Phosphorus Dnrm Patents (Class 523/451)
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Patent number: 7834070Abstract: The invention provides a halogen-free and thermal resistant composition, including a mixture of bismaleimide and maleimide with molar ratio of 99:1-50:50; a barbituric acid, wherein the molar ratio of the mixture and the barbituric acid is 93:7-80:20; and an epoxy resin, wherein (the mixture with the barbituric acid) and the epoxy resin have a weight ratio of 5:95 to 50:50. The mixture undergoes reaction at 110-130° C. for about 2˜7 hours to form a maleimide modified epoxy resin. The procedure of forming the composition is solvent-free, thereby providing improved integrity for electronic packaging, lower curing temperature, and a simplified process.Type: GrantFiled: July 20, 2007Date of Patent: November 16, 2010Assignee: Industrial Technology Research InstituteInventors: Feng-Po Tseng, Jung-Mu Hsu, Jing-Pin Pan, Tzong-Ming Lee
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Patent number: 7824754Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.Type: GrantFiled: May 12, 2010Date of Patent: November 2, 2010Assignees: Sony Corporation, Sony Chemical & Information Device CorporationInventors: Masao Saito, Osamu Takamatsu, Takayuku Matsushima
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Patent number: 7820741Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) a specific polyphosphoric acid-melamine-based compound salt and/or polyphosphoric acid-diamine compound salt, and (F) an ion scavenger and/or a heavy metal deactivator.Type: GrantFiled: October 1, 2007Date of Patent: October 26, 2010Assignee: Shin-Etsu Chemicals Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7820740Abstract: The present invention provides a halogen-free, flame retardant adhesive composition that exhibits excellent anti-migration properties, not only within single layer structures, but also within multilayer structures of much higher density such as copper-clad laminates. The flame retardant adhesive composition according to the present invention comprises: (A) a halogen-free epoxy resin, (B) a carboxyl group-containing acrylic resin and/or a carboxyl group-containing acrylonitrile-butadiene rubber, (C) a curing agent, (E) specific phosphinate and/or diphosphonate compounds, and (F) an ion scavenger and/or a heavy metal deactivator.Type: GrantFiled: October 1, 2007Date of Patent: October 26, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20100248570Abstract: A halogen-free varnish includes epoxy resin, composite curing agent, condensed phosphate, and filler. The composite curing agent includes Benzoxazine (BZ) resin and amino triazine novolac (ATN) resin. The filler has aluminium hydroxide and silica.Type: ApplicationFiled: March 24, 2009Publication date: September 30, 2010Inventor: Li-Chun Chen
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Patent number: 7795744Abstract: The objective of the present invention is to provides a cationically curable epoxy resin composition excellent in sealing and adhesive property specifically to glass, excellent reflow resistance property, moisture resistance and water resistance while keeping a good workability intrinsic to a light curable resins. The invention provides a cationically curable epoxy resin composition comprising: (a) an epoxy resin component; (b) a cationic photo-initiator; (c) a cationic thermal-initiator and (d) a filler selected from the group consisting of oxides, hydroxides and carbonates containing a Group II element in the long periodic table.Type: GrantFiled: December 16, 2004Date of Patent: September 14, 2010Assignee: Henkel CorporationInventors: Chunfu Chen, Yoke Ai Gan
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Patent number: 7754790Abstract: An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.Type: GrantFiled: January 22, 2008Date of Patent: July 13, 2010Assignees: Sony Corporation, Sony Chemical & Information Device CorporationInventors: Masao Saito, Osamu Takamatsu, Takayuku Matsushima
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Publication number: 20100168279Abstract: This invention is a barrier composition comprising a resin or resin/filler system that is capable of being cured at low temperature while still maintaining superior barrier performance. This composition comprises (a) an aromatic compound having meta-substituted epoxy functionalities; (b) a multifunctional aliphatic amine; (c) optionally, one or more fillers; (d) optionally one or more adhesion promoters; (c) optionally, a phenolic cure accelerator.Type: ApplicationFiled: March 30, 2006Publication date: July 1, 2010Inventors: Shengqian Kong, Sarah E. Grieshaber, Donald E. Herr
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Publication number: 20100133703Abstract: A semiconductor chip laminate comprises a plurality of semiconductor chips and an adhesive layer through which the plurality of semiconductor chips are laminated, wherein the adhesive layer is composed of an adhesive composition comprising an acrylic polymer (A); an epoxy resin (B); a thermal curing agent (C); and a certain organic phosphine compound (D) as a thermal curing accelerator, and the content of the organic phosphine compound (D) relative to 100 parts by weight in total of the epoxy resin (B) and the thermal curing agent (C) is 0.001 to 15 parts by weight.Type: ApplicationFiled: November 25, 2009Publication date: June 3, 2010Applicant: LINTEC CORPORATIONInventors: Yasunori Karasawa, Isao Ichikawa
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Publication number: 20100093239Abstract: The invention relates to ethylene diphosphinic acids and salts thereof of general formula A-P(O)(OX)—CR1R2—CR3R4—P(O)(OX)-A, in which A, H and/or CR5R6—OH,R1,R2,R3,R4,R5,R6 are the same or different, and denote independently from each other H, C1-C20 alkyl, C6-C20 aryl and or C6-C20 aralkyl, and X denotes H, an alkali metal, an element of the second main and secondary group, an element of the third main and secondary group, an element of the fourth main and secondary group, an element of the fifth main and secondary group, an element of the sixth secondary group, an element of the seventh secondary group, an element of the eight secondary group and/or a nitrogen base. Also disclosed are a method for producing same and the use thereof.Type: ApplicationFiled: October 6, 2007Publication date: April 15, 2010Inventors: Harald Bauer, Werner Krause, Peter Staniek
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Patent number: 7674865Abstract: An epoxy resin composition for photosemiconductor element encapsulation, which is excellent in both light transmissibility and low stress property, as well as light resistance against short wavelength light (for example, 350 to 500 nm), is provided. The epoxy resin composition for photosemiconductor element encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) an acid anhydride curing agent, and (C) a specific silicone resin.Type: GrantFiled: March 1, 2006Date of Patent: March 9, 2010Assignee: Nitto Denko CorporationInventor: Hisataka Ito
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Publication number: 20100048766Abstract: The present invention relates to a polyphosphate-containing halogen-free adhesive, primarily used as an adhesive. The composition comprising the polyphosphate group compounds which effectively meets the needs for environmental protection and flame retardancy, and the high flexibility and flame retardancy of the adhesive made it suitable for using on printed circuit board, especially the flexible printed circuit board.Type: ApplicationFiled: February 22, 2007Publication date: February 25, 2010Inventors: Yu Hsain Cheng, We Ming Te, Gary Yonggang Min
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Publication number: 20090318588Abstract: Disclosed herein is a thermoplastic resin composition with good heat stability, light stability and impact strength. In an exemplary embodiment, the thermoplastic resin composition comprises (A) about 10 to about 99 parts by weight of an epoxy group-containing styrenic resin; (B) about 1 to about 90 parts by weight of a polyester resin; (C) about 0.1 to about 10 parts by weight of a thermoplastic polyester resin comprising a cycloaliphatic diol such as cyclohexane dimethanol, per about 100 parts by weight of a base resin comprising (A)+(B); (D) about 0.05 to about 2 parts by weight of a hindered phenolic compound, per about 100 parts by weight of a base resin comprising (A)+(B); (E) about 0.05 to about 4 parts by weight of a phosphite compound, per about 100 parts by weight of a base resin comprising (A)+(B); and (F) about 0.Type: ApplicationFiled: June 3, 2009Publication date: December 24, 2009Applicant: CHEIL INDUSTRIES INC.Inventors: Jun Myung KIM, Jin Hwan CHOI, Jee Kwon PARK, Jae Won LEE
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Patent number: 7618711Abstract: A resin coated metal plate having excellent formability comprises, on a metal plate, a resin coating layer containing a conductive filler and a corrosion inhibitor, a matrix resin constituting the resin coating layer is made mainly of a flexible epoxy resin and has a modulus of elasticity of not less than 3 GPa. When secondarily cured, the resin coated metal plate is imparted with excellent weldability and corrosion resistance.Type: GrantFiled: February 17, 2005Date of Patent: November 17, 2009Assignee: Kabushiki Kaisha Kobe Seiko ShoInventors: Hironobu Nakanishi, Kazuhisa Fujisawa, Hiroo Shige, Masatoshi Iwai
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Publication number: 20090252952Abstract: A Cr-free steel sheet includes a Zn-based electroplated steel sheet, a Cr-free layer which is formed by a Cr-free treatment liquid coated on the steel sheet, the Cr-free treatment liquid containing silicate of 3 to 40 parts by weight, silane of 0.5 to 10 parts by weight, titanium compound of 0.2 to 8 parts by weight, binder resin of 10 to 50 parts by weight, the binder resin being selected from the group consisting of urethane resin, epoxy resin and a combination thereof, and phosphoric ester of 1 to 5 parts by weight based on the Cr-free treatment liquid of 100 parts by weight, and a resin layer which is formed by a resin treatment liquid coated on the Cr-free layer, the resin treatment liquid containing melamine resin of 3 to 25 parts by weight, colloidal silica of 10 to 20 parts by weight, metal powder of 5 to 40 parts by weight, and phosphoric ester of 1 to 5 parts by weight based on phenoxy resin of 100 parts by weight.Type: ApplicationFiled: December 27, 2006Publication date: October 8, 2009Applicant: POSCOInventors: Sang-Keol Noh, Jae-Ryung Lee, Yong-Kyun Cho
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Patent number: 7585904Abstract: A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below.Type: GrantFiled: January 23, 2006Date of Patent: September 8, 2009Assignee: Hitachi Chemical Company, Ltd.Inventor: Shinya Nakamura
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Patent number: 7544727Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.Type: GrantFiled: October 28, 2005Date of Patent: June 9, 2009Assignee: Hitachi Chemical Co., Ltd.Inventors: Ryoichi Ikezawa, Masanobu Fujii, Shinsuke Hagiwara
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Patent number: 7524394Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a nitrogen-containing polyphosphate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil; and a method of bonding two substrates, including the steps of sandwiching the above adhesive sheet between two substrates, and curing the adhesive sheet. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate.Type: GrantFiled: April 12, 2006Date of Patent: April 28, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Patent number: 7524563Abstract: Provided is a flame retardant adhesive composition including (A) a halogen-free epoxy resin, (B) a thermoplastic resin and/or a synthetic rubber, (C) a curing agent, (D) a phytate compound, and (E) a curing accelerator. Also provided are an adhesive sheet having a layer including the above composition, and a protective layer for covering the layer including the composition; a coverlay film having an electrically insulating film, and a layer including the above composition provided on top of the film; and a flexible copper-clad laminate having an electrically insulating film, a layer including the above composition provided on top of the film, and copper foil. Further provided are a process for producing the adhesive sheet, a process for producing the coverlay film, and a process for producing the flexible copper-clad laminate. The halogen-free adhesive composition yields a cured product, on curing, that exhibits excellent flame retardancy and electrical characteristics (anti-migration properties).Type: GrantFiled: April 12, 2006Date of Patent: April 28, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toru Nakanishi, Kazunori Kondo, Shigehiro Hoshida, Tadashi Amano
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Publication number: 20090093570Abstract: An encapsulant composition for a light-emitting diode is provided. One embodiment of the encapsulant composition comprises: (a) about 100 parts by weight of at least one liquid bi-functional epoxy resin containing about 40˜50 weight % of aromatic ring; (b) about 55˜120 parts by weight of a curing agent comprising at least one bi-functional thiol curing agent containing aromatic ring and at least one aliphatic tetra-functional thiol curing agent, wherein the curing agent contains about 10˜50 weight % of aromatic ring and about 20˜35 weight % of sulfur; and (c) about 0.05˜0.5 parts by weight of a catalyst. The encapsulant composition having a high refractive index can be used for a solid state light emitting device to enhance light extraction efficiency.Type: ApplicationFiled: June 27, 2008Publication date: April 9, 2009Inventors: Chia-Wen Hsu, Hsun-Tien Li, Kai-Chi Chen
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Patent number: 7511383Abstract: A flame retardant featuring: an inorganic porous fine particle, a phosphazene compound represented by the following average compositional formula (1) (X is a single bond, CH2, C(CH3)2, SO2, S, 0, or O(CO)O; n is an integer of from 3 to 1000; d and e are numbers with 2d+e=2n), and a resin layer. The phosphazene compound is supported on the inorganic porous fine particle, and the resin layer coats the inorganic porous fine particle with the phosphazene compound supported thereon. The resin layer thermally decomposes to lose weight by 10% at a temperature of from 300° C. to 500° C., as measured by thermogravimetry in the air at a heating rate of 10° C./min.Type: GrantFiled: April 3, 2006Date of Patent: March 31, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Shoichi Osada
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Patent number: 7476444Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.Type: GrantFiled: September 15, 2006Date of Patent: January 13, 2009Assignee: PPG Industries Ohio, Inc.Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M Nugent, Jr., Yves Le Disert, Laurent Deronne
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Publication number: 20080234409Abstract: Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material.Type: ApplicationFiled: March 3, 2005Publication date: September 25, 2008Applicant: HITACHI CHEMICAL CO., LTD.Inventors: Seiichi Akagi, Mitsuo Katayose, Takatoshi Ikeuchi, Yoshinori Endou, Ryouichi Ikezawa
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Patent number: 7423097Abstract: A radiation curable resin composition comprises a glycidyloxy groups-containing polybutadiene or hydrogenated polybutadiene, a mono-oxetane compound or monofunctional epoxy compound, and a cationic photopolymerization initiator.Type: GrantFiled: April 11, 2003Date of Patent: September 9, 2008Assignee: Toagosei Co., Ltd.Inventor: Kazumasa Inata
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Publication number: 20080199717Abstract: An epoxy adhesive composition of an epoxy resin, an epoxy terminated liquid rubber, filler, and an amine curing package for said epoxy resin is disclosed. Advantageously, a short chain diol will be incorporated into the adhesive in order to enhance reactivity and strength build. Advantageously, a mixture of amines will be used in the curative including multifunctional aliphatic amines that improve adhesion and strength build; tertiary amines which are used to enhance adhesion and strength build, polyamides which can be used to provide flexibility; and amine-terminated rubbers (ATBN) which can improve toughness and impact resistance to the cured system. The preferred short chain diol is glycerin. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating.Type: ApplicationFiled: February 15, 2007Publication date: August 21, 2008Inventor: Michael J. Barker
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Patent number: 7396588Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.Type: GrantFiled: November 14, 2006Date of Patent: July 8, 2008Assignee: Zeon CorporationInventors: Yasuhiro Wakizaka, Toshiyasu Matsui, Daisuke Uchida, Koichi Ikeda
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Publication number: 20080097010Abstract: The object of the invention is to provide a resin composition for semiconductor encapsulation realizing excellent soldering resistance and flame resistance and having excellent flowability and curing properties, and a semiconductor device. The invention has solved the object by a resin composition for semiconductor encapsulation comprising (A) an epoxy resin containing (a) an epoxy resin represented by formula (1), (B) a compound having two or more phenolic hydroxyl groups in its molecule, (C) an inorganic filler, and (D) a curing accelerator: wherein each of R1 and R2 represents a hydrogen atom or a hydrocarbon group with 4 or less carbon atoms and may be the same or different; and ‘n’ represents a mean value that is a positive number of from 0 to 5; in the formula (1).Type: ApplicationFiled: July 19, 2005Publication date: April 24, 2008Inventor: Hirofumi Kuroda
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Patent number: 7320830Abstract: The present invention provides a non-flammable heat-resistant resin composition that is provided with (A) modified polyamideimide resin, (B) thermosetting resin and (C) organic phosphor-based compound, and a cured film, obtained from the non-flammable heat-resistant resin composition, exerts a storage elastic modulus of 700 MPa or less, a coefficient of thermal expansion of 5×10?3/K or less and an internal stress of 20 MPa or less, in a temperature range of 25 to 250° C., and the present invention also relates to an adhesive film using the resin composition.Type: GrantFiled: September 2, 2002Date of Patent: January 22, 2008Assignee: Hitachi Chemical Co., Ltd.Inventors: Toshihiko Itou, Masaru Tanaka, Shigehiro Nakamura
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Publication number: 20070231579Abstract: Provided is a coating composition containing (a) a resinous binder composition including an epoxy-functional polymer; and (b) a solid particulate composition dispersed in the resinous binder composition including (i) an electrically conductive material and (ii) a corrosion inhibitive material. The electrically conductive material (i) and the corrosion inhibitive material (ii) are present in a weight ratio of the conductive material (i) to the corrosion inhibitive material (ii) ranging from 1:8 to 12:1. The composition is characterized in that when applied to a conductive substrate to form a coating thereon, the coating is weldable. Coated substrates and related methods are further provided.Type: ApplicationFiled: March 20, 2007Publication date: October 4, 2007Applicant: PPG INDUSTRIES OHIO, INC.Inventors: Dennis W. Jones, Steven D. Perrine, Richard M. Nugent
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Patent number: 7169474Abstract: An epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, and (D) an effective flux component selected from among abietic acid, palustric acid, levopimaric acid and dihydroabietic acid is low volatile and exhibits improved wetting and adherent properties to solder balls. The epoxy resin composition is used to cover and encapsulate a semiconductor chip, especially as no-flow underfill material, forming a highly reliable semiconductor device.Type: GrantFiled: February 5, 2004Date of Patent: January 30, 2007Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Tsuyoshi Honda
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Patent number: 7160609Abstract: A curable composition comprises an insulating resin and a halogen-free flame retardant. The halogen-free flame retardant has a particulate form, and whose primary particles have an average major axis from 0.01 to 5 ?m, an aspect ratio of 5 or less, and the proportion of a major axis of more than 10 ?m being at most 10% by number. A varnish comprises an insulating resin, a curing agent, a flame retardant and an organic solvent. The flame retardant is a flame retardant in particulate form surface-treated with a coupling agent, and the flame retardant particles present in the varnish have a secondary particle diameter of 30 ?m or less.Type: GrantFiled: October 15, 2001Date of Patent: January 9, 2007Assignee: Zeon CorporationInventors: Yasuhiro Wakizaka, Toshiyasu Matsui, Daisuke Uchida, Koichi Ikeda
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Patent number: 7144763Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.Type: GrantFiled: May 27, 2005Date of Patent: December 5, 2006Assignee: General Electric CompanyInventors: Malgorzata Iwona Rubinsztajn, Slawomir Rubinsztajn
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Patent number: 7138445Abstract: The present invention relates to a flame retardant thermoplastic resin composition that contains a phenol resin derivative having good char formability, regardless of the base resin. A flame retardant thermoplastic resin composition according to the present invention comprises (A) 100 parts by weight of a thermoplastic resin as a base resin, (B) about 0.1˜100 parts by weight of a phenol resin derivative, and (C) about 0.1˜50 parts by weight of a phosphoric acid ester morpholide compound or a mixture of phosphoric acid ester morpholide compounds. Another flame retardant thermoplastic resin composition according to the present invention comprises (A) 100 parts by weight of a thermoplastic resin as a base resin, (B) about 0.1˜100 parts by weight of polyphenylene ether, (C) about 0.1˜100 parts by weight of a phenol resin derivative, and (D) about 0.1˜50 parts by weight of a phosphoric acid ester morpholide compound or a mixture of phosphoric acid ester morpholide compounds.Type: GrantFiled: December 8, 2003Date of Patent: November 21, 2006Assignee: Cheil Industries Inc.Inventors: Jae Ho Yang, Sang Hyun Hong, Gyu Chul Lee, Bok Nam Jang, Young Gil Jang, Sung Hee Ahn, Su Hak Bae, Jong-Cheol Lim, Kyung-Hoon Seo, Sam-Joo Yang
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Patent number: 7084194Abstract: A halogen-free resin composition is provided, comprising: (A) one or more phosphorous-containing epoxy resins; (B) a hardener; and (C) a hardening accelerator, wherein the hardener of component (B) has the structure represented by the following formula (I): wherein, each symbol is defined as in the specification. The halogen-free resin composition of the present invention has excellent thermal resistance and flame retardant property, and is thereby suitably useful in the application of adhesives, composite materials, laminated plates, printed circuit boards, copper foil adhesives, inks used for build-up process, semiconductor packaging materials, and the like.Type: GrantFiled: August 4, 2003Date of Patent: August 1, 2006Assignee: Chang Chun Plastics Co., Ltd.Inventors: Kuen-Yuan Hwang, An-Pang Tu, Chi-Yi Ju, Wen-Tsai Tsai
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Patent number: 7070861Abstract: A flame retardant epoxy resin composition containing (A) a phenolic novolak type epoxy resin including a phenolic novolak type epoxy resin of the following formula (1) and/or formula (2) in a total of at least 50 wt %: (wherein, n is 0 or a positive integer) (wherein, n is 0 or a positive integer) (B) a bisphenol type epoxy resin not containing a halogen, (C) an inorganic filler, and (D) an organic flame retardant. A prepreg and a fiber-reinforced composite using this epoxy resin composition.Type: GrantFiled: December 18, 2001Date of Patent: July 4, 2006Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Masato Taguchi, Yasushi Suzumura, Tadayoshi Saitou, Akihiro Itou
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Patent number: 7064157Abstract: The present invention relates to a phosphorus-containing epoxy resin, which is an epoxy resin modified with a side chain having a reactive phosphorus-containing compound. Also, the present invention relates to a flame-retardant resin composition, which comprises: (1) the phosphorus-containing epoxy resin, (2) a halogen-free hardener having a reactive hydrogen capable of reacting with the epoxy group in epoxy resin, and (3) a hardener promoter. The flame-retardant resin composition described above has improved excellent heat resistance and flame retardant property, and is especially suitable for adhesive laminates, composite materials, printed circuit boards, adhesive material for copper foils, and is suitable for IC packaging materials.Type: GrantFiled: February 27, 2001Date of Patent: June 20, 2006Assignee: Chang Chun Plastics Co., Ltd.Inventors: Kuen Yuan Hwang, Hong-Hsing Chen, An Pang Tu, Huan-Chang Chao
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Patent number: 7053138Abstract: Compounds of formula (I) or (II), wherein R1 is C1–C18alkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; C5–C22aryl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; or C7–C30aralkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups, and the radicals R2 to R13 are each independently of the others hydrogen; —NO2; dialkylamino; alkylthio; alkylsulfonyl; halogen; C1–C18alkyl; C1–C18alkoxy; C1–C18alkoxyalkyl; C5–C12cycloalkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; C5–C22aryl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups; or C7–C30aralkyl that is unsubstituted or substituted by one or more C1–C6alkyl groups or C1–C6alkoxy groups, are suitable as flame-proofing agents for thermoplastic or thermosetting polymersType: GrantFiled: November 20, 2001Date of Patent: May 30, 2006Assignee: Huntsman Advanced Materials Americas Inc.Inventors: Franck Magendie, Ulrich Weidmann
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Patent number: 6955848Abstract: This invention provides a multi-layer circuit board excellent in flame resistance, insulating property and adhesion and not generating detrimental substances when burnt, and a curable composition suitable for obtaining the multi-layer circuit board. The curable composition contains an insulating resin such as an alicyclic olefin polymer or an aromatic polyether polymer, a nitrogen-type curing agent such as 1,3-diallyl-5-glycidyl isocyanurate and a phosphorus-type flame retardant such as phosphoric acid ester amide, and is molded into a film by a solution casting method. The film so formed is laminated on an internal layer board and is cured to give the multi-layer circuit substrate.Type: GrantFiled: March 30, 2001Date of Patent: October 18, 2005Assignee: Zeon CorporationInventors: Yasuhiro Wakizaka, Kanji Yuyama
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Patent number: 6933332Abstract: A cured epoxy coating comprising from about 30% to about 40% of at least one epoxy resin selected from the group consisting of diglycidyl ethers of bisphenol A, from about 55% to about 60% of a particulate flame retardant, from about 1% to about 4% of at least one multifunctional hindered phenol; and no more than about 5% of at least one adhesion promoter. The cured coating provides insulation for electrical current carriers and has an average surface roughness from about 10 ?m to about 13 ?m as measured using a Pethometer M4P 150 surface profile measuring instrument.Type: GrantFiled: March 20, 2003Date of Patent: August 23, 2005Assignee: 3M Innovative Properties CompanyInventors: Curtis R. Guilbert, Steven H. Huang
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Patent number: 6924328Abstract: A coating composition includes a thermoplastic dispersion and a stabilizer. The stabilizer includes the reaction product of an epoxy resin and an acid, wherein the stabilizer has at least two oxirane functional groups per molecule.Type: GrantFiled: August 20, 2002Date of Patent: August 2, 2005Assignee: Valspar Sourcing, Inc.Inventors: Jason M. Legleiter, Robert M. O'Brien
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Patent number: 6916889Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.Type: GrantFiled: May 1, 2003Date of Patent: July 12, 2005Assignee: General Electric CompanyInventors: Malgorzata Iwona Rubinsztajn, Slawomir Rubinsztajn
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Patent number: 6916539Abstract: A halogen-free, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.Type: GrantFiled: August 9, 2002Date of Patent: July 12, 2005Assignee: Fujitsu LimitedInventors: Nawalage Florence Cooray, Koji Tsukamoto, Takeshi Ishitsuka
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Patent number: 6830825Abstract: An epoxy resin composition for encapsulation of semiconductors which contains substantially no halogen-based flame retarding agents or antimony compounds having properties of moldability, flame retardance, high-temperature storage characteristics, reliability for moisture resistance, and solder cracking resistance. The epoxy resin composition for encapsulating semiconductors contains (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a phosphazene compound as essential components, the total weight of phosphate ion and phosphite ion contained in the phosphazene compound being not more than 500 ppm. Further, the epoxy resin composition may optionally contain a flame-retarding assistant or an ion scavenger.Type: GrantFiled: October 31, 2002Date of Patent: December 14, 2004Assignee: Sumitomo Bakelite Company, Ltd.Inventors: Takafumi Sumiyoshi, Ayako Mizushima, Ken Oota, Yoshio Fujieda, Hiroki Nikaido, Takashi Aihara
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Patent number: 6815495Abstract: A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an alkyd resin, or mixtures thereof. The coating solution, in the liquid state, contains water. The binder contains 50-100% phenolic resin, preferably based on phenol and/or resorcinol.Type: GrantFiled: May 17, 2001Date of Patent: November 9, 2004Assignee: DaimlerChrysler AGInventors: Anita Marten, Daniela Maichel
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Patent number: 6809162Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant (11) may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.Type: GrantFiled: April 29, 2003Date of Patent: October 26, 2004Assignee: General Electric CompanyInventor: Malgorzata Iwona Rubinsztajn
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Patent number: 6803414Abstract: A damping resin composition is provided which includes bifunctional diacrylate or bifunctional dimethacrylate (A) expressed by the formula (1) below, and an unsaturated polyester resin (B+C) containing an unsaturated polyester (B) and a cross-linking monomer (C), and/or an epoxy acrylate resin (B′+C) containing an epoxy acrylate (B′) and a cross-linking monomer (C), wherein the bifunctional diacrylate or bifunctional dimethacrylate (A) is contained in an amount of 15 to 85% by weight, and the unsaturated polyester resin (B+C) or the epoxy acrylate resin (B′+C) or a mixture (B″+C) thereof that contains the unsaturated polyester resin (B+C) in an amount of 5 to 95% by weight and the epoxy acrylate resin (B′+C) in an amount of 95 to 5% by weight is contained in an amount of 85 to 15% by weight, the bifunctional diacrylate or bifunctional dimethacrylate (A) being expressed by: CH2=CR2CO−(R1O)n−OCOCR2=CH2 (1) whType: GrantFiled: April 26, 2002Date of Patent: October 12, 2004Assignee: Mitsubishi Fuso Truck and Bus CorporationInventors: Takeshi Honjo, Harushige Yamamura, Tai Uruji, Masayoshi Yamaguchi, Yusuke Koizumi, Hiroshi Hayashi
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Patent number: 6797750Abstract: The present invention has an object to provide a flame-retardant epoxy resin composition excellent in heat resistance and moisture resistance. A flame-retardant epoxy resin composition relating to the present invention contains an epoxy resin (A), a phosphazene compound (B), an epoxy hardener (C) and an inorganic filler (D), wherein the phosphazene compound (B) and the epoxy hardener (C) are included in the range of 0.Type: GrantFiled: November 7, 2002Date of Patent: September 28, 2004Assignee: Otsuka Kagaku Kabushiki KaishaInventors: Masatoshi Taniguchi, Yuji Tada, Yoichi Nishioka
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Patent number: 6767941Abstract: A halogen-free, flame-retardant composition includes (1) organic phosphorus compound (A) and (1′) melamine or a compound derived from melamine (B); or (2) a melamine-phosphorus compound (AB). The composition also includes and olefin polymer and from 0.1-30 wt % based on the olefin polymer, of a compound containing acid, acid anhydride or epoxy groups. The flame-retardant composition may included in a polycondensate composition which incorporate the flame-retardant composition is substantially shortened.Type: GrantFiled: November 27, 2001Date of Patent: July 27, 2004Assignee: DSM IP Assets B.V.Inventors: Pieter A. Van Der Spek, Martinus L. M. Bos, William A. C. Roovers, Marnix Van Gurp, Henrica N. A. M. Menting
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Patent number: 6747074Abstract: Described is a flexible, solid fire sealant produced by high shear mixing in a substantially volatile-free state and capable of being molded or extruded into a variety of shapes and used as firestops for windows, doors, dampers, shutters, and through-penetrations, the sealant containing water-insoluble intumescent mineral granules, a polymeric, halogen-free binder, and a flame retardant, wherein the sealant has a softness value from about 0.01 to about 3.75 mm and exhibits high expansion values and chars upon exposure to heat.Type: GrantFiled: March 26, 1999Date of Patent: June 8, 2004Assignee: 3M Innovative Properties CompanyInventors: Mark R. Buckingham, Walton W. Welna
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Publication number: 20040087687Abstract: A photocurable composition, including (a) an epoxy resin component; (b) a (meth)acrylate; (c) a cationic photoinitiator; (d) a radical photoinitiator; and (e) a phosphite component. A method of making a 3-D object from such a composition, and the resulting 3-D object.Type: ApplicationFiled: October 30, 2002Publication date: May 6, 2004Applicant: Vantico A&T US Inc.Inventor: Darchun Billy Yang