Solid Polymer Derived Solely From Phenolic Reactants Wherein None Of The Reactants Contains A Plurality Of Methylol Groups Or Derivatives Thereof Patents (Class 525/390)
Abstract: Disclosed herein is a two-component structural adhesive based on organic compounds containing radically polymerizable multiple bonds, in particular substituted acrylates and/or methacrylates, which on account of their lack of acids are particularly suited for adhering rare earth permanent magnets based on neodymium-iron-boron.
Abstract: A curable resin composition for use as a constituting material of an electrophotographic photoreceptor, comprises: a phenolic resin; a charge transportable material having a reactive functional group; and at least one of an organic sulfonic acid and its derivative.
Type:
Grant
Filed:
June 1, 2006
Date of Patent:
September 8, 2009
Assignee:
Fuji Xerox Co., Ltd.
Inventors:
Wataru Yamada, Katsumi Nukada, Masahiro Iwasaki, Kenji Yao
Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.
Type:
Application
Filed:
February 19, 2009
Publication date:
August 27, 2009
Applicant:
NATIONAL CHUNG HSING UNIVERSITY
Inventors:
Ching-Hsuan Lin, Yu Ming Hu, Hong Tze Lin
Abstract: To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board. A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.
Type:
Application
Filed:
April 26, 2007
Publication date:
August 13, 2009
Applicant:
HITACHI CHEMICAL CO., LTD.
Inventors:
Koji Morita, Shin Takanezawa, Kazunaga Sakai, Yuusuke Kondou
Abstract: A compound having the formula: Each Ar is an aromatic group. Each R is an alkyl group. The value n is a positive integer. The values of w, x, y, and z are 0 or 1. If y is 0 than x and z are 0 and w is 1, and if y is 1 than x and z have different values and w equals z. A thermoset made by crosslinking a silane-containing compound with the above compound. A method of making the above compound when y is 1 by: reacting 4,4?-difluorobenzophenone with an aromatic diol to form an oligomer; and reacting the oligomer with a vinyl dialkylsilane. A method of making the below compound by: reacting 4,4?-difluorobenzophenone with a vinyl dialkylsilane. Each R is an independently selected alkyl group.
Type:
Application
Filed:
January 28, 2008
Publication date:
July 30, 2009
Applicant:
The Government of the United States of America, as represented by the Secretary of the Navy
Abstract: An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.
Type:
Grant
Filed:
May 29, 2008
Date of Patent:
July 14, 2009
Assignee:
International Business Machines Corporation
Abstract: In various embodiments the present invention comprises 2,4,6-trisubstituted-1,3,5-triazine capping agents comprising one, two, or three leaving groups as substituents with any remaining substituents being essentially inert to reaction with a nucleophilic group on a polymer or monomer, or reactive with a nucleophilic group on a polymer or monomer at a slower rate than any leaving group. The invention also comprises polymers or monomers with nucleophilic groups capped with a triazine moiety. Still other embodiments of the invention comprise processes for capping nucleophilic groups in a polymer or monomer which comprises combining and reacting the polymer or monomer with a triazine-comprising capping agent.
Type:
Grant
Filed:
June 21, 2007
Date of Patent:
June 16, 2009
Assignee:
SABIC Innovative Platics IP B.V.
Inventors:
Sterling Bruce Brown, Hans-Peter Brack, James Anthony Cella, Dennis Karlik
Abstract: A polyphenylene ether resin composition comprising a polyphenylene ether, wherein the polyphenylene ether has a polymer chain comprising recurring units each represented by the following formula (1): and has the following characteristics (a), (b) and (c): (a) when the polyphenylene ether is analyzed by 1H-NMR, the polyphenylene ether exhibits a triplet signal (S1) at 3.55 ppm, wherein the triplet signal (S1) has a relative intensity of 0.05 to 0.25 in terms of the percentage of the integrated intensity of the triplet signal (S1), based on the integrated intensity of a signal (S2) observed at 6.47 ppm; (b) the polyphenylene ether exhibits an absorbance of from 0.01 to 0.40 at a wavelength of 480 nm; and (c) the polyphenylene ether has a weight average molecular weight of from 30,000 to 100,000.
Abstract: The present invention provides a novel narrow distribution dendrimer-like star polymer having a controlled molecular structure, and a method capable of easily producing the star polymer. Disclosed is a polymer comprising a core portion and an arm portion, wherein the arm portion includes a first generation composed of a polymer chain and a second generation composed of a polymer chain formed at the outer shell of the first generation, the number of arms of the second generation is larger than the number of arms of the first generation, the first generation composed of the polymer chain is a polymer chain derived from a monomer having a polymerizable double bond, and the ratio of the weight average molecular weight (Mw) to the number average molecular weight (Mn), (Mw/Mn), of the star polymer is within a range from 1.001 to 2.50.
Abstract: The present invention is directed to a hyperbranched-polyester comprising at least one kind of a structural unit selected from an aromatic oxycarbonyl unit (P), aromatic and/or aliphatic dioxy units (Q), and an aromatic dicarboxy unit (R), and a trifunctional or higher polyfunctional organic residue (B), wherein the content of B is within a range from 7.5 to 50 mol % based on entire monomers constituting the hyperbranched-polyester. The present invention provides a hyperbranched-polyester which can remarkably improve thin-wall flowability, stiffness and gas barrier property by blending with a thermoplastic resin, and a thermoplastic resin composition blended with the same.
Abstract: The present invention discloses a latent thermosetting ink formulation for ink jet applications comprising a phenolic resin, an amino resin and a polyol. The formulation is characterized as having a viscosity of lower than 50 Cps at a shear rate of 10 to 100,000 sec-1 at a temperature lower than 100 C and a surface tension lower than 40 dynes/cm.
Type:
Application
Filed:
August 17, 2006
Publication date:
April 30, 2009
Inventors:
Izhar Halahmi, Shalom Luski, Michal Cohen
Abstract: The present invention provides a liquid-crystalline polyester blend, which is obtained by combining a liquid-crystalline polyester (A) and a liquid-crystalline polyester (B) such that the ratio by weight of (A)/(B) is 99/1 to 80/20: liquid-crystalline polyester (A) which consists of aromatic oxycarbonyl repeating units, aromatic dioxy repeating units and aromatic dicarbonyl repeating units, and contains 40-80 mol % of the repeating unit represented by formula (I) based on the total repeating units constituting the liquid-crystalline polyester (A); liquid-crystalline polyester (B) which comprises repeating units represented by formulae (I) and (II), wherein the molar proportion of the total amount of the repeating units represented by formulae (I) and (II) based on the total amount of the repeating units constituting the liquid-crystalline polyester (B) is greater than or equal to 90 mol % and the molar proportion of the repeating units represented by formulae (I) to (II) is from 10/90 to 50/50.
Abstract: Elastomer precursor gum (for any of fluoroelastomer, acrylic acid ester rubber/polyacrylate rubber, ethylene acrylic rubber, silicone, nitrile butyl rubber, hydrogenated nitrile rubber, natural rubber, polyurethane, and styrene butadiene rubber) and non-gum polymer are admixed with optional electrically conductive particulate and/or optional filler to provide either a continuous phase of polymer with dispersed gum portions, a continuous phase of elastomer precursor gum with dispersed polymer portions, or an interpenetrated structure of elastomer precursor gum and polymer. Curing is optionally enabled with techniques such as electron beam radiation.
Abstract: The present invention provides a method to producing a phenol resin by which a polyarylene having low melt viscosity ether can be industrially produced by extremely simple and easy method, without the need of a special aftertreatment after polymerization and complicated multistep reaction, and produces a method of producing an epoxy resin from a phenol resin obtained by the above-mentioned method. The method of producing a phenol resin having a polyarylene ether structure includes a step of a dehydration condensation reaction of reacting a polyhydroxyaromatic compound (A) having two or more phenolic hydroxyl groups per molecule in the presence of a basic catalysis (B).
Abstract: The invention relates to thermoplastic compositions comprising a polymer matrix and an additive which modifies the rheological behavior of the matrix in the molten state. The purpose of the invention is to provide a preferably non-reactive additive which can be dispersed in the matrix and which can be used to obtain a good compromise in terms of rheological properties/mechanical properties. According to the invention, the additive is a hyperbranched polymer which is functionalized by R<2> radicals, R<2> being a radical of the following type: substituted or non-substituted hydrocarbon, of the silicon type, linear or branched alkyl, aromatic, arylalkyl, alkylaryl or cycloaliphatic, which can comprise one or more unsaturations and/or one or more heteroatoms.
Abstract: The present invention relates to novolak resins prepared with, inter alia, one or more alkylphenols. The invention further relates to compositions comprising the novolak resins, such as vulcanizable rubber compositions, and to products obtained therewith.
Type:
Application
Filed:
September 10, 2008
Publication date:
March 5, 2009
Applicant:
SI GROUP, INC.
Inventors:
L. Scott HOWARD, Todd M. AUBE, Timothy Edward BANACH, James J. LAMB
Abstract: The invention concerns a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 25 to 80 parts by weight of a polymeric staple fiber containing a polymer or copolymer derived from a monomer selected from the group consisting of 4,4?diaminodiphenyl sulfone, 3,3?diaminodiphenyl sulfone, and mixtures thereof; and 20 to 75 parts by weight of a modacrylic fiber, based on 100 parts by weight of the polymeric fiber and the modacrylic fiber in the yarn.
Abstract: This invention relates to a flame-resistant spun staple yarns and fabrics and garments comprising these yarns and methods of making the same. The yarns have 50 to 95 parts by weight of a polymeric staple fiber containing a structure derived from a monomer selected from the group consisting of 4,4?diaminodiphenyl sulfone, 3,3?diaminodiphenyl sulfone, and mixtures thereof; and 5 to 50 parts by weight of a polyoxadiazole fiber or greater, based on the total amount of the polymeric fiber and the polyoxadiazole fiber in the yarn.
Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.
Abstract: The invention relates to polymers containing at least 0.5 mol % of units of formula (3) wherein J, M, X1, X2, Y1p, Y2n, Y3m and q are as defined in the specification.
Abstract: Essentially at most two-dimensional shaped article (A) comprising at least one polymer composition (C) comprising at least one high glass transition temperature sulfone polymer (P). Methods of making it and uses thereof.
Type:
Application
Filed:
September 30, 2005
Publication date:
January 29, 2009
Applicant:
SOLVAY ADVANCED POLYMERS, L.L.C.
Inventors:
Geoffrey Scott Underwood, Brian A. Stern, Anthony Lippl, Shari Weinberg, Selvaraj Savariar, Mohammad Jamal El-Hibri
Abstract: The present invention relates to macromonomer compounds possessing antioxidant properties, antioxidant polymers comprising the antioxidant macromonomers as a recurring unit, and methods of inhibiting oxidation in a substance comprising contacting the substance with the antioxidant polymers. In one embodiment, substantially all of the recurring macromonomeric units of the antioxidant polymers comprise an antioxidant moiety. In another embodiment, all of the recurring macromonomer units of the antioxidant polymers comprise an antioxidant moiety. The method of the present invention, yields antioxidant polymers with substantially all of the recurring units comprising an antioxidant moiety. These antioxidant polymers have greater bulk antioxidative properties than previously known.
Abstract: The instant invention relates to compositions comprising a benzoxazine resin and an advancement resin based on bisphenol A diglycidyl ether and bisphenol S and, optionally, ferrocene and aluminium trihydrate. Such compositions are, when cured to form polymeric networks, difficultly inflammable and resistant to high temperatures. Such compositions may especially be used in the production of printed wiring boards.
Abstract: Compositions comprising blends of polyphenylene and poly(aryl ether sulfone) and methods for making such blends are disclosed. Miscible blends of polyphenylene and poly(aryl ether sulfone) are also disclosed. The blends are useful in numerous applications such as in the preparation of articles and of foams having reduced density.
Type:
Application
Filed:
September 6, 2007
Publication date:
November 27, 2008
Applicant:
SOLVAY ADVANCED POLYMERS L.L.C.
Inventors:
Nikica Maljkovic, Roy L. Carter, David B. Thomas, Leslie J. Myrick, Todd S. Rushing
Abstract: Provided is a copolycarbonate which can meet a wide range of molding conditions as a raw material and which results in providing good optical molded articles. It is a copolycarbonate comprising repetitive units represented by the following Formulas (I) and (II), wherein a content of the repetitive unit represented by Formula (II) described below is 1 to 30 mass %, and a viscosity number is 30 to 71. In the formulas, R1 and R2 represent an alkyl group having 1 to 6 carbon atoms; X represents a single bond, an alkylene group having 1 to 8 carbon atoms, an alkylidene group having 2 to 8 carbon atoms, a cycloalkylene group having 5 to 15 carbon atoms, a cycloalkylidene group having 5 to 15 carbon atoms, —S—, —SO—, —SO2—, —O—, —CO— or the like; R3 and R4 represent an alkyl group having 1 to 3 carbon atoms; Y represents a linear or branched alkylene group having 2 to 15 carbon atoms; a to d each are an integer of 0 to 4; and n is an integer of 2 to 450.
Type:
Application
Filed:
February 21, 2005
Publication date:
November 20, 2008
Applicant:
Idemitsu Kosan Co., Ltd.
Inventors:
Yasuhiro Ishikawa, Hiroshi Kawato, Atsushi Sato
Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), HO—YaO—X—OY—ObH ??(1) HO—X—OH ??(2) Y—OH ??(3) wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.
Abstract: Multi-layer composites having a blend of a dimethyl bisphenol cyclohexane polycarbonate and a bisphenol A polycarbonate as a top layer joined to a bisphenol-A polycarbonate second layer provide both surface scratch resistance and the ability to form molded and die cut articles. In the top layer, repeat units of dimethyl bisphenol cyclohexane are present in an amount of at least 50 weight percent relative of the total repeat units in the top layer, preferably in a weight ratio of from 60 to 75 weight percent.
Type:
Application
Filed:
April 13, 2007
Publication date:
October 16, 2008
Applicant:
GENERAL ELECTRIC COMPANY
Inventors:
Sapna Blackburn, Kwan Hongladarom, Mike M. Laurin, Jan Pleun Lens, Hendrik Theodorus van de Grampel
Abstract: A composition for the treatment of metal surfaces and for the deposition of metals or metal alloys on plastics surfaces contains a) at least one polymer as component A, composed of the structural element (1) and at least three structural elements selected from the group consisting of b) water or another solvent which is suitable for dissolving, dispersing, suspending or emulsifying the polymer, as component B; c) if required, surface-active compounds, dispersants, suspending media and/or emulsifiers as component C. In a process for the treatment of a metal surface and a process for the deposition of metals or metal alloys on a plastics surface, the metal or plastics surface is brought into contact with a polymer (component A). Furthermore, polymers (component A) are used for the treatment of metal surfaces and for the deposition of metals or metal alloys on a plastics surface, and polymers composed of special components A?a, A?b and A?c.
Type:
Grant
Filed:
December 27, 2002
Date of Patent:
June 24, 2008
Assignee:
BASF SE
Inventors:
Monica Fernandez Gonzalez, Hans-Ulrich Jäger, Peter Neumann, Helmut Witteler
Abstract: A bifunctional phenylene ether oligomer containing monophenylene and biphenylene moieties can be rendered thermosetting by reacting the terminal phenolic hydroxyl groups with a) a cyanogen halide to introduce terminal cyanate groups, b) a halogenated glycidyl to form terminal epoxy groups, or c) an allyl halide to produce allylic terminal groups. The epoxy-terminated phenylene ether oligomer can be further reacted acrylic and/or methacrylic acid to yield an epoxy di(meth)acrylate which can be further modified with a carboxylic acid or anhydride to obtain and acid-modified epoxy di(meth)acrylate.
Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.
Type:
Grant
Filed:
September 26, 2007
Date of Patent:
June 10, 2008
Assignee:
International Business Machines Corporation
Abstract: Featured are novel heterocycle substituted hydroquinones, aromatic copolymers and homopolymers bearing main and side chain polar pyridine units. These polymers exhibit good mechanical properties, high thermal and oxidative stability, high doping ability and high conductivity values. These novel polymers can be used in the preparation and application of MEA on PEMFC type single cells. The combination of the above mentioned properties indicate the potential of the newly prepared materials to be used as electrolytes in high temperature PEM fuel cells.
Abstract: A process for preparing derivatized poly(4-hydroxystryrene) having a novolak type structure which comprises the steps of (i) supplying a solution of methanol containing 4-hydroxyphenylmethylcarbinol, (ii) subjecting said solution to an acid catalyzed displacement reaction for a sufficient period of time and under suitable conditions of temperature and pressure to convert substantially all of said carbinol to 4-hydroxyphenylmethylcarbinol methyl ether in solution, (iii) polymerizing said ether containing solution in the presence of a suitable acid catalyst for a sufficient period of time and under suitable conditions of temperature and pressure to form a novolak type polymer.
Abstract: A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is particularly useful for fabricating plastic-packaged electronic devices.
Type:
Grant
Filed:
August 18, 2004
Date of Patent:
February 12, 2008
Assignee:
General Electric Company
Inventors:
Joop Birsak, Herbert Shin-I Chao, Bryan Duffey, Amy Rene Freshour, Hugo Gerard Eduard Ingelbrecht, Qiwei Lu, Michael Joseph O'Brien, Prameela Susarla, Michael Vallance, Kenneth Paul Zarnoch
Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.
Type:
Grant
Filed:
March 19, 2007
Date of Patent:
January 22, 2008
Assignee:
International Business Machines Corporation
Abstract: The present invention provides a liquid crystalline polymer composition comprising (A) a polymer including units of formula (I), and units of formula (II) and/or units of formula (III), the units of formula (I) being included in 15-80% by mol, based on the total units [(I)+(II)+(III)]; and (B) a polymer (B) including units of formula (IV), formula (V) and the formula (VI), each of units being included in 30-80% by mol, 10-35% by mol and 10-35% by mol, respectively, based on the total units [(IV)+(V)+(VI)], the component (B) being included in 5-80% by weight based on the total weight of the components (A) and (B); wherein (I) —(VI) are —OC—Ar1-0-, —O—Ar2—O—, —OC—Ar3—CO—, —OC—Ar4—O—, —O—Ar5—X— and —OC—Ar6—CO—, respectively.
Type:
Application
Filed:
June 13, 2007
Publication date:
December 20, 2007
Inventors:
Tomoya Hosoda, Satoshi Okamoto, Toshiki Mori
Abstract: The poly(phenylene oxide) resin composition of the invention is a poly(phenylene oxide) resin composition containing poly(phenylene oxide) and triallyl isocyanurate, wherein the poly(phenylene oxide) has a number average molecular weight in a range from 2,000 to 12,000 and the IPN structure can be formed in a cured product of the poly(phenylene oxide) and triallyl isocyanurate to provide a high heat resistance, and at the same time by using a poly(phenylene oxide) with a relatively low molecular weight, the fluidity of the melt resin can be made desirable at the time of molding to result in high molding properties.
Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.
Abstract: A method of separating a polymer-solvent mixture is described wherein a polymer-solvent mixture is heated prior to its introduction into an extruder comprising an upstream vent and/or a side feeder vent to allow flash evaporation of the solvent, and downstream vents for removal of remaining solvent. The one-step method is highly efficient having very high throughput rates while at the same time providing a polymer product containing low levels of residual solvent.
Type:
Grant
Filed:
June 6, 2005
Date of Patent:
June 5, 2007
Assignee:
General Electric Company
Inventors:
Norberto Silvi, Mark H. Giammattei, Paul W. Buckley
Abstract: A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.
Type:
Grant
Filed:
February 7, 2001
Date of Patent:
March 20, 2007
Assignee:
International Business Machines Corporation
Abstract: A poly(arylene ether) polymer includes polymer repeat units of the following structure: —(O—Ar1—O—Ar2)m—(O—Ar3—O—Ar4)n— where Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0.05 to 0.95, n is 1-m, and at least one of the aryl radicals is grafted to at least one hydroxyalkyl group, such as 2-undecanol. The polymer is especially useful in electrically conductive adhesives.
Type:
Grant
Filed:
July 16, 2003
Date of Patent:
March 13, 2007
Inventors:
William Franklin Burgoyne, Jr., Ching-Ping Wong, Silvia Liong
Abstract: A poly(arylene ether) composition comprises a first poly(arylene ether) resin having an intrinsic viscosity greater than or equal to about 0.3 dl/g, as measured in chloroform at 25° C. and a second viscosity poly(arylene ether) resin having an intrinsic viscosity less than or equal to about 0.17 dl/g, as measured in chloroform at 25° C. wherein the composition is essentially free of plasticizers.
Abstract: Poly(arylene ether) polymers are provided having polymer repeat units of the following structure: wherein Ar1, Ar2, Ar3, and Ar4 are identical or different aryl radicals, m is 0 to 1, n is 1-m, and at least one of G1, G2, G3, G4, G5, G6, G7 and G8 is a hydroxyalkyl furan group. Thin films of the polymer and methods of making the polymer are also provided.
Type:
Grant
Filed:
November 1, 2004
Date of Patent:
February 20, 2007
Inventors:
William Franklin Burgoyne, Jr., Christine Peck Kretz
Abstract: A synthetic resin composition includes at least one synthetic resin and RBC or CRBC particles dispersed in the resin. A method for preparing a synthetic resin composition includes mixing RBC or CRBC particles with a synthetic resin at a temperature near the melting temperature of the synthetic resin. Preferably, the method of includes the step of kneading the mixture.
Abstract: An insulating-film forming material comprising a resin (A) that has a structure represented by formula (I): wherein Y1, Y2, Ar1 and Ar2 are the same or different; each of Y1, Y2, Ar1 and Ar2represents an aromatic ring-containing divalent organic group; at least one of Y1 and Y2 is a divalent aromatic polycyclic group having a specific structure; m and n each indicates a molar percentage of the repeating units; and m falls between 0 and 100 with (m+n)=100.
Abstract: A curable resin composition containing a polyfunctional cyanate ester resin and a bifunctional phenylene ether oligomer having a number average molecular weight of 500 to 3,000 and having a specific structure represented by the formula (1), and a cured product thereof.
Abstract: A high flow polyphenylene ether resin composition comprises a blend of at least two polyphenylene ether resins, a first resin having an intrinsic viscosity of at least 0.3 dl/g, and a second resin having an intrinsic viscosity of less than 0.17 dl/g and preferably having a particle size of at least about 100 ?m. Fiber reinforced and flame retarded compositions exhibit high HDT values.
Abstract: The present invention is concerned with cross-linked sulfonated polymers, eventually perfluorinated, and their preparation process. When molded in the form of membranes, the polymers are useful in electrochemical cells, in a chlorine-sodium electrolysis process, as separator in an electrochemical preparation or organic and inorganic compounds, as separators between an aqueous phase and an organic phase, or as catalyst for Diels-Alder additions, Friedel-Craft reactions, aldol concentrations, cationic polymerisation, esterification, and acetal formation.
Abstract: A high performance thermoplastic polymer composition having improved melt flow properties, comprising a thermoplastic polymer resin and a low intrinsic viscosity poly(arylene ether). Preferred thermoplastic polymers are poly(imide) polymers.
Type:
Grant
Filed:
May 6, 2003
Date of Patent:
March 28, 2006
Assignee:
General Electric
Inventors:
Franciscus Johannes Maria van Beek, Glen D. Merfeld, Alan Oshinski, Robert Puyenbroek, Kenneth Paul Zarnoch
Abstract: The present invention provides a method of producing an aqueous dispersion. A resin (b) or a solvent solution thereof, or a precursor (b0) of the resin (b) or a solvent solution thereof is dispersed in an aqueous dispersion of resin particles (A) composed of resin (a), and is caused the precursor (b0) to react where the precursor (b0) or a solvent solution thereof is used, to prepare resin particles (B) composed of said resin (b). Thereby, an aqueous dispersion (X1) of resin particles (C) having a structure such that the resin particle (A) adheres to the surface of the resin particle (B) is obtained.