Abstract: A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homogeneous solution, which, when cooled to less than approximately 70° C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100° C. causes the adhesive to melt and allows separation of adhered pieces.

Abstract: The present invention provides an epoxy resin composition containing (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, wherein the epoxy resin (A) contains a phosphorus atom, and wherein 5 to 50 parts by weight of the phenoxy resin (C) and 0.05 to 10 parts by weight of the curing accelerator (D) are mixed with 100 parts by weight in total of the epoxy resin (A) and the phenolic curing agent (B).

Abstract: A wiring substrate includes (1) an insulating substrate having an opening, or a core substrate and a build-up layer wherein at least one of the core substrate and the build-up layer has an opening, (2) at least one electronic part disposed in the opening, and (3) an embedding resin comprising a thermoplastic resin, an acid anhydride curing agent, a curing accelerator, and a filler, wherein the embedding resin shows a viscosity of not higher than 85 Pa·s in a shear rate of 8.4 s−1 after allowing to stand for 24 hours at 25° C.±1° C.

Abstract: The present invention is directed to a low-friction coating composition, comprising: about 10 to about 30 wt % of an epoxy resin composition consisting essentially of 4-glycidyloxy-N,N′-diglycidylaniline; about 30 to about 60 wt % of an epoxide resin composition consisting essentially of bisphenol A diglycidyl ether polymer; and about 20 to about 40 wt % of an aromatic amine composition consisting essentially of 4,4′-sulfonyldianiline; wherein all weight percents are based on the total weight of the low-friction coating composition, and wherein the low-friction coating composition is substantially free of chromate. The invention is also directed to a substrate coated with the above low-friction coating composition, and methods of coating a substrate with the low-friction coating composition.

Abstract: An epoxy resin composition giving a cured resin plate which, after 60 hour standing at 150° C. and at the saturated vapor pressure, has a water absorption of 3.5% by weight or lower; a prepreg which comprises the epoxy resin composition and reinforcing fibers; and a fiber-reinforced resin roll which is 1) a laminate comprising fiber-reinforced resin layers each comprising reinforcing fibers and a matrix resin, wherein the matrix resin is a resin composition giving a cured resin plate which, after 60 hour standing at 150° C. and at the saturated vapor pressure, has a water absorption of 3.5% by weight or lower; or 2) a laminate comprising (i) at least one fiber-reinforced resin layer comprising long reinforcing fibers having an elastic modulus of 600˜800 Gpa and a resin composition and (ii) at least one fiber-reinforced resin layer comprising long reinforcing fibers having an elastic modulus of 140˜300 Gpa and a resin composition.

Abstract: This invention relates to an article comprising a bio-supportive matrix comprising at least one bio-limiting agent and at least one nutritional source on a substrate. The invention also relates to the bio-supportive matrix and methods of using the matrix. The present invention can be used as a biological barrier to unwanted organisms, such as animals and plants, by producing allelochemicals that either kill or repel those organisms. The invention could be used as a coating on a vessel to prevent fouling of vessels. The invention may also be used to manufacture specific allelochemicals such as drugs or pharmaceuticals. The invention also relates to a method of preparing a bio-limiting ecological substrate useful as a means for producing allelochemicals, comprising the steps of providing a bio-supportive matrix as described above, and exposing the matrix to the environment, wherein the matrix is prepared to provide a biomass that produces the desired allelochemicals.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A latent curing agent is disclosed for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A); and a curable epoxy resin composition comprising such curing agent and an epoxy compound having more than one epoxy group on the average in the molecule.

Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.

Abstract: An optical resin prepared by curing a polymerizable composition comprising a (thio)epoxy compound having at least one intramolecular disulfide bond exhibits a considerably high refractive index while maintaining good optical properties and a high Abbe number. In addition, the above polymerizable composition to which is added primary and/or secondary amines as an yellowing inhibitor in a proportion of 0.001 to 0.5 of the total molar number of NH2 and NH groups in the amines to the total molar number of thioepoxy and epoxy groups in the (thio)epoxy compound having at least one intramolecular disulfide bond, can provide a transparent resin in which yellowing and reduction in heat resistance associated therewith are adequately prevented while maintaining a high refractive index.

Abstract: A resin composition used in an electrodeposition coating composition and containing an amine-modified vinyl resin (A) prepared by addition reaction of a secondary amine to an epoxy group-containing vinyl copolymer obtained by copolymerizing 2 to 30 parts by weight of an epoxy group-containing polymerizable unsaturated monomer (a-1) and 70 to 98 parts by weight of other polymerizable unsaturated monomer (a-2) copolymerizable with the monomer (a-1) by a catalytic chain transfer polymerization and having a weight average molecular weight of 2,000 to 20,000, and a blocked polyisocyanate (B).

Abstract: The subject invention relates to a foundry binder system which cures in the presence of a volatile amine curing catalyst comprising (a) an epoxy resin, (b) an acrylated organic polyisocyanate, (c) a reactive unsaturated acrylic monomer, acrylic polymer, or mixtures thereof, and (d) an oxidizing agent comprising a hydroperoxide. The foundry binders are used for making foundry mixes. The foundry mixes are used to make foundry shapes which are used to make metal castings.

Abstract: The room temperature polymerizable composition comprises at least one polymerizable monomer having at least one episulfide functionality and an effective amount of at least one (alkoxyphenyl)phosphine polymerization catalyst.

Abstract: Curable epoxy resin compositions, which are obtainable by heating a composition containing at least one epoxy compound, which contains on average at least one, preferably more than one, 1,2-epoxy group and optionally also one or several hydroxyl groups in the molecule, in the presence of at least one Lewis acid as catalyst, wherein the Lewis acid is a salt of trifluoromethanesulfonic acid or of perchloric acid, the counterion of which carries a 2- to 6-fold positive charge, until the epoxy value, measured in equivalent epoxy/kg (Eq/kg) of the starting material, has been reduced by 1 to 60 percent, preferably by 5 to 50 percent; a process for their preparation, and their use for the preparation of fully cured moulded compositions or coatings.

Abstract: Epoxy resin compositions which comprise, as essential components, (A) an epoxy resin having two or more epoxy groups in one molecule, (B) a phenolic curing agent, (C) a phenoxy resin containing a bisphenol S skeleton and having a weight average molecular weight of 5,000 to 100,000, and (D) a curing accelerator, are useful for making adhesive films formed by coating the epoxy resin composition on a supporting base film. Such compositions are also useful for making prepregs, by coating and/or impregnating a sheet-shaped reinforced base material made of a fiber with the resin composition, as well as multilayer printed-wiring boards made with such prepregs. Such epoxy resin compositions are also useful for forming conductor layers with excellent adhesiveness without requiring, in the insulating layer, a roughening component which deteriorates performance, as well as multilayer printed-wiring boards.

Abstract: The object of the present invention is to provide resin compositions conferring cured materials (a coating or the like) with excellent appearance, excellent mechanical properties, or the like. The present invention provides resin compositions containing a vinyl copolymer with an epoxy group and a branched glutaric acid.

Abstract: A low dielectric constant composition used in electric circuit boards is disclosed. The composition includes (a) 20-99.9 parts by weight of a functionalized syndiotactic styrene/para-alkystyrene copolymer having microfoaming when being cured; (b) 0.01-80 parts by weight of a mixture of epoxy resins; and (c) less than 50 parts by weight of a curing agent.

Abstract: A method for rendering nondetonble energetic materials, such as are contained in or removed from decommissioned ordnance. The energetic materials are either combined with epoxy hardener or are combined with other compounds, preferably amine compounds, to form a substance that functions as an epoxy hardener. According to the invention, energetic materials (including TNT, RDX and Composition B) that are treated according to the invention method yield a reaction product that is non-explosive, that serves to harden or cure conventional epoxy resin to form a stable, nonexplosive waste product. Epoxy hardener made using the method of the invention is also described.

Abstract: Resin systems containing a dicyclopentadiene-based epoxy resin and an ortho-alkylated aromatic diamine hardener exhibit low moisture absorption, high Tg and good retention of properties under hot and wet conditions. These properties make the resin systems especially useful in aerospace applications.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little.

Abstract: It is an object of the present invention to provide a cationic electrodeposition coating composition which is free of toxic rust-preventive pigments such as lead compounds and capable of giving coating films having high resistance to corrosion and rusting, even when applied to a substrate surface which is only insufficiently subjected, to a chemical conversion treatment. The present invention provides a cationic electrodeposition coating composition which comprises a rust inhibitor comprising at least one compound selected from the group consisting of compounds containing any of elemental metals belonging to the period 4, 5 or 6 of group 3 of the periodic table and a sulfonium- and propargyl group-containing resin composition. For, example, the content of said rust inhibitor is 0.03 to 10 weight parts in terms of the elemental metal in the rust inhibitor based on 100 weight parts of the solid resins in the resin composition.

Abstract: Two-component systems based on aqueous dispersions of hydrophilic epoxy adducts Ah having hydroxyl groups as reactive groups and unblocked difunctional or polyfunctional isocyanates B, said hydrophilic epoxy adducts Ah being selected from cationically stabilized hydrophilic epoxy adducts Ak, anionically stabilized hydrophilic epoxy adducts Aa and also nonionically stabilized epoxy adducts An and zwitterionically stabilized epoxy-amine adducts Aak.

Abstract: A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to less than approximately 90° C. to form a thermally-removable epoxy. The thermally-removable epoxy can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C. in a polar solvent. The epoxy material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.

Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealing resin which enables a semiconductor device, such as a CSP/BGA assembly which includes a semiconductor chip mounted on a carrier substrate, to be securely connected to a circuit board by short-time heat curing and with good productivity, which demonstrates excellent heat shock properties (or thermal cycle properties), and permits the CSP/BGA assembly to be easily removed from the circuit board in the event of semiconductor device or connection failure.

Abstract: An optical resin prepared by curing a polymerizable composition comprising a (thio)epoxy compound having at least one intramolecular disulfide bond exhibits a considerably high refractive index while maintaining good optical properties and a high Abbe number. In addition, the above polymerizable composition to which is added primary and/or secondary amines as an yellowing inhibitor in a proportion of 0.001 to 0.5 of the total molar number of NH2 and NH groups in the amines to the total molar number of thioepoxy and epoxy groups in the (thio)epoxy compound having at least one intramolecular disulfide bond, can provide a transparent resin in which yellowing and reduction in heat resistance associated therewith are adequately prevented while maintaining a high refractive index.

Abstract: An agent for the single-stage full blocking of polyisocyanates comprises or consists of an alcohol mixture A) comprising a) furfuryl alcohol or substituted furfuryl alcohols in an amount corresponding to from 60 to 90, in particular from 65 to 85, mol % of hydroxyl groups and b) at least one monoalcohol in an amount corresponding to at least 2 mol % of hydroxyl groups, based in each case on the total amount of hydroxyl groups in components a) and b). In addition, the alcohol mixture A) may also include at least one aliphatic polyol c) of low molecular mass with a functionality of three and/or more in an amount corresponding to at least 5 mol % of hydroxyl groups, based on the total amount of hydroxyl groups in components a), b) and c). In this case component b) can have a molecular weight of <163 g/mol.

Abstract: The invention is a sprayable coating having noise vibration and harshness reduction or absorption properties. Such composition comprises from about 10 to about 60 percent of the flexible epoxy resin, from about 5 to about 40 percent by weight of a rigid epoxy resin formulation, and a curing agent for the epoxy moieties of the two resins. In another embodiment, the invention is a method of coating a substrate to reduce the impact of noise vibration and harshness on the substrate or users of the substrate, which process comprises spraying the above defined composition on to a substrate and curing the resin on such substrate. In yet another embodiment the invention is a coated substrate described herein before having enhanced noise vibration and harshness properties.

Abstract: The present invention relates to an aqueous binder dispersion for cathodic electrodeposition coatings obtained A) by reacting I. a precursor prepared at temperatures of from 120 to 180° C. from a) a diepoxide compound or a mixture of diepoxide compounds and b) an aromatic or aliphatic compound hydroxyl, carboxyl, phenol and/or thiol groups, or a mixture of such compounds with reaction of the phenolic hydroxyl groups with epoxide groups, II. with at least one organic amine or a mixture of organic amines at a temperature between 60 and about 130° C. to give an epoxide/amine adduct; B) subsequently or simultaneously reacting at least one secondary hydroxyl group of the precursor with an unreacted epoxide group of the epoxide/amine adduct prepared in step A) at a temperatures of from about 110 to about 150° C.; C) adding a crosslinking agent at a temperature of less than about 150° C.

Abstract: A curable composition is described, comprising a) 10 to 90% by weight of at least one, optionally water-dilutable, water-emulsifiable or water-dispersible, epoxy resin having more than one epoxy group in the molecule; b) 90 to 10% by weight of at least one polyamine adduct which predominantly corresponds to the idealised formula (I) and which is prepared from an adduct of formula (A) and a polyamine of formula (XII), wherein the sum of the percentages by weight of components (a) and (b) is always 100%; c) optionally, at least one further aliphatic, cycloaliphatic, aromatic/aliphatic, aromatic or heteroaromatic mono- or polyamine which may optionally be modified by adduction; and d) optionally, at least one customary additive, R1 and R2 and also m and n and B being defined in more detail in the description. The novel compositions are used for the preparation of colourants and coatings.

Abstract: The present invention provides a room-temperature curable, reinforced thermosetting epoxy resin composition. The composition includes an epoxy resin first component, and an epoxy resin hardener second component. The epoxy resin component includes an epoxy resin, and may further include an inorganic and/or organic filler component, such as a structural reinforcement component. The epoxy resin hardener component includes an amine-based hardener, and may further include an inorganic and/or organic filler component. Cured reaction products of the composition demonstrate at about room temperature an adhesive strength of at least about 6500 psi, such as about 8000 to about 10000, and a fracture toughness of at least about 10 in-lbs/in2, such as about 20 to about 35 in-lbs/in2. In addition, the cured reaction products of the composition demonstrate a creep resistance at about room temperature at least about 6000 psi of at least about 1 hour.

Abstract: A lubricating coating compound used for forming a thermosetting synthetic resin lubricating film, wherein a resin composition composed of an epoxy resin, a curing agent, a reactive silicone oil with an epoxy group, and a triazinethiol is dissolved in an organic solvent, wherein if the sum of the epoxy resin and the curing agent is set to 100 parts by weight, the sum of the reactive silicone oil with an epoxy group and the triazinethiol is 2 to 30 parts by weight.

Abstract: The present invention is directed to polymerizable dental compositions containing a) 3 to 80 wt. % of cycloaliphatic epoxides; b) 0 to 80 wt. % of an epoxide or a mixture of epoxides which are different from a); c) 3 to 85 wt. % of a filer material; d) 0.01 to 25 wt. % of initiators, inhibitors and/or accelerators; e) 0 to 25 wt. % of auxiliary agents, the individual percentages of which are in relation to the total weight. The new polymerizable agents are particularly suited as dental material.

Abstract: The present invention provides a phase-separation structure comprising a phenoxy resin modified with a carboxylated elastomer, prepared from a phenoxy resin and a carboxylated elastomer, the resin and the elastomer constituting a phase-separation structure, wherein the light transmittance of the structure in a 75 &mgr;m-thick film form at a wavelength of 500 nm is not less than 10% of the light transmittance of the air, which is useful as adhesives, film materials, and molding materials for encapsulating electronic components.

Abstract: An emulsified reactive epoxy polymer composition which is readily dispersed in water and is particularly suited for use in a coating composition which may be cured at ambient temperatures. The emulsifiable epoxy composition incorporates a hydrophilic polyoxyalkylene segment.

Abstract: A latent curing agent is disclosed for epoxy resin, comprising a reaction product obtainable by allowing (A) an epoxy compound having more than one epoxy groups on the average in the molecule and (B) a compound having in the molecule both a tertiary amino group and at least one functional group selected from the group consisting of OH group, SH group, NH group, NH2 group, COOH group and CONHNH2 group, to react on each other in the presence of 0.05-5.0 equivalents of water per 1 equivalent of the epoxy group of Compound (A); and a curable epoxy resin composition comprising such curing agent and an epoxy compound having more than one epoxy group on the average in the molecule.

Abstract: A cathodic electrocoating composition comprises an aqueous carrier, a film forming binder, comprising an epoxy-amine adduct and a blocked polyisocyanate crosslinking agent, dispersed in the carrier, and a novel additive comprising the reaction product of (1) a polyoxy alkylene di or monoamine; (2) a glycidoxy alkyl alkoxy silane; and (3) a glycidyl compound selected from the group consisting of a glycidyl ester of a carboxylic acid and an alkyl glycidyl ether, which reaction product is hydrolyzed in the presence of acid and water to convert alkoxysilane moieties to silanol moieties. The electrocoat composition produces coatings having a smoother appearance with better edge coverage and fewer craters.

Abstract: Epoxy resin mixtures suitable for producing halogen-free flame-retardant composites by the injection process comprise the following components: (A) a phosphorus-free aliphatic and/or aromatic and/or heterocyclic epoxy resin; (B) an epoxide group-containing phosphorus compound; (C) a phosphorus-modified epoxy resin with an epoxide value of from 0.02 to 1 mol/100 g, obtained by reacting polyepoxy compounds having at least two epoxide groups per molecule with phosphinic anhydrides and/or phosphonic anhydrides or with phosphonic monoesters, followed by thermal elimination of alcohol; and (D) as hardener, at least one primary or secondary aliphatic polyamine with NH and/or NH2 groups.

Abstract: An acidic substance is added to a mixture containing a compound having epithio structures and a catalyst for curing the compound and the mixture is solidified. The mixture containing a compound having epithio structures and a catalyst for curing the compound can be mildly solidified for disposal.

Abstract: A bonded structure of an Al alloy pressed plate, in which another member is bonded onto the surface of the Al alloy pressed plate that has a lubricant layer by use of an epoxy resin based adhesive. The adhesive contains an epoxy resin, a dehydrated phosphate and a latent curing agent. The epoxy resin comprises a polyester type epoxy resin and at least one resin selected from the group consisting of a bisphenol epoxy resin, a rubber-modified bisphenol epoxy resin, and a urethane-modified epoxy resin.

Abstract: A process to provide an aqueous dispersion is provided comprising the steps of:a) emulsifying a mixture comprisingi) water,ii) at least one epoxy resin having a functionality of greater than 0.8 epoxide group per molecule,iii) from 0.1 to 20 weight percent, based on the epoxy resin, of at least one polyoxyalkylene surfactant, andiv) optionally an acetone-free solvent solution to produce a resin-surfactant emulsion; andb) adding a solvent mixture to said resin-surfactant emulsion, said solvent mixture comprising i) acetone and ii) a non-volatile hydrophobic liquid resin or resin modifier to produce the aqueous dispersion.

Abstract: A liquid epoxy resin composition comprising (A) an epoxy resin component which includes specific amounts of three specific epoxy resins, (B) a curing agent, (C) a curing accelerator, and (D) an inorganic filler has a low viscosity, high cure rate, ease of processing, reliability, and shelf stability. The composition can be used as a semiconductor device encapsulant to provide BGA packages having minimal warpage.

Abstract: A water reducible polyurethane resin for use in coating compositions is provided with humidity resistance at relatively low cost by employing a urethane prepolymer which is the reaction product of (i) a polyisocyanate, (ii) a polyhydroxy compound which is the reaction product of an organic acid and an epoxy compound, at least one of which includes a hydrocarbon group of at least six carbon atoms, and (iii) a monomer having an anionic group and functionality reactive with isocyanate. Preferred embodiments employ C.sub.36 dimer diacid and the propylene oxide ester of neodecanoic acid to make the polyhydroxy compound.

Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble cross-linked polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: A flexible thermally-conductive epoxy-based adhesive composition and method for making the same are provided. The present adhesive composition comprises (a) a polymer mixture comprising at least one polyepoxide resin having a hardness not exceeding a durometer Shore D reading of about 45, when cured with a stoichiometric amount of diethylene triamine ("DETA"), and a substantially stoichiometric amount of at least one latent epoxy resin curing agent; and (b) a thermally-conductive filler. Optional components include secondary epoxy resins, non-reactive flexibilizers, diluents, and processing aids. The present adhesive composition is rheologically stable for weeks or even months at room temperature and is curable in less than one hour at a temperature ranging from about 100.degree. C. to 140.degree. C., whereupon the cured adhesive composition exhibits a durometer Shore A of less than about 90 and a thermal conductivity exceeding 0.4 BTU/hr-ft-.degree. F. (0.7 W/m-K).

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: Provided by the invention is a thermosetting adhesive composition suitable for use in the preparation of metal foil-laminated base sheets of flexible printed circuit boards and laminated product related thereto such as coverlay films and bonding sheets. The adhesive composition is a uniform blend which comprises: (A) an epoxy resin including a brominated epoxy resin to exhibit flame retardancy; (B) a combination of two or three kinds of different nitrile rubbers distinguishable relative to the iodine value and content of carboxyl groups at the molecular chain ends in a specified weight proportion; (C) a curing agent for the epoxy resin; and (D) a curing accelerator, with optional admixture of (E) an inorganic filler; and/or (F) a vulcanizing agent for the nitrile rubbers.

Abstract: A composition is useful as a prepreg containing reinforcing fibers comprises an epoxy resin, a thermoplastic elastomer of a polyamide and/or polyester block copolymer, a curing agent such as dicyandiamide, and optionally a thermoplastic resin such as a polyvinyl formal resin.

Abstract: Unsaturated hydrophobic resins modified with labile hydrophillic groups exhibit reversible solubility in water. Beta-dialkyl amino carboxylate derivatives of novolak resins are useful to make baking enamels and resists.