Abstract: The present invention provides an inspection method for a pixel array and an inspection apparatus thereof. The inspection method firstly charges a sample pixel area containing a flawed pixel unit and normal pixel units with different testing voltages, then creates a lookup table of brightness threshold value according to the brightness values of the pixel units under those testing voltages ; and then charges a pixel area under test when inspecting the pixel area under test, selects a suitable brightness threshold value from the lookup table according to the current voltage value and the brightness value thereof, and then determines if pixel units of the pixel area under test have any defect according to the brightness threshold value. Therefore, the present invention reduces defect-identifying error and enhances inspection accuracy.

Abstract: A method and system for incorporating electronic signature analysis in a low voltage power supply to centrally monitor current consumption is disclosed. The electrical loads powered by the low voltage power supply can be tested individually via an automatic test routine by measuring and scaling of current through a differential amplifier. The current consumption of each electrical load can be measured by analyzing a “delta” in the current draw of each electrical load's ON and OFF condition. This value can be compared against a stored table of high and low limits for each electrical load. If a load's current is outside the limits, it will be logged for repairs. A current sensing device can be inserted in series with the output(s) of the low voltage power supply, while in test mode, to allow the automatic test routine to run, and then be shorted out for normal operation.

Abstract: A method of analyzing integrated circuit (IC) product yield can include storing, within a memory of a system comprising a processor, parametric data from a manufacturing process of an IC and determining a measure of non-random variation for at least one parameter of the parametric data using a pattern detection technique. The processor can compare the measure of non-random variation to a randomness criteria and selectively output a notification indicating that variation in the parameter is non-random according to the comparison of the measure of non-random variation to the randomness criteria.

Abstract: A process monitoring method for a joining operation of a joining element at a speed of at least 5 m/s, in particular placing a bolt at least 10 m/s into at least one component with the aid of a placing device which has the following features: A plunger for placing the joining element, a buffer which limits a maximum deflection of the plunger in the joining direction, and a distance measurement with which the deflection of the plunger can be detected, wherein the process monitoring comprises the following steps: Detecting the travel of the plunger during the joining operation as a function of time in the form of a distance-time curve, detecting a placement of the plunger on the buffer, evaluating the distance-time curve such that, in the presence of at least one maximum followed by at least one minimum in the distance-time curve and without the plunger contacting the buffer, a joint connection is judged to be OK.

Abstract: The present invention discloses a system for testing illuminating elements and a method for testing illuminating elements, wherein the method includes the following steps. Firstly, an illuminating element and an unilluminated area on a circuit board are covered respectively. A reference voltage is obtained according to a brightness of the unilluminated area and a testing voltage is obtained according to a brightness of the illuminating element being driven. Afterwards, whether the illuminating element passes a testing process or not is judged from the reference voltage and the testing voltage.

Abstract: The present invention is a method and system for detecting an abnormal on-line analysis or laboratory measurement and for predicting an abnormal quality excursion due to an abnormal process condition.

Abstract: A method involves, via a sensor application interface, 1) receiving, from an application, a measurement request associated with a quality-of-service control; 2) in accord with the quality-of-service control, obtaining measurement data from a sensor; and 3) returning to the application i) the measurement data obtained from the sensor, and ii) an indicator of accuracy of the measurement data.

Abstract: In a method for measurement of flatness of objects on a measuring machine, at least two objects are fixed on a worktable of the measuring machine. The method establishes a first coordinate system for the worktable location, sets two groups of horizontal scanning points for each object, and sets two groups of vertical scanning points for each object. By controlling at least two laser heads of the measuring machine, the objects are measured and coordinate values for each of the points scanned are obtained. The method calibrates a first coordinate system and establishes a second coordinate system based on the first coordinate system. In the second coordinate system, the at least two laser heads measure the objects and obtain data, and an indication of the flatness of each object is calculated and displayed on a display device.

Abstract: Provided is a sampling apparatus that samples a signal under measurement, including a sample processing section that outputs sample data obtained by sampling the signal under measurement with a sampling timing at non-uniform intervals obtained by thinning a reference clock, a storage section that stores the sample data, and a waveform generating section that generates a waveform of the signal under measurement based on the sample data read from the storage section. The sample processing section includes a sampler that samples the signal under measurement in synchronization with the reference clock and a data thinning section that thins the sample data output by the sampler and outputs this thinned data as sample data with the sampling timing at non-uniform intervals.

Abstract: A management apparatus includes: a managing unit that manages production information corresponding to each of a plurality of information processing devices; a specifying unit that specifies, based on a defect notice for at least one component and the production information on the managed information processing devices, at least one of the information processing devices using the component; a state judging unit that judges whether each information processing device is in an operable state where a processing function of each information processing device is operable in an environment in which the processing function of each information processing device is provided; and an operation restricting unit that performs operation restriction for the processing function of each information processing device according to the defect notice if the state judging unit judges that each information processing device is in the operable state.

Abstract: A method includes passing a lot through a production process and evaluating a statistical quality of the production process. Additionally, the method includes calculating an advanced process control (APC) recipe parameter adjustment (RPA) distribution value and determining if sampling is indicated. Furthermore, the method includes, if sampling is indicated, performing a measurement process of the lot.

Abstract: Methods, systems, and computer-readable media provide for facility integrity testing. According to embodiments, a method for populating a watch list with circuits of a communications network to be monitored for repeat failures is provided. According to the method, a trouble ticket associated with one of the circuits and a trouble code and analysis code (TC/AC) combination associated with the trouble ticket is retrieved. Whether the trouble ticket meets a watch list criterion is determined. In response to determining that the trouble ticket meets the watch list criterion, the trouble ticket and the TC/AC combination are added to the watch list.

Abstract: An information processing device stores an extracted feature of each inspection item of the process inspection, and a determination result of a final inspection in a memory device, calculates a separation degree between a distribution of features of products which were determined as good products at the final inspection and a distribution of features of products which were determined as defective products at the final inspection for every inspection item or every combination of inspection items based on data of the products stored in the memory device, selects an inspection item whose inspection standard is to be reset from the inspection items or the combinations of the inspection items based on a value of the separation degree. Thus providing a method of appropriately setting an inspection standard for detecting a defect sign during process inspection. Further a process inspection device and inspection standard setting device which implements the same.

Abstract: System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing an inter-metal (“IM”) WAT on a plurality of processed wafer lots; selecting a subset of the plurality of wafer lots using a lot sampling process; and selecting a sample wafer group using the wafer lot subset, wherein IM WAT is performed on wafers of the sample wafer group to obtain IM WAT data therefore. The method further comprises estimating final WAT data for all wafers in the processed wafer lots from IM WAT data obtained for the sample wafer group and providing the estimated final WAT data to a WAT APC process for controlling processes.

Abstract: A process for determining a root cause problem for an out-of-tolerance component manufactured by a plurality of operations performed on the component. The process can include providing manufacturing data from at least a subset of plurality of operations performed on a plurality of components and discovering an out-of-tolerance measurement on at least a subset of the plurality of manufactured components downstream from the plurality of operations. An auto-regression analysis between the out-of-tolerance measurement and the plurality of upstream operations can also be performed using the manufacturing data. A correlation between at least one of the upstream operations and the out-of-tolerance measurement can be found and the correlation can result in the identification of at least one upstream operation that is the root cause of the out-of-tolerance measurement.

Abstract: Various embodiments relating to resonance inspections and in-service parts are disclosed. One protocol (150) includes conducting a resonance inspection of an in-service part (152). The frequency response of the in-service part may be compared with a resonance standard (154) for purposes of determining whether or not the in-service part is changing abnormally (156). An in-service part that is identified as changing abnormally may be characterized as being “rejected” (160). An in-service part that is no identified as changing abnormally may be characterized as being “accepted” (158).

Abstract: Measuring apparatus and method for monitoring fabrication of a semiconductor wafer by exciting and measuring vibrations of the wafer substrate. A measurable parameter of vibration (e.g. frequency) is indicative of mass of a vibrating region. Mass change caused by wafer treatment is reflected in changes in vibration measurements taken before and after that treatment. The apparatus includes a wafer support e.g. projecting ledge (19), a vibration exciting device e.g. contact probe (28) or pressure differential applicator, and a measurement device e.g. frequency sensor (62).

Abstract: Data analysis systems and related methods. An implementation of a method of determining a relationship between a variable of interest and one or more process variables represented by a corresponding plurality of tags may include accessing a data historian including historical data including a variable of interest and a plurality of tags. The method may include defining a plurality of bins, retrieving historical data corresponding with the plurality of bins using the data historian, filtering the historical data for each of the plurality of bins using one or more filters to produce filtered historical data, generating an output display using the filtered historical data for the variable of interest and each of the plurality of tags, and determining which of the plurality of tags correlate with the variable of interest using the output display. The output display may include an overlay CUSUM chart and a correlation plot.

Abstract: A method of brokering information in a manufacturing system which includes a broker coupled between a supplier of information and a consumer of information. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format.

Abstract: The invention relates to improved methods for the production of patient-specific medical devices such as patient-specific (surgical) guides, orthoses and prostheses based on unique patient-specific identifiers.

Abstract: Various methods and systems for creating or performing a dynamic sampling scheme for a process during which measurements are performed on wafers are provided. One method for creating a dynamic sampling scheme for a process during which measurements are performed on wafers includes performing the measurements on all of the wafers in at least one lot at all measurement spots on the wafers. The method also includes determining an optimal sampling scheme, an enhanced sampling scheme, a reduced sampling scheme, and thresholds for the dynamic sampling scheme for the process based on results of the measurements. The thresholds correspond to values of the measurements at which the optimal sampling scheme, the enhanced sampling scheme, and the reduced sampling scheme are to be used for the process.

Abstract: A wafer test apparatus, comprises: a storage unit that stores a first test program including a plurality of first operation test programs and a second test program including a plurality of second operation test programs; and a calculation unit that executes the first test program on at least one of wafers in a lot and outputs accumulated information about a defective memory cell(s) included in the wafer to the outside thereof when each operation test of the plurality of first operation tests is completed, and executes the second test program on remaining wafers in the lot and outputs accumulated information about a defective memory cell(s) included in the wafer to the outside thereof when all the operation tests in the plurality of second operation tests are completed.

Abstract: A computerized method for categorizing defects on a substrate. A list of defects on the substrate is received as input to a processor, where each defect is represented by a defect location and an associated micro-defect code. The input is analyzed with the processor to detect spatial clusters of defects on the substrate. The spatial clusters are analyzed with the processor to determine which of the spatial clusters represent known macro-defects and which of the spatial clusters represent unknown macro-defects. The micro-defect code associated with each defect that is included in one of the spatial clusters that is determined to be a known macro-defect is changed with the processor with a macro-defect code that is associated solely with the known macro-defect. The processor analyzes the defects that are included in one of the spatial clusters that is determined to be an unknown macro-defect to determine a predominantly occurring micro-defect code.

Abstract: Spectral information may be employed in process control and/or quality control of goods and articles. Spectral information may be employed in process control and/or quality control of media, for example financial instruments, identity documents, legal documents, medical documents, financial transaction cards, and/or other media, fluids for example lubricants, fuels, coolants, or other materials that flow, and in machinery, for example vehicles, motors, generators, compressors, presses, drills and/or supply systems. Spectral information may be employed in identifying biological tissue and/or facilitating diagnosis based on biological tissue.

Abstract: The invention relates to a test method for examining an inspection device, which is associated with a functional unit of a master unit, comprising at least the following steps: producing a specified number of faulty and/or correct containers or test containers by means of the functional unit itself in that a control signal for producing a distinctive element is fed to the functional unit; leading the faulty containers or test containers past the inspection device, which detects the faulty containers or test containers and produces a signal to discharge the faulty containers or test containers, or indicates a value regarding the expected and the measured faulty and/or correct containers. The test method is automatically started or performed and is suitable, for example, for examining a label position checking device, the filling amount checking unit, and the closure seating checking unit in order to be able to determine the fault-free functioning thereof or optionally the faulty functioning thereof.

Abstract: Disclosed is a method for design validity verification of an electronic circuit board with regard to power supply noise, wherein with regard to an i-th LSI (i=1 to n) on the electronic circuit board, an input voltage Vin[i] to the LSI from the printed circuit board is given by Vin[i]=VDD?Z1si[i]×VDD/(Z1si[i]+Z11[i]),where Z1si[i] is an input impedance characteristic and Z11[i] is a reflected impedance characteristic viewed from a position at which the i-th LSI is mounted, being a characteristic with the i-th LSI omitted from the whole of the electronic circuit board and a judgment is made as to whether or not a reflected voltage Vr[i]=Vin[i]×(Z1si[i]+Z11[i])/(Z1si[i]?Z11[i]) satisfies |Vr[i]|?? V (power supply variation tolerance range).

Abstract: A film forming apparatus which forms a film on a substrate by utilizing a chemical solution, including: a correlation data creating unit which creates a correlation data that is related to the quality of a chemical solution, from data that is related to the properties of the chemical solution including at least one of data on storage temperature for the chemical solution to be loaded and data on pressure applied to the chemical solution to be loaded; and a determining unit which determines whether or not the chemical solution holds expected quality thereof on the bases of the correlation data.

Abstract: The present disclosure relates to specification, optimization and matching of optical systems by use of orientation Zernike polynomials. In some embodiments, a method for assessing the suitability of an optical system of a microlithographic projection exposure apparatus is provided. The method can include determining a Jones pupil of the optical system, at least approximately describing the Jones pupil using an expansion into orientation Zernike polynomials, and assessing the suitability of the optical system on the basis of the expansion coefficient of at least one of the orientation Zernike polynomials in the expansion.

Abstract: System and method for implementing wafer acceptance test (“WAT”) advanced process control (“APC”) are described. In one embodiment, the method comprises performing a key process on a sample number of wafers of a lot of wafers; performing a key inline measurement related to the key process to produce metrology data for the wafers; predicting WAT data from the metrology data using an inline-to-WAT model; and using the predicted WAT data to tune a WAT APC process for controlling a tuning process or a process APC process.

Abstract: Calibration systems and methods simultaneously calibrate a magnetic compass and gyroscopes. An exemplary embodiment rotates the field calibration system. Based upon the rotation sensed by the magnetic compass and the gyroscopes, the field calibration system determines compensation for both the magnetic compass and the gyroscopes.

Abstract: A method for increasing overall yield in semiconductor manufacturing including routing wafers or wafer lots based on process variation data obtained from the wafers or wafer lots and on process variation data obtained from tools processing the wafers or wafer lots. A system for increasing overall yield in semiconductor manufacturing includes a module for routing wafers or wafer lots based on process variation data obtained from the wafers or wafer lots and on process variation data obtained from the tools processing the wafers or wafer lots.

Abstract: A method for monitoring the manufacture of molded ophthalmic lenses is disclosed. The method monitors the occurrence of predetermined events and records such events in a device history record and a shadow table.

Abstract: A method and apparatus for authenticating items having a security mark containing a DNA fragment to prevent fraud uses a Raman spectrometer to generate a response spectrum from monochrome incident beam on the security mark on an item. Gross fluorescence is removed from the security mark response spectrum to produce a Raman security mark response spectrum. Peaks in the Raman security mark response spectrum are detected to generate Raman security mark peak data. The Raman security mark peak data is compared to a Raman peak library to determine if there is a match. The item is indicated as being authentic if a match of the Raman security mark peak data is found in the Raman peak library.

Abstract: Some embodiments for a fault detection apparatus may include one or more monitors to detect at least three operating states of a sensor, such as pass, fail, and inoperative so as to enable a manufacturing facility to differentiate between situations in which a container does not have the appropriate machine-readable label and situations wherein the sensor is actually inoperative. The fail state may be indicative of an object on a conveyor system not matching a predetermined description, identity or characteristic. The pass state may be indicative of an object on a conveyor system matching the predetermined description, identity or characteristic. The inoperative state may be indicative of a sensor output associated with a malfunction in the sensor itself. The fault detection apparatus may also include a fail-to-safe controller configured to detect these operating states.

Abstract: A test system may include multiple test stations. Electronic devices may be tested using the test system. Each test station may include a test unit such as a radio-frequency tester that can make wireless and wired radio-frequency signal measurements on devices under test. The test stations may be configured to perform pass-fail testing on devices under test during manufacturing. One or more selected devices under test that have passed the pass-fail tests may be retested using the test stations. Multiple tests may be performed at a given test station using the same selected device under test. Gathered test data may be analyzed to determine whether the test stations have sufficient accuracy and precision or need to be recalibrated or taken offline.

Abstract: One aspect related to design of systems and methods for manufacturing products that include technology in skilled areas is configuring a production station for use by an operator without specialized skills. The present invention contemplates an approach to designing a station configurable to perform one or more of incoming inspection, assembly, testing, and branding. A preferred approach includes verifying data associated with units prior to accepting them for incorporation, preventing incorporation of an incorrect unit, and guiding an operator in possible remedial action. This approach includes storing data in a server and making such data substantially instantly accessible to production stations once written in the server. Such data preferably includes software to configure the production station such that the operator need not have specialized skills. A production station designed using this approach is particularly useful in the manufacture of an outdoor unit of a split-mount microwave radio system.

Abstract: Methods, systems, computer program products and program storage devices for determining whether or not to perform an action based at least partly on an estimated maximum test range.

Abstract: A method for logging and reporting driver activity and vehicle operation includes identifying a driver of a vehicle, recording operating data with an on-board recorder that is hard-wired to an engine control module, coupled to a mileage sensing system, and linked to a global navigation satellite system, and recording duty status of the driver. An hours of service log and a fuel tax log are created from the operating data. The method includes comparing the driver's hours of service log to an applicable requirement, indicating to the driver whether the driver is in-compliance or out-of-compliance with the applicable requirement, automatically uploading the logs to a receiver external to the vehicle using a wireless telecommunications network, and emitting a compliance signal representative of whether the driver is in-compliance or out-of-compliance with the applicable requirement to a second receiver external to the vehicle and under control of authorities.

Abstract: Disclosed is an apparatus for testing an LED lamp which includes: a secured seat on which the LED lamp is seated; an up and down shifter which, when the LED lamp is seated on the secured seat, shifts from an initial position spaced upward from the LED lamp to a measurement position in which the up and down shifter contacts with a socket of the LED lamp, and which supplies electric power to the LED lamp when the up and down shifter is placed in the measurement position, and a sensor sensing that the up and down shifter is placed in the measurement position; and a quality determining means determining a quality of the LED lamp based on light emitted from the LED lamp, and comprising an illuminometer or a luminance meter.

Abstract: According to one embodiment, an evaluating apparatus includes a resist-pattern-data acquiring unit and an evaluating unit. The resist-pattern-data acquiring unit acquires resist pattern data having a plurality of feature values including at least two among a hole diameter measured concerning a pattern for hole formation in the resist pattern, an aspect ratio of the hole diameter, and a difference of hole diameters at a plurality of signal thresholds. The evaluating unit calculates an evaluation value using an evaluation function for evaluating whether a hole pattern formed on a processing target by using the pattern for hole formation is unopened and the resist pattern data and evaluates presence or absence of a risk that the hole pattern is unopened.

Abstract: Provided is a test apparatus that tests a plurality of devices under test formed on a wafer under test. The test apparatus comprises a test substrate that faces the wafer under test and is electrically connected to the devices under test; a programmable device that is provided on the test substrate and changes a logic relationship of output logic data with respect to input logic data, according to program data supplied thereto; a plurality of input/output circuits that are provided on the test substrate to correspond to the devices under test and that each supply the corresponding device under test with a test signal corresponding to the output logic data of the programmable device; and a judging section that judges pass/fail of each device under test, based on operation results of each device under test according to the test signal.

Abstract: A system and method is disclosed for providing a plurality of hardware performance monitors for adaptive voltage scaling in an integrated circuit system that comprises a plurality of threshold voltage VT logic libraries. Each hardware performance monitor is associated with one of the plurality of threshold voltage VT logic libraries and provides a signal that measures a performance of its respective threshold voltage VT logic library die temperature, process corner and supply voltage. The difference between the measured performance and a nominal expected performance for each hardware performance monitor is determined. The largest of the plurality of difference signals is selected and provided to an advanced power controller for use in providing adaptive voltage scaling for the integrated circuit system.

Abstract: Provided is a product sorting method based on the quantitative evaluation of a potential failure. The product sorting method manufactures a plurality of independent products with a manufacture device. The product sorting method obtains test records for the respective products by testing the products with a test device. The product sorting method determines whether the products are good products or fail products by analyzing the test records with a failure determination device. The product sorting method calculates a quality index which defines the possibility of potential failure of a population comprising the tested products as one value, by analyzing the test records with a quality index calculation device. The product sorting method determines whether to perform a subsequent operation for products which are determined as the good products by analyzing the quality index with a product sorting device.

Abstract: In order to inspect a three dimensional shape, a predetermined inspection target component formed on a board is selected as the measurement target, a shape of the inspection target component is acquired, a reference point of the inspection target component is detected, relative location information of a polarity mark formed on the inspection target component with respect to the reference point is acquired, and it is judged whether the inspection target component is good or bad by checking whether the polarity mark exists or not by using the relative location information with respect to the reference point. Thus, the location of the polarity mark may be accurately known, and polarity inspection may be more easily and accurately performed.

Abstract: In a method for verifying manufacturing accuracy, a point cloud of a workpiece is read. A first determined point is determined according to the first point of the point cloud and a second determined point is determined according to the final point of the point cloud. A first line, a second line, and a third line are all located by respectively connecting the first point and the first determined point, the final point and the second determined point, and the first determined point and the second determined point. Qualification of the workpiece is determined by measuring a first angle of the first line and the third line, a second angle of the second line and the third line, a first distance between the first determined point and the second line, and a second distance between the second determined point and the first line.

Abstract: An optical metrology apparatus for measuring periodic structures using multiple incident azimuthal (phi) and polar (theta) incident angles is described. One embodiment provides the enhanced calculation speed for the special case of phi=90 incidence for 1-D (line and space) structures, which has the incident plane parallel to the grating lines, as opposed to the phi=0 classical mounting, which has incident plane perpendicular to the grating lines. The enhancement reduces the computation time of the phi=90 case to the same order as the corresponding phi=0 case, and in some cases the phi=90 case can be significantly faster. One advantageous configuration consists of two measurements for each sample structure, one perpendicular to the grating lines and one parallel. This provides additional information about the structure, equivalent to two simultaneous angles of incidence, without excessive increase in computation time.

Abstract: A terminal insertion defect determining method includes a step of determining the defect state by judging whether the preset condition is satisfied or not in an insulation-displacement period where an insulation-displacement part is insulation-displaced to a wire, a step of determining the defect state by judging whether the preset condition is satisfied or not in an intermediate period between the insulation-displacement period and a press-fitting period where a press-fitting part is press-fitted to a press-fitted part, and a step of determining the defect state by judging whether the preset condition is satisfied or not in the press-fitting period.

Abstract: Some embodiments for a fault detection apparatus may include one or more monitors to detect at least three operating states of a sensor, such as pass, fail, and inoperative so as to enable a manufacturing facility to differentiate between situations in which a container does not have the appropriate machine readable label and situations wherein the sensor is actually inoperative. The fail state may be indicative of an object on a conveyor system not matching a predetermined description, identity or characteristic. The pass state may be indicative of an object on a conveyor system matching the predetermined description, identity or characteristic. The inoperative state may be indicative of a sensor output associated with a malfunction in the sensor itself. The fault detection apparatus may also include a fail-to-safe controller configured to detect these operating states.

Abstract: Method and system that test device sensitivity according to whether the device passes or fails when subjected to a test signal. The device may be repeatedly subjected to test signal at varying operating parameters in order to assess pass-fail threshold at which the device transitions from operating properly/improperly to operating improperly/properly.

Abstract: A method optimizes photomask inspection. After masks are manufactured, the method predicts the likelihood that the masks will be defect free based on defect criteria, etch area, etch mode, and etch tool type associated with the masks. The method skips an initial mask inspection for masks that have a predictability value above a predetermined value and performs the initial mask inspection for masks that have a predictability value below the predetermined value. After initial inspection is preformed (or skipped), a pellicle is mounted on the mask and then all masks are inspected or reinspected for defects and foreign matter.