Abstract: The present invention relates to a creosote resistant epoxy adhesive system comprising(A) a low viscosity primer comprising(a) a resin component comprising diglycidyl ether of Bisphenol A, diglycidyl ether of butanediol, and epoxy silane; and(b) a hardener component comprising an aliphatic amine; and(B) an adhesive component comprising(a) a resin component comprising diglycidyl ether of Bisphenol A, a diluent, a filler, and epoxy silane; and(b) a hardener component comprising a combination of (i) an aliphatic or aromatic amine and (ii) a polyamide or an adducted amine with diglycidyl ether of Bisphenol, and a fillerand wherein a flexibilizer is present in either component (a) or component (b) of said adhesive component.

Abstract: A penetrable, epoxy resin composition is disclosed which comprises: a liquid, epoxy resin mixture containing a glycidyl ether of bisphenol having an epoxy equivalent of 158-270 and a flexible epoxy resin; a curing agent capable of reacting with the epoxy resin mixture when heated to a curing temperature; an inert organic solvent which does not react with the epoxy resin mixture, which is capable of dissolving the curing agent and which has a boiling point lower than the curing temperature; and an inorganic filler having an average particle size of 0.1-5 .mu.m.

Abstract: Disclosed is a curable epoxy resin composition which is effectively cured at ambient temperature and when cured has excellent adhesive strength and good water resistance. The epoxy resin composition comprises:(a) an epoxy resin having at least two epoxy groups in one molecule,(b) a monofunctional (meth)acrylate represented by ##STR1## wherein R.sub.1 represents a hydrogen atom or an alkyl group having 1 to 12 carbon atoms, R.sub.2 and R.sub.3 respectively represent a hydrogen atom or a methyl group, and n is an integer of 1 to 4, and(c) An amine curing agent selected from the group consisting of an aromatic polyamine, a modified aromatic polyamine, a polyamideamine and a mixture thereof. The present invention also provides an adhesive composition prepared from the above mentioned curable epoxy resin composition.

Abstract: An epoxy resin composition used as a matrix for a fiber-reinforced composite is disclosed, which comprises the following components:(A) a bifunctional epoxy resin;(B) at least one of a trifunctional epoxy resin and a tetrafunctional epoxy resin;(C) a dihydroxybiphenyl compound represented by the following general formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which may be the same or different, each represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; and(D) an aromatic amine,wherein said components (A), (B), (C) and (D) are used in amounts satisfying the following conditions:1/0.1.gtoreq.a/b.gtoreq.1/1.210/1.gtoreq.(a+b)/c.gtoreq.1/11/0.8.gtoreq.(a+b-c)/d.gtoreq.1/1.5wherein a represents the molar number of epoxy groups in component (A), b represents the molar number of epoxy groups in component (B), c represents the molar number of phenolic OH groups in component (C) and d represents the molar number of NH groups in component (D).

Abstract: A cationic electrodeposition paint composition suitable to be coated on a road wheel of an automotive vehicle. The paint composition is composed of an acrylic cationic resin (A), a urethanated epoxy cationic resin (B) a hardner resin (C) of a blocked isocyanate, and a cationic cross-linked resin particulate (D) having an average particle size ranging from 0.01.mu. to 1.mu.. In the paint composition the acrylic cationic resin (A), the urethanated epoxy system cationic resin (B), the blocked isocyanate hardner resin (C) and the cationic cross-linked resin particulate are respectively in amount of 20 to 70 parts by weight, 5 to 50 parts by weight, 10 to 40 parts by weight and 1 to 20 parts by weight relative to 100 parts by weight of a total solid content of the resins and particulate (A), (B), (C) and (D), thereby improving the corrosion resistance of the paint composition to the cut edge portion of the road wheel and the weatherability of coated paint film.

Abstract: Curable compositions contain a low molecular weight polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts. Said compositions are preferably free from hardeners for epoxy resins. They may be used in the preparation of bonding sheets which are useful in the manufacture of multilayer printed circuit assemblies and which have excellent physical and electrical properties.

Abstract: An epoxy resin powder coating composition comprises 100 parts by weight of bisphenol A mixed epoxy resin having number average molecular weight from 1,700 to 4,500 comprising a bisphenol A epoxy resin (A) having a number average molecular weight from 2,500 to 8,000 and a bisphenol A epoxy resin (B) having a number average molecular weight from 300 to 1,000 (C) a novolak epoxy resin 5 to 20 parts by weight of polyvinyl butyral resin or polyviny formal resin, a hardener, and a filler.

Abstract: Method of enhancing the concrete crack-bridging ability of a corrosion resistant lining for concrete surfaces by applying a crack-bridging basecoat to the concrete surfaces.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: A reactive hot-melt adhesive is described, which contains a resin component, at least one thermally activatable latent curing agent for the resin component and optionally accelerators, fillers, thixotropic agents and further conventional additives. The adhesive is characterized in that the resin component is obtainable by reacting a) an epoxy resin solid at room temperature and b) an epoxy resin liquid at room temperature with c) a linear polyoxypropylene having amino terminal groups, in which the epoxy resins a) and b) are used in such a quantity, based on the polyoxypropylene with amino terminal groups, that an excess of epoxy groups, based on the amino groups, is ensured.

Abstract: An epoxy resin bonding composition containing two different epoxy resin as a liquid admixture, a curing agent and a polyamide powder is disclosed. The bonding composition may be used, for example, to bond a ferrite magnetic to a motor yoke. One of the epoxy resins is an unmodified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The other epoxy resin is an urethane-modified or glycol-modified glycidyl ether of bisphenol A, bisphenol F or bisphenol AD. The polyamide powder has an average particle size of 150 .mu.m or less and a melting of at least 170.degree. C. and is present in an amount 1-50 parts by weight per 100 parts by weight of liquid epoxy resin admixture.

Abstract: Reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.

Abstract: A penetrable, epoxy resin composition is disclosed which comprises: a liquid, epoxy resin mixture containing a glycidyl ether of bisphenol having an epoxy equivalent of 158-270 and a flexible epoxy resin which is a glycidyl ether of a bisphenol modified with a glycol or a urethane; a curing agent capable of reacting with the epoxy resin mixture when heated to a curing temperature; an inert organic solvent which does not react with the epoxy resin mixture, which is capable of dissolving the curing agent and which has a boiling point lower than the curing temperature; and an inorganic filler having an average particle size of 0.1-5 .mu.m.

Abstract: A resin composition especially suited to the resin transfer molding and wet filament winding processes is composed of epoxide compounds and one or more aromatic amine hardeners wherein the blend of epoxide compounds is (i) a diglycidyl ether of the reaction product of a bisphenol and a blend of (a) a diglycidyl ether of bisphenol A other than that of (i) and (b) a halohydrin having about two epoxy groups per molecule, (ii) a copolymer of ethyl hexyl acrylate and glycidyl methacrylate and (iii) a neopentyl glycol digylcidyl ether. This composition has a low viscosity, and when cured, exhibits high toughness and mechanical strengths useful in making high performance composites.

Abstract: A size for carbon fibers and glass fibers comprises an epoxy resin and a polyester with a hydrophilic and a hydrophobic moiety in the molecule.

Abstract: A coating resin composition comprising as a main component an epoxy-polyamine resin resulting from the addition of (d) an amine compound having active hydrogen to an epoxy resin obtained by reacting (a) a diepoxide compound with less than 1 equivalent, per equivalent of the diepoxide compound (a), of (b) a bisphenol, said diepoxide compound being obtained by reacting a dihydric dimer alcohol derived from an unsaturated fatty acid or aliphatic unsaturated alcohol having 14 to 24 carbon atoms with an epihalohydrin; and a coating resin composition comprising as a main component an epoxy-polyamine resin resulting from the addition of (d) an amine compound having active hydrogen to an epoxy resin obtained by reacting (a) a diepoxide compound with more than 1 equivalent, per equivalent of the diepoxide compound (a), of (b) a bisphenol and further reacting the product with (c) bisphenol diglycidyl ether, said diepoxide compound being obtained by reacting a dihydric dimer alcohol derived from an unsaturated fatty aci

Abstract: Curable compositions containing a polyphenylene ether and a polyepoxide composition containing brominated and non-brominated bisphenol polyglycidyl ethers, in combination with further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and bonding sheets therefor and having excellent physical and electrical properties.

Abstract: A conductive die attach composition containing no solvent and substantially no ionic impurities which comprises:(a) an epoxy resin system comprising (i) at least one low viscosity epoxy resin; and (ii) at least one epoxy resin hardener;(b) at least one unsaturated monomer which, when polymerized, is not capable of reacting with said epoxy resin system;(c) at least one free radical initiator for polymericing said unsaturated monomer; and(d) finely divided silver particles.

Abstract: A powder coating composition suitable for slot insulation is disclosed which includes an epoxy resin containing at least 60% by weight of a mixture of a first glycidyl ether of bisphenol A having a number average molecular weight of 2500-8000 with a second glycidyl ether of bisphenol A having a number average molecular weight of 350-1700, the mixture having a number average molecular weight of 1600-4600, a carboxyl group-terminated polyester resin in an amount of 5-100 parts by weight per 100 parts by weight of the epoxy resin, a curing agent, and an inorganic filler in an amount of 10-80% by weight.

Abstract: Disclosed are epoxy resin compositions comprising essentially (A) multi-functional epoxy resins, (B) imide-modified silicone compounds, (C) phenolic novolaks having more than 2 OH groups, and (D) inorganic fillers. When cured, these compositions have excellent processability and lower internal stress as compared to a similar composition without the imide-modified silicone compounds. These compositions are useful for sealing semiconductor devices or other molding applications.

Abstract: An adhesive for electroless plating is composed of at least one kind of fine powders selected from either a cured heat resistant resin or an inorganic material and easily soluble in a predetermined solution and a heat resistant resin solution sparingly soluble in the predetermined solution by curing treatment. The adhesive for electroless plating in which the above fine powders are dispersed in the above uncured heat resistant resin solution, is coated on a circuit board, dried and cured to form an adhesive layer. When the above predetermined solution contacts with the surface of the adhesive layer, its surface is roughed to be formed a plating film having an excellent adhesiveness by electroless plating.

Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin, (b) a hardening agent, (c) an inorganic filler and (d) a polymaleimide having a specific structure is herein provided. Preferably, the resin composition comprises, as all of or a part of the epoxy resin, a modified epoxy resin composed of (i) a graft polymer of an epoxy resin and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the graft polymer. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.

Abstract: A rust-proof sealing composition contains 30 to 90 parts by weight of an epoxy resin, 8 to 30 parts by weight of a curing agent containing a carboxylic acid derivative selected from the group consisting of aminocarboxylic acid, polycarboxylic acid hydrazide having not less than 8 carbon atoms and mixtures thereof, 1 to 20 parts by weight of an electrically conductive carbon and a balance of a filler such that the total amounts make up 100 parts by weight. The epoxy resin contains 100 to 30 wt. % of a modified epoxy resin selected from the group consisting of a butadiene/acrylonitrile-modified epoxy resin, an urethane-modified epoxy resin and mixtures thereof, and 0 to 70 wt. % of an epoxy other than the modified epoxy resin.

Abstract: An epoxide resin moulding composition, comprising(a) a phenol or cresol novolak epoxide resin,(b) dicyandiamide as a hardener,(c) an accelerator suitable for hardening with dicyandiamide,(d) 20 to 70% by weight of calcium carbonate and(e) 10 to 60% by weight of glass fibres, the quantity of components (d) and (e) together not exceeding 80% by weight, relative to the total weight of the epoxide resin moulding composition,is suitable with advantage for the manufacture of commutators and slipring bodies.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: Novel reactive hot melt structural adhesives comprising urethane oligomer and epoxy mixture in specified ratios. The compositions offer very high shear, peel, and impact strengths, properties of particular value in bonding adherends in an auto body assembly line.

Abstract: A composition of enhanced thermal conductivity which comprises a tetrabrominated diglycidyl ether polyepoxide; and epoxy polymer having an epoxy functionality of 3.5 to 6; zinc oxide and curing agents; and use thereof.

Abstract: An epoxy resin composition is disclosed, which comprises the following elements:(A) a bifunctional epoxy resin;(B) a trifunctional epoxy resin;(C) a phenolic compound represented by the following general formula: ##STR1## wherein X.sub.1, X.sub.2, X.sub.3, X.sub.4, X.sub.5, X.sub.6, X.sub.7, X.sub.8, X.sub.9, X.sub.10, X.sub.11, X.sub.12, R.sub.1, R.sub.2, R.sub.3 and R.sub.4, which may be the same or different, each represents a hydrogen atom or a methyl group; and(D) 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone, wherein the molar ratio of epoxy groups in element (A) to those in element (B) is in the range of from 1/4.0 to 1/0.1, element (C) is used in an amount that satisfies the condition:1/0.9.ltoreq.(A+B)/C.ltoreq.1/0.1and element (D) is used in an amount that satisfies the condition:1/1.3.ltoreq.(A+B-C)/D.ltoreq.1/0.

Abstract: A structural adhesive having excellent anti-corrosion properties which comprises: (A) a rubber modified epoxy resin prepared by reaction of a bisphenol epoxy resin and a butadiene-acrylonitrile-(meth)acrylic acid copolymer, (B) an urethane modified epoxy resin, (C) a latent curing agent, and (D) a rust inhibiting pigment selected from the group consisting of: (i) a rust inhibiting pigment comprising aluminum orthophosphate and a zinc compound, (ii) a rust inhibiting pigment comprising aluminum metaphosphate, a zinc compound and/or an alkaline earth metal compound, and (iii) a rust inhibiting pigment comprising aluminum metaphosphate and a zinc compound and optionally an alkaline earth metal compound, wherein the adhesive contains said rubber modified epoxy resin (A) and said urethane modified epoxy resin (B) in a weight ratio of 1:9 to 3:1, and said latent curing agent (C) and said rust inhibiting pigment (D) at 0.

Abstract: Heat curable epoxy resin systems are disclosed which may be cured to form monophasic matrix resins and adhesives which, when utilized as matrix resins in carbon fiber reinforced composites, are capable of forming quasiisotropic panels having CAI values greater than 275 MPa after an impact of 6.68 kJ/m, and which maintain their tack after extended storage at room temperature.

Abstract: An epoxy resin powder coating composition which comprises:(A) an epoxy resin comprising mainly of a bisphenol A epoxy resin mixture of (a) a bisphenol A epoxy resin having a number average molecular weight of from 2,500 to 8,000 and (b) a bisphenol A epoxy resin having a number average molecular weight of from 350 to 1,700, said mixture having a number average molecular weight of from 1,700 to 4,500;(B) rubber powder in an amount of 2 to 30 parts by weight per 100 parts by weight of said epoxy resin (A);(C) at least one hardener; and(D) a filler.The coating composition is particularly useful for the insulation of slots for motor rotors, exhibiting excellent thermal resistance, adhesiveness, impact resistance and coverage.

Abstract: An epoxy resin powder coating composition with excellent adhesibility which comprises a bisphenol A type mixed epoxy resin having a number average molecular weight of from 800 to 2,000 comprising a mixture of a bisphenol A type epoxy resin having an average molecular weight of from 350 to 1,000 and a bisphenol A type epoxy resin having a number average molecular weight of from 2,500 to 8,000, an imidazole base compound, dicyandiamide, a pre-reacted product of an imidazole base compound with epoxy resin, and a filler.

Abstract: The invention relates to a novel electrocoating composition for metallic substrates that exhibits "thick-build" protective properties at "medium-build" thicknesses. It is composed of a self-addition epoxy resin-polyamine adduct, a blocked isocyanate cross-linker, a polyglycol-polyamine grind resin, a plasticizer, an anti-cratering agent and pigments.

Abstract: Blends of high molecular weight polyphenylene ethers with various epoxy materials, particularly polyglycidyl ethers of bisphenolic compounds, are homogeneous at high temperatures and may be cured in the presence of a catalyst such as aluminum tris(acetylacetonate) or zinc bis(acetylacetonate), especially in the additional presence of an accelerator such as a basic nitrogen compound. The cured compositions have advantageous physical and electrical properties and are useful, for example, for the preparation of printed circuit boards.

Abstract: A fiber reinforced composite structure having a glass transition temperature greater than 150.degree. C. is comprised of:a) reinforcing fiber andb) a curable epoxy resin composition comprising(i) one or more epoxides having more than one epoxide group per molecule, of which epoxides at least 10 percent by weight is a 9,9-bis[4-(2,3-epoxypropoxy)phenyl]fluorene, all of the fluorene epoxy present being free of ortho substitution;(ii) an effective amount of one or more epoxy curing agents.

Abstract: A paint composition for cation electrodeposition painting, used for painting automotive vehicle body etc. The paint composition comprises basic unsaturated modified epoxy ester expressed by the general formula: ##STR1## where R.sub.1 and R.sub.2 are functional groups at least one of which is .alpha., .beta.-ethylenic double bond containing groups and the remainder is an unsaturated fatty acid chain; R.sub.3 is a group expressed by the formula: ##STR2## and X and Y are functional groups whose total number is n+1 in which not less than one functional group is a group containing both a tertiary amine function and a urethane function, and the remainder are hydroxyl groups (--OH), n being an integer ranging from 1 to 20.

Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an armotic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.

Abstract: A flexible epoxy adhesive composition comprising a mixture of a fatty acid modified epoxy resin and an oxypropylene epoxy resin in the ratio of about 1:3 to 1:1. The adhesive paste also includes a stoichiometric amount of a polyamine curing agent, 1 to 20 total liquid weight percent of a plasticizer and 1 to 5 weight percent of microfine silicon dioxide particles. Fillers, such as aluminum oxide and glass beads, are optionally added. This adhesive paste is particularly well suited for use as a flat pack adhesive to provide a releasable bond and is also well suited for use in space applications.

Abstract: An epoxy resin composition which comprises a curable epoxy resin, a hardener, and a block copolymer formed by the reaction of a triphenol-alkane type resin or a polymer thereof with a specific organopoly-siloxane. The composition provides a cured product having a high glass transition point, a low coefficient of expansion, good crack resistance, and is less likely to exert stress to the semiconductor devices. It exhibits distinct characteristics when used as a sealing compound for semiconductor devices, especially in the case where the element is bonded directly to a printed circuit board or heat sink. It is very unlikely that a semiconductor device sealed with it would become warped.

Abstract: Curable compositions containing a reaction product of at least one bisphenol polyglycidyl ether, at least one epoxidized novolak and at least one brominated bisphenol, in combination with a polyphenylene ether and further components including specific catalysts and hardeners, may be used in the preparation of laminates useful as printed circuit boards and having excellent physical and electrical properties.

Abstract: Thermoplastic epoxy resins are prepared by (A) reacting an advanced epoxy resin prepared by reacting a mixture of (1) a relatively low equivalent weight aromatic based epoxy resin and (2) a (meth)acrylate polymer with (3) a dihydric phenol with (4) a monofunctional compound reactive with vicinal epoxide groups; and (B) mixing the product form (A) with the reaction product of (5) a relatively low equivalent weight epoxy resin and (6) a monofunctional compound reactive with vicinal epoxide groups. The resultant product is substantially free of residual epoxide groups. These resins are particularly useful in formulating pavement marking paints.

Abstract: Flexible thermoplastic epoxy resins are prepared by reacting (1) an advanced epoxy resin prepared by reacting a mixture of an aromatic based epoxy resin and an aliphatic based epoxy resin with a polyhydric phenol in the presence of an advancement catalyst with (2) a monocarboxylic acid or anhydride thereof; reacting the resultant product with a mixture of an aromatic based epoxy resin and a monofunctional material reactive with vicinal epoxy groups; and reacting the resultant product with a carboxyl terminated elastomer. These resins are particularly useful in formulating pavement marking paints.

Abstract: The invention relates to a composition and method for setting and grouting tile on various substrates characterized by quick setting times and excellent chemical and physical properties.

Abstract: Novel 3-ring tetraglycidates having the formula ##STR1## wherein ##STR2## Y=halogen, C.sub.1 -C.sub.4 alkyl; and n=0 to 4, are disclosed.Epoxy resin systems exhibiting good tensile properties and moisture sensitivity can be made by copolymerizing the tetraglycidates with a polyamine curing agent. Prepregs can be made by combining the epoxy resin systems with a fiber reinforcement. The epoxy resin system may include a co-epoxide.

Abstract: Compositions comprising a mixture of (A) an epoxy resin composition consisting essentially of (1) at least one epoxy resin which has an average of not more than 2 vicinal epoxy groups per molecule; (2) at least one epoxy resin which has an average of more than 2 vicinal epoxy groups per molecule and (3) at least one rubber or elastomer; and (B) optionally, a low viscosity reactive diluent, are useful in preparing low temperature curable compositions. Also claimed is low temperature curable compositions containing the above components (A) and (B); (C) at least one cycloaliphatic amine hardener and (D) optionally, an accelerator for component (D).

Abstract: Thermoplastic epoxy resins are prepared by (A) reacting an advanced epoxy resin prepared by reacting a mixture of (1) a relatively low equivalent weight aromatic based epoxy resin and (2) a (meth)acrylate polymer with (3) a dihydric phenol with (4) a monofunctional compound reactive with vicinal epoxide groups; and (B) mixing the product from (A) with the reaction product of (5) a relatively low equivalent weight epoxy resin and (6) a monofunctional compound reactive with vicinal epoxide groups. The resultant product is substantially free of residual epoxide groups. These resins are particularly useful in formulating pavement marking paints.

Abstract: An adhesive composition which is particularly suitable for use as a die-attach adhesive. The adhesive composition comprises the reaction product of an admixture of an effective amount of a phenoxy resin, at least one epoxy resin and a fluorene curative.

Abstract: An adhesive mixture comprising a multiplicity of contiguous deposits of a curable but uncured fluid resin and a fluid curing agent for the resin, said deposits being separated by a thin flexible barrier film of cured resin resulting from the interaction between the resin and curing agent.

Abstract: An adhesive composition which is curable by electromagnetic induction heating when it is applied to various substrates, said adhesive comprising a mixture of(I) An epoxy resin component and(II) A hardener component and(III) From 2 to 60% by weight of (I) and (II) of an electromagnetic energy absorbing material is described.

Abstract: A nonskid coating formulation comprising, by weight, 3 to 8% amine resins, to 13% epoxy resins, 17 to 22% pigments, fillers, and thickeners, 10 to 20% solvents and 39 to 56% aggregates.