Abstract: A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins; and/or hydroxy- or carboxyl-functional fluoropolymers, fluorochloropolymers or fluoroacrylic polymers blended with a at least one poly(phenylene ether) and at least one curing agent for the thermosetting resin.

Abstract: In a liquid epoxy resin composition comprising a liquid epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the liquid epoxy resin is a mixture of (a) a liquid epoxy resin containing two or less epoxy functional groups and (b) a solid epoxy resin containing two or more epoxy functional groups in a weight ratio (a)/(b) of from 9/1 to 1/4, having a viscosity of up to 10,000 poises at 25° C. as measured by an E type viscometer. The composition is adherent to silicon chips, the cured product is highly resistant to humidity and thermal shocks, and the composition is useful as sealant for semiconductor devices.

Abstract: The invention relates to polymerizable preparations which contain: (a) 3 to 80 wt. % of an epoxy or of a mixture of epoxies of general formula (I), whereby n and m, independent of one another, represent 0, 1, 2 or 3, and n+m ranges from 2 to 6, and whereby the molar mass of the epoxy or the average molar mass of the mixture of epoxies ranges from 250 to 1000 g/mol; (b) 0 to 80 wt. % of an epoxy or of a mixture of epoxies that differ from (a); (c) 3 to 85 wt. % of fillers; (d) 0.001 to 25 wt. % of initiators, retarders and/or accelerators, and; (e) 0 to 25 wt. % of auxiliary agents, whereby the specified percentages refer to the total weight of the preparation.

Abstract: The present invention provides a resin composition for coating, capable of forming a coating film excellent in electrodeposition property, coating surface smoothness and anticorrosivity in spite of small content of organic solvent and without containing a lead compound, and comprising a modified epoxy-polyamine resin (f), obtained by first reacting a diepoxide compound (a), wherein a specified amount of alkylene oxide has been introduced, and a bisphenol A type epoxy resin of an epoxy equivalent 170-500 with a bisphenol (b), reacting the epoxy resin (c) thus obtained with a cyclic ester (d), and further reacting the modified epoxy resin (e) thus obtained with an amine compound having active hydrogen.

Abstract: The present invention provides a resin composition for coating, capable of forming a coating film excellent in electrodeposition property, coating surface smoothness and anticorrosivity in spite of small content of organic solvent and without containing a lead compound, and comprising a modified epoxy-polyamine resin (f), obtained by first reacting a diepoxide compound (a), wherein a specified amount of alkylene oxide has been introduced, and a bisphenol A type epoxy resin of an epoxy equivalent 170-500 with a bisphenol (b), reacting the epoxy resin (c) thus obtained with a cyclic ester (d), and further reacting the modified epoxy resin (e) thus obtained with an amine compound having active hydrogen.

Abstract: An adhesive composition for bonding optical parts comprising (A) 3 to 60 wt % of an epoxysilane or a hydrolysis/polycondensation product thereof, (B) 5 to 90 wt % of a bisphenol type epoxy resin having a viscosity of 2,000 to 5,000 mPa·s, (C) 5 to 35 wt % of a novolak type epoxy resin, 3 to 30 wt % of a curing agent which is an amine, and water and an alcohol in an amount of 0 to 0.75 time the total number of mols of the hydrolyzable groups or atoms of the epoxysilane. This composition has excellent moisture resistance and heat resistance, suppresses the formation of bubbles during curing, is free from such a defect as opaqueness caused by bubbles and can be used for the assembly and bonding of optical parts.

Abstract: A self-crosslinking powder coating material, comprising (A) up to 50% by weight, based on the powder coating material, of a mixture of (A1) at least one epoxy resin with an epoxy equivalent weight (EEW) <800 g, (A2) at least one epoxy resin with an epoxy equivalent weight (EEW) of from 800 to 1500 g, and (A3) at least one epoxy resin with an epoxy equivalent weight (EEW) >1500 g, and (B) at least 50% by weight, based on the powder coating material, of at least one filler; and its use to coat shaped parts, especially engine blocks, which after coating are shaped by machining.

Abstract: Flexible epoxy-based adhesive compositions which remain Theologically stable at room temperature in an uncured state comprise: (a) at least one flexible polyepoxide resin having a hardness not exceeding a durometer Shore D reading of 45 when cured with a stoichiometric amount of diethylene triamine (“DETA”); and (b) a substantially stoichiometric amount of at least one latent epoxy resin curing agent. Optionally, the adhesive composition may also incorporate one or more semi-flexible resins. Other optional components include fillers, thixotropic agents, and flexibilizers. The adhesive composition provicdes an epoxy-based adhesive composition that is storable for weeks as a single component mixture at room temperature, curable at temperatures ranging from about 100° C. to 125° C. in less than two hours, and flexible upon curing to temperatures as low as minus 50° C., exhibiting a durometer Shore A of less than about 95.

Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.

Abstract: A resin composition is provided comprising a silicone-modified epoxy or phenolic resin obtained by reacting an epoxy or phenolic resin having specific structural units with an organopolysiloxane. The modified epoxy or phenolic resin is such that after the modified epoxy or phenolic resin is cured alone or together with another epoxy resin and/or phenolic resin to form a cured product, the organopolysiloxane component does not form a phase separation structure in the cured product. The composition cures into a product having both the adherence, heat resistance and humidity resistance characteristic of epoxy or phenolic resins and the flexibility and impact resistance characteristic of silicone resins.

Abstract: Binders for aqueous corrosion protection systems, comprising products A′ABC of reaction of epoxy resins, fatty acids, and amines, having a number average molar mass Mn of at least 5000 g/mol, obtained by reacting epoxide compounds A′ containing at least two epoxide groups per molecule and reaction products ABC of epoxide compounds A, fatty acids B, and amines C, wherein, where appropriate, the epoxide compounds A′ and/or the epoxide compounds A have been modified prior to further reaction, in whole or in part, by reaction with compounds D containing at least one acid group or hydroxyl group reactive toward epoxide groups, and wherein, where appropriate, the amines C have been modified prior to further reaction, in whole or in part, by reaction with aliphatic or aromatic monoepoxide compounds A″ or mixtures thereof.

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: Anti-reflective compositions and methods of using those compositions with low dielectric constant materials are provided. In one embodiment, the compositions include polymers comprising recurring monomers having unreacted epoxide groups. In another embodiment, the polymers further comprise recurring monomers comprising epoxide rings reacted with a light attenuating compound so as to open the ring. The compositions can be applied to dielectric layers so as to minimize or prevent reflection during the dual damascene process while simultaneously blocking via or photoresist poisoning which commonly occurs when organic anti-reflective coatings are applied to low dielectric constant layers.

Abstract: PEG and related polymer derivatives having weak, hydrolytically unstable linkages near the reactive end of the polymer are provided for conjugation to drugs, including proteins, enzymes, small molecules, and others. These derivatives provide a sufficient circulation period for a drug-PEG conjugate and then for hydrolytic breakdown of the conjugate and release of the bound molecule. In some cases, drugs that previously had reduced activity when permanently coupled to PEG can have therapeutically suitable activity when coupled to a degradable PEG in accordance with the invention. The PEG of the invention can be used to impart water solubility, size, slow rate of kidney clearance, and reduced immunogenicity to the conjugate. Controlled hydrolytic release of the bound molecule in the aqueous environment can then enhance the drug delivery system.

Abstract: Provided are low temperature curing thermosetting epoxy powder coating compositions comprising at least one non-crystalline epoxy resin, at least one crystalline epoxy resin, a curing agent, and a cure catalyst. Coatings made from such powder compositions exhibit a substantial reduction in bubble entrapment, enough to prevent a visible haze from forming in the coating, when cured at low temperatures demanded by brass substrates.

Abstract: A process of forming vias in a composition comprising (a) applying a layer of a composition containing (i) a cyanate ester, (ii) a bismaleimide, (iii) a co-curing agent having the structure R1—Ar—R2 wherein Ar is at least one aryl moiety, R1 is at least one unsaturated aliphatic moiety and R2 is at least one glycidyl moiety, (iv) an epoxy resin and, optionally, (v) a free-radical initiator; (b) covering the layer with a mask having windows through which radiation can be transmitted; (c) exposing part of the composition to radiation to at least partially cure it in the exposed areas; (d) removing the non-cured portions of the composition; and (e) completing the cure of the resin compositions.

Abstract: The invention relates to a one-component epoxy resin adhesive which is elasticated with silicone rubber and whose open joint time is adaptable to whichever production process it is being used in by the concentration of UV initiator and/or the duration and/or intensity of UV activation and which is therefore particularly suitable for automatable manufacturing processes, since the workpieces after initial fixing require no additional mounts even during thermal aftercuring. This adhesive is preferentially suitable for the extensive adhesive bonding of permanent magnets, such as in the assembly of a permasyn motor, for example.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: This invention concerns low viscosity aldimine and ketimine reactive diluents having multi-imine functionality, which are useful in automotive refinish coating compositions, including a process for making them and the coatings that contain them.

Abstract: An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a curing agent and (c) 1 to 100 parts by weight of a modified epoxy resin, is suitable as an underfill sealing agent, is capable of heat-curing in a short time with a good productivity, is capable of surely connecting a semiconductor device such as a CSP and a BGA on a wiring board without giving an adverse effect on each part disposed on the wiring board by heat-curing at a relatively low temperature, has excellent heat shock property (temperature cycling property) and impact resistance, is free from bleeding of contaminants from its cured product, and is capable of easily detaching the CSP or BGA from the wiring board in the case where a defect is found, making it possible to reuse a normal wiring board or semiconductor device.

Abstract: An improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of a difunctional epoxy resin. The photosensitive cationically polymerizable epoxy based system is especially useful as a solder mask and does not contain bromine.

Abstract: Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed.

Abstract: The present invention is directed to an adhesive composition, which comprises an epoxy resin, a coupling agent, filler, and an effective amount of an amine-curing agent or curative for said epoxy resin. Advantageously, tri-functional and/or tetrafunctional epoxy resins and/or acrylate monomers will be incorporated into the adhesive composition in order to reduce open time and enhance substrate adhesion. Advantageously, a mixture of amines will be used in the curative including aliphatic amines, which have low viscosities and efficiently wet the substrate for enhancing adhesion; polyamines, which can be used to manipulate open time and allow for improved ratio tolerance of the adhesive system; and amine-terminated rubbers (ATBN), which can improve impact resistance and the toughness of the cured adhesive. Preferred coupling agents are silanes.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: Pigment pastes suitable for the production of cathodically depositable electrodeposition lacquers (CEC) obtainable by dispersion of pigments and/or fillers in an aqueous paste resin containing tertiary-bonded amino nitrogen, whereby epoxy compounds and, if not already present, acid are added to the aqueous paste resin in the presence of pigments and/or fillers, process for their production and CEC coating compounds containing the same.

Abstract: A pultrusion resin composition comprising about 75 wt % to about 85 wt % of a phenolic resin, about 9 wt % to about 20 wt % of the reaction product of a polyhydroxy compound and an epoxy-functional polysiloxane, about 6 wt % to about 15 wt %, of a phenolic epoxy, and about 0.2 wt % to about 1 wt % of a catalyst, based on total weight of the composition. Pultruded products are formed by drawing fibrous reinforcement through a bath of the pultrusion resin composition.

Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.

Abstract: A process for impregnating an electrical coil which comprises a winding comprising two or more layers consisting of more than one turn of an electrically conducting wire-form material with a polymer material which electrically insulates the individual turns of the wire-form material from one another with the aid of a thermally curable epoxy resin composition, which composition is solid at room temperature and comprises the following constituents: (a) an epoxy resin which is solid at room temperature, selected from (a1) polyglycidyl ethers based on novolaks; (a2) diglycidyl ethers based on bisphenols, and (a3) mixtures of more than one of components (a1) and (a2); (b) a crosslinking agent for component (a); (c) a suitable accelerator for the reaction of component (a) and component (b); (d) from 15 to 70 percent by weight, based on the overall weight of the composition, of filler selected from (d1) calcium carbonate, (d2) quartz flour, (d3) wollastonite whose particles have an average ratio of length

Abstract: A photothermosetting composition is described which contains a base resin (A), a photopolymerizable photomonomer or photooligomer (B), a photoinitiator (C), an epoxide compound containing at least two epoxy groups (D), and an organic solvent. The base resin (A) an epoxide compound (a) containing at least two epoxy groups, an unsaturated monobasic acid (b), a saturated or unsaturated dibasic acid (c), and a saturated or unsaturated acid anhydride (d) according to the ratio of (a)/(b)/(c) of 1:0.90˜0.95:0.025˜0.050 and the acid value of the base resin is in the range of 40˜49 mg KOH/g. This photothermosetting component was coating on the substrate, and then dried by baking, exposed by light, developed, irradiated by ultraviolet light or heated, and cured to form a solder mask.

Abstract: In the present invention an adhesive composition is provided. The adhesive composition includes epoxidized cashew nutshell liquid, a catalyst, and diglycidyl ether of bisphenol A. The invention may further include at least one additive selected from the group including curing agents, bonding enhancers, hardeners, flexibilizers, tackifiers, and mixtures thereof.

Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises (A)2 thermosetting resin such as epoxy resin and a curing agent, and (B)2 compound containing one functional group which can react with thermosetting resin (A) or its curing agent, and a moiety selected from the following formulae (1) to (4) Furthermore, the present invention also relates to a prepreg formed by impregnating reinforcing fiber with the aforesaid resin composition and to carbon fiber reinforced composite materials comprising reinforcing fiber and a cured aforesaid thermosetting resin composition.

Abstract: A mixture of a self-curing epoxy resin having an equivalent weight of from about 100 to about 700, a melt viscosity of from about 200 to about 2000 centipoise at 150° C. and a low temperature curing agent is extruded as one component at a temperature below 220° F. and the extrudate is cooled and pulverized to form a low temperature curable coating powder. The powder cures at a temperature of from about 225 to about 300° F. and produces a coating having a smooth surface with either a low or high gloss. The powder is particulary useful for coating heat-sensitive substrates such as plastics, paper, cardboard and wood.

Abstract: The present invention provides a resin composition for coating, capable of forming a coating film excellent in electrodeposition property, coating surface smoothness and anticorrosivity in spite of small content of organic solvent and without containing a lead compound, and comprising a modified epoxy-polyamine resin (f), obtained by first reacting a diepoxide compound (a), wherein a specified amount of alkylene oxide has been introduced, and a bisphenol A type epoxy resin of an epoxy equivalent 170-500 with a bisphenol (b), reacting the epoxy resin (c) thus obtained with a cyclic ester (d), and further reacting the modified epoxy resin (e) thus obtained with an amine compound having active hydrogen.

Abstract: The present invention discloses a continuous process and the associated system for upstaging liquid epoxy resins to produce resins with higher molecular weight. The process comprises passing continuously (i) a liquid epoxy resin having a first molecular weight, (ii) a catalyst and (iii) a compound having at least one active hydrogen or reactive functional group capable of reacting with the liquid epoxy resin in the presence of the catalyst, flow through one or more reaction chambers and under conditions effective to produce a stream comprising an upstaged epoxy resin product having a second molecular weight. The second molecular weight is higher than the first molecular weight.

Abstract: Hardeners for epoxy resins are disclosed which have the capability of curing at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. These novel hardeners include a range of reactivity which results in a range of pot lives from minutes to months. These materials co-cure readily with polyamines and have little or no amine odor. Mixture viscosity can be controlled over a wide range independent of filler concentration which allows a broad range of applications from coating and casting to adhesives. Class I hardeners contain a mixture of polyols, polyamines and tertiary amines and cure at temperatures between 20-50° C., while class II hardeners have the same polyols mixed with one or more tertiary amines and cure between 65-100° C. Class III hardeners contain the same polyols combined with either imadazole or dicyandiamide, and optionally, a tertiary amine and cure at 120° C.

Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: Compositions having high moisture resistance and flexibility comprise an organic component and a filler. The organic component comprises a long-chain cycloaliphatic epoxy resin, a short-chain cycloaliphatic epoxy resin, a cyanate ester, and a Lewis acid catalyst. Preferably the organic component further comprises a Bronsted acid co-catalyst and/or a flexibilizing modifier. The compositions are useful in various semiconductor applications, including as die attach adhesives, underfills, encapsulants, via fills, prepreg binders, polymer solder masks and polymer bumps on flip chip or BGA assemblies.

Abstract: According to the present invention, an improved photoimagable cationically polymerizable epoxy based solder mask is provided that contains a non-brominated epoxy resin system and from about 0.1 to about 15 parts, by weight per 100 parts of resin system, of a cationic photoinitiator. The non-brominated epoxy-resin system has solids that are comprised of from about 10% to about 80% by weight, of a polyol resin having epoxy functionality; from about 0% to about 90% by weight of a polyepoxy resin; and from about 25% to about 85% by weight of an difunctional epoxy resin. Since the photosensitive cationically polymerizable epoxy based solder mask does not contain bromine, it is particularly advantageous halogens in waste processing chemicals or in incinerated scrap circuit boards are regulated by environmental concerns. The photosensitive cationically polymerizable non-brominated epoxy based solder mask has a glass transition temperature greater than about 100° C., preferably greater than about 110° C.

Abstract: The present invention provides a resin composition for coating, capable of forming a coating film excellent in electrodeposition property, coating surface smoothness and anticorrosivity in spite of small content of organic solvent and without containing a lead compound, and comprising a modified epoxy-polyamine resin (i), obtained by first reacting a diepoxide compound (a), wherein a specified amount of alkylene oxide has been introduced, and a bisphenol A type epoxy resin of an epoxy equivalent 170-500 with a bisphenol (b), reacting the epoxy resin (c) thus obtained with a cyclic ester (d), and further reacting the modified epoxy resin (e) thus obtained with an amine compound having active hydrogen.

Abstract: An assembly and method for connecting two substrates utilizes a nonconductive laminant that is compatible when wet with a conductive paste when wet. Thus, the curing of the nonconductive laminant and the conductive paste may be performed together. The nonconductive laminant also cures in a shorter time than those previously available, thus the stress on the semiconductor device created by exposure to the cure temperature is additionally reduced.

Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.

Abstract: A composition comprising an epoxy resin and a ketimine compound, wherein the epoxy resin is either (1) an epoxy resin having a content of an epoxy resin having no hydroxyl group in the molecule in a range of more than 90 mol % to 100 mol % or less, (2) an epoxy resin wherein hydroxyl groups are capped with an isocyanate group-containing compound, (3) an epoxy resin wherein hydroxyl groups are capped with an alkoxysilyl group-containing compound, or (4) an epoxy resin containing an alkoxysilyl group-containing compound which is capable of capping hydroxyl groups of the epoxy resin. When either of the those epoxy resins is used and also the ketimine compound having high steric hindrance is used, a one-pack epoxy resin composition having good curing property and particularly excellent storage stability can be provided.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.

Abstract: A current limiting PTC device (10) has two electrodes (14) with a thin film of electric conducting polymer material (20) disposed between the electrodes, the polymer material (20) having superior flexibility and short circuit performance, where the polymer material contains short chain aliphatic diepoxide, conductive filler particles, curing agent, and, preferably, a minor amount of bisphenol A epoxy resin.

Abstract: A curable composition comprises a compound having at least one epoxy group and at least one styrenic or cinnamyl group per molecule.

Abstract: An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin, a phenolic resin, a hardening accelerator and an inorganic filler. The epoxy resin composition having the following properties (X) to (Z) does not cause the chip tilting attributable to resin flow during resin encapsulation, such as semiconductor element shifting or gold wire deformation, and can obtain highly reliable semiconductor devices: (X) the viscosity thereof as measured with a flow tester at 175° C. is from 50 to 500 P; (Y) the minimum melt viscosity thereof as determined from the temperature dependence of viscosity thereof as measured with a dynamic viscoelastic meter at a shear rate of 5 (1/s) is 1×105 poise or lower; and (Z) the ratio of the viscosity thereof as measured at 90° C. (Z1) to that as measured at 110° C. (Z2) both with a dynamic viscoelastic meter at a shear rate of 5 (1/s), (Z1/Z2), is 2.0 or higher.