Abstract: The present invention relates to the marking and identification of defective die sites on a mounting substrate. A mounting substrate is provided which is inspected and tested for visual and electrical defects. Information relating to the functionality and/or various defects of one or more die sites is then encoded in the form of a designator placed on the substrate. The information encoded on the designator may then be read or scanned by, for example, computer-driven video equipment and used in a die-attach process to discriminately place semiconductor dice only on known good die sites. Embodiments of the designator include information encoded in the form of a bar code, a series of identifying marks, a strip of magnetic tape or a computerized map of a mounting substrate. Correlated data regarding die site functionality can then be electronically transferred to a die-bonding apparatus.

Abstract: A method of manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating ICs on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic wafer map is electronically stored for each wafer indicating the locations of good and bad ICs on the wafer and the fuse IDs of the ICs on the wafer. Each IC is then separated from its wafer to form an IC die, and the IC dice are assembled into IC devices. At the opens/shorts test at the end of assembly, the fuse ID of each IC in each device is automatically retrieved so the wafer map of the IC device may be accessed and evaluated to identify any IC devices containing bad ICs that have accidentally been assembled into IC devices. Any “bad” IC devices are discarded while remaining IC devices continue on to back-end testing.

Abstract: Methods and apparatus for performing a test on a product include applying a test on a product and, if the test indicates a defect in the product, determining whether the defect is external to the product. The method further includes, if the defect is determined to be external to the product, skipping repair of the product for the defect. In one aspect, a method for performing a test on a product includes determining an external defect for the product and, if an external defect exists for the product, skipping further testing of the product for the determined external defect.

Abstract: An inspection and verification system includes an inspection fixture for inspecting a finished part prior to its placement in a shipping container. The inspection fixture signals a processor that the finished part has “passed” or “failed”. A finished part that passes is placed in the shipping container, which is locked in a loading position on the weighing platform of an electronic scale. If the weight of the finished part does not match a standard finished part weight, the part is rejected, the shipping container is removed and quarantined, and a new shipping container is locked in the loading position. When the weight of the finished part matches the standard weight, the part is accepted and it remains in the shipping container. When the processor receives a number of “accept” signals equal to a standard shipping container quantity, it releases the shipping container.

Abstract: A method, system, and computer-readable medium is described for automatically identifying incongruous item packages, such as to detect incongruities in the items that are included as contents of the item packages and/or to identify incongruities in the packaging used for the item packages. In some situations, the automatic identification of incongruous packages includes initially automatically learning appropriate values for parameters of items (e.g., item weights and/or dimensions) based on automatically measured parameters of packages including those items. Those item values can then be used to estimate corresponding parameter values of sealed packages that contain those items, and to further identify incongruous item packages whose measured parameter values do not correspond to the estimated values for those parameters.

Abstract: A method and apparatus for operating a production system that includes a plurality of production facilities is provided. The method includes receiving, in real-time, for each facility, cost data for a first resource used by each respective facility to produce an output, receiving, in real-time, for each facility, cost data for a second resource used by each respective facility to produce the output, determining, in real-time; an automated incremental cost curve for the system based on a level of production of each facility and the received resource cost data, and determining a production output target for each production facility to achieve an optimum production system output based on the real-time incremental cost curves. The system includes at least one production facility that includes a software code segment programmed to determine, in real-time, an incremental cost of a first resource based on a level of production of each respective facility.

Abstract: Disclosed herein is a method and system for calibrating line drive currents in systems that generate data signals by varying line drive currents and that interpret the data signals by comparing them to one or more reference voltages. The calibration includes varying the line drive current at a transmitting component. At different line drive currents, a receiver reference voltage is varied while the transmitting component transmits data to a receiving component. At each line drive current, the system records the highest and lowest receiver reference voltages at which data errors do not occur. The system then examines the recorded high and low receiver reference voltages to determine a desirable line drive current.

Abstract: A package handling system for use with a plurality of packages having package identification thereon. The system of one embodiment comprises processing stations where packages having heterogeneous contents are processed. One or more identifiers are positioned at the processing stations to detect the package identifications associated with the packages. A controller is coupled to the identifier to receive identification information about a package and detected by the identifier. The controller is coupled to the data input device to receive first package data related to an actual condition of the package. The controller has second package data related to acceptable package conditions. The controller uses the first and second package data to determine if the package is in a kickout condition.

Abstract: Using information about the position, orientation, and shape of a crack appeared in a judged material and information about the structure of the judged material as parameters, the stress intensity factor KI of the crack is found. Based on the stress intensity factor KI, hydrogen embrittlement cracking of the judged material is judged. The crack growth rate and possibility of brittle fracture can be judged by comparing the stress intensity factor KI with the critical stress intensity factor KIH for crack initiation or the critical stress intensity factor KIC-H for brittle fracture about the temper embrittled steel which absorbs approximately 2.0 ppm hydrogen.

Abstract: A method and apparatus for communicating estimated vehicular speed and length using data obtained from a single wire-loop. The detector card connected to a single wire-loop produces a first bivalent output based on the actual measurement of a vehicle at the wire-loop sensor and synthesizes a second bivalent output to mimic the output of a two wire-loop speed trap. By simulating a second bivalent output at the detector card level, a conventional field controller is capable of estimating the vehicular speed from a single wire-loop sensor.

Abstract: The method for identifying the presence of an item to a user interface entails using a container having a loading opening and a collection opening, passing the item through the loading opening activating a first sensor, sending a first signal from the first sensor to an intelligent device, creating a first intelligent device signal from the intelligent device, communicating the first intelligent device signal to a communication system, opening the collection opening to collect the item, thereby activating a second sensor, sending a second signal from the second sensor to the intelligent device, creating a second intelligent device signal from the intelligent device, communicating the second intelligent device signal to the communication system, and using a software interface to process the first intelligent device signal and the second intelligent device signal and present the intelligent device signals processed by the software interface to the user interface.

Abstract: A method (10) for acquiring material for use within a die and for determining whether a die has certain characteristics which would allow the die to have a relatively long operating life. The method (10) requires that a suppler of a die provide certain material which is analyzed to determine whether the supplied material has a certain toughness. If the material has the requisite toughness, a material signature is created and used to evaluate further materials and dies produced and/or provided by the supplier.

Abstract: A method for classifying patterns of failcodes on a semiconductor wafer, in accordance with the present invention, includes determining failcodes for chips on the wafer and checking adjacent chips for each chip on the wafer having a failcode to determine a failcode pattern having a defined number of chips.

Abstract: A method of manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating ICs on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic wafer map is electronically stored for each wafer indicating the locations of good and bad ICs on the wafer and the fuse IDs of the ICs on the wafer. Each IC is then separated from its wafer to form an IC die, and the IC dice are assembled into IC devices. At the opens/shorts test at the end of assembly, the fuse ID of each IC in each device is automatically retrieved so the wafer map of the IC device may be accessed and evaluated to identify any IC devices containing bad ICs that have accidentally been assembled into IC devices. Any “bad” IC devices are discarded while remaining IC devices continue on to back-end testing.

Abstract: A method for creating a guardband that incorporates statistical models for test environment, system environment, tester-to-system offset and reliability into a model and then processes a final guardband by factoring manufacturing process variation and quality against yield loss.

Abstract: A desired Acceptable Quality Limit (AQL), a desired Key Defect Rate (KDR), a desired power of a sampling plan for items that are manufactured and a desired false alarm rate for the sampling plan are input into a computer. The computer calculates a required sample size to provide the desired AQL, the desired KDR, the desired power of the sampling plan for the items that are manufactured and the desired false alarm rate for the sampling plan. Thus, each of the individual parameters may be independently specified based on the items that are manufactured, desired AQLs, KDRs, power and false alarm rates. Reliance on ANSI/ASQ Z1.9 tables which might best fit a user's desired parameters can be reduced and preferably eliminated. In addition to calculating the required sample size, a decision rule critical value also may be calculated based upon the required sample size to provide the desired AQL, the desired KDR, the desired power and the desired false alarm rate for the sampling plan.

Abstract: Systems and methods for controlling at least one reticle-induced error in a process system, the systems and methods including adjusting measurement data associated with the process system, where the adjustment can be based on at least one reticle identifier (ID) associated with the measurement data, and reticle-induced error data associated with the at least one reticle ID. The methods and systems also include combining the adjusted measurement data to compute at least one control for the process system.

Abstract: A method for classifying a substrate first provides the substrate and its corresponding inspection map. Then, a database having a plurality of specification data is provided. After that, the inspection map is compared with each of the specification data so as to find the specification data coinciding with the inspection map. Finally, the substrate is defined according to the layout of active areas coinciding with the inspection map, and then the substrate is classified and stored.

Abstract: A pattern inspection apparatus determines a difference of the measured dislocation of respective alignment marks of an opaque pattern and a phase shifting pattern (measurement difference), in addition to a difference between the both alignment mark positions in design (design difference). A difference between the measurement difference and the design difference is set as a difference in alignment mark position between the opaque pattern and the phase shifting pattern in a reference pattern which is later used in inspection. In this manner, by correcting one pattern data with respect to the other pattern data in the reference pattern, the displacement generated in the both patterns can be reflected, and the reference pattern data regarding an image of a sample which is actually observed can be created.

Abstract: An organic semiconductor product state monitor attached to a product receives a product usefulness input, which, along with the product predetermined usefulness limit, is used to determine an indicator command to indicate a state of usefulness of the product. An organic circuit is formed and placed on a product with a power supply to control the circuit operation.

Abstract: Exemplary embodiments include a method, system, and storage medium for optimizing scheduling activities in a manufacturing environment. The method includes receiving a planned factory cycle time value and schedule information for lots associated with a queue. The planned factory cycle time value includes an anticipated pace for lot workflow. Upon receiving a dispatch request, a critical ratio for each lot is calculated and compared with the planned factory cycle time value. An ‘at risk’ value is assigned to a lot when the planned factory cycle time value is greater than the lot's critical ratio. A higher priority is assigned to lots determined to be at risk than the priority assigned to those lots not at risk. The at risk lots are sorted by a priority value set during a planning period and also by a critical ratio. The lots not at risk are sorted by critical ratio.

Abstract: A method tests an electronic component, especially a memory chip, which is connected to a computer system. Initially, test patterns and AC-/DC-parameters are read into the computer system. Then, the computer system generates an input test pattern for the electronic component. Afterwards, a simulation process is performed processing the input test pattern by the electronic component and measuring the current flowing in the electronic component. Ultimately, the method produces a statement concerning the functionality of the tested electronic component. Program instructions for causing a computer system to perform the above-described method for testing an electronic component can be stored in a computer program, a computer readable medium, a computer memory, a read-only memory, an electrical carrier signal, and a carrier, especially a data carrier. A computer system runs the computer program embodying the method.

Abstract: A method of screening defects includes steps of: (a) measuring a quiescent current at a first supply voltage for each of a plurality of devices; (b) measuring a quiescent current at a second supply voltage for each of the plurality of devices; (c) generating a plot of the quiescent current measured at the first supply voltage vs. the quiescent current measured at the second supply voltage for each of the plurality of devices; (d) determining a range of intrinsic variation of quiescent current in the plot; and (e) identifying any of the plurality of devices corresponding to a measurement plotted outside the range of intrinsic variation as defective.

Abstract: Methods, systems, and computer program products for facilitating user choices among complex alternatives utilize conjoint analysis to simplify choices to be made by the user. A selector tool presents a user with a first and second series of choices relating to attributes of products or services available to the user. A utilities calculation engine calculates the relative utility of each of the products or services to the user and presents output to the user, which indicates the relative utility of each of the products or services. The user can then select the product or service that has the highest utility value for the user based on the calculated relative utility values.

Abstract: A system and a method of testing an electrical device to determine a range of combinations of values of N parameters for which the device functions properly are described. In one embodiment, the method comprises subdividing a plot region comprising a plurality of operating points each corresponding to a particular combination of values of the N parameters into at least two partially overlapping sub-regions; testing the electrical device using the combination of values of the N variable parameters corresponding to the operating points located in each corner of each sub-region; and for each sub-region with respect to which the device does not function in the same manner at each corner operating point thereof, repeating the incrementing, subdividing and testing.

Abstract: Disclosed are methods and apparatus for determining whether to perform burn-in on a semiconductor product, such as a product wafer or product wafer lot. In general terms, test structures on the semiconductor product are inspected to extract yield information, such as defect densities. Since this yield information is related to the early or extrinsic instantaneous failure rate, one may then determine the instantaneous extrinsic failure rate for one or more failure mechanisms, such as electromigration, gate oxide breakdown, or hot carrier injection, based on this yield information. It is then determined whether to perform burn-in on the semiconductor product based on the determined instantaneous failure rate.

Abstract: In the present invention, plural test vectors are supplied to good and faulty samples as semiconductor devices in order to measure current values, and change rates of the current values corresponding to each test vector are calculated. The change rates of the current values in the good and faulty samples are then compared, and address pairs of test vectors to be used in a pass/fail decision for semiconductor devices are determined based on the comparison results. Test vectors to be used for performing an emission analysis are obtained based on the change rates of the current values obtained from the good and faulty samples. The obtained test vectors are supplied to the faulty sample in order to perform the emission analysis, in which emission patterns of the good and faulty samples are compared, by using an emission microscope, and a part of a defect in the faulty sample is detected.

Abstract: The present invention relates to a tool for analyzing by priority a defect having a high possibility of causing an electrical failure when inspecting a particle and a pattern defect in a piece of work which constitutes an electronic device such as a semiconductor integrated circuit, and relates to a system therefor. On the basis of the result of comparison between defect information which is the result of inspection by an inspection tool and layout data stored in an auxiliary storage device, or on the basis of the result of reinspection by comparison between a defect and a wiring pattern as a background by an inspection processing operation unit, an object to be reviewed is selected using review conditions stored in the auxiliary storage device.

Abstract: A method an apparatus for non-destructive testing and evaluation of part samples includes obtaining a defect image of the sample, displaying the defect image on a display, referencing the defect image, such as through marking or annotation, to highlight locations at which defects or measurements are found, superimposing the defect image onto a live image of the part, and physically marking/annotating the part, tracing the marks from the defect image onto the physical sample, while viewing the live image. Because both the defect image and the live image are viewed through the same camera lens and are therefore subject to the same amount of distortion, the actual sample can be marked exactly according to the marks made in the defect image; there is no need to attempt matching a distorted defect image with the physical sample, as has been done in the prior art.

Abstract: A method is disclosed wherewith a person skilled in the art of statistical quality control may determine whether a process, a product or a service is statically equivalent to another of known quality, or to a desired known quality. The method may also be used to determine whether multiplicities of products, processes, or services are statistically equivalent to one another and of a desired quality. The method makes the determination based on an equivalency index that is derived from integration of the probability distribution of data of measurement taken from products processes, or services.

Abstract: A system/method of establishing a two-way communication system between a testing/manufacturing site and a component vendor is disclosed. The system allows the test results related to a component failure to be immediately available to a vendor by allowing the vendor password protected access to a product database that contains information regarding the product being tested. The system automatically alerts the vendor associated with the defective component, and allows the vendor to download the vendor's failure analysis report to the product database as soon as it becomes available. Upon receipt of the vendor's failure analysis report, the appropriate testing/manufacturing personnel are notified.

Abstract: A system and method of monitoring LCD production yields, predicting the effects of different testing methodologies on LCD production yields, and optimizing production yields is provided that compares the effect of different testing methodologies on the yields at various stages in the LCD testing and assembly process. The present invention can also be used to predict the effect of different testing methodologies on user-defined parameters, such as profit.

Abstract: The method and system for extracting information from a plurality of articles and for storing the extracted information in a knowledge-based information store. The method and system identify a plurality of articles from which information is to be extracted. The method and system identify and assign a plurality of information extractors for extracting information from the plurality of articles. The method and system receive information extracted by an information extractor from an article assigned to the information extractor. The method and system enable a content reviewer to review the extracted information received from the information extractor and the content reviewer identifies errors associated with the extracted information. If the error count is above the threshold level, the article may be reassigned for information extraction. If the error count is equal to or below the threshold level, the content reviewer may change the extracted information to correct the errors.

Abstract: Data collection and display representative of at least one characteristic relevant to a viability product contained in a sealed package, via monitoring at least one characteristic associated with a state condition of said product. A viability state condition may be related to probability of degradation of the product. The monitoring may include analyzing data associated with at least one said characteristic and, based on said analyzing, determining at least one critical date of said product which may be displayed. When current state of viability can be predicted, freezing said display with said signal representative of an expiration or maturity state condition, or dynamically altering a display accordingly. Options for displaying a history of said characteristic may be provided.

Abstract: A method for detecting malfunctions in a flowmeter includes the measuring of the receive signal VIN output by a transducer. A characteristic of the receive signal is compared to a predetermined reference characteristic VREF and the peak voltage VPK of the receive signal is stored. An alarm signal VAL is generated when a trigger characteristic VDEC of the receive signal is less than the predetermined reference characteristic. A threshold voltage VTH is defined, proportional to the peak amplitude VPK of the receive signal in such a manner that VTH=K×VPK where K is a factor depending on the transducer. The receive signal is compared with the threshold voltage and a conditioned output signal VOUT is generated in a first state when the receive signal is greater than the threshold voltage, and in a second state when the receive signal is less than the threshold voltage.

Abstract: An unused state detection circuit is disclosed that detects an unused state in a semiconductor circuit. A semiconductor circuit is “unused” when the unused state detection circuit has not been permanently cleared. When a semiconductor circuit is first powered up, the unused state detection circuit will detect that the semiconductor circuit has not previously been “used” and can automatically activate a boot up procedure or a testing procedure (or both). After the semiconductor circuit is used, the unused state detection circuit provides an indication that the semiconductor circuit is no longer unused. The unused state detection circuit uses the state of a dedicated non-volatile memory array or a dedicated region of the general non-volatile memory portion of the semiconductor circuit to detect whether the semiconductor circuit has been previously unused.

Abstract: The invention relates to a method for imaging and analysing the formation and surface topography of a fast-moving web or for the statistical analysis of impurities and spots. An electronic matrix camera is used to take images of a web moving at least 5 m/s, the exposure time of the electronic shutter of the camera being adjusted so that the sum of the static pixel size of the web and the dynamic imaging inaccuracy caused by movement is at most about 0.6 mm in the direction of travel. The exposure time is shorter than 25 &mgr;s.

Abstract: A method for analyzing a system for safety to personnel or other systems is disclosed comprising: identifying at least one operating parameter of a first subcomponent of said product; identifying an inherent hazard of said first subcomponents based on an analysis of the at least one operating parameter; identifying features of the structure or operation of the subcomponent corresponding to the inherent hazard; identifying modifications or controls for the identified features which would mitigate the inherent hazard; prioritizing the identified features with respect to the effect that each of said features has on safety of the product; and determining whether an unsafe condition could result from the inherent hazard.

Abstract: A method and apparatus for providing communication between a defect source identifier and a tool data collection and control system. The defect source identifier collects wafer data until a defect is identified. Upon identification of a defect, a request is sent to the tool data collection and control system to request data of the tool parameters at the time the defect occurred. The tool data collection and control system retrieves the tool parameters and communicates them to the defect source identifier through a network. The tool parameters are processed by the defect source identifier to extract certain wafer data. The selected wafer data is communicated to the tool data collection and control system and is used to execute a prediction model to predict failure possible of the tool elements.

Abstract: Method, apparatus and product for analyzing a quality control regimen comprising one or more quality control tests, to determine if the tests are in statistical control, and therefore could be removed from the regimen or sampled at a different rate. On sample data relating to each of the tests, there is determined Cpi, a measure of the spread of the data, which is simply the ratio of the magnitude of the actual range of the data, to the magnitude of calculated statistical range of the data. There is also determined CPKi, which is a measure of how close the spread of the data is to the upper or lower limit of the data. For convenience, the magnitude of Cpi is represented as a vertical bar graph, with the value of CPKi shown as a position of the bar graph within normalized limits. Using Cpi and CPKi decisions regarding removal of each the test can be made.

Abstract: When product inspection results and an inspection frequency for each inspection item are input to the product inspection result input device 1, the inspection items are selected, the presence or absence of product inspection results required for each inspection item is determined, selection of previous product inspection results is performed via the inspection item master 2a and inspection frequency master 2b of the product standard management device 2, and product inspection results for other product batches measured previously are cited for insufficient data for each inspection item missing from the inspection results document according to the inspection item conditions of the inspection results document.

Abstract: A degradation state of the gas turbine is repeatedly estimated with the aid of a set of measured values, at least one of the measured values not being taken into account in each case during the estimation. A deviating estimate which deviates substantially from the remaining estimates or from an estimate which takes account of all the measured values implies that a measured value which has not been taken into account for this deviating estimate is defective. This renders it possible to distinguish in a simple way between changes in state and measuring errors. In the case of a method for determining a degradation of a gas turbine which is being implemented in any case, the determination of defective sensors according to the invention is possible with a low programming outlay and without assumptions concerning a response of individual sensors.

Abstract: Methods are provided for developing medical diagnostic tests using decision-support systems, such as neural networks. Patient data or information, typically patient history or clinical data, are analyzed by the decision-support systems to identify important or relevant variables and decision-support systems are trained on the patient data. Patient data are augmented by biochemical test data, or results, where available, to refine performance. The resulting decision-support systems are employed to evaluate specific observation values and test results, to guide the development of biochemical or other diagnostic tests, too assess a course of treatment, to identify new diagnostic tests and disease markers, to identify useful therapies, and to provide the decision-support functionality for the test.

Abstract: A failure analysis device is provided which can realize automatic light emission analysis even when the tested chips have logic LSIs etc. fabricated therein. A comparator (11) compares individual Iddq values (I1) to (In) sequentially provided from a probe card (3) with a threshold (Ith1) provided from a main control unit (7). An abnormality occurrence vector specifying unit (8) receives data (D2) about the results of comparison from the comparator (11) and specifies an abnormality occurrence vector or vectors from among a plurality of test vectors (TB1) to (TBn) on the basis of the data (D2). More specifically, the abnormality occurrence vector specifying unit (8) specifies the test vector as the abnormality occurrence vector when the corresponding detected Iddq value is larger than the threshold (Ith1).

Abstract: In the present invention, for an NC program for controlling a machine tool, information for machining quality required by a machine tool is prewritten in the program. A measurement program for measuring the machining quality of the workpiece using a measuring machine is produced by analyzing the NC program. The machining quality of the workpiece is measured by the measurement program and the measuring machine. The machining quality of the workpiece can be judged by comparing the measurement results and the machining quality information included in the NC program. By utilizing this quality judgement, simple and effective system control can be achieved when a system such as CIM (Computer Integrated Manufacturing) is constructed in cooperation with other machine tools.

Abstract: A method and apparatus for evaluation of films, such as low-k thin films with nano-scale pores, are provided. The evaluation may include characterization of the pore structure, the characterization results in determining pore sizes, hence obtaining pore size data. Moreover, the characterization may result in a non-destructive evaluation of mechanical properties, in particular the Young's Modulus, or the effect of interfering physical & chemical factors such as Pore Killers. Further, in line monitoring or studying of pore structure porosity and pore size distribution (PSD) of low-k films and evaluation of the mechanical properties of porous low-k films simultaneously using the same set of experimental data is provided.

Abstract: A method tests an electronic component, especially a memory chip, which is connected to a computer system. Initially, test patterns and AC-/DC-parameters are read into the computer system. Then, the computer system generates an input test pattern for the electronic component. Afterwards, a simulation process is performed processing the input test pattern by the electronic component and measuring the current flowing in the electronic component. Ultimately, the method produces a statement concerning the functionality of the tested electronic component. Program instructions for causing a computer system to perform the above-described method for testing an electronic component can be stored in a computer program, a computer readable medium, a computer memory, a read-only memory, an electrical carrier signal, and a carrier, especially a data carrier. A computer system runs the computer program embodying the method.

Abstract: The microwaviness (i.e., surface waviness for wavelengths on the order of the length of the transducing head) of a recording disk surface is measured during manufacture as a quality control process. Preferably, the disk is measured using an actuator-mounted thermal sensor, comprising an electrical resistance element driven with a constant current. At small distances, the disk surface acts as a heat sink and variation in this distance will be detected as a change in resistance of the sensor. Preferably the sensor is initially used to characterize the gross waviness of the surface, and the actuator then follows this gross waviness to measure surface variations in the microwaviness range.

Abstract: Failures associate with bad hand pieces and blade failures in an ultrasonic surgical system are distinguished by monitoring the rate of change of the resonance frequency and the rate of change of the resonance impedance of the hand piece/blade as the drive frequency is changed. As the system reaches resonance, the control system locks onto the resonance frequency. When a loss of lock occurs with no recovery, the rate of change of the frequency and rate of change of the impedance are compared to obtain the fastest rate of change which is stored in non-volatile memory of the ultrasonic generator. If the rates of change are higher than normal rates of change due to temperature changes with the longest blades, a “Bad Blade” message is displayed on an LCD.

Abstract: A method of brokering information in a manufacturing system comprising a broker coupled between a supplier of information and a consumer of information is set forth. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format. Additionally, a method of brokering fault detection and classification data in a manufacturing system which comprises providing a broker coupled between a supplier of fault detection and classification data and a consumer of fault detection and classification data is set forth. The manufacturing system receives fault detection and classification data from the supplier in a first format and sends fault detection and classification data from the broker to the consumer in a second format. Additionally, a manufacturing system which comprises a supplier of fault detection and classification data, a consumer of fault detection and classification data and a broker is set forth.