Abstract: An epoxy resin composition for semiconductor sealing, which comprises an epoxy resin, a curing agent and an inorganic filler, and has a J-value of 10 to 50, which is a maximum jetting flow value determined according to a method of evaluating jetting flow of epoxy resin composition.

Abstract: A composition comprising a resin having latent primary amine functionality is described. The latent amine functionality is obtained by reacting a cyclic anhydride with an amine compound having two primary amine groups and one secondary amine group. The latent amine resin is combined with a curing agent having a plurality of cyclic carbonate groups in a crosslinkable coating composition.

Abstract: An insulating adhesive for a multilayer printed circuit board, which is to be laminated to an internal layer circuit board coated with an undercoating agent comprising an epoxy resin and a curing agent therefor, and which comprises as essential components:(a) a bisphenol type epoxy resin or phenoxy resin having a weight average molecular weight of at least 10,000,(b) a bisphenol type epoxy resin having an epoxy equivalent of not more than 500, and(c) an epoxy resin curing agent, said insulating adhesive being excellent in storage stability in the form of a varnish or as coated on a copper foil, and when coated on an internal layer circuit board coated with an undercoating agent, being able to be well integrally cured with the undercoating agent.

Abstract: Epoxy resin compositions containing polyepoxides having at least two 1,2-epoxide groups are disclosed. The polyepoxides can be obtained by reacting (i) di- or polyepoxides or mixtures thereof with monoepoxides, (ii) one or more amines chosen from sterically hindered amines, disecondary diamines and diprimary diamines to form an epoxide-amine adduct, and (iii) subsequently reacting the epoxide-amine adduct with polyfunctional isocyanates. The composition also contains curing agents for the polyepoxides and can optionally contain additional 1,2-epoxide compounds and additives. The compositions are useful as coatings for bridging cracks, as adhesives and as constituents of paints.

Abstract: Provided is an epoxy resin composition comprising a crystalline epoxy resin (A) and an amorphous epoxy resin as an essential component, wherein the crystalline epoxy resin (A) being uniformly dispersed in the amorphous epoxy resin (B) as a crystallite. The epoxy resin composition has a high softening point, hardly causes blocking during the storage and has an excellent handling property.

Abstract: An impregnation resin composition comprising an alicyclic epoxy compound, an acid anhydride, an aluminum compound having an organic group, and butylglycidyl ether, wherein the alicyclic epoxy compound contains not more than 30 ppm in concentration of Na ion component.

Abstract: An epoxy sealer/healer formulation for sealing and strengthening cracked concrete comprising an epoxy resin, an amine and a dialkylene triamine-alkylene oxide adduct, where the formulation provides a modulus and/or compressive strength at least that of uncracked concrete and effective for penetrating a concrete crack at a rate of at least 10 mm/min for a crack 0.5 mm wide when applied by gravity feed. The epoxy sealer/healer preferably has a viscosity of less than 100 centipoise and a tack-free time of less than 12 hours. The epoxy sealer/healer is advantageous in being able to bond to moist concrete surfaces. A method of using the epoxy sealer/healer for sealing and restoring the strength of cracked concrete is also set forth.

Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.

Abstract: An epoxy composition which is an infusible, gelled, heat curable, epoxy functional reaction product formed by mixing together:(A) one or more epoxy resins or epoxy group containing compounds;(B) a hardener system which will react with (A) to give a gelled solid, but which does not cause complete curing of (A) under the reaction conditions chosen for reaction of (A) and (B) to give a gelled solid; and(C) an optional further hardener system for (A) and the reaction product of (A) and(B), which is different from (B), and which remains largely unreacted with (A) and(B) under said reaction conditions.

Abstract: A selif-emulsifying epoxy resin (A), prepared from proportions by mass of(A-1) from 50 to 95% of one or more epoxide compounds having at least two epoxide groups per molecule and an epoxide group content of from 300 to 11,200 mmol/kg;(A-2) from 5 to 50% of an aromatic polyol;(A-3) from 0 to 25% of modifying compounds having at least two epoxide-reactive groups;(A-4) from 5 to 25% of an emulsifying product of the condensation of(A-4-a) an aliphatic polyol having a weight-average molar mass M.sub.W of from 200 to 20,000 g/mol and(A-4-b) an epoxide compound having at least two epoxide groups per molecule and an epoxide group content of from 500 to 10,000 mmol/kg,whereby the ratio of the number of OH groups to the number of EP groups is from 1:2 to 1:10 and the epoxide group content of these condensation products (A-4) is between 100 and 6700 mmol/kg.

Abstract: A polyepoxy composition comprising a trisepoxide represented by general formula (I) described below which is well-balanced between thermal stability and water resistance is provided. ##STR1## In the formula, R represents a methyl group, X represents an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, which may be identical or different, respectively, Y represents a hydrogen atom or a methyl group, and m and n represent an integer of 0 to 2.

Abstract: Hardeners for epoxy resins include a reaction product of (A) a compound having an average of at least one 1,2-epoxide group per molecule, compound (A) being a reaction products of (A1) a polyfunctional epoxide having ate least two 1,2-epoxide groups per molecule of said epoxide and (A2) a monohydroxyaromatic compound, and (B) an amine. Epoxy resins cured with the hardeners are useful as coatings.

Abstract: A coating composition is described comprising, in an aqueous medium:A) a resin having a plurality of primary amine groups, andB) a curing agent having a plurality of cyclic carbonate groups.

Abstract: This invention relates to coating compositions including one or more resins having amino-reactive groups; one or more polyamine curing agents; and one or more aminourethanes. The aminourethanes can be reaction products of (i) oligomeric or polymeric compounds which contain at least one, preferably two or more terminal 2-oxo-1,3-dioxolane groups (cyclic carbonate groups), and (ii) amines containing at least one primary, preferably two or more primary and, if desired, also secondary and tertiary amino groups. The ratios of equivalents of C1):C2) typically is from 1:1 to 1:10, preferably from 1:1.05 to 1:5 and particularly preferably from 1:1.1 to 1:2, and the end product preferably contains one or more free primary amino groups. The composition further may contain, if desired, pigments, fillers, one or more organic solvents, water and conventional additives.

Abstract: A process for the production of a storage-stable, modified phenol-aldehyde resol resin includes the use of an alkylresorcinol modifier and preferably a readily-available mixture of alkylresorcinols. A binder system includes the modified phenol-aldehyde resin combined with a curing agent that includes an additional source of an aldehyde, e.g., a phenol-formaldehyde resin. The resin and binder system are useful in the production of a wood composite (such as plywood, oriented strandboard, or fiberboard).

Abstract: The invention relates to a process for preparing a composition contains a polymer and a crosslinking agent which comprises mixing a polymer that is solid at room temperature with a crosslinking agent, the polymer and the crosslinker having complementary reactive groups, at a temperature at which the viscosity of the polymer (measured according to Emila) is less than 5000 dpas, in a means for achieving a homogeneous composition in such a short time that less than 20% of the reactive groups of one of either the polymer or crosslinking agent has reacted, and subsequently cooling and comminuting the composition.The mixing is preferably effected in a static mixer at a temperature higher than 140.degree. C.

Abstract: The invention relates to flame-resistant epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a hardener, which comprise a phosphorus-containing compound of the formula I or II ##STR1## in which R is a linear or branched alkyl, cycloalkyl, aryl or alkylaryl group having 1 to 18 carbon atoms or is hydrogen, and R' is a linear or branched alkylene, cycloalkylene, arylene or alkylarylene group having 1 to 18 carbon atoms, to a process for their preparation and to their use.

Abstract: Provided are epoxy curing agents comprising the reaction product of reactants consisting essentially of a mono-alkylene polyamine having less than about 12 carbon atoms, an alicyclic diamine in an amount of greater than about 10% of the amine equivalents of said amine component, an aromatic mono-glycidyl ether having less than about 18 carbon atoms, and a diglycidyl ether of an aromatic diol having an average degree of oligomerization of less than about 3.5, wherein the ratio of primary amine equivalents of said alkylene polyamine to the total epoxide equivalents of said aromatic glycidyl ether and said diglycidyl ether of an aromatic diol is are greater than one, and the ratio of epoxide equivalents of said aromatic mono-glycidyl ether to epoxide equivalents of said diglycidyl ether of an aromatic diol is greater than one.

Abstract: Epoxy resin mixtures for prepregs and compositesEpoxy resin mixtures for preparing prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides, or phosphonic acid half-esters;a glycidyl group-free compound with phenolic OH groups in the form of bisphenol-A, bisphenol-F, or a high-molecular phenoxy resin obtained through the condensation of bisphenol-A or bisphenol-F with epichlorohydrin;an aromatic polyamine used as a hardening agent.

Abstract: The present invention provides a method of preparing an orthopedic cast comprising the step of coating a porous flexible substrate with a water-curable resin composition composed of a water-reactive alkoxysilane terminated resin having at least one hydrolyzable group per molecule. The resin composition has a viscosity of no greater than about 500 Pa-s under ambient conditions and contains less than about 1 wt-% of a solvent, based on the total weight of the resin composition.

Abstract: A stable aqueous emulsions of epoxy resins are provided using an epoxy-functional polyether having the formula: ##STR1## wherein R.sup.1 is a C.sub.1 -C.sub.15 alkyl, aryl or alkylaryl group, R.sup.2 is a divalent aliphatic group, a divalent cycloaliphatic group, a divalent aryl group, or a divalent arylaliphatic group, R.sup.3 is independently a hydrogen or a C.sub.1 -C.sub.10 alkyl group, R.sup.8 is a divalent aliphatic group optionally containing ether or ester group(s) or together with R.sup.9 or R.sup.10 form a spiro ring optionally containing heteroatoms, and R.sup.9 and R.sup.10 are independently hydrogen or R.sup.9 or R.sup.10 together with R.sup.

Abstract: The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: A binder composition for thermosetting powder paints comprising (i) a polymer that is capable of reacting with epoxy groups and (ii) a crosslinker that contains epoxy groups, wherein the crosslinker comprises at least one C.sub.5 to C.sub.26 linear or branched aliphatic chain with the proviso that epoxy groups are carried on at least one aliphatic chain. In order to function as a crosslinker the amount of oxirane-oxygen originating from the crosslinker in the binder composition is higher than 0.1 meq/gram. The crosslinker is, for example, an epoxydized oil, a modified epoxydized oil or an epoxydized alkyd resin. A powder paint comprising the binder composition can contain a suitable catalyst and, optionally, an additional curing agent.

Abstract: A process for incorporation of epoxidized polydienes into aromatic epoxy resins which comprises (a) blending the epoxidized polydiene into a curing agent in a ratio of 1:20 to 1:4, (b) reacting the epoxidized polydiene and a curing agent at a temperature of from 100.degree. to 150.degree. C. over a time from 10 to 100 minutes, (c) mixing the pre-reacted epoxidized polydiene and curing agent with the aromatic epoxy resin and accelerator, and (d) curing the aromatic epoxy resin by heating the full mixture of paragraph (c) to a temperature of from 110.degree. to 170.degree. C. for from 2 to 6 hours.

Abstract: According to the present invention, there is provided an acrylic copolymer having a number average molecular weight of 1000-500,000, which comprises 1-90 % by weight of a structural unit represented by the following general formula ##STR1## (wherein R represents a hydrogen atom or a methyl group) and 99-10 % by weight of a structural unit-derived from an ethylenic unsaturated monomer, an acrylic copolymer composition and a paint containing the same.The coat obtained by applying the acrylic copolymer has excellent abrasion resistance, chemical resistance, flexibility, strength and the like.

Abstract: A method of preparing a self-dispersing epoxy resin composition is provided. The method comprises reacting a polyepoxide with a polyoxyalkylene polyol wherein the equivalent ratio of epoxide groups of said polyepoxide to hydroxyl groups of said polyoxyalkylene polyol is greater than 10:1, to form an polyol-epoxy adduct and reacting said polyol-epoxy adduct with a polyepoxide and a polyhydric alcohol to form a self-dispersing epoxy resin. Also provided are aqueous dispersions of the self-dispersing epoxy resin and coating compositions comprising the same. The coating compositions are particularly useful as industrial maintenance coatings.

Abstract: A thermosetting epoxy resin powder coating composition is provided that comprises an epoxy resin composed of a diglycidyl ether of bisphenol A, a curing agent composed of a bisphenol A encapped diglycidyl ether of bisphenol A, and a cure catalyst composed of an imidazole adducted to a diglycidyl ether of bisphenol A, in which the ratio of curing agent to epoxy resin is below 70% stoichiometry, and preferably between about 10% and 60% stoichiometry. The thermosetting epoxy resin powder coating composition not only exhibits the desired flexibility and fast cure speeds, but also exhibits superior adhesion and superior resistance to delamination and cathodic disbondment, preferably having cathodic disbondment values typically less than 4 mm radial disbondment, and preferably less than 2 mm radial disbondment. Such properties are highly advantageous for protective powder coatings used on rebars and pipelines.

Abstract: This invention relates to coating compositions including one or more resins having amino-reactive groups; one or more polyamine curing agents; and one or more aminourethanes. The aminourethanes can be reaction products of (i) oligomeric or polymeric compounds which contain at least one, preferably two or more terminal 2-oxo-1,3-dioxolane groups (cyclic carbonate groups), and (ii) amines containing at least one primary, preferably two or more primary and, if desired, also secondary and tertiary amino groups. The ratios of equivalents of C1):C2) typically is from 1:1 to 1:10, preferably from 1:1.05 to 1:5 and particularly preferably from 1:1.1 to 1:2, and the end product preferably contains one or more free primary amino groups. The composition further may contain, if desired, pigments, fillers, one or more organic solvents, water and conventional additives.

Abstract: The present invention relates to an article comprising a substrate which has coated thereon a photopolymerizable epoxy composition containing a plurality of epoxides including at least one selected from the group consisting of bisphenol A epoxides and cycloaliphatic epoxides, and at least one aliphatic epoxide, from about 0.1% to about 2% of at least one organometallic cationic initiator capable of initiating polymerization at wavelengths of from about 200 to about 600 nm, and optionally at least one accelerating agent. The article can be a flexible tape backing or a chip-resistant paint.

Abstract: The peel strength of lightweight, liquid polysulfide-based sealants for aircraft is improved by the addition of an epoxy-terminated liquid polysulfide to the liquid polysulfide. The lightweight sealants have a specific gravity of from about 1 to about 1.3 and the amount of epoxide terminated polysulfide is from about 0.4 to about 5% of the weight of the polysulfide present in the sealant. Fillers having a specific gravity of from about 0.1 to about 2.2 are used.

Abstract: There is disclosed a self-disbursing curable epoxy resin composition comprising the addition product of reactants comprising (a) 1.0 reactive equivalent of an epoxy resin, (b) from about 0.40 to 0.95 reactive equivalents of a polyhydric phenol, and (c) from about 0.005 to 0.5 reactive equivalents of an amine-epoxy adduct comprising the addition product of reactants comprising 1.0 reactive equivalent of an aromatic polyepoxide and from about 0.3 to 0.9 reactive equivalents of a polyoxyalkyleneamine.

Abstract: A process for the production of a modified phenol-aldehyde resin which may form a binder system when combined with a curing agent which includes an additional source of an aldehyde, e.g., a phenol-formaldehyde resin. The inventive phenol-aldehyde resin may be modified with compounds from one of the following classes: (1) dihydroxybenzenes, (2) aminophenols, and (3) phenylenediamines. The resin and adhesive are useful in the production of a wood composite (such as plywood, oriented strandboard, or fiberboard).

Abstract: There is disclosed a self-dispersing curable epoxy resin composition comprising the addition product of reactants comprising (a) 1.0 reactive equivalent of an epoxy resin, (b) from about 0.40 to 0.95 reactive equivalents of a polyhydric phenol, and (c) from about 0.005 to 0.5 reactive equivalents of an amine-epoxy adduct comprising the addition product of reactants comprising 1.0 reactive equivalent of a polyepoxide and from about 0.3 to 0.9 reactive equivalents of a polyoxyalkyleneamine having the structural formula:R.sub.1 --O--R.sub.2 --CH.sub.2 CH(R.sub.3)--X--R.sub.4 --NH2wherein:R.sub.1 designates a monovalent organic radical selected from the group consisting of C.sub.1 to C.sub.12 aliphatic, alicyclic or aromatic hydrocarbons, andR.sub.2 represents a polyoxyalkylene chain having the structural formula:(CH.sub.2 --CH.sub.2 --O).sub.a --(CH.sub.2 --CH(R.sub.5)--O).sub.bwherein:R.sub.5 is a monovalent organic radical selected from the group consisting of C.sub.1 to C.sub.

Abstract: An epoxy resin composition for semiconductor encapsulation use comprising an epoxy resin, a phenol resin, and an inorganic filler is improved by blending therein a component which is obtained by copolymerizing or homopolymerizing a reactive monomer having a vinyl group and an epoxy or phenolic hydroxyl group in a molecule thereof with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. Alternatively, the modifying component (C) is obtained by copolymerizing a reactive monomer and a silane monomer with or preferably in the presence of a thermoplastic elastomer or organic synthetic rubber. The composition cures to products having improved thermal shock resistance and adherence.

Abstract: Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water such that the particle sizes of the solids are less than 30 .mu.m. The primer compositions are environmentally superior to solvent based primers without loss of physical properties, are storage stable, and exhibit excellent solvent resistance.

Abstract: An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.

Abstract: A resin composition is provided that is suitable for impregnating sheet material, including fabrics, films, paper and tapes of the type employed to form prepregs, such as tapes used to form electrical insulation layers on electrical components. The resin composition includes a solid or semi-solid epoxy resin having an epoxide functionality of at least 2.5, a metal acetylacetonate for catalyzing the epoxy resin, and an accelerator of bisphenol A-formaldehyde novolac catalyzed by an acidic catalyst and having a hydroxyl equivalent weight of 120. The resin composition is essentially unreactive at room temperature and at elevated temperatures sufficient to enable permeation of the sheet material by the resin in its manufacture, is essentially unreactive at temperatures required to remove moisture and volatiles during processing of articles wrapped or taped with the sheet material, and cures at a higher temperature without adversely affecting the cure characteristics of the resin composition.

Abstract: Aqueous epoxy resin dispersion comprising (A) an epoxy resin which is a condensation product of (A-1) from 50 to 95% by weight, preferably from 55 to 85% by weight, of one or more epoxide compounds having at least two epoxide groups per molecule and an epoxide equivalent mass of from 100 to 2000 g/mol, (A-2) from 5 to 50% by weight, preferably from 15 to 45% by weight, of an aromatic polyol; and (A-3) from 0 to 25% by weight, preferably from 0 to 10% by weight, of modifying compounds containing at least two epoxide-reactive groups; (B) a dispersant comprising (B-1) a condensation product of a polyol having a weight-average molecular mass (M.sub.

Abstract: A newly-blended one part system heat-resistant epoxy resin composition which exhibits excellent stability at room temperature, quickly undergoes the curing reaction, molded within short periods of time, and, after cured, exhibits excellent Tg, resistance against the water, resistance against degradation by heat, and a variety of excellent properties in combination. The heat-resistant epoxy resin composition having excellent stability at room temperature comprises an epoxy compound having two or more epoxy groups, a curing agent which comprises a naphthalenedicarboxylic dihydrazide as a main component, and a ceramic whisker as a filler.

Abstract: A stable aqueous emulsions of epoxy resins are provided using an epoxy-functional polyether having the formula: ##STR1## wherein Q is A or B, R.sup.1 is independently a divalent hydrocarbon group, R.sup.2 is a divalent aliphatic group optionally containing ether or ester groups or together with R.sup.3 or R.sup.4 form a spiro ring optionally containing heteroatoms, and R.sup.3 and R.sup.4 are independently hydrogen or R.sup.3 or R.sup.4 together with R.sup.2 form a spiro ring optionally containing heteroatoms such as oxygen, X and Y are independently hydrogen, methyl or ethyl group with the provision that if X is methyl or ethyl, Y is hydrogen or if Y is methyl or ethyl, X is hydrogen and n+m+o is a positive real number from about 15 to 450, and where Q is B, n+o is a real number in an amount effective to provide emulsifying property.

Abstract: Described herein are compositions containing (a) a cycloaliphatic epoxy resin, (b) an aromatic amine hardener, and (c) a particular cure accelerator. These compositions afford unreinforced castings with a high level of mechanical properties and improved heat deflection temperatures.

Abstract: Described herein are resinous compositions comprising a particular cycloaliphatic epoxy resin and the adduct of these epoxy resins with an aromatic active hydrogen-containing compound. These compositions afford unreinforced castings with higher heat deflection temperatures, faster cure rates, and reduced water uptake than similar compositions containing epoxy adducts made from aliphatic polyols.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: An advanced epoxy cationic resin useful as a cathodic electrodeposition coating is prepared by reacting in the presence of a suitable catalyst (A) a composition comprising (1) at least one diglycidyl ether of (a) an oxyalkylated aromatic diol or (b) an oxyalkylated cycloaliphatic diol or (c) certain oxyalkylated aliphatic diols and (2) at least one diglycidyl ether of a dihydric phenol with (B) at least one dihydric phenol and optionally (C) a monofunctional capping agent. Components (A-1) and (A-2) are employed in quantities such that from 10 to 75 weight percent of the diglycidyl ethers contained in component (A) are contributed by component (A-1), and from 25 to 90 weight percent of such glycidyl ethers are contributed by component (A-2). The terminal oxirane groups in the thus formed advanced epoxy resin are converted to cationic groups by reacting the resin with a nucleophilic compound and adding an organic acid and water at at least one point in the reaction.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: Disclosed is a liquid epoxy resin composition comprising (A) a liquid epoxy resin, (B) a dimethylpolysiloxane having epoxy groups at its both ends, and (C) a dispersing agent comprising the reaction product of (C-1) a dimethylpolysiloxane having amino groups or carboxyl groups reactive with epoxy resins at its side chains or both ends and having phenyl groups or polyether groups for improving its compatibility with epoxy resins at its side chains, and (C-2) an epoxy resin having the same structure as the component (A). The composition has a reduced internal stress, while maintaining the heat resistance intrinsic to epoxy resins, and has excellent resistance, crack resistance and heat shock resistance.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.