Abstract: A coating powder, based on glycidyl (meth)acrylate copolymer/carboxylic acid functional polyester chemistry, provides a smooth, weatherable, reduced gloss coating for use on heat sensitive substrates, such as wood. The glycidyl (meth)acrylate copolymer has an epoxy equivalent weight of 250 to 400 and the carboxylic acid functional polyester has a viscosity of 2500 cps or less at 200 C.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more hydroxy compounds, reacting the thus formed intermediate with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: Hardeners for epoxy resins produced by reacting one or more &agr;,&bgr;-unsaturated carboxylic acid esters with one or more aminopolyalkylene oxide compounds, reacting the thus formed intermediate with one or more polyhydroxy compounds, reacting the thus formed intermediate with one or more polyepoxide compounds, and reacting the thus formed intermediate with one or more amines are described. Processes for their production, aqueous dispersions containing the same and methods for their use are also described.

Abstract: An insulating resin is made containing an epoxy system of epoxy resin: and an epoxy diluent, with a phenolic accelerator selected from catechol or pyrogallol and an organotin latent catalyst selected from triphenyltin chloride, tribenzyltin chloride, tribenzyltin hydroxide or triphenyltin acetate. The insulating resin is solventless and has a viscosity of from 10 centipoise to 450 centipoise at 25° C. for up to eight weeks and can be used as an impregnating resin in slot portions (15) and 16of an electrical coil (10), usually in combination with mica tape, in a motor (20) or a generator (30).

Abstract: Resin systems containing a dicyclopentadiene-based epoxy resin and an ortho-alkylated aromatic diamine hardener exhibit low moisture absorption, high Tg and good retention of properties under hot and wet conditions. These properties make the resin systems especially useful in aerospace applications.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: A sealed semiconductor chip having a surface film of a sealed resin composition, wherein the resin composition has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; a semiconductor-sealing resin composition for sealing a semiconductor chip, which has a linear expansion coefficient of 60×10−6/K or less at a temperature equal to or less than its glass transition point and 140×10−6/K or less at a temperature equal to or higher than its glass transition point; the sealed semiconductor chip is chip size and has high reliability; the semiconductor-sealing resin composition creates a good seal on chip wafers and has high reliability; and the chip wafers sealed with a surface film of the resin composition warp little.

Abstract: Binders for road-marking paints, comprising a (meth)acrylate copolymer A and one or more olefinincally unsaturated monomers B which can be cured by adding free-radical initiators C, wherein the binders have mass fractions of from 20 to 80% of the (meth)acrylate copolymer A and from 80 to 20% of the olefinically unsaturated monomers B, where the (meth)acrylate copolymers A are obtainable by reacting, mass fractions of, from 10 to 50% of compounds A1 selected from the group consisting of from 10 to 50% of compounds A1 selected from the group consisting of monoexpoxides, lactones and lactams having from 4 to 18 carbon atoms, from 1 to 25% of olefinically unsaturated monomers A2 which contain at least one acid group selected from the group consisting of carboxyl groups, sulfonic acid groups and phosphonic acid groups, from 5 to 70% of methacylates A3 of linear, branched or cyclic alchohols having from 1 to 20 carbon atoms, from 2 to 84% of acrylates A4 of linear, branched or cyclic alcohols having from 2 to 2

Abstract: The present invention concerns hydroxyaliphatic functional diglycidyl ethers of bisphenols (epoxy resins); curable (thermosettable) mixtures of at least one hydroxyaliphatic functional epoxy resin and at least one curing agent and/or catalyst therefor, as well as cured (thermoset) compositions prepared therefrom; and derivatives prepared therefrom. The bisphenol precursor to the diglycidyl ether contains a hydroxyaliphatic group linkage between the two aromatic rings of the bisphenol.

Abstract: An epoxy resin mixture is prepared by a) the reaction of (i) a diglycidyl compound, (ii) a bisphenol compound and (iii) at least one monophenol at temperatures of from 160 to 170° C. in the presence of an advancement catalyst that can be thermally deactivated, (b) upon completion of the reaction, the catalyst is deactivated by heating to a temperature of approximately 180° C. wherein (A1) one or more epoxy resins having an epoxy functionality of greater than two is added, and c) the resulting epoxy resin mixture is homogenized at that temperature.

Abstract: A curable composition for build-up which comprises (A) a bisepoxy compound represented by formula (I) shown below and (B) a polyepoxy compound having a polyhydric phenol skeleton at a weight ratio (A)/(B) of 3/97 to 20/80.

Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates, while the powders from which the coatings are made still exhibit good storage stability and melt-processability.

Abstract: The present invention provides a curable resin composition with excellent low temperature curability and good storage stability, which comprises (A) a polyepoxide compound, (B) a curing agent containing at least one functional group selected from carboxyl group and acid anhydride group, and (C) a potential curing catalyst composed of a reaction product of an onium salt and diphenyl phosphate.

Abstract: An insulating resin is made, containing an epoxy system of resin and epoxy diluent, with phenolic accelerator selected from catechol and pyrogallol and organotin latent catalyst selected from triphenyltin chloride, tribenzyltin chloride, tribenzyltin hydroxide and triphenyltin acetate; where the insulating resin is solventless and has a viscosity of from 10 centipoise to 450 centipoise at 25° C. for up to eight weeks, where the insulating resin can be used as an impregnating resin in slot portions (15) and 16 of an electrical coil (10), usually in combination with mica tape, in a motor (20) or a generator (30).

Abstract: Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as disecondary polyoxyalkylenediamines, and/or diprimary diamines, if desired with the addition of further 1,2-epoxide compounds and also hardeners, and use thereof as a coating for crack bridging, as an adhesive and in powder surface coatings.

Abstract: The invention relates to rubber blends containing said at least one solution-polymerized rubber containing hydroxyl groups, synthesized from diolefins and vinylaromatic monomers, wherein said at least one solution-polymerized rubber containing hydroxyl groups contain in the region of 0.1 to 5 wt. % of bonded hydroxyl groups, to a process for their preparation and to their use for the production of all kinds of moldings.

Abstract: Gas barrier coating compositions are provided which include a polyamine component, a polyepoxide component and a hydroxy-substituted aromatic compound that is present in an amount sufficient to provide a gas barrier coating having an oxygen permeability less than or equal to 75 percent of the oxygen permeability of the same composition without a hydroxy-substituted aromatic compound. Also provided is a multi-layer packaging material having at least one gas permeable packaging material layer and at least one gas barrier material layer formed from the gas barrier coating composition. Sealable containers are also provided.

Abstract: To a substrate such as brass is applied a powder coating comprising a) at least one non-crystalline epoxy resin, b) at least one crystalline epoxy resin such as tetramethylbisphenol diglycidyl ether in an amount sufficient to reduce or eliminate bubble entrapment within the cured coating when cured at a temperature of below about 350° F. (about 177° C.), and c) a curing agent such as dicyandiamide.

Abstract: A thermosetting resin system including an epoxy resin, a bismaleimide, a cyanate ester and a co-curing agent that is an aromatic moiety having unsaturated aliphatic groups and glycidyl ether groups is provided. Preferred co-curing agents are 2-allylphenyl glycidyl ether and 2,2′-diallylbisphenol A diglycidyl ether. The resin system can be employed as an encapsulant for electronic components and as dielectric layers with microvias on printed circuits.

Abstract: The invention is a sprayable coating having noise vibration and harshness reduction or absorption properties. Such composition comprises from about 10 to about 60 percent of the flexible epoxy resin, from about 5 to about 40 percent by weight of a rigid epoxy resin formulation, and a curing agent for the epoxy moieties of the two resins. In another embodiment, the invention is a method of coating a substrate to reduce the impact of noise vibration and harshness on the substrate or users of the substrate, which process comprises spraying the above defined composition on to a substrate and curing the resin on such substrate. In yet another embodiment the invention is a coated substrate described herein before having enhanced noise vibration and harshness properties.

Abstract: The present invention relates to an epoxy resin composition used for cap seal of a hard disc drive spindle motor, which hardly causes outgassing even when using in a hard disc for high-speed rotation and has high reliability. The composition comprises an epoxy resin having at least one glycidyl group in a molecule as a component (A), a monomer having at least one unsaturated bond group in a molecule (polyfunctional vinyl monomer or monofunctional vinyl monomer) as a component (B), an epoxy resin curing agent as a component (C), a photopolymerization initiator as a component (D), and a partially-esterified unsaturated epoxy resin wherein 10-90% of an epoxy equivalent of a bisphenol type epoxy resin is (meth)acrylated as a component (E).

Abstract: A UV curable composition comprising a UV curable epoxy-functional essentially solvent free reactant, and a UV curing agent, and a conductive filler, said conductive filler present at a selected concentration, particle size distribution and shape, wherein said composition, subsequent to cure, provides a deposited conductive film whose conductivity is controlled by said conductive filler concentration, particle size distribution and shape.

Abstract: The present invention provides a thermosetting organic solvent type coating capable of forming a cured coating film having a TUKON hardness at 20° C. of 15 or more and the minimum value of dynamic modulus E′ at a frequency of 110 Hz in the temperature range of 150-200° C., of 1×109 dyn/cm2 or more. The cured film formed from the coating, as compared with the cured films formed from conventional organic solvent type coatings used as a top coat for automobile (e.g. an organic solvent type coating containing, as main components, a hydroxyl group-containing acrylic resin and a melamine resin, or a carboxylic-epoxy type coating), is at least equivalent in weatherability, finish appearance, acid resistance, etc. and superior in stain resistance.

Abstract: An epoxy resin composition comprising (A) a bifunctional crystalline epoxy compound, (B) an amorphous trisphenolmethane type epoxy compound having three or more of epoxy groups in a molecule, and (C) an epoxy curing agent having phenolic hydroxyl groups. The resin composition has an excellent moldability (low viscosity and can be filled with filler with high density) and high softening point, and is used preferably as an encapsulating material for electronic device.

Abstract: The present invention is directed to polymerizable dental compositions containing a) 3 to 80 wt. % of cycloaliphatic epoxides; b) 0 to 80 wt. % of an epoxide or a mixture of epoxides which are different from a); c) 3 to 85 wt. % of a filer material; d) 0.01 to 25 wt. % of initiators, inhibitors and/or accelerators; e) 0 to 25 wt. % of auxiliary agents, the individual percentages of which are in relation to the total weight. The new polymerizable agents are particularly suited as dental material.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A thermosetting resin composition obtained by heat treating, under the specified conditions, a mixture of a polyaddition thermosetting resin, a silicic compound (oligomer) having a functional group capable of causing an addition reaction with a curing agent for the polyaddition thermosetting resin, and water, followed by adding of a curing agent for the polyaddition thermosetting resin is useful for producing thermosetting resin molded articles, resin encapsulated semiconductor devices, automobile parts, etc., which are high in heat resistance, small in change of elastic modulus at high temperatures, and resistant to crack and peeling.

Abstract: An epoxy resin containing group(s) of formula (1) and having a number average molecular weight of 400-10,000, an epoxy equivalent of 100-5,000 and an average number of glycidyl ether groups per molecule of 2-50 wherein A is a group (wherein R3 is a saturated aliphatic polyhydric alcohol residue having 2 to 30 carbon atoms, D is oxyalkylene group, a, b, c and d are 0-25, e and f are 0-4, e+f equals 0-4 and a+b+c×e+d×f equals 0-50), and B is (g, h are 0-18), etc. and R1 and R2 are H, glycidyl or a group of the formula wherein A and B are as defined above, and R7, R8 and R9 are H or glycidyl group; its preparation, and photo-curable and powder coating resin compositions containing the same.

Abstract: Disclosed in a halogen-free flame-retardant epoxy resin composition, comprising (A) a bisphenol A type epoxy resin, (B) a novolak type epoxy resin, (C) a phenolic resin type curing agent, (D) a curing accelerator, and (E) an inorganic filler. The phenolic resin type curing agent (C) is provided by a nitrogen-containing phenolic resin, preferably, by a co-condensation resin formed by the reaction among a phenolic compound, a guanamine compound, and an aldehyde compound. More desirably, a phenolic resin containing both phosphorus and nitrogen should be used as the curing agent (C). Further, a combination of the co-condensation resin noted above (C-1) and a reactive phosphoric acid ester can be used as a curing agent.

Abstract: The present invention relates to thermosetting resin compositions comprising (a) a first vinyl ester resin synthesized from the diglycidyl ether of bisphenol A, bisphenol A and glacial methacrylic acid, in from about 1% to about 95% by weight of the total composition; (b) a resin selected from the group consisting of (1) a second different vinyl ester synthesized from the diglycidyl ether of bisphenol A with glacial methacrylic acid, and (2) an unsaturated polyester, in from about 1% to about 69% by weight of the total composition; and electrical laminates made therefrom which further comprise a catalyst in from about 0.1% to about 2% by weight of the total composition and which may or may not be clad with an electrical conductive layer on at least one side; and a method of producing these.

Abstract: There is provided a curing agent composition, a method for making a curing agent composition, two component curable epoxy resin compositions, methods of their manufacture, and the different cured products thereof. The curing agent comprises the reaction product of a a) phenolic acid substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom; b) a polyepoxide compound; c) a polyamine compound having at least two primary amine groups; and d) a monoglycidyl capping agent. The curing agents contain secondary amine groups, yet are reactive enough to cure epoxy resins without the necessity for external catalysts/accelerators, at a wide range of curing temperatures and are immediately compatible with a standard diglycidyl ether of Bisphenol-A epoxy resins.

Abstract: An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

Abstract: There is provided a surfactant composition, a stable, self emulsifiable water borne curing agent composition, and methods for the manufacture of each, and two component water borne curable epoxy resin compositions. The surfactant composition comprises the reaction product of an a) a phenolic acid substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom; b) a polyepoxide compound; c) a polyamine compound having at least two primary amine groups; d) a reactive surfactant; and optionally e) a monoglycidyl, monocarboxylic acid, or monoisocyanate capping agent; wherein the reactive surfactant comprises an epoxide, a carboxylic acid or anhydrides thereof, or an isocyanate functional moeity, and a hydrophilic moiety comprising a polyoxyalkylene monool or polyol residue.

Abstract: A one-component epoxy resin for coverage of bare chips and for underfilling of flip chips is disclosed. Two polyol components are combined in the inventive epoxy resin which decidedly improve the properties of the resin with respect to coefficient of expansion, shrinkage stress, substrate adhesion, and reactivity.

Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates, while the powders from which the coatings are made still exhibit good storage stability and melt-processability.

Abstract: An epoxy resin composition according to the present invention is one initiating cationic polymerization upon irradiation with energy rays. The epoxy resin composition is formed of at least bisphenol epoxy resin (A) as an active ingredient, epoxy resin (B) shown in the following formula and cationic polymerization catalyst (C).

Abstract: Epoxy resins which are obtainable by a process in which, first of all(a) by reacting(A1) at least one substance selected from the substances of the formula (I) and of the formula (II): ##STR1## in which Alc is the radical of a diol which has been freed fromI ts hydroxyl groups and comprises 2 to 20 carbon atoms,Ac is the radical of a dicarboxylic acid which has been freed from its carboxyl groups and comprises 2 to 20 carbon atoms,[Ph] is the radical of a difunctional phenolic compound which has been freed from its phenolic hydroxyl groups and has 6 to 20 carbon atoms, andc is a number greater than 1 but not more than 2, with(A2) at least one liquid diglycidyl ether based on a first bisphenol compound in an amount chosen so that there are more than two equivalents of glycidyl groups of component (A2) for a total of one equivalent of carboxyl and phenolic hydroxyl groups of component (A1),a pre-advanced diglycidyl ether resin is formed in dispersion in the liquid diglycidyl ether of which there is at least one

Abstract: Proposed is a thermosetting powder coating composition comprising a mixture of particles reactive towards one another and a catalyst, with a portion of the reactive particles comprising a polymer reacting with epoxy to form ester forming or ether forming groups, while another portion comprises an at least bifunctional cross-linking agent which contains 2-oxo-1,3-dioxolan-4-yl groups, hereinafter referred to as cyclocarbonate groups, and, optionally, epoxy groups, with both the polymer reacting with epoxy to form ester forming and/or ether forming groups and the cross-linking agent being obtained by means of a non-vinylic addition and/or polymerization process. The catalyst used as ring opener for the cyclocarbonate groups is present in a quantity of 0.01 to 10, preferably 0.1 to 5, parts by weight per 100 parts by weight of the mixture of particles reactive towards one another. The quantity of epoxy oxygen present in the cross-linking agent after CO.sub.2 unblocking preferably is at least 0.4 wt. %.

Abstract: An epoxy resin which is useful as adhesives, resins for coatings, encapsulants, resins for a lamination board, casting materials, molding compounds, and electric insulators, and which can provide a cured resin having excellent heat resistance and moisture resistance is provided which comprises (A) an epoxy resin containing a trisepoxy compound represented by general formula (I), and (B) a curing agent for an epoxy resin, ##STR1## wherein R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from general formula (II) ##STR2## wherein R.sub.2 and R.sub.3 are an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.

Abstract: An epoxy resin composition which can be crushed at an ordinary temperature and which comprises respective components described below,(a) 10 to 80 parts by weight of a 4,4'-biphenol type epoxy resin which is crystalline at an ordinary temperature,(b) 20 to 90 parts by weight of a noncrystalline epoxy resin having a softening point of 35.degree. C. to 55.degree. C.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: Copolymer compositions are provided, including those which undergo less than .+-.1.0% bulk polymerization shrinkage and are useful as strain-free composites, high-strength adhesives, and precision castings. The copolymer compositions are formed from the cationic initiated polymerization of alicyclic spiroorthocarbonate monomers and epoxy resin monomers or comonomers. A preferred spiroorthocarbonate monomer is 2,3,8,9-di(tetramethylene)-1,5,7,11-tetraoxaspiro-[5,5]undecane. A preferred epoxy resin is a three component epoxy comonomer mixture of (i) diglycidyl ether of bisphenol A, (ii) 3,4-epoxycyclohexanemethyl-3,4-epoxycyclohexane carboxylate, and (iii) vinyl cyclohexene dioxide, preferably in a ratio of 5:4:1 by weight.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: An indicator for complete polymerization and cure of base-catalyzed epoxy thermoset resin systems is disclosed. In particular, the present invention makes use of an diazo dye having amino groups which forms a salt or complex with hardeners used in various epoxy resin systems. Upon full polymerization and consumption of the hardener, a chromophoric shift of the dye can be observed.

Abstract: A reactive hot melt adhesive contains, as resin component, a reaction product ofa) 30 to 50 wt-% of an epoxy resin, solid at root temperature, prepared from bisphenol A and/or bisphenol F and epichlorhydrin with an epoxide equivalent weight of 400 to 700,b) 10 to 25 wt-% of an epoxy resin, liquid at room temperature, prepared from bisphenol A and/or bisphenol F and epichlorhydrin with an epoxide equivalent weight of 150 to 220 andc) 35 to 50 wt-% amino-terminated polyethylene and/or polypropylene glycols.

Abstract: The present invention provides a thermosetting organic solvent type coating capable of forming a cured coating film having a TUKON hardness at 20.degree. C. of 15 or more and the minimum value of dynamic modulus E' at a frequency of 110 Hz in the temperature range of 150-200.degree. C., of 1.times.1O.sup.9 dyn/cm.sup.2 or more. The cured film formed from the coating, as compared with the cured films formed from conventional organic solvent type coatings used as a top coat for automobile (e.g. an organic solvent type coating containing, as main components, a hydroxyl group-containing acrylic resin and a melamine resin, or a carboxylic-epoxy type coating), is at least equivalent in weatherability, finish appearance, acid resistance, etc. and superior in stain resistance.