Abstract: A test architecture accesses IP core test wrappers within an IC using a Link Instruction Register (LIR). An IEEE P1500 standard is in development for providing test access to these individual cores via a test structure called a wrapper. The wrapper resides at the boundary of the core and provides a way to test the core and the interconnections between cores. The test architecture enables each of the plural wrappers in the IC, including wrappers in cores embedded within other cores, with separate enable signals.

Abstract: An operating system independent JTAG debugging system implemented to run in a web browser. The software executing in the browser identifies the JTAG enabled components in the target system that is to be tested and automatically downloads the latest versions of the appropriate software and drivers from a test server database, together with any applicable patches and software updates.

Abstract: An integrated circuit includes an LBIST controller operative to run a test program on at least one selection of core logic of the integrated circuit to test the operability of the at least one selection of core logic. The integrated circuit also includes a monitoring logic structure operative to detect at least one type of operation executed for the test program from at least one particular control signal activated by the LBIST controller for controlling the at least one selection of core logic to execute the test program from among at least one control signal for controlling operations on the at least one selection of core logic.

Abstract: Techniques related to remotely boundary scanning of an integrated circuit embedded in a target computing system are disclosed herein. In an example, a host computing system includes a first peripheral port and a second peripheral port. A port-to-port boundary scan assembly is to interface boundary scan data between the first and the second peripheral ports. Thereby the boundary scan data can be routed from the second peripheral bus to the target computing system via a network port at the host computing system.

Abstract: A scan test architecture facilitates low power testing of semiconductor circuits by selectively dividing the serial scan paths into shorter sections. Multiplexers between the sections control connecting the sections into longer or shorted paths. Select and enable signals control the operation of the scan path sections. The output of each scan path passes through a multiplexer to compare circuits on the semiconductor substrate. The compare circuits also receive expected data and mask data. The compare circuits provide a fail flag output from the semiconductor substrate.

Abstract: A system comprises a plurality of components, scan chain selection logic coupled to the components, and override selection logic coupled to the scan chain selection logic. The scan chain selection logic selects various of the components to be members of a scan chain under the direction of a host computer. The override selection logic detects a change in the scan chain and, as a result, blocks the entire scan chain from progressing.

Abstract: Plural scan test paths (401) are provided to reduce power consumed during testing such as combinational logic (101). A state machine (408) operates according to plural shift states (500) to control each scan path in capturing data from response outputs of the combinational logic and then shifting one bit at a time to reduce the capacitive and constant state power consumed by shifting the scan paths.

Abstract: A method for scan testing an integrated circuit that includes a plurality of on-chip logic modules includes configuring the integrated circuit for module level scan testing and chip level scan testing by way of an external automatic test pattern generator (ATPG) tool. The ATPG tool generates first and second sets of test patterns for module level and chip level scan testing of the integrated circuit. The ATPG tool generates the second set of test patterns by excluding the design faults which have already been targeted during the module level scan testing, from the first set of test patterns and reduces the overall time required for scan testing the integrated circuit.

Abstract: Scan testing and scan compression are key to realizing cost reduction and shipped quality. New defect types in ever more complex designs require increased compression. However, increased density of unknown (X) values reduces effective compression. A scan compression method can achieve very high compression and full coverage for any density of unknown values. The described techniques can be fully integrated in the design-for-test (DFT) and automatic test pattern generation (ATPG) flows. Results from using these techniques on industrial designs demonstrate consistent and predictable advantages over other methods.

Abstract: Data is communicated through two separate circuits or circuit groups, each having clock and mode inputs, by sequentially reversing the role of the clock and mode inputs. The data communication circuits have data inputs, data outputs, a clock input for timing or synchronizing the data input and/or output communication, and a mode input for controlling the data input and/or output communication. A clock/mode signal connects to the clock input of one circuit and to the mode input of the other circuit. A mode/clock signal connects to the mode input of the one circuit and to the clock input of the other circuit. The role of the mode and clock signals on the mode/clock and clock/mode signals, or their reversal, selects one or the other of the data communication circuits.

Abstract: Topology discovery of a target system having a plurality of components coupled with a scan topology may be performed by driving a low logic value on the data input signal and a data output signal of the scan topology. An input data value and an output data value for each of the plurality of components is sampled and recorded. A low logic value is then scanned through the scan path and recorded at each component. The scan topology may be determined based on the recorded data values and the recorded scan values.

Abstract: Scan architectures are commonly used to test digital circuitry in integrated circuits. The present disclosure describes a method of adapting conventional scan architectures into a low power scan architecture. The low power scan architecture maintains the test time of conventional scan architectures, while requiring significantly less operational power than conventional scan architectures. The low power scan architecture is advantageous to IC/die manufacturers since it allows a larger number of circuits (such as DSP or CPU core circuits) embedded in an IC/die to be tested in parallel without consuming too much power within the IC/die. Since the low power scan architecture reduces test power consumption, it is possible to simultaneously test more die on a wafer than previously possible using conventional scan architectures. This allows wafer test times to be reduced which reduces the manufacturing cost of each die on the wafer.

Abstract: Scan testing of plural target electrical circuits, such as circuits 1 through N, becomes accelerated by using the scan test response data output from one circuit, such as circuit 1, as the scan test stimulus data for another circuit, such as circuit 2. After reset, a scan path captures the output response data from the reset stimulus from all circuits. A tester then shifts the captured data only the length of the first circuit's scan path while loading the first circuit's scan path with new test stimulus data. The new response data from all the circuits then is captured in the scan path. This shift and capture cycle is repeated until the first circuit is tested. The first circuit is then disabled and any remaining stimulus data is applied to the second circuit. This process is repeated until all the circuits are tested. A data retaining boundary scan cell used in the scan testing connects the output of an additional multiplexer as the input to a boundary cell.

Abstract: A circuit module includes a shift register constituting part of a scan chain within a semiconductor integrated circuit, a control unit for controlling an operation of the shift register using a control signal generated within the semiconductor integrated circuit and a selection unit for selecting between a short-circuit path through which a scan signal is loaded and an ordinary path through which the scan signal is loaded after being made to go through the shift register, where the ordinary path is selected when the operation of the shift register is permitted by the control signal and the short-circuit path is selected when the operation of the shift register is not permitted.

Abstract: A virtual In-Circuit Emulation (ICE) capability is provided herein for supporting testing of Joint Test Action Group (JTAG) hardware. A Virtual ICE Driver is configured for enabling any debug software to interface with target hardware in a flexible and scalable manner. The Virtual ICE Driver is configured such that the test instruction set used with the Virtual ICE Driver is not required to compute vectors, as the JTAG operations are expressed as local native instructions on scan segments, thereby enabling ICE resources to be accessed directly. The Virtual ICE Driver is configured such that ICE may be combined with instrument-based JTAG approaches (e.g., the IEEE P1687 standard and other suitable approaches).

Abstract: Testing of integrated circuits is achieved by a test architecture utilizing a scan frame input shift register, a scan frame output shift register, a test controller, and a test interface comprising a scan input, a scan clock, a test enable, and a scan output. Scan frames input to the scan frame input shift register contain a test stimulus data section and a test command section. Scan frames output from the scan frame output shift register contain a test response data section and, optionally, a section for outputting other data. The command section of the input scan frame controls the test architecture to execute a desired test operation.

Abstract: A method for scan testing an integrated circuit that includes a plurality of on-chip logic modules includes configuring the integrated circuit for module level scan testing and chip level scan testing by way of an external automatic test pattern generator (ATPG) tool. The ATPG tool generates first and second sets of test patterns for module level and chip level scan testing of the integrated circuit. The ATPG tool generates the second set of test patterns by excluding the design faults which have already been targeted during the module level scan testing, from the first set of test patterns and reduces the overall time required for scan testing the integrated circuit.

Abstract: Disclosed are representative embodiments of methods, apparatus, and systems for partitioning-based Test Access Mechanisms (TAM). Test response data are captured by scan cells of a plurality scan chains in a circuit under test and are compared with test response data expected for a good CUT to generate check values. Based on the check values, partition pass/fail signals are generated by partitioning scheme generators. Each of the partitioning scheme generators is configured to generate one of the partition pass/fail signals for one of partitioning schemes. A partitioning scheme divides the scan cells into a set of non-overlapping partitions. Based on the partition pass/fail signals, a failure diagnosis process may be performed.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: An electronic system is configured for scan testing, with a clock distribution network going to a plurality of blocks of the system, and a test capture clock being generated locally at each block. Capture clock pulses are optionally generated at different times for different blocks, and are optionally suppressed for some blocks.

Abstract: Exemplary system, method and computer accessible medium that can transform a circuit by selecting at least one scan cell as an interface register and inserting a shadow register into each interface register. Operations can be shifted to load and unload at least one scan cell in the circuit. An operation can be launched in at least one of the interface registers and in a first set of scan cells. A capture operation can be performed in a second set of scan cells. An operation can be restored in at least one interface register by transferring data from at least one shadow register.

Abstract: Chain or logic diagnosis resolution can be enhanced in the presence of limited failure cycles using embodiments of the various methods, systems, and apparatus described herein. For example, pattern sets can be ordered according to a diagnosis coverage figure, which can be used to measure chain or logic diagnosability of the pattern set. Per-pin based diagnosis techniques can also be used to analyze limited failure data.

Abstract: An integrated circuit comprises a memory or other circuit core having an input interface and an output interface, scan circuitry comprising at least one scan chain having a plurality of scan cells, and additional circuitry associated with at least one of the input interface and the output interface and testable utilizing said at least one scan chain. The scan circuitry further comprises a scan controller configured to control signal values applied to one or more signal lines of the input interface in conjunction with testing of the additional circuitry utilizing said at least one scan chain. For example, the scan controller may control signal values applied to respective address input and write enable signal lines in a manner that ensures that data written to a memory in a write operation of a given memory cycle can be read from the memory in a read operation of a subsequent memory cycle.

Abstract: Scan distributor, collector, and controller circuitry connect to the functional inputs and outputs of core circuitry on integrated circuits to provide testing through those functional inputs and outputs. Multiplexer and demultiplexer circuits select between the scan circuitry and the functional inputs and outputs. The core circuitry can also be provided with built-in scan distributor, collector, and controller circuitry to avoid having to add it external of the core circuitry. With appropriately placed built-in scan distributor and collector circuits, connecting together the functional inputs and outputs of the core circuitry also connects together the scan distributor and collector circuitry in each core. This can provide a hierarchy of scan circuitry and reduce the need for separate test interconnects and multiplexers.

Abstract: A method and apparatus for preventing the overwriting of memory contents during certain scan operations is disclosed. An integrated circuit (IC) may include a memory and a scan chain having a number of serially coupled scan elements. A number of the scan elements may be coupled to circuitry for inputting signals to or receiving signals output from the memory. An inhibit circuit may also be coupled to the circuitry for inputting signals to the memory. During scan shifting operations commensurate with a scan dump mode or a memory dump mode, the inhibit circuit may de-assert one or more control signals that otherwise enable access to the memory in order to prevent shifted data from overwriting the contents stored in the memory. The apparatus may also include a bypass unit coupled to a memory read port, which can be activated to prevent unauthorized access to protected data stored in the memory.

Abstract: Today many instances of IEEE 1149.1 Tap domains are included in integrated circuits (ICs). While all TAP domains may be serially connected on a scan path that is accessible external to the IC, it is generally preferred to have selectivity on which Tap domain or Tap domains are accessed. Therefore Tap domain selection circuitry may be included in ICs and placed in the scan path along with the Tap domains. Ideally, the Tap domain selection circuitry should only be present in the scan path when it is necessary to modify which Tap domains are selected in the scan path. The present disclosure describes a novel method and apparatus which allows the Tap domain selection circuitry to be removed from the scan path after it has been used to select Tap domains and to be replaced back into the scan path when it is necessary to select different Tap domains.

Abstract: A first apparatus, such as a die or a semiconductor package, has signal paths extending through the apparatus. The signal paths can include through vias and other components. The signal paths are operable to communicate with a second apparatus when the second apparatus is stacked with the first apparatus. The first apparatus also has pass gates. Each pass gate is configurable in response to a signal, to short a pair of the signal paths to enable substantially simultaneous testing of the signal paths. The pass gates may be configurable to isolate the signal paths during operation of the first apparatus.

Abstract: An integrated circuit comprises scan test circuitry and additional circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises at least one scan chain having scan cells. The scan test circuitry further comprises transition launch mode selection circuitry configured to provide independent selection between multiple transition launch modes for each of a plurality of clock domains of the integrated circuit. The multiple transition launch modes may include, for example, at least a launch-on-shift mode and a launch-on-capture mode. These transition launch modes provide different manners of launching a given signal transition via at least one of the scan cells in a corresponding one of the clock domains. The transition launch mode selection circuitry may be configured to generate from a common shift enable signal multiple independently controllable shift enable signals for respective ones of the clock domains of the integrated circuit.

Abstract: Testing of integrated circuits is achieved by a test architecture utilizing a scan frame input shift register, a scan frame output shift register, a test controller, and a test interface comprising a scan input, a scan clock, a test enable, and a scan output. Scan frames input to the scan frame input shift register contain a test stimulus data section and a test command section. Scan frames output from the scan frame output shift register contain a test response data section and, optionally, a section for outputting other data. The command section of the input scan frame controls the test architecture to execute a desired test operation.

Abstract: The disclosure describes a novel method and apparatus for allowing response data output from the scan outputs of a circuit under test to be formatted and applied as stimulus data input to the scan inputs of the circuit under test. Also the disclosure described a novel method and apparatus for allowing the response data output from the scan outputs of a circuit under test to be formatted and used as expected data to compare against the response data output from the circuit under test. Additional embodiments are also provided and described in the disclosure.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: A Scan-BIST architecture is adapted into a low power Scan-BIST architecture. A generator 102, compactor 106, and controller 110 remain the same as in the known art. The changes between the known art Scan-BIST architecture and the low power Scan-BIST architecture involve modification of the known scan path into scan path 502, to insert scan paths A 506, B 508 and C 510, and the insertion of an adaptor circuit 504 in the control path 114 between controller 110 and scan path 502.

Abstract: A method includes shifting a first logic sequence into a first scan chain having a first plurality of scan blocks coupled together, outputting a second logic sequence from each of the plurality of scan blocks in the first scan chain to a respective scan block in a second scan chain, and shifting a third logic sequence out of the second scan chain. At least one improperly functioning scan block of the first scan chain is identified based on the third logic sequence shifted out of the second scan chain.

Abstract: An integrated circuit comprises scan test circuitry and additional circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises at least one scan chain having a plurality of scan cells, with the scan chain being configured to operate as a serial shift register in a scan shift mode of operation and to capture functional data from at least a portion of the additional circuitry in a functional mode of operation. At least a given one of the scan cells of the scan chain comprises output control circuitry which is configured to disable a functional data output of the scan cell in the scan shift mode of operation and to disable a scan output of the scan cell in the functional mode of operation.

Abstract: The disclosure describes novel methods and apparatuses for accessing test compression architectures (TCA) in a device using either a parallel or serial access technique. The serial access technique may be controlled by a device tester or by a JTAG controller. Further the disclosure provides an approach to access the TCA of a device when the device exists in a daisy-chain arrangement with other devices, such as in a customer's system. Additional embodiments are also provided and described in the disclosure.

Abstract: A test architecture accesses IP core test wrappers within an IC using a Link Instruction Register (LIR). An IEEE P1500 standard is in development for providing test access to these individual cores via a test structure called a wrapper. The wrapper resides at the boundary of the core and provides a way to test the core and the interconnections between cores. The test architecture enables each of the plural wrappers in the IC, including wrappers in cores embedded within other cores, with separate enable signals.

Abstract: To improve a delay fault coverage without increasing an area overhead, provided is a scan test circuit including: scan flip-flops forming a clock domain that operates according to the same clock within a semiconductor integrated circuit including a target of a delay fault test; a test pattern generation mode control unit (scan flip-flop) that is supplied with the same clock as that supplied to the scan flip-flops, and selects one of a skewed-load mode and a broadside mode as a test pattern generation mode of the delay fault test; and a scan enable signal output unit (OR gate) that outputs a first scan enable signal, which is determined based on the test pattern generation mode, to the scan flip-flops.

Abstract: Scan distributor, collector, and controller circuitry connect to the functional inputs and outputs of core circuitry on integrated circuits to provide testing through those functional inputs and outputs. Multiplexer and demultiplexer circuits select between the scan circuitry and the functional inputs and outputs. The core circuitry can also be provided with built-in scan distributor, collector, and controller circuitry to avoid having to add it external of the core circuitry. With appropriately placed built-in scan distributor and collector circuits, connecting together the functional inputs and outputs of the core circuitry also connects together the scan distributor and collector circuitry in each core. This can provide a hierarchy of scan circuitry and reduce the need for separate test interconnects and multiplexers.

Abstract: An integrated circuit comprises a scan chain with parallel inputs and outputs coupled to a functional circuit. A scan chain modifying circuit is provided coupled to the scan chain. When testing is authorized the scan chain modifying circuit operates in a mode wherein a normal shift path is provided through the scan chain. When testing is not authorized the scan chain modifying circuit operates to effect spontaneous dynamic changes in the shift path, which dynamically vary the length of the shift path between external terminals of the integrated circuit while shifting takes place. In an embodiment the dynamical variations are controlled by a running key comparison. In other embodiments running key comparison is used to disable transfer through the scan chain or operation of functional circuits.

Abstract: An integrated circuit for performing a design for testability (DFT) scan test is provided. The integrated circuit includes at least one scan chain including a plurality of flip-flops, at least one interface scan chain including a plurality of flip-flops, a decompressor configured to be connected with an input terminal of the at least one interface scan chain and to decompress a first input signal and then transmit it to the at least one scan chain, a compressor configured to be connected with an output terminal of the at least one scan chain and to compress an output signal of the at least one scan chain, and at least one multiplexer configured to be connected with the decompressor and to selectively output an output signal of the decompressor or a second input signal in response to a control signal.

Abstract: An integrated circuit or circuit board includes functional circuitry and a scan path. The scan path includes a test data input lead, a test data output lead, a multiplexer, and scan cells. A dedicated scan cell has a functional data output separate from a test data output. Shared scan cells each have a combined output for functional data and test data. The shared scan cells are coupled in series. The test data input of the first shared scan cell is connected to the test data output of the dedicated scan cell. The combined output of one shared scan cell is coupled to the test data input lead of another shared scan cell. The multiplexer has an input coupled to the test data output, an input connected to the combined output lead of the last shared scan cell in the series, and an output connected in the scan path.

Abstract: Scan architectures are commonly used to test digital circuitry in integrated circuits. The present invention describes a method of adapting conventional scan architectures into a low power scan architecture. The low power scan architecture maintains the test time of conventional scan architectures, while requiring significantly less operational power than conventional scan architectures. The low power scan architecture is advantageous to IC/die manufacturers since it allows a larger number of circuits (such as DSP or CPU core circuits) embedded in an IC/die to be tested in parallel without consuming too much power within the IC/die. Since the low power scan architecture reduces test power consumption, it is possible to simultaneously test more die on a wafer than previously possible using conventional scan architectures. This allows wafer test times to be reduced which reduces the manufacturing cost of each die on the wafer.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: A method for applying test patterns to scan chains in a circuit-under-test. The method includes providing a compressed test pattern of bits; decompressing the compressed test pattern into a decompressed test pattern of bits as the compressed test pattern is being provided; and applying the decompressed test pattern to scan chains of the circuit-under-test. The actions of providing the compressed test pattern, decompressing the compressed test pattern, and applying the decompressed pattern are performed synchronously at the same or different clock rates, depending on the way in which the decompressed bits are to be generated. A circuit that performs the decompression includes a decompressor such as a linear finite state machine adapted to receive a compressed test pattern of bits. The decompressor decompresses the test pattern into a decompressed test pattern of bits as the compressed test pattern is being received.

Abstract: A system for testing multi-clock domains in an integrated circuit (IC) includes a plurality of clock sources coupled to a plurality of clock controllers. Each of the clock sources generates a fast clock associated with one of the multi-clock domains. Each of the clock controllers is configured to provide capture pulses to test one clock domain. The capture pulses provided to a clock domain are at a frequency of a fast clock associated with the clock domain. The clock controllers operate sequentially to provide the capture pulses to test the clock domains.

Abstract: A method and apparatus for testing a scan-based 3D integrated circuit (3DIC) using time-division demultiplexing/multiplexing allowing for high-data-rate scan patterns applied at input/output pads converting into low-data-rate scan patterns applied to each embeddded module in the 3DIC. A set of 3D design guidelines is proposed to reduce the number of test times and the number of through-silicon vias (TSVs) required for both pre-bond testing and post-bond testing. The technique allows reuse of scan patterns developed for pre-bond testing of each die (layer) for post-bond testing of the whole 3DIC. It further reduces test application time without concerns for I/O pad count limit and risks for fault coverage loss.

Abstract: In a particular embodiment, a method is disclosed that includes mapping failing bit positions within multiple scan chains to memory locations of a memory mask. The method also includes executing logic built-in self-test (LBIST) testing on a semiconductor device using the memory mask to selectively mask certain results within the multiple scan chains. The results are associated with performance of LBIST testing on the semiconductor device.

Abstract: Topology discovery of a target system having a plurality of components coupled with a scan topology may be performed by driving a low logic value on the data input signal and a data output signal of the scan topology. An input data value and an output data value for each of the plurality of components is sampled and recorded. A low logic value is then scanned through the scan path and recorded at each component. The scan topology may be determined based on the recorded data values and the recorded scan values.

Abstract: An integrated circuit comprises scan test circuitry and additional circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises a scan chain having a plurality of scan cells. The integrated circuit further comprises a clock distribution network configured to provide clock signals to respective portions of the integrated circuit. The clock distribution network comprises clock gating circuitry configured to control delivery of one or more of the clock signals along respective clock signal lines of the clock distribution network at least in part responsive to a scan shift control signal that is also utilized to cause the scan cells to form a serial shift register during scan testing. The clock gating circuitry may be used to determine whether a clock delay defect that causes a scan error during scan testing will also cause a functional error during functional operation, thereby improving yield in integrated circuit manufacturing.

Abstract: A test control port (TCP) includes a state machine SM, an instruction register IR, data registers DRs, a gating circuit and a TDO MX. The SM inputs TCI signals and outputs control signals to the IR and to the DR. During instruction or data scans, the IR or DRs are enabled to input data from TDI and output data to the TDO MX and the top surface TDO signal. The bottom surface TCI inputs may be coupled to the top surface TCO signals via the gating circuit. The top surface TDI signal may be coupled to the bottom surface TDO signal via TDO MX. This allows concatenating or daisy-chaining the IR and DR of a TCP of a lower die with an IR and DR of a TCP of a die stacked on top of the lower die.