Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Combination compounds from curing agents/accelerators and flame-protection agents for the latent curing/acceleration of epoxide resin systems and their endowment with flame-retarding properties, the epoxide resin systems being able to be thermally cured, as well as the products prepared from the epoxide resin systems.

Abstract: The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame-retardant resin composition comprising as essential components (A) an epoxy resin, (B) a curing agent and (C) a phosphorus compound containing at least as part thereof a phosphine oxide compound, a prepreg produced by impregnating this flame-retardant resin composition in a fiber base, and a laminate produced by hot-pressing a single sheet or a pile of two or more sheets of the prepreg.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: Curable flame-resistant substantially halogen free epoxy resin compositions, comprising: (a) one or more bifunctional or polyfunctional epoxy resin; (b) a specific phosphorous-containing compound; (c) a curing agent consisting of oligomers of styrene and maleic acid and/or maleic anhydride and/or salts or esters of maleic acid; (d) a curing catalyst; and optionally; (e) additives; prepregs derived from said compositions and laminates derived from said prepregs.

Abstract: A halogen-tree, flame-retardant insulating epoxy resin composition which comprises (1) an epoxy resin, (2) a curing agent for the epoxy resin, (3) a phosphate of a resorcinol type, (4) aluminum hydroxide, and (5) a cure accelerator for the epoxy resin. The composition displays necessary flame retardant properties and sufficient insulating properties after the formation of an insulating layer in a circuit board, withstands a plating process, and does not cause the bleedout of the insulation layer formed. A circuit board with flame retardant properties comprising insulation layers formed of the epoxy resin composition is also disclosed.

Abstract: The present invention provides a flame-retardant resin composition having high flame retardancy without using any halogen compound and suited for printed circuit boards. Specifically, it provides a flame-retardant resin composition containing as its essential constituents: (A) a novolak epoxy resin, (B) a novolak resin, and (C) a phosphorus compound reactable with said epoxy resin or novolak resin, and also provides prepregs and laminates or copper-clad laminates using this resin composition.

Abstract: A solid-state image pickup apparatus having hermetic seal portion capable of packaged in a smaller size by a simple construction and fabricated with high precision at wafer level is constructed such that an epoxy-type resin sheet having opening portion only at light-receiving portion is adhered to solid-state image pickup device chip by an adhesive and a transparent member capable of becoming a flat-plate portion is adhered onto the epoxy-type resin sheet by means of an adhesive.

Abstract: A high molecular weight epoxy resin obtained by polymerization reaction of a difunctional epoxy resin (X) with a dihydric phenol compound (Y) containing 70-100% by weight of bisphenol S in the presence of a catalyst, the high molecular weight epoxy resin being characterized in that a weight average molecular weight thereof is 10,000-200,000. A resinous composition for a printed circuit board, comprising the high molecular weight epoxy resin, an epoxy resin other than the above-mentioned resin and a curing agent as essential components.

Abstract: The present invention discloses a dielectric composition having two steps of laminating temperatures. The composition is comprised of: a diamine curing agent containing asymmetrical chemical structures with different reactivity; an epoxy resin compound, containing at least two epoxy groups; and inorganic powder. In addition, flame retardant and toughener are added dependent on the requirements.

Abstract: Fire resistant adhesive resins that include a halogen-free and bromine-free flame retardant ingredient and conductive foils coated with the halogen-free fire resistant adhesive resin coated compositions of this invention as well as printed circuit boards manufactured using the adhesive resin coated conductive foils.

Abstract: The invention relates to flame-retardant thermoset compositions which comprise, as flame retardant, at least one phosphinic and/or a diphosphinic salt of these.

Abstract: A halogen-free flame retardant resin composition comprising a radically polymerizable resin which is modified with a phosphorus-containing compound of the formula (1): in which R is a hydrogen atom or a group of the formula: —(CH2)n—R1 in that R1 is a group derived from a compound having at least two phenolic hydroxyl groups or epoxy groups, and n is an integer of 0 to 3.

Abstract: The object of the present invention is to provide an epoxy resin compositions for encapsulating of semiconductors containing no bromine compounds and no antimony oxide and excellent in flame retardancy, moisture resistance, moldability, curability and electric characteristics. This composition is an epoxy resin composition containing (A) an epoxy resin, (B) a phenolic resin, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame retardant, wherein the improvement comprises the red phosphorus-based flame retardant (E) having a total content of phosphate ion and phosphite ion extracted from the retardant when subjected to extraction with water at 80° C. for 20 hours is not more than 2000 ppm, the amount of the red phosphorus in the red phosphorus-based retardant being 20-40% by weight and the red phosphorus-based retardant being contained in an amount of 0.5-5% by weight in the whole resin composition.

Abstract: Methods of making and using annealable insulated metal-based powder particles are provided. The insulated metal-based powder particles are formed from metal-based core particles that are coated with an annealable insulating material. The annealable insulating material has at least one inorganic compound and at least one organic polymeric resin. The inorganic compound in the insulating material forms a nonporous insulating layer surrounding the metal-based core particles upon heating. The organic polymeric resin preferably aids in dispersing or binding the inorganic compound to the metal-based core particles prior to annealing. The insulated metal-based powder particles produced can be formed into core components that can be annealed to improve the magnetic performance of the core component. The core components produced are particularly useful under AC operating conditions of 500 Hz or lower.

Abstract: The present invention provides a curable resin composition with excellent low temperature curability and good storage stability, which comprises (A) a polyepoxide compound, (B) a curing agent containing at least one functional group selected from carboxyl group and acid anhydride group, and (C) a potential curing catalyst composed of a reaction product of an onium salt and diphenyl phosphate.

Abstract: A semiconductor encapsulating epoxy resin composition is provided comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a microencapsulated flame retardant comprising a red phosphorus-base core coated with a thermoplastic resin and/or thermosetting resin, (D) a molybdenum compound, and (E) an inorganic filler. The composition and its cured product have moisture-proof reliability and high flame retardance despite the absence of halogenated epoxy resins and antimony oxide.

Abstract: In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide; the inorganic filler being mixed in an amount of from 70% by volume to 85% by volume based on the total weight of the encapsulant composition, and the hydrous bismuth nitrate oxide being mixed in an amount of from 2.5 parts by weight to 20 parts by weight based on 100 parts by weight of the epoxy resin, and ii) an electronic device having an encapsulating member comprising a cured product of this encapsulant composition.

Abstract: The present invention provides a flame-retardant resin composition comprising: (A) an epoxy resin other than halogenated epoxy resins, having at least two epoxy groups in the molecule, (B) a curing agent, and (C) a product obtained by reacting (C1) a phosphorus compound having at least one P-H linkage in the molecule, with (C2) a compound having, in the molecule, at least one functional group selected from the group consisting of C—C double bond, epoxy group, alcoholic hydroxyl group and carbonyl group, and at least one functional group selected from the group consisting of epoxy group, phenolic hydroxyl group, amino group, cyanate ester group and isocyanate group, and having a phosphorus content of 0.3% by weight to 8% by weight. This resin composition has high flame retardancy without using any halogen compound and does not impair the properties of an article to which the composition is applied.

Abstract: A flame retardant epoxy resin composition suitable for semiconductor encapsulation contains (A) a crystalline epoxy resin whose 30 wt % m-cresol solution has a viscosity of lower than 80 centipoise at 25° C., (B) a curing agent having at least two phenolic hydroxyl groups, and (C) silica. The composition optionally contains (D) an organopolysiloxane, (E) an organic phosphine oxide, (F) an amide group-containing release agent, and/or (G) a silane coupling agent. The cured composition achieves flame retardance rating UL-94 V-0 without a need for flame retardants and remains stable at high temperature.

Abstract: A bonded structure of an Al alloy pressed plate, in which another member is bonded onto the surface of the Al alloy pressed plate that has a lubricant layer by use of an epoxy resin based adhesive. The adhesive contains an epoxy resin, a dehydrated phosphate and a latent curing agent. The epoxy resin comprises a polyester type epoxy resin and at least one resin selected from the group consisting of a bisphenol epoxy resin, a rubber-modified bisphenol epoxy resin, and a urethane-modified epoxy resin.

Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is suited for semiconductor encapsulation. A specific organic phosphorus compound is used as the curing accelerator. The composition is smoothly flowing, stable during storage, effectively curable and mold releasable and can be molded and cured into products free from wire flow and voids.

Abstract: Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.

Abstract: An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

Abstract: Epoxy resin compositions comprising (A) a polyfunctional epoxy resin, (B) a polyfunctional phenolic resin curing agent, (C) an organophosphorus curing accelerator, (D) an aminosilane coupling agent, and (E) an inorganic filler have excellent flow properties, shelf stability and curing speed and are thus suitable for semiconductor encapsulation, especially BGA encapsulation. Semiconductor devices encapsulated with the epoxy resin compositions are highly reliable.

Abstract: This invention is directed to the preparation of alloy articles consisting essentially of glass and high temperature organic thermoplastic or thermosetting polymers having working temperatures which are compatible with that of the glass and/or the precursor glass for the glass-ceramic. The glass and polymer are combined at the working temperature to form an intimate mixture; i.e., the glass and polymer are in a sufficiently fluid state to be blended together to yield a body exhibiting an essentially uniform, fine-grained microstructure wherein, desirably, there is at least partial miscibility and/or a reaction between the glass and the polymer to promote adhesion and bonding therebetween. A body is shaped from the mixture and cooled to room temperature.

Abstract: An improved aqueous cathodic electrocoating composition of an aqueous carrier having dispersed therein a film forming binder of (1) an epoxy-resin amine adduct and (2) a blocked polyisocyanate crosslinking agent; wherein the improvement is an epoxy resin amine adduct which is a reaction product of an epoxy resin and a polyhydric phenol which is chain extended with a primary amine to form a chain extended epoxy resin having epoxy end groups and an equivalent amine to epoxy ratio is 1-10 to 4-10 and wherein the epoxy end groups of the resin are reacted with a ketimine and/or a diamine and the resulting chain extended epoxy resin has an epoxy equivalent weight of about 700-2,000 and is neutralized with an organic or inorganic acid; wherein the electrocoating composition has improved throw power and forms coatings that have improved corrosion resistance in comparison to conventional electrocoating compositions formed from epoxy resins extended with conventional diamines or polyols.

Abstract: A halogen-free flame retardant epoxy resin composition containing (A) a bisphenol A type epoxy resin, (B) a curing agent, (C) red phosphorus particles each of which is covered with a covering layer, at least the outermost layer of which is formed of a resin, and (D) an inorganic filler.

Abstract: An abrasive article, and methods of making and using same, containing an inorganic metal orthophosphate salt. The abrasive article including a coated abrasive article having a size or supersize coating layer containing an alkali metal or alkaline earth metal orthophosphate salt devoid of hydrogen. The inventive abrasive article reduces the grinding energy required while improving abrading efficiency in some cases.

Abstract: A flame-retardant resin composition which comprises (A) 100 parts by weight of an unhalogenated epoxy resin having at least two epoxy groups in one molecule, (B) 20 to 205 parts by weight of a maleimide compound having at least one maleimido group in one molecule, (C) 20 to 65 parts by weight of a curing agent having an amino group and (D) a phosphorus compound in a proportion of 0.5 to 4.5 parts by weight in terms of phosphorus element per 100 parts by weight of a total of the components (A), (B) and (C), provided that the proportion of nitrogen element contained in the composition is 2.0 to 10.0 parts by weight per 100 parts by weight of the total composition. The above flame-retardant resin composition has a high flame retardance without adding a halogen compound and does not deteriorate the characteristics of commercial products.

Abstract: Disclosed is an epoxy resin composition suitable for sealing a semiconductor, comprising an epoxy resin (A), a hardener (B), an inorganic filler (C), and a phosphoric acid ester compound (D), an amount of the inorganic filler (C) contained being more than 80% by weight relative to the composition. A semiconductor sealing epoxy resin composition excellent in flame retardancy, formability, reliability and solder heat resistance is obtained without an essential need to use a halogen-based flame retardant or an antimony-based flame retardant.

Abstract: Flame-resistantly formulated, flowable, latently reactive, phenolically curable epoxy-resin moulding compounds for the encapsulation of electronic components containing the following components:an epoxy-resin component obtained from a solvent-free reaction resin mixture of polyepoxy resin and polyisocyanate resin having a molar ratio of the epoxy groups to the isocyanate groups of 1.1 to 4 at a reaction temperature of up to 220.degree. C. in the presence of a reaction accelerator in a concentration of 0.5 to 2.5% and using triphenylphosphine oxide in a concentration of 0.05 to 10%, relative in each case to the reaction resin mixture,a hardener component containing at least two phenolic hydroxyl groups per molecule,inorganic filler,and standard additives.

Abstract: Proposed is a flame-retardant heat-curable flowable epoxy resin composition suitable for use in case potting of film capacitors exhibiting very little settling of the particulate ingredients in storage and excellent impregnability in case potting as well as excellent flame retardancy, moisture resistance and tracking resistance of the composition after curing. The composition comprises, as a uniform blend:(a) 100 parts by weight of a bisphenol-based epoxy resin which is liquid at a temperature of working in case potting;(b) from 10 to 40 parts by weight of an alkyleneglycol diglycidyl ether or cycloalkyleneglycol diglycidyl ether;(c) from 80 to 120 parts by weight of a polycarboxylic acid anhydride;(d) from 4 to 20 parts by weight of a powder of red phosphorus; and(e) from 100 to 200 parts by weight of a powder of hydrated alumina which characteristically is a combination of (e1) from 80 to 95% by weight of a first powder of hydrated alumina having an average particle diameter in the range from 10 to 25 .mu.

Abstract: An epoxy resin composition for encapsulating a semiconductor, which is free from halogen and antimony and has excellent soldering crack resistance and high-temperature storage life without lowering the flame-retardancy, and which comprises as essential components (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a red phosphorus-based flame-retardant, wherein the ratio of (a) the number of epoxy groups of the epoxy resin to (b) the number of phenolic hydroxyl groups of the phenol resin curing agent ?(a)/(b)! is 0.8 to 1.2, the amount of the inorganic filler (D) contained in the epoxy resin composition is 70 to 90% by weight based on the total weight of the epoxy resin composition and the cured product of the epoxy resin composition has a glass transition temperature of 100.degree. to 160.degree. C. and a linear expansion coefficient at 25.degree. C. of 0.8 to 1.8.times.10.sup.-5 /.degree.C.

Abstract: Curable epoxy resin composition comprising a bisphenol based epoxy resin having between 1.1 and 2.5 epoxy groups on average per molecule, a polyhydric phenol curing agent having more than two phenolic hydroxyl groups on average per molecule and red phosphorus. Also are described a process for the production of such curable epoxy resin compositions, the use of the compositions, especially in the impregnation of fibrous fibers, and products comprising or coated by the partly cured or cured epoxy resin compositions, especially impregnated fibrous fibers and laminates made therefrom.

Abstract: This invention relates to aqueous epoxy resin-containing compositions and to such compositions which are particularly useful for depositing coatings on metalic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin or a mixture of resins containing more than 50% by weight of at least one water-dispersible or emulsifiable epoxy resin, (B) chromium trioxide, and (C) water, said composition further characterized as being substantially free of strontium chromate. The aqueous compositions may also contain other ingredients including zinc and/or ferro alloys, and polytetrafluoroethylene as a lubricant to aid metal stamping operations, and a soluble colorant.

Abstract: Disclosed is a thermosetting coating composition comprising (A) an epoxy compound and (B) an aromatic sulfonium salt represented by the formula ##STR1## wherein R.sup.1 represents a hydrogen atom, a hydroxyl group, an alkoxyl group, or a group represented by the formula ##STR2## wherein Y represents an alkyl group, an alkoxyl group, a phenyl group or a phenoxy group all of which may have a substituent, each of R.sup.2 and R.sup.3 represents a hydrogen atom, a halogen atom, or an alkyl group, each of R.sup.4 and R.sup.5 represents an alkyl group, an aralkyl group or an aryl group all of which may have a substituent, and X.sup.- represents SbF.sub.6.sup.-, PF.sub.6.sup.-, AsF.sub.6.sup.-, or BF.sub.4.sup.-.

Abstract: An epoxy resin composition comprising (A) 20-80 parts by weight of an epoxy resin, (B) 20-80 parts by weight of a curing agent, (C) 0.1-50 parts by weight of a phosphorus-containing flame retardant, and (D) 200-1,200 parts by weight of an inorganic filler cures into products having improved high-temperature exposure resistance, flame retardancy, and reflow cracking resistance. The composition eliminates blending of antimony trioxide and brominated compounds and is useful in encapsulating semiconductor devices for imparting high-temperature reliability.

Abstract: Disclosed is an acid-epoxy curing type powder coating composition which forms a coated film having excellent yellow resistance and appearance. The powder coating composition comprises:(A) an epoxy group-containing acrylic resin prepared by polymerizing the monomer mixture which comprises,(a) 35 to 65% by weight of an epoxy group-containing ethylenically unsaturated monomer, and(b) remainder amount of an ethylenically unsaturated monomer which is different from the epoxy group-containing ethylenically unsaturated monomer;(B) a polycarboxylic acid; and(C) an antioxidant having a melting point of from 50.degree. to 140.degree. C.

Abstract: Disclosed herein is a precursor powder composition comprising a resin, a combination of zinc dust, zinc powder and zinc-coated microspheres and graphite, said powder being soluble in a solvent blend at a facility remote from the powder manufacturing facility, thereby, decoupling the powder manufacturing process from the end use of the powder which could be in a traditional solvent-based paint. Also disclosed are coating compositions for use in protecting metallic substrates from corrosion, comprising necessary additives and film forming substances including alkyl silicate, epoxy resins, powder and non-powder, and polyester resins, all the compositions being modified with about 4 to about 20 weight percent graphite powder based on total weight of the composition.

Abstract: This invention relates to aqueous epoxy resin-containing compositions useful for depositing coatings on metallic substrates in order to protect substrates against corrosion. The aqueous compositions generally comprise (A) an organic resin component consisting essentially of at least one water-dispersible or emulsifiable epoxy resin; (B) a non-ionic emulsifier, (C) chromium trioxide, (D) a conductive pigment, (E) water, and, optionally, polytetrafluorethylene as a lubricant. The compositions may also contain phosphoric acid or an alkylphosphoric acid. These compositions are useful in coil coating operations to improve the electrocoatability of a metal substrate, in particular, steel, galvanized or aluminized substrates. The basecoated metal can then be conventionally coated or electro coated with weldable or non-weldable primer coatings and may be followed by the application of decorative topcoats.

Abstract: A process for preparing a solid particle dispersion of an epoxy compound of the formula SI, ##STR1## wherein R is H, an alkyl group, or an aryl group; L.sub.1 is an alkylene group or an arylene group; L.sub.2 is --O--, --CO--, --S--, --SO.sub.2 --, --PO.sub.2 --, --CO.sub.2 --, --NHCO-- or --NHSO.sub.2 --, wherein L.sub.2 may be orientated in either direction; L.sub.3 is an alkylene group; m is 0 or 1; p is 0 or 1; and X is ##STR2## wherein R' is H or an alkyl or aryl group, with the proviso that where L.sub.2 comprises an ionizable group, X may also be an alkyl group or an aryl group is disclosed. The process comprising the steps of: (a) forming a coarse aqueous slurry of solid particles of said compound; and (b) milling said slurry in the presence of a hydrophobic, photographically inert, liquid second component which has a logP.sub.(calc) greater than about 6.0 for time sufficient to provide particles of the desired average particle size.

Abstract: A novel plastic composition and method for making the same comprising a host polymer having substantially uniformly distributed therethrough a non-miscible liquid crystal polymer and red amorphous phosphorus. The liquid crystal polymer is present in a concentration sufficient to encapsulate said red amorphous phosphorus such that a substantial portion of the red amorphous phosphorus does not contact the host polymer.

Abstract: Triazine compounds useful as flame retardants have the formula: ##STR1## where Am represents an amino group, Pp represents a phosphonate group and Z represents an amino group or a phosphonate group, or are polymers comprising repeating units of the formula: ##STR2## where ##STR3## is a diamine residue. The triazine compounds are used as flame retardants in plastics materials, particularly polyurethane foam or artificial fibres, or in intumescent fire protection compositions.

Abstract: A corrosion-resistant coating which can be applied directly to a surface as self-priming topcoat comprising an epoxy resin binder and a combination of pigments consisting essentially of an aluminum triphosphate, zinc salts of benzoic acids, and an alkaline earth metal phosphate such as zinc-barium phosphate. In addition, the coating contains up to about 30 parts by weight of a titanium dioxide pigment, up to about 2.0 parts by weight of an oil soluble surface active agent and up to about 50 parts by weight of at least one organic paint solvent.

Abstract: Tetra-[N-alkyl-2,2,6,6-tetramethylpiperidin-4-yl]-4,4'-diphenylbisphosphoni te Abstract of the DisclosureNovel compounds of formula I ##STR1## wherein R is C.sub.1 -C.sub.4 alkyl, allyl or benzyl, as stabilisers for protecting organic materials from thermal, oxidative or light-induced degradation.

Abstract: A vibration-isolating composite material consists essentially of powder of an inorganic elastic material and a synthetic polymer mixed thereto. The inorganic elastic material is at least one material selected from the group consisting of NdP.sub.5 O.sub.4, BiVO.sub.3, Gd.sub.2 (MoO.sub.4).sub.3, GdNbO.sub.4 and KH.sub.2 PO.sub.4 and the synthetic polymer is at least one material selected from the group consisting of thermoplastic resins, thermosetting resins and rubber materials.

Abstract: A flame retardant capable of imparting a polyamide-containing resin with excellent flame retardancy without deteriorating the impact strength of the polyamide-containing resin even when it is incorporated in a small amount, and a flame-retardant polyamide-containing resin composition containing the above flame retardant and having practically sufficient impact strength. The flame retardant comprises 100 parts by weight of magnesium hydroxide, 2 to 750 parts by weight of red phosphorus and 0.2 to 250 parts by weight of an epoxy resin, and the flame-retardant polyamide-containing resin composition comprises 100 parts by weight of a polyamide-containing resin, 2 to 50 parts by weight of magnesium hydroxide, 1 to 15 parts by weight of red phosphorus and 0.1 to 5 parts by weight of an epoxy resin.