Abstract: A low color epoxy resin composition comprising (a) an epoxy resin and (b) at least one an inorganic phosphorous-containing compound stabilizing agent, for example an additive such as sodium pyrophosphate dibasic (SPD) compound; wherein the resulting epoxy resin composition is storage stable and the epoxy resin composition exhibits a low color. The low color epoxy resin composition is used to prepare an epoxy encapsulant which is useful in light emitting diodes (LEDs).

Abstract: The present invention provides an epoxy resin composition for sealing a geomagnetic sensor module, including: an epoxy resin; a curing agent; and a phase change material, and provides a geomagnetic sensor module sealed with the epoxy resin composition. The present invention is advantageous in that a geomagnetic sensor can be maintained at a predetermined temperature because a sealing material including a phase change material is used.

Abstract: Fire retardant or flame retardant additives are incorporated into thermoplastic, thermoset, and/or elastomeric polymer materials to form polymer compositions having improved fire retardant properties. More particularly, the polymer compositions of the present invention comprise additive compositions which have the effect of improving the FR effectiveness, the additive compositions comprising a mesoporous silicate additive. In addition, the polymer compositions of the present invention comprise additive compositions comprising a mesoporous silicate additive and a filler, wherein the filler is a flame retardant addition, an inert filler, or combinations thereof.

Abstract: The invention relates to an aqueous sizing composition for reinforcing charges, preferably glass fibers, comprising a silane coupling agent, an epoxy film forming polymer comprising 2-8 reactive epoxy groups per chain and compatible with thermoplastic polyester matrix resin selected from PET and PBT, and a hypophosphite in an amount of 5 to 30 w % of the composition, preferably 7 to 25 w %, more preferably 10 to 20 w % and most preferably 12 to 18 w % of the composition. A thermoplastic polyester resin reinforced with glass fibers coated with a sizing composition of the invention shows improved resistance to staining and improved tensile elongation at break. The sizing composition further improves processability of the sized fibres.

Abstract: A halogen-free resin composition includes (A) 100 parts by weight of epoxy resin; (B) 2 to 15 parts by weight of oxydianiline (ODA); and (C) 2 to 20 parts by weight of amino triazine novolac (ATN) resin. The halogen-free resin composition includes specific ingredients, and is characterized by specific proportions thereof, to thereby achieve a low dielectric constant, a low dielectric dissipation factor, high heat resistance, and high flame retardation, and thus is suitable for producing a prepreg or resin film to thereby be applicable to copper clad laminates and printed circuit boards.

Abstract: A mold compound is provided for encapsulating a semiconductor device (101). The mold compound comprises at least approximately 70% by weight silica fillers, at least approximately 10% by weight epoxy resin system, and beneficial ions that are beneficial with respect to copper ball bond corrosion. A total level of the beneficial ions in the mold compound is at least approximately 100 ppm.

Abstract: In accordance with the present invention, compositions are described which are useful, for example, for the preparation of metal-clad laminate structures, methods for the preparation thereof, and various uses therefor. Invention metal-clad laminate structures are useful, for example, in the multi-layer board (MLB) industry, in the preparation of burn-in test boards and high reliability boards, in applications where low coefficient of thermal expansion (CTE) is beneficial, in the preparation of boards used in down-hole drilling, and the like.

Abstract: A resin composition prepared by blending an epoxy compound represented by the following formula (1), an acid anhydride, and a curing accelerator, wherein the epoxy compound is purified in such a way that, in a chromatogram obtained by gas chromatographic analysis, a ratio of a peak area B of peaks derived from a heavier molecular mass portion having longer retention times than the epoxy compound to a peak area A of peak(s) derived from the epoxy compound B/A is 2.0×10?3 or less. [In the formula, R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11, and R12 each independently represent a hydrogen atom, a halogen atom, an alkyl group which may have a substituent, or an alkoxy group which may have a substituent.

Abstract: This disclosure relates to flame retardants that are useful for epoxy resin systems. Coating compositions and methods are provided the include an epoxy resin and a phosphate-containing flame retardant wherein the phosphate-containing flame retardant is selected from Group 1 metallic salts of a phosphate of a saccharide, Group 2 salts of a glycerophosphate, and Group 1 metallic salts of a polyphosphate. The provided flame retardants have low toxicity and are friendly to the environment.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A flame retardant composition is produced by mixing a flammable organic material with an inorganic phosphorus-inorganic phosphoric oxyacid compound or its salts. The inorganic phosphorus-inorganic phosphoric oxyacid compounds are produced by reacting an inorganic phosphorus compound having a valence of 3-4 with an inorganic phosphorus oxyacid with a valence of 5. Carbonization auxiliaries, metal-containing compound having a carbonization acceleration effect, a comb-like polymer and a filler may be added with the flame retardant composition.

Abstract: A resin composition is provided which can be suitably used in a printed circuit board having excellent electrical properties, heat resistance and peel strength, with flame retardancy maintained, a prepreg and resin sheet which use the same, and a metal foil-clad laminate which uses the prepreg. A resin composition including a polyphenylene ether (A), a specific phosphorus-containing cyanate ester compound (B), a non-halogenated epoxy resin (C), a cyanate ester compound (D) and a filler (E) is used.

Abstract: The present invention relates to an epoxy resin composition, and a prepreg and a copper clad laminate made therefrom. The epoxy resin composition comprises: (A) epoxy resin containing two or over two epoxy groups, (B) active ester curing agent, and (C) phosphate salt compound. The epoxy resin composition of the present invention adopts epoxy resin with specific molecular structure, which has comparatively high functionality, so the cured products have high glass transition temperature and low hydroscopic property; active ester is adopted as the curing agent to make full use of the advantages that polar groups will not be produced when the active ester reacts with the epoxy resin; the prepreg and copper clad laminate made therefrom of the present invention can achieve halogen-free flame retardance, and meanwhile have excellent dielectric properties and good resistance to humidity and heat.

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: The invention relates to the use of a powder coating composition consisting of a bonding agent system, a wax comprising an acid group, one or more basic metal compounds or SiO2 for producing a textured/structured coating surface.

Abstract: There is provided herein a flame retardant thermoplastic composition comprising: a. at least one thermoplastic polyester or polyamide; b. at least one brominated flame retardant; c. at least one metal phosphonate or phosphinate. There is also provided a method of making said flame retardant thermoplastic composition; and an article containing the thermoplastic polymer composition.

Abstract: There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2) Si(OR3)4??(1) R1Si(OR3)3??(2), wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne/cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.

Abstract: The treatment of an agricultural setting may be implemented by applying an adhesive using a pump sprayer. The agricultural setting may include mulch, pine straw, wood chips, and other materials used in landscaping. The adhesive may be used to keep the agricultural setting in place. For example, the adhesive may keep mulch from moving in heavy winds or during a storm.

Abstract: Condensation products of melamine and phenylphosphonic acid, a process for their preparation, their compositions with polymeric materials and their use as flame retardants in polymer substrates are provided. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates, such as polyesters, polyamides and polycarbonates.

Abstract: Halogen-free flame retardant compositions comprising copolyetherester thermoplastic elastomers, melamine cyanurate and epoxy-containing compounds and cables and wires made from such flame retardant polymer composition provide good electrical insulation resistance during use.

Abstract: The present invention aims to provide a carboxyl group-containing polyimide, and prepolymer thereof which give a cured product highly satisfying thermosetting property, PCT resistance, solvent resistance and peel strength at the same time. The present invention relates to a terminal acid anhydride group-containing imide prepolymer which is characterized by being produced by reacting an acid anhydride group in a tetracarboxylic acid dianhydride with an isocyanate group in a diisocyanate compound, and a carboxyl group-containing polyimide which is characterized in having such a structure where the chain of said terminal acid anhydride group-containing imide prepolymer is extended via a polyol compound. The present invention also relates to a thermosetting resin composition and a flexible metal-clad laminate which utilize such carboxyl group-containing polyimide.

Abstract: The present invention relate to a halogen-free high-Tg resin composition and a prepreg and a laminate fabricated by using the same. The composition comprises, based on parts by weight of organic solids: (A) 10-50 parts by weight of a cyanate ester resin; (B) at least one compound having a dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one bismaleimide resin; (D) 10-50 parts by weight of at least one polyepoxy compound; and (E) 5-30 parts by weight of at least one phosphorus-containing flame retardant.

Abstract: A powder composition including a resin and from 5% to 70%, by weight based on powder composition weight, of a corrosion-inhibiting pigment, optionally including from 0% to 65%, by weight based on powder composition weight, zinc, the composition being substantially free from pigment providing a metallic effect is provided. The corrosion-inhibiting pigment may be present in amounts of up to 50%, by weight based on powder composition weight, for example, up to 35%. A method for coating a substrate with the powder composition and the coated substrate so formed are also provided.

Abstract: Provided is a resin composition for encapsulating a semiconductor which has excellent flame resistance and solder resistance, and can be manufactured at a low cost. The composition includes a phenol resin (A), an epoxy resin (B), and an inorganic filler (C).

Abstract: Disclosed herein is an adhesive composition for clutch disc application comprising of an epoxy resin of bisphenol A and epichlotrohydrin, partially hydrogenated carboxylated nitrile butadiene rubber (HX-NBR) in solid form as a toughening agent in the ratio 80:20, and optionally with additives to obtain improved lap shear strength and cushioning properties.

Abstract: Disclosed is a liquid curable epoxy resin composition which includes a cycloaliphatic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a silica (B); and a phosphite ester (C). The liquid curable epoxy resin composition preferably includes, for example, 5 to 80 parts by weight of the cycloaliphatic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; 20 to 95 parts by weight of the silica (B); and 0.001 to 5.0 parts by weight of the phosphite ester (C), per 100 parts by weight of the total amount of the components (A) and (B).

Abstract: The present invention relates to flame retardant polymer compositions which comprise phosphinic acid salts in combination with polymer chain extension agents on the basis of epoxide structures and oxides or hydroxides of selected metals. The compositions are especially useful for the manufacture of flame retardant compositions based on thermoplastic polymers, especially polyolefin homo- and copolymers, such as polybutylene terephthalate (PBT).

Abstract: The present invention refers to a chromium-free insulation coating material for non-oriented silicon steel, comprising, in parts by weight, the following components: metal dihydrogen phosphate salt of 100 parts, epoxy resin of 10˜60 parts, naphthenate drier or isooctanoate metal salt drier of 0.001˜10 parts, organic solvent of 0.001˜100 parts and pure water of 60˜2000 parts. The metal dihydrogen phosphate salt is Al(H2PO4)3, Mg(H2PO4)2, Ca(H2PO4)2 or Zn(H2PO4)2; the epoxy resin is water-soluble epoxy resin or epoxy resin emulsion. Chromium-free insulation coating material of the present invention, after being coated on non-oriented silicon steel, renders highly transparent appearance, and has excellent insulativity, corrosion resistance, adhesiveness, weldability and manufacturability, so as to eliminate defects of the existing chromium-free coating, such as sticky and un-wear-resistant and to meet environment protection requirements.

Abstract: Technologies are generally described for a nanocomposite polymer dielectric that may incorporate two types of nanoparticles and a polymer. One of the two types of nanoparticle may be a first, smaller nanoparticle, that may occupy spaces between larger second nanoparticles. Another of the two types of nanoparticle may be the second, larger, “high-?” nanoparticle, which supports the overall dielectric constant of the material. In an applied electric field, the first, smaller nanoparticle may redistribute local charge to homogenize electric fields in the dielectric material, tending to avoid the development of “hot spots”. Such a two-nanoparticle nanocomposite dielectric material may provide increased dielectric breakdown strength and voltage endurance in comparison with a nanoparticle dielectric which only contains a single type of “high-?” nanoparticle.

Abstract: A composition comprising polycarbonate, polyethylene terephthalate, organopolysiloxane-polycarbonate block copolymer, and epoxy-functional block copolymer for providing an improved balance of properties, including heat aging performance in combination with impact resistance. Articles molded from the composition are advantageously useful for automotive applications.

Abstract: The present disclosure provides a composition which includes a thermoplastic polyurethane, a flame retardant, and an epoxidized novolac resin. The flame retardant may be selected from one or more of the following: a melamine-containing compound, a nitrogen/phosphorus-based flame retardant, a phosphorus-based flame retardant, a metal-5 containing flame retardant, and combinations thereof. The composition may be a component of an article such as a coated wire or cable, with the composition present in the coating.

Abstract: A halogen-free resin composition includes (A) 100 parts per hundred resin of epoxy resin; (B) 1 to 100 parts per hundred resin of benzoxazine resin; (C) 1 to 100 parts per hundred resin of styrene-maleic anhydride; (D) 0.5 to 30 parts per hundred resin of amine curing agent; and (E) 5 to 150 parts per hundred resin of halogen-free flame retardant. The composition obtains properties of low dielectric constant, low dissipation factor, high heat resistance and flame retardancy by specific composition and ratio. Thus, a prepreg or a resin film, which can be applied to a copper clad laminate and a printed circuit board, is formed.

Abstract: The invention relates to curable compositions which comprise epoxy resins, amino hardeners, and a phosphonate of the formula I. Addition of phosphonate of the formula I can give cured epoxy resins which have not only improved flame retardants but also an increased glass transition temperature when comparison is made with the corresponding resins without said addition.

Abstract: A thermosetting adhesive is configured to include a photoradical generator which generates radicals from irradiation of active energy rays in a thermosetting insulating adhesive component. In a repair method when this thermosetting adhesive is used, a cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays from the substrate side or the electronic component side prior to separating the electronic component from the substrate, and the cured matter is removed using such solvent. Alternatively, the cured matter of the thermosetting adhesive is made soluble or swellable in a predetermined solvent by irradiating the cured matter with active energy rays after the electronic component has been separated from the substrate, and the cured matter is removed using such solvent.

Abstract: Disclosed is a liquid thermosetting epoxy resin composition including a base resin, a curing agent (D), and curing accelerator (E) or including a base resin and a curing catalyst (D?), each base resin including an alicyclic epoxy compound (A) having at least one alicyclic skeleton and two or more epoxy groups per molecule; a polyester polyol and/or a polycarbonate polyol (B), each polyol having two or more terminal hydroxyl groups; and a phosphorous ester (C). The liquid thermosetting epoxy resin composition exhibits excellent viscosity stability and can give a cured article which is homogeneous even when having a large thickness, does not crack under heat cycle conditions, and is highly thermally stable and satisfactorily optically transparent.

Abstract: A resin composition is provided. The resin composition comprises: an epoxy resin; and a hardener, which is a stable solution obtainable from the following steps: (a) adding a N,O-heterocyclic compound of formula I or II and a DOPO-based compound into an organic solvent to provide a reaction solution: wherein R1 to R3, W1, W2, m, n, p and q are as defined in the specification; (b) heating the reaction solution to carry out a ring-opening reaction to provide a polymer solution; and (c) cooling the polymer solution to obtain the stable solution, wherein the organic solvent is unreactive to the N,O-heterocyclic compound and the DOPO-based compound, and the amounts of the DOPO-based compound and the hardener are as defined in the specification.

Abstract: Disclosed herein is a method of preparing a high-melting point flame retardant crystal, comprising the steps of: reacting 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide with 1,4-naphthoquinone in an inert solvent having a dielectric constant of 10 or less to reduce a content of by-products, thereby obtaining a reaction composition; and dissolving the reaction composition in any one solvent selected from the group consisting of ethyleneglycol, propyleneglycol, diethyleneglycol, cyclohexanone, benzyl alcohol, acetate ester, benzoate ester and a mixture thereof to recrystallize and refine the reaction composition, thereby obtaining high-melting point retardant crystal, represented by Formula 1, having a start melting point of 280° C. or more and a melting point of 291° C.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: This invention relates to a process for producing compounds derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO). In particular, the invention relates to producing DOPO-derived compounds by reacting DOPO with diol compounds in the presence of a catalyst. This invention also relates to DOPO derived composition containing a high melting point diastereomer. The DOPO derived compounds may be useful as flame-retardants.

Abstract: The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphonates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates.

Abstract: Embodiments of the present disclosure provide a composition that includes a phosphorous-containing compound, a cyanate ester, an epoxy resin, and a maleimide. For the various embodiments, a viscosity of the composition increases less than 100% as measured by Gardner Bubble Viscosity a temperature of 23° C. in at least 3 days. For the various embodiments, the composition of the present disclosure can also include an aprotic solvent, such as a ketone. Embodiments of the present disclosure further include a composition that includes the phosphorous-containing compound, the cyanate ester, and the aprotic solvent. For the various embodiments, the composition can also include the epoxy resin and the maleimide. For the various embodiments, the composition does not include an aliphatic alcohol.

Abstract: A flame-retardant rubber composition for vulcanization, comprising an epichlorohydrin based rubber (A), red phosphorus (B), and a vulcanizing agent (C), in which the content of the red phosphorus (B) is from 3 to 20 parts by weight for 100 parts by weight of the epichlorohydrin based rubber (A).

Abstract: The present disclosure provides a thermosetting resin composition including a benzoxazine component comprising two or more benzoxazine monomer compounds and at least one epoxy resin characterized in that a resultant cured product formed by curing the thermosetting resin composition possesses high heat resistance and low dielectric loss at high frequency. The thermosetting resin composition is especially suited for use in high speed printed circuit boards and semiconductor devices.

Abstract: Certain aluminum salts of organic phosphorus acids are found to have a strong effect on inhibiting the epoxy cure rate in epoxy formulations. The substances act catalytically and can be used at a low level in an epoxy formulation to adjust the reactivity of a resin formulation to give longer gel times. Compositions and methods of preparing and using the compositions are disclosed.

Abstract: A resin composition which comprises polylactic acid, does not release an isocyanate group at the time of production and has excellent hydrolysis resistance and a low environmental burden. The resin composition comprises: (A) 100 parts by weight of a resin component (component A) containing polylactic acid (component A-?); (B) 0.001 to 10 parts by weight of a compound (component B) having one carbodiimide group and a cyclic structure in which first nitrogen and second nitrogen are bonded to each other via a bonding group, the cyclic structure consisting of 8 to 50 atoms; and (C) 0.001 to 2 parts by weight of at least one antioxidant (component C) selected from the group consisting of a hindered phenol-based compound, a phosphite-based compound, a phosphonite-based compound and a thioether-based compound.

Abstract: Flame retardant compositions that are halogen-free or substantially halogen-free are disclosed. In certain examples, the compositions comprise a halogen-free or substantially halogen-free epoxide and one or more phosphorated compounds. In some examples, the phosphorated compound comprises an average particle size less than 10 microns. In other examples, the phosphorated compound provides a surface area of 78.5 ?m2 to about 1965 ?m2. Prepregs, laminates, molded articles and printed circuit boards using the compositions are also disclosed.

Abstract: The present invention is related to the use of specific derivatives of diphosphines as flame retardants in aromatic and heteroaromatic epoxy resins and to a method for reducing the flammability of organic material comprising aromatic and/or heteroaromatic epoxy resins in which the specific derivates of diphosphines are incorporated. Moreover, the invention is related to an aromatic and/or heteroaromatic epoxy resin composition containing aromatic and heteroaromatic epoxy resin as such or in processed form and incorporated in the aromatic and/or heteroaromatic epoxy resin at least one of the derivatives of diphosphines in an amount of from 1 to 35% by weight, based on the weight of the aromatic and/or heteroaromatic epoxy resin.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: Mixtures of three types of linear, branched or cyclic phosphates are useful flame retardants, especially for thermoplastic resins or as functional additives in polymer matrices.

Abstract: A halogen-free, flame retardant composition comprises thermoplastic polyurethane, olefin block copolymer, carbonyl-containing olefin polymer compatibilizer, and flame retardant package comprising bisphenol-A bis(diphenyl phosphate) and/or resorcinol bis(diphenyl phosphate), a nitrogen/phosphorus based, halogen-free flame retardant, and epoxidized novolac. The composition that will not only be processed easily to make a wire or cable sheath but also pass both the VW-1 flame retardancy test and the UL1581 heat deformation test at 150° C. exhibits good tensile and flexibility properties.