polishing and measuring a wafer having a device of the particular type. The method further includes determining the polish rate of a polisher using a set of measurements obtained from a wafer polished on the polisher; and updating the polish rate of the polisher in response to polishing a wafer on the polisher and measuring the wafer. The method also includes determining a desired polishing time on the polisher for a wafer having a device of the particular type using the updated polishing characteristic of the device and the updated polish rate of the polisher.
    Type: Grant
    Filed: November 9, 2000
    Date of Patent: September 23, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Nital S. Patel, Gregory A. Miller, Christopher D. Guinn, Adriana Sanchez
  • Patent number: 6612902
    Abstract: An invention is disclosed for end point triggering in a chemical mechanical polishing process. A sensor array is positioned beneath a polishing belt having an end point window. The polishing belt is then rotated during the CMP process, and a transverse position of the end point window is determined based on a portion of the sensor array covered by a particular portion of the polishing belt. The particular portion of the polishing belt can be the end point window, a trigger slot, or a portion of the polishing belt covered by a reflective material. The sensor array can optionally be a charged coupled device (CCD), or a linear array of sensors. In operation, the positional information is determined based on which sensors are covered by the particular portion of the polishing belt. The positional information is then communicated to a belt steering system, which corrects the transverse position of the end point window based on which sensors are covered by the particular portion of the polishing belt.
    Type: Grant
    Filed: March 29, 2001
    Date of Patent: September 2, 2003
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Herbert E. Litvak
  • Patent number: 6612901
    Abstract: Planarizing machines, planarizing pads, and methods for planarizing or endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrates. One particular embodiment is a planarizing machine that controls the movement of a planarizing pad along a pad travel path to provide optical analysis of a substrate assembly during a planarizing cycle. The planarizing machine can include a table having an optical opening at an illumination site in a planarizing zone and a light source aligned with the illumination site to direct a light beam through the optical opening in the table. The planarizing machine can further include a planarizing pad and a pad advancing mechanism. The planarizing pad has a planarizing medium and at least one optically transmissive window along the pad travel path. The pad advancing mechanism has an actuator system coupled to the pad and a position monitor coupled to the actuator system.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: September 2, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Vishnu K. Agarwal
  • Patent number: 6612903
    Abstract: An apparatus and method are disclosed for planarizing a wafer in a carrier with adjustable pressure zones and adjustable barriers between zones. The carrier has an independently controlled central zone and concentric surrounding zones for distributing the pressure on the backside of a wafer while the wafer is being pressed against an abrasive surface in a chemical-mechanical polishing tool. The pressure zones may be created by mounting an elastic web diaphragm to a carrier housing that has a plurality of recesses. A corresponding plurality of elastic ring shaped ribs may extend from the web diaphragm opposite the recesses. The plurality of ring shaped ribs thereby defines a central zone surrounded by one or more concentric surrounding zones. The zones and barriers may be individually pressurized by utilizing corresponding fluid communication paths during the planarization process.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: September 2, 2003
    Assignee: Speedfam-IPEC Corporation
    Inventors: Nikolay N. Korovin, Stephen C. Schultz, John D. Herb, James L. Farmer
  • Patent number: 6612900
    Abstract: A method and apparatus for the wireless transfer of measurements made during chemical-mechanical planarization of semiconductor wafers with a planarizing machine. The apparatus includes a sensor connected to the semiconductor substrate or a movable portion of the planarizing machine. The apparatus further comprises a display spaced apart from the sensor and a wireless communication link coupled between the sensor and the display to transmit a signal from the sensor to the display. The wireless communication link may include an infrared link, a radio link, an acoustic link, or an inductive link. The sensor may measure force, pressure, temperature, pH, electrical resistance or other planarizing parameters. The sensor may also detect light reflected from a reflective surface of a substrate that is used to calibrate the planarizing machine.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: September 2, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Scott E. Moore
  • Patent number: 6609949
    Abstract: An interfaced carrier assembly including an interface circuit having printed contacts to provide electrical interface or feedback control for lapping operations. The printed contacts are formed on a base material on the interface circuit and interface with terminal pads on a slider bar supported by a carrier plate for lapping feedback control. The interface circuit is assembled with the carrier plate with contacts on the interface circuit aligned with terminal pads on the slider bar supported by the carrier plate. Alignment of the terminal pads on the slider bar and contacts on the interface circuit are measured by digital cameras for assembly of the interfaced carrier assembly.
    Type: Grant
    Filed: February 6, 2001
    Date of Patent: August 26, 2003
    Assignee: Seagate Technology LLC
    Inventors: Bruce Anderson, Dongming Liu, Edward M. Erickson, Shanlin Hao
  • Patent number: 6602110
    Abstract: A polishing system for polishing a surface of a substrate, such as the surface of an optical pin mold, to a desired surface finish and profile under the automated control of a computer during a polishing cycle. The polishing system includes a polishing spindle assembly that holds and rotates a polishing tool that is contacted under pressure with a surface of the mold pin. A torque sensor is associated with the polishing spindle assembly to sense a torque on the polishing tool during the polishing cycle. The polishing system further includes a feedback control system that dynamically adjusts the position of the polishing spindle assembly in response to the torque sensed by the torque sensor to maintain a substantially constant torque on the polishing tool during the polishing cycle.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: August 5, 2003
    Assignee: 3M Innovative Properties Company
    Inventors: Allen Y. Yi, Tomasz A. Pol, Michael Hezlep
  • Patent number: 6599171
    Abstract: A cup attaching apparatus for attaching a cup for eyeglass lens processing to a subject lens to be processed, includes: an imaging optical system, which obtains an image of the lens by illuminating the lens with rays of light shaped to be larger in diameter than the lens; a display; a display control unit, which displays, on the display, the obtained lens image and an alignment mark superimposed on the obtained lens image, the alignment mark having substantially the same contour as a small lens portion of a bifocal lens; a first input unit, which inputs an amount of offset of the alignment mark with respect to a cup attachment center; and a second input unit, which inputs layout data for layout of the lens with respect to a target lens shape, wherein the display control unit determines a display position of the alignment mark based on the inputted offset amount and layout data, and displays the alignment mark at the determined display position on the display.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: July 29, 2003
    Assignee: Nidek Co., Ltd.
    Inventor: Toshiaki Mizuno
  • Patent number: 6592430
    Abstract: A rotation axis of a work spindle and a rotation axis of a spindle primary-axis portion are rotated relative to each other and feeding of a work-piece to a tool is accordingly adjusted, whereby warpage of the tool in accordance with a change in machining condition is corrected. A revolution volume of the relative rotation is compared and calculated in process based on data entered in advance, a result of measurement by a displacement sensor and information such as a machining position, and controlled in real time until the end of machining. The relative rotation is driven by an actuator such as a piezoelectric element, at a resolution even as fine as in seconds. The data entered in advance can be sequentially updated in accordance with monitoring of a processed product.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: July 15, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tomoaki Nakasuji, Masahiko Hasegawa, Yoshinori Hirai
  • Patent number: 6592431
    Abstract: An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, includes: a lens rotating unit having rotating shafts for holding and rotating the lens; an abrasive wheel; an abrasive wheel state detecting unit for detecting a lowered processing performance of the abrasive wheel; and a notifying unit for notifying that dressing for the abrasive wheel is required based on a result of detection by the abrasive wheel state detecting unit.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: July 15, 2003
    Assignee: Nidex Co., Ltd.
    Inventors: Toshiaki Mizuno, Shinji Koike
  • Patent number: 6591148
    Abstract: A numerical control device for synchronously controlling the movement of a plurality of axes of a machine by repeatedly controlling a cyclic motion. An axis of the machine is designed to stop at a predetermined position upon the occurrence of an emergency stop. To achieve this stop position, an amount of retraction is set up to a position where a tool of machine does not interfere with a work piece or other obstacles. When an emergency stop signal is entered during a binary operation, because of an occurrence of an abnormality, a movement control amount for each period, corresponding to a set amount of retraction, is added to the movement control amount for each period of the binary operation and the axis is thereby driven by the resultant modified movement control amount. The binary operation is stopped upon the reaching of the stop position, and the tool can be held at this retracted position, by the set amount of retraction.
    Type: Grant
    Filed: June 1, 2000
    Date of Patent: July 8, 2003
    Assignee: Fanuc Ltd.
    Inventors: Teruo Masuda, Eiji Genma, Ken Yasuda
  • Publication number: 20030124957
    Abstract: The substrate polishing apparatus for polishing a polishing surface of a substrate comprises a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a surface of the table, a substrate support member for pressing the substrate onto the polishing member, an optical system composed of an optical fiber for irradiating the polishing surface of the substrate with a light of irradiation and an optical fiber for receiving a reflected light reflected on the polishing surface of the substrate, an analysis-processing system for processing an analysis of the reflected light received with the optical system, and the film-thickness monitoring device, wherein the table is provided with a liquid-feeding opening for feeding a translucent liquid into a through-hole disposed in the polishing member.
    Type: Application
    Filed: December 27, 2002
    Publication date: July 3, 2003
    Inventors: Yoichi Kobayashi, Shunsuke Nakai, Hitoshi Tsuji, Yasuo Tsukuda, Hiroki Yamauchi
  • Publication number: 20030119422
    Abstract: A method for lapping which eliminates lapping damage includes a high-speed lapping operation at a high torque which is continuously performed after performing intermittently a low-speed lapping operation under low torque on a workpiece. Therefore, the excessive load during a first lapping stage due to the projection on the surface of the workpiece is greatly decreased. A continuous lapping is performed after the projection becomes smooth to some extent, and thus the lapping damage is prevented.
    Type: Application
    Filed: December 9, 2002
    Publication date: June 26, 2003
    Applicant: Murata Manufacturing Co., Ltd.
    Inventor: Nobuyuki Hori