Abstract: The present invention relates to composites comprising inorganic micro pigments and/or fillers in the form of surface-phosphated microparticles, whose surface is at least partially coated with finely divided with alkaline earth carbonate nanoparticles by means of binders based on copolymers comprising as the monomers one or more dicarboxylic acids and one or more monomers from the group of diamines, triamines, dialkanolamines or trialkanolamines and epichlorohydrin, a method for producing such composites, aqueous slurries thereof and the use thereof in papermaking or in the field of production of paints and plastics as well as the use of the binders for the coating of microparticles with nano alkaline earth carbonate.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Flame retardant compositions that include a thermoplastic polyurethane, a metal hydrate flame retardant and a phosphorus-based flame retardant are provided. The compositions are characterized by good flame retardant properties, as well as high insulation resistance.

Abstract: The present invention relates to a sheet for forming a hard coating and a method of formation thereof. The present invention can provide a transfer material or a surface protection sheet having a high refractive index and superior physical properties, such as hardness, friction resistance, abrasion resistance, chemical resistance, transparency, luster, and the like, for forming a hard coating on the surface of various molded products, including resin molded products or wood products, and a method for forming a hard coating from such transfer material or surface protection sheets.

Abstract: A low color epoxy resin composition comprising (a) an epoxy resin and (b) at least one an inorganic phosphorous-containing compound stabilizing agent, for example an additive such as sodium pyrophosphate dibasic (SPD) compound; wherein the resulting epoxy resin composition is storage stable and the epoxy resin composition exhibits a low color. The low color epoxy resin composition is used to prepare an epoxy encapsulant which is useful in light emitting diodes (LEDs).

Abstract: 1,3-substituted imidazolium salts of the formula I are used as latent catalysts for curing compostions comprising epoxy compounds: in which: R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms; R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring; X is the anion of a phosphorus oxyacid, and n is 1, 2 or 3.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.

Abstract: The present invention relates to a curable precursor of a fire-retardant, low-density and essentially halogen-free epoxy composition comprising (i) 10 to 70 weight percent of at least one organic epoxide compound with an epoxide functionality of at least one, (ii) 1 to 55 weight percent of at least one epoxide hardener, (iii) 5 to 50 weight percent of an essentially halogen-free fire-retardant system that includes a mixture of: (1) at least one compound selected from the group comprising alkaline earth metal hydroxides and aluminium group hydroxides, and (2) at least one phosphorous-containing material, (iv) 10 to 60 weight percent of a filler system capable of reducing the density of the precursor that includes a mixture of (1) at least one low-density inorganic filler having a density of between 0.1 to 0.5 g cm?3?, (2) at least one low-density organic filler having a density of between 0.01 to 0.30 g/cm?3? and being compressible.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: Mixtures of three types of linear, branched or cyclic phosphates are useful flame retardants, especially for thermoplastic resins or as functional additives in polymer matrices.

Abstract: A molded article for an electric vehicle part is provided using a thermoplastic polyester resin composition imparting excellent hydrolysis resistance, electric insulation, flame retardance, and tracking resistance. The molded article for an electric vehicle part is formed by molding the thermoplastic polyester resin composition including a thermoplastic polyester resin, which has a terminal carboxyl group amount that is no more than 30 meq/kg, and a flame retardant, in which the tracking resistance measured according to IEC 112, the third edition, after pressurized heat treatment with the 120° C. saturated steam for 200 hours is no less than 500 V, and in which the volume resistivity value measured after the pressurized heating treatment with the 120° C. saturated steam for 200 hours is no less than 1×1015 ?·m.

Abstract: The present invention provides a latent catalyst for epoxy resin, comprising: a cation moiety having an activity of accelerating curing reaction of epoxy resin; and a silicate anion moiety of suppressing the curing reaction-accelerating activity. Also disclosed are an epoxy resin composition comprising the latent catalyst and a semiconductor device using the epoxy resin composition.

Abstract: This invention relates to 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide derived additive flame-retardants, which are useful in epoxy resin compositions. The epoxy resin compositions may be used in making prepregs or laminates for printed wiring boards and composite materials.

Abstract: The present invention relates to novel, halogen-free flame retardant derived from 9,10-Dihydro-9-Oxa-10-Phosphaphenantrene-10-oxide (DOPO). This invention also relates to the use of the halogen free DOPO derived flame retardant in polymers.

Abstract: The present invention relates to a halogen-free resin composition with high frequency dielectric property, and a prepreg and a laminate made therefrom. The halogen-free resin composition with high frequency dielectric property comprises, calculating according to the parts by weight of organic solids: (A) 10-50 parts by weight of copolymer of styrene-maleic anhydride; (B) 10-50 parts by weight of at least one compound having dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one polyepoxide; (D) 5-30 parts by weight of at least one phosphorus-containing flame retardant. Prepregs and laminates made from the resin composition have low dielectric constant, low dielectric dissipation factor, high glass transition temperature, high heat resistance, low moisture adsorption, and the technological operation is simple.

Abstract: The invention provides a fiber reinforced resin composition comprising a melt-kneaded product (A) prepared by melt-kneading a first resin (A1) and a second resin (A2) that has reactive functional group as well as a third resin (B) and a fibrous filler (C), wherein, with respect to the contents of the components, the first resin (A1), the second resin with a reactive functional group (A2), and the third resin (B) account for 0.1 to 75 wt %, 0.1 to 15 wt %, and 10 to 99.8 wt %, respectively, to form a resin composition while said fibrous filler (C) accounts for 0.1 to 300 parts by weight per 100 parts by weight of said resin composition, said first resin (A1) and said third resin (B) forming a matrix resin, said second resin (A2) being dispersed as particles in said matrix resin, and said particles having a number average particle diameter of 10 to 1,000 nm.

Abstract: Curable compositions comprising (i) at least one epoxy resin comprising at least one aromatic moiety or a moiety derivable by hydrogenating an aromatic moiety and wherein the epoxy resin does not contain an aromatic amine moiety, (ii) an epoxide hardener system comprising (a) a carboxylic acid anhydride, (b) a first amine having a melting point from about 30° C. to about 100° C. and containing at least one primary amine group; and (c) a second amine having a melting point of from about 50° C. to about 180° C. and having at least one primary amine group, wherein the first and second amines are selected such that they have a difference in melting points of at least 10° C.

Abstract: A method for production of a reactive polyurethane emulsion for use in impregnating and coating a textile fabric includes reacting polyols alone or in combination with at least one of diols and triols with a substoichiometric amount of diisocyanates so as to form medium-viscosity, OH-terminated prepolymers. The prepolymers are mixed with an external emulsifier. At least one of a diisocyanate, a triisocyanate and a polyisocyanate are added so as to bring about a crosslinking of the prepolymers.

Abstract: The present invention relates to a solid pigment preparation comprising, all based on the total weight of the preparation, (A) at least 60% by weight of a pigment component comprising at least one pigment and/or a filler, (B) 1% by weight to 29% by weight of a surface-active additive component based on at least a phosphoric or phosphonic ester, which may be anionic or nonionic; (C) 1% by weight to 29% by weight of at least one nonionic surface-active additive based on polyethers selected from the group consisting of propylene oxide homopolymers; ethylene oxide-propylene oxide block copolymers wherein the terminal blocks consist of propylene oxide units; ethylene oxide adducts onto mono- or bifunctional amines or alcohols wherein the length of the ethylene oxide chain is chosen such that the adduct is water-insoluble; and ethylene oxide-propylene oxide block copolymer adducts onto mono- or bifunctional amines or alcohols wherein the terminal block consists of propylene oxide units; (D) 0% by weight to 20% by

Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.

Abstract: A curing accelerator for epoxy resin compositions, which is used in a one-pack type epoxy resin composition having excellent storage stability and rapid curability. The curing accelerator for epoxy resin compositions contains a microcapsule type curing accelerator wherein a compound represented by formula (I) is encapsulated by a thermosetting resin. (In formula (I), R1 and R2 each represents a hydrogen atom or an alkyl group.

Abstract: The invention relates to an ethylenebis(hydroxyalkylphosphinic acid) and salts thereof. The acid has the general formula: A-P(O)(OX)—CR1R2—CR3R4—P(O)(OX)-A. Variable A is CR5R6—OH. Variables R1, R2, R3, R4, R5, and R6 are the same or different, and denote independently from each other H, C1-C20 alkyl, C6-C20 aryl, or C6-C20 aralkyl, so long as at least one of R1 and R2 is H and at least one of R3 and R4 is H. Variable X denotes H, an alkali metal, an element of main or transition group 2, an element of main or transition group 3, an element of main or transition group 4, an element of main or transition group 5, an element of transition group 6, an element of transition group 7, an element of transition group 8 and/or a nitrogen base. Also disclosed are a method for producing same and the use thereof.

Abstract: A detoxification method for obtaining a pigment compound free from acute and chronic aquatic ecotoxicity by mixing at least one zinc-based component with good anti-corrosive properties but high toxicity-with a phosphate or hydrogen phosphate of a magnesium, sodium, potassium, calcium, strontium, aluminum, ammonium, or organic type or any other compound based on such cations, such as carbonates, oxides, silicates, phosphites, pyrophosphates or phosphonates, said phosphates or hydrogen carbonates or carbonates or oxides or silicates or phosphites or pyrophosphates freed from toxicity enabling a very considerable reduction of the toxic power of said zinc-based component, while maintaining the good anti-corrosive properties thereof.

Abstract: The present invention relates to flame retardant polymer compositions which comprise mixtures of phosphinic acid salts and dihydrophospho-phenantrene (DOPO). The mixtures are especially useful for the manufacture of flame retardant compositions based on polyfunctional epoxides and epoxy resin compositions that result in laminates with excellent surface characteristics and reduced delamination tendency.

Abstract: The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphinates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates.

Abstract: Disclosed is a halogen-free flame-retardant epoxy resin composition for printed circuit board, which includes (A) a halogen-free epoxy resin; (B) a copolymer of styrene and maleic anhydride used as a first curing agent; (C) poly(1,3-phenylene methylphosphonate) used as a second curing agent; (D) a curing accelerator; and (E) an inorganic filler.

Abstract: The present invention relates to flame retardant polymer compositions which comprise melamine phenylphosphonates and mixtures with dihydro-oxa-phosphaphenanthrene derivatives. The compositions are especially useful for the manufacture of flame retardant compounds based on polyfunctional epoxides or polycondensates like polyesters, polyamides and polycarbonates.

Abstract: Disclosed is a resin composition exhibiting a low thermal expansion coefficient, as well as higher heat resistance, flame resistance and insulation reliability than ever before when used in a multilayer printed wiring board that requires fine wiring work. Also disclosed are a prepreg, a resin sheet, a metal-clad laminate, a printed wiring board, a multilayer printed wiring board and a semiconductor device, all of which comprising the resin composition. The resin composition of the present invention comprises (A) an epoxy resin, (B) a cyanate resin and (C) an onium salt compound as essential components.

Abstract: A composition comprising: a) an epoxy resin; b) a hardener; and c) a stabilizer comprising a metal-containing compound, the metal-containing compound comprising a metal selected from the group consisting of Group 11-13 metals and combinations thereof, wherein the composition is prepared from a halogen-containing compound is disclosed.

Abstract: The invention is aimed at providing a liquid resin composition capable of densely containing a filler and of filling up a narrow gap in a flip-chip-bonded semiconductor device, and a highly-reliable semiconductor device using the same. The liquid resin composition of the present invention contains (A) an epoxy resin; (B) an epoxy resin curing agent; and (C) a filler, wherein content of (C) the filler is 60% by weight or more and 80% by weight or less of the whole liquid resin composition, and contact angle (?) of the liquid resin composition, measured at 110° C. in accordance with JIS R3257, is 30° or smaller.

Abstract: The invention relates to a heat curable composition for fire-resistant or intumescent composite parts, which is free of any halogen additive or halogen structure in the components thereof, and which comprises: a) 100 parts by weight of a dry resin, including a1) an unsaturated polyester having an acid index lower than 10 and/or a2) a vinyl ester; b) 40 to 200 parts by weight of a reactive thinner among ethylenically unsaturated monomers; c) 20 to 110 parts by weight of a thermal expansion agent selected from melamine and derivatives thereof, guanidine, glycine, urea, triisiocynurates, and azodicarbinamide; d) 0 to 250 parts by weight of aluminium trihydrate; e) 10 to 80 parts by weight of a carbonisation precursor agent selected from multifunctional polyols; f) 50 to 200 parts by weight of a compound selected from a phosphorus derivative and/or a boric acid derivative; g) optionally at least one metal oxide; h) optionally other additives and fillers; i) optionally reinforcements containing natural or syntheti

Abstract: A process for the production of impact-modified composition that contains polyalkylene terephthalate and polycarbonate resins is disclosed. The process includes (i) in a first step combining in the melt at 90 to 175° C. glycidyl ester with at least one member selected from the first group consisting of polyalkylene terephthalate and polycarbonate to obtain a molten mixture, said member in powder form, and (ii) in a subsequent step combining the molten mixture with at least one component selected from the second group consisting of polyalkylene terephthalate and polycarbonate to obtain a composition. The composition is characterized in high gloss value.

Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B], [C], [D], and [E]: [A] epoxy resin, [B] amine curing agent, [C] phosphorus compound, [D] curing accelerator, and [E] thermoplastic resin, wherein the resin composition has a phosphorus atom concentration of 0.2 to 15% by weight.

Abstract: This disclosure relates to flame retardants that are useful for epoxy resin systems. Coating compositions and methods are provided the include an epoxy resin and a phosphate-containing flame retardant wherein the phosphate-containing flame retardant is selected from Group 1 metallic salts of a phosphate of a saccharide, Group 2 salts of a glycerophosphate, and Group 1 metallic salts of a polyphosphate. The provided flame retardants have low toxicity and are friendly to the environment.

Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.

Abstract: An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy resin containing about 40˜50 weight % of aromatic ring; (b) about 55˜120 parts by weight of a curing agent comprising at least one bi-functional thiol curing agent containing aromatic ring and at least one aliphatic tetra-functional thiol curing agent, wherein the curing agent contains about 10˜50 weight % of aromatic ring and about 20˜35 weight % of sulfur; and (c) about 0.05˜0.5 parts by weight of a catalyst. The encapsulant composition having a high refractive index can be used for a solid state light emitting device to enhance light extraction efficiency.

Abstract: Disclosed is a low melting point glass which has excellent water resistance and can impart excellent flame retardancy to a resin composition. Also disclosed is a resin composition comprising the low melting point glass. Further disclosed is a resin molded article. Specifically disclosed is a low melting point glass which comprises 22-27 mol % of P2O3, 3-18 mol % of SO3, 25-40 mol % of ZnO, 0-2 mol % of Al2O3, 0-4 mol % of Li2O, 0-15 mol % of Na2O and 11-35 mol % of K2O, wherein the total amount of Li2O, Na2O and K2O is 25-35 mol %. The low melting point glass has a glass transition temperature of 200 to 300° C. exclusive. A resin composition is produced by mixing the low melting point glass with a resin. A resin molded article is produced by molding or curing the resin composition.

Abstract: As a novel laminated film which uses no halogen series compound and is capable of conferring in a flame-retardant adhesive composition comprising a phosphorus series compound mixed therein an even better flame-retardancy, a laminated film is proposed, provided with a resin layer on at least one face of a flame-retardant adhesive composition layer comprising a flame-retardant adhesive composition containing a thermoset-type adhesive resin composition (A), a phosphorus series compound (B) with a melting temperature of 170° C. or higher and a foaming agent (C) in an unfoamed state.

Abstract: To provide phosphorus-containing epoxy resins and phosphorus-containing epoxy resin compositions having high levels of appearance, yield and economic efficiency and cured products thereof that are used for various applications. A phosphorus-containing phenol compound represented by Formula (3) obtained by reacting a compound represented by Formula (2) with a compound represented by Formula (1), wherein in the peak area (A) of the component represented by Formula (1) on a chromatogram measured under specific conditions by gel permeation chromatography, peak area (B) on the high-molecular-weight side of the component of Formula (1), and total area (C) of peak area (A) and peak area (B), the value obtained by dividing peak area (B) by total area (C) is 8 area % or less, and epoxy resin compositions and cured products comprising the phosphorus-containing phenol compound as an essential ingredient.

Abstract: The present invention relates generally to resin compositions having a generally halogen-free epoxy resin that can encompass a novolak epoxy resin, a curing agent and a non-halogen flame-retardant material. For some embodiments, the curing agent can be dicyandiamide and the flame retardant can be 10-benzyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. Embodiments of the current invention also relate generally to prepregs prepared from such resin compositions; and laminates prepared from such prepregs.

Abstract: A hydroxyphenyl or alkoxyphenyl phosphine oxide composition comprises (i) a first mixture of mono-(hydroxyphenyl) or (alkoxyphenyl) phosphine oxide isomers each having the formula (I): (ii) a second mixture of bis-(hydroxyaryl) or (alkoxyphenyl) phosphine oxide isomers each having the formula (II): and (iii) a third mixture of tris-(hydroxyaryl) or (alkoxyphenyl) phosphine oxide isomers each having the formula (III): wherein R is hydrogen or an alkyl group containing from 1 to 6 carbon atoms, R1 and R2 are the same or different and each is an alkyl group containing from 1 to 6 carbon atoms, and each of x and y is an integer between 0 and 4.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: a benzoxazine ring-containing compound comprising the reaction product of: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n ??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1; and (C) a thermosetting or thermoplastic composition. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance.

Abstract: The present invention generally relates to a resin composition, a cured resin, a sheet-like cured resin, a laminated body, a prepreg, electronic parts, single and multilayer circuit boards comprising a cyanate ester polymer and condensed phosphate ester, for use in single and multilayer circuit boards that are especially useful in the high-frequency range of above 100 MHz.

Abstract: The invention relates to a halogen-free flameproofing agent for curable moulding materials, the use of such flameproofing agents for the flame-retardant treatment of curable moulding materials, a process for the preparation of halogen-free, flame-retardant curable moulding materials, and halogen-free, flame-retardant curable moulding materials.

Abstract: Disclosed herein is a flame retardant thermoplastic resin composition including a polycarbonate resin, a branched acrylic copolymer, and a flame retardant. The flame retardant thermoplastic resin composition can have good compatibility as well as good flame retardancy, scratch resistance, colorability and appearance without requiring the addition of a compatibilizer.

Abstract: A novel flame-retardant thermoplastic polyhydroxy polyether resin obtained by reacting at least one epoxy resin (A) selected from glycidyl esters of divalent aliphatic carboxylic acids having 15 to 64 carbon atoms or glycidyl ethers of divalent aliphatic alcohols having 15 to 64 carbon atoms with a phosphorus atom-containing divalent phenol compound (B) as essential components, wherein the component (A) accounts for 2 to 52 mol % with respect to the whole resin, the weight average molecular weight thereof is 10,000 to 200,000, and the phosphorus content thereof is 1 to 5 wt %.

Abstract: The present invention relates to the production of organophosphorus compounds, in particular 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) or derivatives thereof which have been known for many years in prior art. They are used preferably as additives for polymers. In particular the use of DOPO and derivatives thereof as flame retardants for polymers, such as e.g. polyesters, polyamides, epoxy resins, has proved to be advantageous.