Abstract: A reactive hot melt adhesive contains, as resin component, a reaction product ofa) 30 to 50 wt-% of an epoxy resin, solid at root temperature, prepared from bisphenol A and/or bisphenol F and epichlorhydrin with an epoxide equivalent weight of 400 to 700,b) 10 to 25 wt-% of an epoxy resin, liquid at room temperature, prepared from bisphenol A and/or bisphenol F and epichlorhydrin with an epoxide equivalent weight of 150 to 220 andc) 35 to 50 wt-% amino-terminated polyethylene and/or polypropylene glycols.

Abstract: A curable composition and a method of making it comprises reacting in the presence of a catalyst epoxy resin(s) having at least 0.05% by weight of epoxy resin oligomer with a solid rubber which is swellable or soluble in the reaction mixture and possessing at least 1% by weight of reactive groups, in a rubber:epoxy resin(s) weight ratio of between 1:1 and 1:20, wherein said epoxy resin(s) comprises (a) at least one epoxy resin having an epoxy functionality of greater than three and (b) at least one second epoxy resin having a functionality of greater than one but not more than three; heating to effect the reaction, cooling to substantially ambient temperature, and adding any remaining portion of epoxy resin and curing agent(s).

Abstract: A solid, one-component, flexible epoxy-based composition and method for making the same are provided. The present compositions comprise: (a) an epoxy-terminated prepolymer formed by reacting at least four moles of a polyepoxide resin with approximately one mole of a diamine compound, wherein at least one of the polyepoxide resin and diamine compound is solid at room temperature, and wherein the prepolymer is rheologically stable for weeks as a single component mixture at room temperature and, and (b) a substantially stoichiometric amount of an epoxy resin curing agent selected from the group consisting of a heat-curable, latent epoxy resin curing agent and a room temperature-curable ketimine curing agent. Optional components include thixotropic agents, diluents, fillers, anti-oxidants, and processing aids. The present uncured epoxy-based compositions upon cure, exhibit a durometer Shore D of less than about 45 (or a durometer Shore A of less than about 100).

Abstract: A method for binding ceramic materials in aqueous media is disclose. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: Disclosed is a multilayer packaging material which is suitable for use as a container for malt beverages and which is tinted so as to block at least 90% of light with wavelengths of electromagnetic radiation ranging from 300 nm to 500 nm. The tinted multilayer packaging materials of the present invention includes: (a) at least one layer of a carbon dioxide (CO.sub.2)-permeable polymeric packaging material, and (b) at least one layer of a CO.sub.2 -treated gas barrier coating, which has an oxygen permeability constant not more than 0.05 cubic centimeter-mil/100 square inches/atmosphere/day. The CO.sub.2 -permeable packaging material can be any polymeric material through which CO.sub.2 can pass and which can be used as a packaging material for food or beverages. The gas barrier coating has an oxygen permeability constant, before CO.sub.2 treatment, of less than 0.3. This gas barrier coating includes the reaction product of a polyamine (A) and a polyepoxide (B).

Abstract: A composite coating is described. The composite comprises a substrate; one or more primer coating layers disposed on the substrate; and at least one topcoat layer disposed on the outermost primer coating layer. The outermost primer coating layer is obtained by reaction of a primer composition that includes a novolac resin having at least one carbamate group and an aminoplast resin.

Abstract: A heat resistant polymer composition, an alignment layer formed using the same, and an LCD having the alignment layer are provided. The heat resistant polymer composition includes 10-25% by weight of a polyimide resin or polyamic acid, 0.1-1% by weight of an adhesive agent, and balance of a solvent. The adhesive agent improves thermal stability. Thus, the LCD having the alignment layer formed using the same can accomplish a desirable pre-tilt angle of liquid crystals and desirable alignment properties of liquid crystal molecules.

Abstract: There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.

Abstract: The present invention pertains to a one component curable epoxy resin composition which is storage-stable at ambient temperature and which maintains a post-cured high glass transition temperature (Tg) of above 130.degree. C. and a low coefficient of thermal expansion (CTE) of less than 1.76.times.10.sup.-5 cm/cm/.degree.C. over a temperature range of -30.degree. to 125.degree. C., and thus finds practical utility in tooling applications. The epoxy resin composition comprises an epoxy resin or mixture thereof, a multifunctional epoxy resin diluent, a boron trichloride amine complex, and at least one filler selected from the group consisting of a silica or a silicate. The invention also relates to the cured product.

Abstract: Curable epoxy resin composition comprising a bisphenol based epoxy resin having between 1.1 and 2.5 epoxy groups on average per molecule, a polyhydric phenol curing agent having more than two phenolic hydroxyl groups on average per molecule and red phosphorus. Also are described a process for the production of such curable epoxy resin compositions, the use of the compositions, especially in the impregnation of fibrous fibers, and products comprising or coated by the partly cured or cured epoxy resin compositions, especially impregnated fibrous fibers and laminates made therefrom.

Abstract: A coating composition is described comprising, in an aqueous medium:A) a resin having a plurality of primary amine groups, andB) a curing agent having a plurality of cyclic carbonate groups.

Abstract: This invention is to provide a multilayer printed circuit board having excellent appearance and reliability and a method of producing the same, and proposes a build-up multilayer printed circuit board comprising an interlaminar insulating layer 4 comprised of an adhesive for additive process between an inner layer copper pattern 3 provided at its surface with a fine uneven layer 9 and an outer layer copper pattern 6 in which the surface of uneven layer 9 in the inner layer copper pattern 3 is covered with a metal layer containing one or more of metals having an ionization tendency not lower than that of copper but not higher than that of titanium, or a noble metal layer 10, and a production technique therefor.

Abstract: An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Abstract: An alkyl sulfide type episulfide compound represented by the following general formula (I) or (II) is herein disclosed: ##STR1## A material obtained by polymerizing/curing the above-mentioned compound is desirable as an optical material for various purposes, particularly a lens material for spectacles.

Abstract: The invention relates to flame-resistant epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprise a phosphorus-containing compound of the formula I or II ##STR1## in which R is a linear or branched alkyl, cycloalkyl, aryl or alkylaryl group having 1 to 18 carbon atoms or is hydrogen, and R' is a linear or branched alkylene, cycloalkylene, arylene or alkylarylene group having 1 to 18 carbon atoms, to a process for their preparation and to their use.

Abstract: A marine cladding composition comprising in combination:a. Copper powderb. Two epoxy resins1. Bisphenol A epoxy resin and2. Polyglycol di-epoxidec. Glass fibersd. Polydimethyl siloxanee. Two amine curing agents1. A polyammido amine and2.

Abstract: Disclosed is a multilayer packaging material which is suitable for use as a container for malt beverages and which is tinted so as to block at least 90% of light with wavelengths of electromagnetic radiation ranging from 300 nm to 500 nm. The tinted multilayer packaging materials of the present invention includes: (a) at least one layer of a carbon dioxide (CO.sub.2)-permeable polymeric packaging material, and (b) at least one layer of a CO.sub.2 -treated gas barrier coating, which has an oxygen permeability constant not more than 0.05 cubic centimeter-mil/100 square inches/atmosphere/day. The CO.sub.2 -permeable packaging material can be any polymeric material through which CO.sub.2 can pass and which can be used as a packaging material for food or beverages. The gas barrier coating has an oxygen permeability constant, before CO.sub.2 treatment, of less than 0.3. This gas barrier coating includes the reaction product of a polyamine (A) and a polyepoxide (B).

Abstract: The invention relates to a heatset intaglio printing ink especially suited for the intaglio printing of security documents such as currency, postage stamps, stock certificates, bank notes and the like. The ink comprises: a) an epoxy resin ester reacted with an unsaturated monobasic acid and a reactive monomer, b) a glycol and/or glycol ether, c) a pigment, d) a drier and e) a compound obtained by reacting an amine/epoxy adduct with a phenolic resin or polyhydric phenol compound.

Abstract: A method and encapsulation material are provided for processing an electronic circuit assembly having surface mount integrated circuit packages mounted with soldered leads to its substrate, in which encapsulation of the soldered lead joints serves to enhance the fatigue life of the solder joints. The encapsulation material is a reactive hot melt epoxy that is curable at temperatures significantly lower than that required for previous epoxy-based encapsulation materials. As such, processing of the circuit assembly is greatly facilitated, while the benefit of encapsulated solder joints is achieved for the assembly. The encapsulation material further includes a latent curative and a filler material for lower the coefficient of thermal expansion of the encapsulation material.

Abstract: A thermosetting epoxy resin powder coating composition is provided that comprises an epoxy resin composed of a diglycidyl ether of bisphenol A, a curing agent composed of a bisphenol A encapped diglycidyl ether of bisphenol A, and a cure catalyst composed of an imidazole adducted to a diglycidyl ether of bisphenol A, in which the ratio of curing agent to epoxy resin is below 70% stoichiometry, and preferably between about 10% and 60% stoichiometry. The thermosetting epoxy resin powder coating composition not only exhibits the desired flexibility and fast cure speeds, but also exhibits superior adhesion and superior resistance to delamination and cathodic disbondment, preferably having cathodic disbondment values typically less than 4 mm radial disbondment, and preferably less than 2 mm radial disbondment. Such properties are highly advantageous for protective powder coatings used on rebars and pipelines.

Abstract: The peel strength of lightweight, liquid polysulfide-based sealants for aircraft is improved by the addition of an epoxy-terminated liquid polysulfide to the liquid polysulfide. The lightweight sealants have a specific gravity of from about 1 to about 1.3 and the amount of epoxide terminated polysulfide is from about 0.4 to about 5% of the weight of the polysulfide present in the sealant. Fillers having a specific gravity of from about 0.1 to about 2.2 are used.

Abstract: A coating composition containing a resin composition consisting of (A) 10 to 90 parts by weight of at least one resin selected from polyester resin having a glass transition temperature of -5.degree. C. to 80.degree. C. and a number average molecular weight of 5,000 to 30,000, and epoxy-modified polyester resin having a glass transition temperature of 10.degree. C. to 130.degree.0 C. and a number average molecular weight of 6,000 to 30,000; (B) 5 to 70 parts by weight of novolac-based epoxy resin and (C) 5 to 40 parts by weight of a curing agent per 100 parts by weight of the resin composition respectively; and (D) 20 to 120 parts by weight of an anticorrosion pigment per 100 parts by weight of the resin composition.

Abstract: A newly-blended one part system heat-resistant epoxy resin composition which exhibits excellent stability at room temperature, quickly undergoes the curing reaction, molded within short periods of time, and, after cured, exhibits excellent Tg, resistance against the water, resistance against degradation by heat, and a variety of excellent properties in combination. The heat-resistant epoxy resin composition having excellent stability at room temperature comprises an epoxy compound having two or more epoxy groups, a curing agent which comprises a naphthalenedicarboxylic dihydrazide as a main component, and a ceramic whisker as a filler.

Abstract: An adhesive for electroless plating is formed by dispersing particular heat-resistant granules easily soluble in an oxidizing agent into a particular heat-resistant resin sparingly soluble in the oxidizing agent through a curing treatment. A printed circuit board is manufactured by using such an adhesive.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeospheres, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: Disclosed is a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a dimethylpolysiloxane having epoxy groups at its both ends, and (C) a dispersing agent comprising the reaction product of (C-1) a dimethylpolysiloxane having amino groups or carboxyl groups reactive with epoxy resins at its side chains or both ends and having phenyl groups or polyether groups for improving its compatibility with epoxy resins at its side chains, and (C-2) an epoxy resin having the same structure as the component (A). The composition has a reduced internal stress, while maintaining the heat resistance intrinsic to epoxy resins, and has excellent resistance, crack resistance and heat shock resistance.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: The invention relates to flame-retarded compositions comprisingA) an epoxy resin mixture consisting ofA1) 15-35% by weight of at least one liquid epoxy resin,A2) 55-85% by weight of aluminum oxide trihydrate having a particle size of D.sub.50 20-25 .mu.m as determined by sieving,A3) 0-20% by weight of at least one further filler andA4) 0-5% by weight of at least one conventional additiveandB) at least one carboxylic acid anhydrideora cycloaliphatic diamine of the formula I or II ##STR1## in which the radicals R.sub.1 to R.sub.4 independently of one another are hydrogen or C.sub.1 -C.sub.4 alkyl and Z is a direct bond, --CH.sub.2 --, --C(CH.sub.3).sub.2 --, --S--, --O--, --SO.sub.2 -- or --CO--, in an amount sufficient to cure component A,the content of components A2 and A3 together being 63-80% by weight, with respect to the total weight of the composition. These compositions are suitable for use in high voltage components, such as flyback transformers.

Abstract: A composition of ferrite and epoxy having the form of a film which can be cut, pressed onto word straps, and heat-cured to form an encapsulating keeper on a plated wire memory. The film comprises ferrite powder in a mixture of epoxy resins, typically Epon 1009 and Epon 828, pulverized dicyandiamide and butadiene/acrylonitrile rubber. The mixture is sprayed onto a sheet of halogenated polyolefin and air dried for 8-12 hours at between 160.degree. F. and 180.degree. F. The resulting flexible film is die cut to fit over word straps and further processed by applying 50-75 psi at 325.degree. F. for one hour.

Abstract: An aqueous solution or dispersion of a vehicle for an aqueous cataphoretic coating material, the solution or dispersion containing one or more acid-neutralized, basic, film forming resins, an organic solvent, and a cross linking agent for the film forming resins, the aqueous solution or dispersion being obtained by mixing the following components A) and B):A) from 95% to 50% by weight solids basis of an aqueous solution or dispersion of one or more, neutralized, basic, film forming resins having a resin solids content of from 25% to 55% by weight, and an organic solvent content of more than 4% by weight, both based on the total solution or dispersion, and a minimum film forming temperature of less than 30.degree. C.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: Polymeric systems are disclosed that exhibit the Johnsen-Rahbeck effect and an electrostatic clutch for using films of these polymeric systems. The films may be pressed from the polymeric reaction product of either a polymer having an anionic functionality reacted with cations, or a polymer having cationic functionality reacted with anions. The dielectric film may be interposed between nesting, or otherwise contacting, conductive surfaces to increase the frictional force between the surfaces by the Johnsen-Rahbeck effect when a voltage differential is applied across the surfaces.

Abstract: An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).

Abstract: Solutions of accelerator systems comprising a binary system comprisinga) 10 to 90% by weight of a salt of formula I[Me].sub.m.sup.x.sym. [R].sub.n.sup.y.crclbar. (I),wherein x and y are the respective number of charges and m and n are each a number 1, 2, 3 or 4, Me is a metal atom and R is the radical of an alcohol, phenol or thiophenol or of a carboxylic acid or thiocarboxylic acid, or10 to 90% by weight of a salt of formula II[Me.sub.1 ].sub.m.sup.x.sym. [A].sub.n.sup.y.crclbar. (II),with an organic complex former containing one or more hetero atoms having free electron pairs,wherein Me.sub.1 is a metal atom or a group of the formula N(R.sub.1).sub.4, S(R.sub.1).sub.3 or P(R.sub.1).sub.4 wherein each R.sub.1 independently of the others is hydrogen, an unsubstituted or substituted C.sub.1 -C.sub.6 alkyl or aryl radical, A is any anion and x, y, m and n are as defined above, andb) 90 to 10% by weight of an organic solvent containing at least one --OH, --OR.sub.1, --COOH, --COOR.sub.1, --COR.sub.1 or --CON(R.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water such that the particle sizes of the solids are less than 30 .mu.m. The primer compositions are environmentally superior to solvent based primers without loss of physical properties, are storage stable, and exhibit excellent solvent resistance.

Abstract: Barrier materials for reducing the permeability of plastic packaging materials are provided, characterized as containing at least about seven percent by weight amine nitrogen, or a total of at least about 17 percent amine nitrogen plus hydroxyl groups. The barrier materials exhibit oxygen permeability of less than about 1.5 cc-mil/100 in.sup.2 -day-atmosphere and a carbon dioxide permeability of less than about 15 cc-mil/100 in.sup.2 -day-atmosphere at 23.degree. C. and zero percent relative humidity. The barrier material can be formed from polyepoxide and polyamine. Optionally the polyamine may comprise prereacted polymeric resin formed from a polyepoxide and a polyamine. Multilayer packaging materials and multilayer containers including the polyamine-polyepoxide barrier material are part of the invention.

Abstract: A resinous material for the manufacture of printed circuit boards is obtained by (a) treating a mixture of bromine- and nonbromine-containing epoxy resins with a secondary diamine such as 5,5-dimethyl hydantion or barbituric acid in the presence of a tertiary amine catalyst to form a modified epoxy resin; (b) heating the modified epoxy resin and a polyisocyanate in the presence of an encyclization catalyst; and (c) dissolving the resulting product in a solvent with a curing agent to form a B-stage prepreg varnish.

Abstract: An essentially water-free solvent system comprising methoxy acetone and an organic protic solvent is useful as a solvent fora) a curing agent for an epoxy resin and/orb) a curing catalyst and/orc) a cure inhibitor.

Abstract: A superior thermal transfer film adhesive comprises the following composition: (a) at least one aliphatic epoxy resin; (b) a stoichiometric amount of at least one aliphatic polyamine curative; (c) an effective amount of a thixotropic agent, such as fumed silica; and (d) about 20 to 50 volume percent of at least one filler, such as alumina, based on the total of the epoxy resin and the curative. The aliphatic epoxy resin has aliphatic pendant chains of 6 to 20 carbon atoms in length. The curative comprises a long chain aliphatic or cycloaliphatic curing agent for the epoxy resin. Since aliphatic moieties, which are flexible, are used, the glass transition temperature of the resulting cured material is lower than epoxies and plasticizers employing rigid moieties. The adhesive of the invention is novel in attaining high volume resistivity (at least 10.sup.14 ohm-cm at 25.degree. C.), low temperature flexibility (-55.degree. C.), excellent adhesion for maximum thermal transfer, and ease of reworkability.

Abstract: Epoxy resin compositions having improved storage stability before curing and improved thermal and mechanical performance after curing comprise a mixture of a polyepoxide and a curing agent that is reactive with the polyepoxide. The epoxy resin composition is characterized by a glass transition temperature of less than 20.degree. C., measured under standard conditions, after subjecting the epoxy resin composition to a specified thermal cycle. The preferred curing agents are aromatic diamines, for example, 3,7-diaminodibenzothiophene-5,5-dioxide; 3,7-diaminophenothiazine sulfone, 3,7-diamino-N-methylphenothiazine sulfone; 2,7-diamino-9-fluorenone and 2,4,6,8-tetramethyl-3,7-diaminothioxanthene sulfone.

Abstract: Epoxy-type impregnating compounds, which are useful for electrical potting or encapsulation, plastic tooling, and fiber-reinforced composites, comprise a resin component and a stoichiometric amount of a curative and have a curing temperature of less than about 120.degree. F. (49.degree. C.). The resin component is the diglycidyl ether of bisphenol A, either alone or as a mixture with up to about 15 wt % of at least one reactive monoepoxide diluent or up to about 50 wt % of at least one reactive diepoxide diluent, the diluent having a viscosity of less than about 200 cp. The curative is a mixture of cycloaliphatic diamines, comprising from about 20 to 80 wt % of at least one sterically-hindered cycloaliphatic diamine and the balance at least one sterically-unhindered cycloaliphatic diamine. These epoxy compounds are unique because they can be handled in relatively large bulk without concern for dangerous runaway exotherms.

Abstract: Barrier materials for reducing the permeability of plastic packaging materials are provided, characterized as containing at least about seven percent by weight amine nitrogen, or a total of at least about 17 percent amine nitrogen plus hydroxyl groups. The barrier materials exhibit oxygen permeability of less than about 1.5 cc-mil/100 in.sup.2 -day-atmosphere and a carbon dioxide permeability of less than about 15 cc-mil/100 in.sup.2 -day-atmosphere at 23.degree. C. and zero percent relative humidity. The barrier material can be formed from polyepoxide and polyamine. Optionally the polyamine may comprise prereacted polymeric resin formed from a polyepoxide and a polyamine. Multilayer packaging materials and multilayer containers including the polyamine-polyepoxide barrier material are part of the invention.

Abstract: A halogen free casting resin suitable for covering electron devices with a fire retardant material contains an acidic ester of an hydroxy-functional phosphor compound and an organic anhydride. A stable mixture can be generated from the acidic ester and the hardener component of the casting resin, and further used for the hardening of epoxides resins. The acidic ester is chemically integrated in the epoxide resin matrix in a stable mixture, thereby improving the long term fire-retardancy of the casting resin molding compound without increasing the volatility of the mixture.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, plasticizer and a high performance epoxy resin selected from a group consisting of epoxy resins represented by the formulas (I-a), (I-b) and (I-c) is disclosed.Use of the high performance epoxy resin in an amount of from 0.1 to 20.0% by weight improves the heat and moisture resistance of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 represent independently H or (CH.sub.2) nCH.sub.3 radical, andn represents 0 or an integer of 1 above.

Abstract: A casting resin composition curable with an epoxy resin curing agent is described, which comprises at least one kind of an epoxy resin selected from bisphenol A diglycidyl ether and bisphenol F diglycidyl ether, a tri-functional or tetra-functional liquid epoxy resin, and an iron powder, the ratio of the iron powder being from 60 to 80% by weight to the amount of the whole resin composition. The casting resin composition can give a cured product having a high hardness and an excellent abrasion resistance.

Abstract: A two-component, or two-part epoxy resin composition which adheres well to wet mortar and concrete is provided. One part comprising a non-cycloaliphatic epoxy resin, a reactive diluent in the form of an epoxy compound, a modifying resin selected from the group consisting of a coumarone-indene polymer resin, a dicyclopentadiene polymer resin, an acrylonitrile modified polyvinyl chloride resin, an amino terminated acrylonitrile-butadiene copolymer resin, and an epoxy terminated polybutadiene resin, a silane coupling agent having an epoxy or amino group, and a synthetic zeolite is combined, on use, with the other part comprising an amine curing agent selected from the group consisting of a cycloaliphatic polyamine, an aliphatic/aromatic polyamide, and an amine adduct.

Abstract: The present invention provides a hardner for epoxide resin masses based on dicyandiamide, wherein it containsa) dicyandiamide with a particle size of .gtoreq.90% .ltoreq.10 .mu.m. andb) 0.1 to 30% by weight of silicon dioxide and/or of an oxide of a metal of Group IIA or IIB of the Periodic Table with a large specific surface area.

Abstract: Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.

Abstract: The problem of the potential for creation of a reactive noncompressible crust in a fluid adhesive mixture comprising a deposit of an uncured curable fluid curable resin composition and a deposit of a fluid curing agent wherein the deposits are separated by a thin flexible barrier film formed from the interaction of the cured resin as reacted by the curing agent, is overcome by including with the fluid curing agent a thickener in an amount sufficient to render the fluid curing agent non-free-flowing at room temperature and preventing the formation of any substantial amount of noncompressible crust in the mixture.