Abstract: The present invention provides a blend comprising one or more epoxy resins and a mixture which comprises 0.3 to 0.9 amine equivalent, per equivalent of epoxide of the epoxy resin used, of a hardener component a) and as hardener component b) a compound of the formula I, a process for preparing this blend, the use of the blend of the invention for producing cured epoxy resin, and an epoxy resin cured with the blend of the invention.

Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.

Abstract: Epoxy resin compositions contain (i) a polyepoxide resin; (ii) a benzofuran diol component, a benzofuran di-epoxide component, or mixture thereof; and (iii) a curing agent, which upon curing, provides a cured resin exhibiting improved chemical and physical characteristics. The epoxy resin composition may also contain a toughening agent to further enhance the cured resin's physical characteristics.

Abstract: The present invention provides an epoxy resin composition for a fiber reinforced composite material comprising an epoxy resin (A) comprising an epoxy resin (a1) having a weight average molecular weight of up to 1,000 and an epoxy resin (a2) having a weight average molecular weight of 10,000 to 100,000 which contains at least 20% by weight of the basic skeleton of the epoxy resin (a1), a thermoplastic resin (B), and a curing agent (C). The cured composition has a co-continuous phase of the epoxy resin (A) and the thermoplastic resin (B) and/or a continuous phase of the thermoplastic resin (B). A cured product having a high toughness can be obtained from this epoxy resin composition.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: A polymeric formulation comprising at least one first epoxy resin having a density between 100 and 10,000 Pa·s, a blocked isocyanate, a polymer comprising hydroxy functional groups, a thermoplastic resin and a cross-linking agent, the polymer comprising hydroxyl functional groups with a hydroxyl content in the range 0.65 to 0.95 meq/g, the isocyanate-equivalents-to-polymer-OH-equivalents rate being in the range 0.60 to 1.1. The first epoxy resin is substantially semisolid at room temperature, the formulation comprising at least one second epoxy resin substantially liquid at room temperature, the first and second epoxy resins being present in a weight ratio from 60:40 to 80:20. These formulations are advantageously used for manufacturing prepregs and articles of composite material according to a dry winding process. By virtue of improved stability, a higher glass transition temperature, and a rheological profile result which can be chemically tailored to the needs of the impregnation/dry winding process.

Abstract: A potting material for an electronic component, an electronic component, and a process for positioning ferrites in an electronic material are disclosed. The potting material is formed by curing a mixture. The mixture includes an epoxy component, an organic amine hardener, a viscosity-controlling agent, and a silica. The potting material has a coefficient of thermal expansion between an inorganic ferrite coefficient of thermal expansion and an organic substrate coefficient of thermal expansion of the electronic component. The potting material includes a rigidity permitting via drilling by one or more of mechanical drilling and laser burning.

Abstract: The invention relates to compositions that can be used as coatings for the inner lining of cargo tanks. The compositions comprise a mixture of epoxy resins, a curing agent, an accelerator or mixture of accelerator(s), and one or more filler(s) or pigment(s), wherein the mixture of epoxy resins comprises 60-80 wt. % of an RDGE epoxy resin and 20-40 wt. % of an epoxy novolac resin, wherein the wt. % is based upon the total weight of the mixture of epoxy resins.

Abstract: The disclosure provides a thermosetting composition, including: (a) about 1-35 wt % of an oligomer, wherein the oligomer is obtained by reacting a liquid epoxy resin with an aromatic primary amine having four active hydrogen atoms, and the liquid epoxy resin and the primary amine have an equivalent mole ratio of 1:0.15-1:2.50; (b) about 5-10 wt % of a long chain resin; (c) about 50-80 wt % of an epoxy resin having at least two functional groups; and (d) about 5-15 wt % of a plasticizer.

Abstract: Embodiments of the present disclosure include an epoxy-adduct hardening agent formed as a reaction product of a first adduct formed as a reaction product of a first epoxy resin and a polyether monoamine and second adduct formed as a reaction product of an ethyleneamine and a glycidyl ether. Embodiments include a curable composition having an epoxy resin and the epoxy-adduct hardening agent.

Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.

Abstract: A curable composition or system including (a) at least one divinylarene dioxide, (b) at least one polythiol compound curing agent; and (c) at least one catalyst; wherein the resulting curable composition may be cured at ambient conditions to provide durable cured material.

Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of heat-curable epoxy-based adhesive compositions that are capable of being easily pumped under high shear at temperatures around room temperature but are resistant to being washed off substrate surfaces prior to being cured.

Abstract: Compounds VB of the formula (I) or (II), said compounds being particularly suitable as curing agents for epoxide resins. The compounds can be produced easily and rapidly. They can be used in the form of aqueous curing agents and form stabile aqueous emulsions in particular. This facilitates the formulation of ECC compounds for use primarily as coatings.

Abstract: A new class of compounds, namely diamino alcohols, is described, along with a process for their production and their use as hardeners, or curing agents, for epoxy resin systems, some of which have high glass transition temperatures, Tgs, such as greater than about 120° C.

Abstract: Curable compositions, cured compositions, and articles that include the cured compositions are described. The curable composition contains a) an epoxy resin, b) a curing agent, c) a reactive liquid modifier, and d) a toughening agent. The cured compositions can be used as structural adhesives. The reactive liquid modifier is an acetoacetate ester of a dimer alcohol. The cured compositions can be used as adhesives such as structural adhesives or as polymeric coatings.

Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.

Abstract: The subject matter of the present invention relates to a blend comprising an epoxy resin, a cyclic carbonate, and a hardener comprising a polyalkoxypolyamine, another amine, and a catalyst, to a process for producing said blend, to the use of the blend of the invention for producing cured epoxy resin, and also to an epoxy resin cured with the blend of the invention, and in particular to fiber-reinforced cured epoxy resins for use in rotor blades for wind turbines.

Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.

Abstract: An epoxy resin composition suitably used for a prepreg which can complete curing in a short time even at a low temperature and secure a sufficient usable period under preservation at room temperature, in comparison with conventional epoxy resin compositions. An epoxy resin composition comprising at least one of an epoxy resin, an amine compound having at least one sulfur atom in the molecule thereof, and a reaction product of an epoxy resin and an amine compound having at least one sulfur atom in the molecule thereof, and an amine compound having at least one sulfur atom in the molecule thereof, and a urea compound and a dicyandiamide, wherein each of the contents of the sulfur atom and the urea compound in the epoxy resin composition is respectively 0.2 to 7% by mass and 1 to 15% by mass.

Abstract: The present invention relates to stable, zero or low VOC epoxy-containing polysiloxane oligomer compositions that provide for a high degree of chemical resistance to compositions containing organic resins, while at the same time, maintaining or improving the flexibility of these organic resin-containing compositions, to processes for preparing epoxy-containing polysiloxane oligomer compositions, and to uses in coatings, sealants, adhesives, and composites containing the same.

Abstract: A surfacing film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, an amine-based curing agent, particulate inorganic fillers; and a toughening component. The surfacing film exhibits high Tg and high cross-linked density after curing, as well as high resistance to paint stripper solutions. The surfacing film is suitable for co-curing with fiber-reinforced resin composite materials. The surfacing film may optionally contain electrically conductive additives to provide sufficient conductivity for lightning strike protection (LSP) or electromagnetic interference (EMI) shielding.

Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: Embodiments of the present disclosure include a curable composition including an epoxy compound selected from the group consisting of aromatic epoxy compounds, alicyclic epoxy compounds, aliphatic epoxy compounds, and combinations thereof, a curing agent selected from the group consisting of novolacs, amines, anhydrides, carboxylic acids, phenols, thiols, and combinations thereof, and a phosphono-methyl-glycine.

Abstract: Curable, one-package, stable adhesive compositions are provided comprising: (a) a resin component comprising a polyepoxide, (b) a polyamine having at least two primary amine, secondary amine, and/or ketimine functional groups; and (c) a curing component comprising dicyandiamide and an accelerator. At least a portion of the polyepoxide in the resin component is reacted with carboxy-terminated butadiene acrylonitrile polymer. The accelerator comprises a reaction product comprising a renewable polyol, a diisocyanate, and a dialkyl monoamine containing alkyl groups with at least two carbon atoms each. The compositions are suitable for use as adhesive compositions over a wide temperature range.

Abstract: Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.

Abstract: There are provided an adhesive resin composition for a hard disk drive (HDD) motor and a HDD motor fabricated by using the same. The adhesive resin composition for a HDD motor adheres fixed members and rotating members of the HDD motor to each other and includes 100 parts by weight of a first resin, 25 to 80 parts by weight of a second resin, a hardness of which after hardening is lower than that of the first resin, and 40 to 100 parts by weight of a hardener. The HDD motor is fabricated by using the adhesive resin composition for a HDD motor including a flexible epoxy resin, whereby reliability of the motor against external impacts may be improved.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2?A/(A+B+C+E)?0.6;??(1), 0.2?B/(A+B+C+E)?0.6;??(2), 0.15?C/(A+B+C+E)?0.4; and??(3), 0?E/(A+B+C+E)?0.2,??(4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].

Abstract: The invention provides an epoxy nanocomposite material for dental therapy, which can be applied to direct or indirect clinical restoration, dental core-post system, and dental brace etc. The epoxy nanocomposite filling material provided by the invention can be polymerized with various curing agents to form the polymer with low shrinkage.

Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Abstract: An adhesive composition includes a first part comprising about 15 to about 60 wt % of an epoxy compound, about 35 to about 80 wt % of an epoxy novolac, and about 5 to about 25 wt % of an epoxy-based reactive diluent based on the total weight of epoxy compound, epoxy novolac, and reactive diluent; and a second part comprising less than about 20 wt % of a hydroxyaromatic solvent, about 80 to about 99 wt % of a Mannich base, and about 1 to about 20 wt % of a tertiary amine, based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1. Additives to further enhance the properties may be included. A method of forming an adhesive layer includes applying the adhesive composition to a surface.

Abstract: Two-component epoxy-based structural adhesives are disclosed which exhibit excellent impact resistance, even when cured at approximately room temperature. The adhesives include an epoxy resin component which includes an epoxy resin and a reactive tougher. The adhesives also include a hardener component, which includes from 15 to 50 weight percent of an amine-terminated polyether, from 4 to 40 weight percent of an amine terminated rubber having a glass transition temperature of ?40° C. or below, and from 10 to 30 weight percent of an amine-terminated polyamide having a melting temperature of no greater than 50° C.

Abstract: Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri- or more-functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.

Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A resin component for a one- or two-component adhesive, a matrix resin, or a structural foam, comprising: C1) at least one epoxy resin, having an average of more than one epoxy group per molecule, that does not correspond to the definition of component C2); C2) at least one oligomeric or polymeric urethane-group-free polyether compound. A one- or two-component epoxy adhesive, structural foam, or matrix material for composites, comprising the aforesaid resin components.

Abstract: A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type reactants from polyamine compounds comprising from 25-75 mol % of a polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof and glycidyl ether compound; (B) An epoxy curing agent of the mixture of (B1) amide-type reactants prepared through polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof, and (B2) a reactant is derived by adduction between other aliphatic polyamines or a mixture thereof and glycidyl ether compound. Coating composition comprising the epoxy curing agent of the above described A or B.

Abstract: Core-shell rubbers are incorporated into epoxy adhesives. The adhesives are structural type adhesives that contain an epoxy resin and a toughener, and may contain a liquid rubber in addition to the core-shell rubber. The adhesives have good modulus and tensile strength, which are obtained without loss of elongation and adhesive properties.

Abstract: Coating composition comprising a liquid first phase comprising one or more polymer binder components having functional groups capable of cross-linking by electron pair exchange, and a second phase which is a powder material, such as sand, comprising one or more compounds capable of activating crosslinking of the binder components in the liquid phase after the second phase is exposed to the first phase. The activating compound in the second phase may include a Lewis acid or Lewis base. Method of applying a coating composition curable by cross-linking chemistry based on electron pair exchange, wherein after application of a layer of the coating composition on a substrate, a powder material comprising one or more cross-linking activating compounds is sprinkled over the wet layer. After sprinkling the powder material over the coating layer, a second coating layer is applied.

Abstract: Curable, aqueous epoxy resin composition, comprising a) an epoxy compound, b) an aminic curing agent which is an aqueous solution of a product from the reaction between i) an adduct between a polyamine and a liquid glycidyl ether which is not a glycidyl ether of a polyalkylene glycol, and ii) an epoxidized polyalkylene glycol, and c) from 0.5 to 15 wt.-%, based on the sum of the components b) and c), of a compound of the general formula (I) whereby R1=—H or —C4H9, and x=1, 2, 3 or 4, providing due to the presence of component c) an adjustable and recognizable end of pot life during application, for example coating, adhesive, as flooring, casting, tooling or encapsulating.

Abstract: It is an object of the present invention to provide an adhesive for electronic components that prevents warpage of electronic components and reflow cracks even in the case of bonding thin electronic components. The present invention relates to an adhesive for electronic components, comprising: an epoxy compound having an aliphatic polyether backbone and a glycidyl ether group; an epoxy group-containing acrylic polymer; an episulfide compound; and a curing agent, wherein the amount of the episulfide compound is 1 parts by weight or more, and less than 30 parts by weight relative to 100 parts by weight of the epoxy compound having an aliphatic polyether backbone and a glycidyl ether group.

Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), metal compound (C), and nitrogen oxide ion (E), wherein metal compound (C) is contained in an amount of 10 to 10,000 ppm calculated as metal, and nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm relative to the mass of the cationic electrodeposition coating composition. A coated article in which an electrodeposition coating film is formed on an untreated steel sheet exhibits excellent corrosion resistance, in particular, excellent hot salt water immersion resistance at 55° C.; and a multilayer coating film formed by a 3-coat 1-bake coating method on the electrodeposition coating film, which is formed on the untreated steel sheet, exhibits excellent corrosion resistance in a combined corrosion cycle test.

Abstract: A cationic electrodeposition coating composition including amino group-containing modified epoxy resin (A), blocked polyisocyanate curing agent (B), phenol resin (C), metal compound (D), and nitrogen oxide ion (E), wherein the metal compound (D) is contained in an amount of 10 to 10,000 ppm calculated as metal and the nitrogen oxide ion (E) is contained in an amount of 50 to 10,000 ppm, relative to the mass of the cationic electrodeposition coating composition. The cationic electrodeposition coating composition exhibits excellent anti-corrosion properties when coated onto untreated steel sheets.

Abstract: A masterbatch composition, a method for the preparation of a masterbatch composition, a method for the preparation of a powder coating composition, a powder coating composition obtainable by said method as well as the use of a masterbatch composition for a powder coating composition or for increasing the opacity of a cured powder coating is disclosed.

Abstract: Curing agent for epoxy resins, consisting of A) 1%-99% by weight of an adduct obtainable by reacting a1) a polyethylene polyamine having up to six nitrogens in the molecule with a2) a monoglycidyl ether, the adduct of a1) and a2) preferably being isolated by removal of the excess polyethylene polyamine, and B) 99%-1% by weight of an adduct obtainable by reacting b1) a diamine or polyamine with b2) styrene, and also curable compositions further comprising an epoxide compound, and the use of these curable compositions for producing moldings and sheetlike structures, and also for applications in the adhesives and sealants sector and for epoxy-resin mortars.

Abstract: Two-component adhesives (K), which includes two components K1 and K2. Component K1 includes at least one epoxy resin A with more than one epoxy group per molecule on average; at least one epoxy adduct B with more than one epoxy group per molecule on average that is an epoxy adduct of type B1 and optionally combined with an epoxy adduct of type B2; at least one reaction product F between an epoxy adduct B and a compound C, which has at least two isocyanate groups, in addition to at least one curing agent D for epoxy resins, which is activated by increased temperature. The component K2 comprises a compound E, which includes at least two isocyanate groups.