Abstract: Testing methods in a pre-programmed memory device after it has been assembled into a final customer platform include issuing a self-test command to the memory device, the memory device reporting results of a self-test of pre-programmed data executed responsive to receiving the self-test command, and issuing a self-repair command responsive to the results indicating repair of the pre-programmed data is needed.

Abstract: The present invention provides a switching converter with pulse skipping mode. The switching converter comprises a switching circuit having at least one switch, a controller and a feedback circuit. The controller comprises an error amplifying circuit, a logic circuit, a ramp signal generator and a pulse skipping circuit. The error amplifying circuit generates a compensation signal based on comparing the feedback signal with a reference signal. The logic circuit generates a control signal to control the ON and OFF switching of the at least one switch based on the compensation signal. The ramp signal generator generates a ramp signal. The pulse skipping circuit generates a pulse skipping signal based on the compensation signal, the ramp signal and a threshold voltage. The logic circuit skips one or more switching pulses of the control signal in accordance with the pulse skipping signal.

Abstract: A semiconductor device and a test apparatus including the same, the semiconductor device including a command distributor receiving a serial command that is synchronized with a first clock signal and converting the serial command into a parallel command, a command decoder receiving the parallel command and generating a pattern sequence based on the parallel command, and a signal generator receiving the pattern sequence and generating operating signals synchronized with a second clock signal, wherein a frequency of the first clock signal is less than a frequency of the second clock signal.

Abstract: Embodiments relate to reliably storing information in a sensor or other device. In an embodiment, information storage circuitry comprises independent, redundant memory portions and error detection circuitry. The circuit can operate in cooperation with a memory writing procedure that utilizes a validity bit and sequentially writes to one or the other of the redundant memory portions such that at least one of the memory portions has data that is valid and can be recognized as such.

Abstract: Systems, methods, and devices related to testing receive equipment. A test signal generator is coupled to both a receiver and an antenna. The receiver is also coupled to the antenna and a test signal verifier. A test signal is synthesized at the generator and is routed to the receiver. Once the verifier verifies that the test signal was received by the receiver, this ensures that the equipment coupled to the receiver, as well as the receiver itself, is in operating condition. Switches or other means of routing the test signal between the different components of the system can also be present.

Abstract: The present invention discloses a method of testing a partially assembled multi-die device (1) by providing a carrier (300) comprising a device-level test data input (12) and a device-level test data output (18); placing a first die on the carrier, the first die having a test access port (100c) comprising a primary test data input (142), a secondary test data input (144) and a test data output (152), the test access port being controlled by a test access port controller (110); communicatively coupling the secondary test data input (144) of the first die to the device-level test data input (12), and the test data output (152) of the first die to the device-level test data output (18); providing the first die with configuration information to bring the first die in a state in which the first die accepts test instructions from its secondary test data input (144); testing the first die, said testing including providing the secondary test data input (144) of the first die with test instructions through the device-

Abstract: Methods and structure are provided for trapping incoming requests directed to hardware registers of an electronic device. The electronic device that comprises a set of hardware registers that define a configuration of the electronic device, circuitry that implements programmable logic defining which hardware registers have been flagged for trapping incoming requests, and a shadow memory that includes values corresponding to the flagged hardware registers. The circuitry is further operable to access a value in shadow memory that corresponds to a flagged hardware register, responsive to receiving a request from an external device to access the flagged hardware register.

Abstract: Testing of die on wafer is achieved by; (1) providing a tester with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, (2) providing die on wafer with the capability of externally communicating JTAG test signals using simultaneously bidirectional transceiver circuitry, and (3) providing a connectivity mechanism between the bidirectional transceiver circuitry's of the tester and a selected group or all of the die on wafer for communication of the JTAG signals.

Abstract: A method and system is provided for automatically generating valid at speed structural test (ASST) test groups. The method includes loading a netlist for an integrated circuit into a processor. The method further includes determining a plurality of clock domain crossings between a plurality of clock domains within the integrated circuit. The method further includes generating a first test group. The method further includes adding a first clock domain of the plurality of clock domains to the first test group. The method further includes adding a second clock domain of the plurality of clock domains to the first test group when the second clock domain does not have a clock domain crossing into the first clock domain.

Abstract: A memory card and methods for testing memory cards are disclosed herein. The memory card has a test interface that allows testing large numbers of memory cards together. Each memory card may have a serial data I/O contact and a test select contact. The memory cards may only send data via the serial data I/O contact when selected, which may allow many memory cards to be connected to the same serial data line during test. Moreover, existing test socket boards may be used without adding additional external circuitry. Thus, cost effective testing of memory cards is provided. In some embodiments, the test interface allows for a serial built in self test (BIST).

Abstract: An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.

Abstract: Provided is an apparatus configured for testing a logic device. The apparatus includes a testing mechanism configured to output test patterns representative of logical structures within the logic device and a testable logic device having (i) input ports coupled to output ports of the automated testing mechanism and (ii) output ports coupled to input ports of the automated testing mechanism. The apparatus also includes a fusing mechanism configured to compensate for defects within the logic device responsive to a segregation of the type of defects identified.

Abstract: A method includes reading, through a processor of a computing device communicatively coupled to a memory, a design of an electronic circuit as part of verification thereof. The method also includes extracting, through the processor, a set of optimized instructions of a test algorithm involved in the verification such that the set of optimized instructions covers a maximum portion of logic functionalities associated with the design of the electronic circuit. Further, the method includes executing, through the processor, the test algorithm solely relevant to the optimized set of instructions to reduce a verification time of the design of the electronic circuit.

Abstract: A method includes receiving a request to read data at a data storage device from an external device. In response to determining that the data is in a first memory of the data storage device, a first read operation is initiated to read the data from the first memory and a response is sent to the external device. The response indicates an error correction code (ECC) error. A read latency of the first read operation exceeds a reply time period corresponding to the request. The response is sent prior to completion of the first read operation and within reply time period.

Abstract: A printed circuit board, an in-circuit test structure and a method for producing the in-circuit test structure thereof are disclosed. The in-circuit test structure comprises a via and a test pad. The via passes through the printed circuit board for communicating with an electrical device to be tested on the printed circuit board. The test pad is formed on an upper surface of the printed circuit board and covering the via, wherein a center of the via deviates from a center of the test pad. In the in-circuit test, the accuracy of the test data can be improved by means of the in-circuit test structure provided by the present invention, and thus the reliability of the test result is ensured. Also, the test efficiency of the in-circuit test is improved.

Abstract: A chip with a built-in self-test (BIST) component capable of testing the linearity of an ADC is described herein. The BIST component uses hardware registers to facilitate a sliding histogram technique to save space on the chip. A subset of detected digital codes are analyzed, and DNL and INL calculations are performed by a controller to determine whether any of the digital codes in the subset exceed maximum or minimum DNL and INL thresholds. New digital codes being detected by the ADC are added to the subset as lower-value digital codes are pushed out of the subset, maintaining the same number of digital codes being analyzed as the subset moves from lower codes detected during lower voltages to higher codes detected at higher voltages. A synchronizer and pointer ensure that the subset moves through the digital codes at the same rate as the analog input ramp source.

Abstract: Techniques and mechanisms are provided for an improved built in self-test (BIST) mechanism for 3D assembly defect detection. According to an embodiment of the present disclosure, the described mechanisms and techniques can function to detect defects in interconnects which vertically connect different layers of a 3D device, as well as to detect defects on a 2D layer of a 3D integrated circuit. Additionally, according to an embodiment of the present disclosure, techniques and mechanisms are provided for determining not only the presence of a defect in a given set of interfaces of an integrated circuit, but the particular interface at which a defect may exist.

Abstract: An on-chip functional debugger includes one or more functional blocks each providing one or more functional outputs. A hierarchical selection tree is formed by one or more selectors having the output of one of the selectors as a final output and individual selector inputs coupled either to a functional output from the functional blocks or to an output of another selector. A selection signal coupled to the select input of each of the selectors to enable a selected one of its output. An output node coupled to the final output. A method of providing on-chip functional debugging is also provided. A desired functional output from one or more available functional outputs is selected and then the selected functional output is coupled to an output node.

Abstract: Electronic apparatus, systems, and methods of operating and constructing the electronic apparatus and/or systems include an embedded processor disposed in a logic chip to direct, among other functions, self-testing of an electronic device structure in conjunction with a pattern buffer disposed in the logic chip, when the electronic device structure is coupled to the logic chip. Additional apparatus, systems, and methods are disclosed.

Abstract: A system includes a first device, a first storage element, a comparator and a second device. The first device is configured to test memory cells in an array of memory cells to detect defective memory cells. The defective memory cells include a first memory cell and a second memory cell. The first storage element is configured to store a first address of the first memory cell. The comparator is configured to compare a second address of the second memory cell to the first address.

Abstract: A test architecture accesses IP core test wrappers within an IC using a Link Instruction Register (LIR). An IEEE P1500 standard is in development for providing test access to these individual cores via a test structure called a wrapper. The wrapper resides at the boundary of the core and provides a way to test the core and the interconnections between cores. The test architecture enables each of the plural wrappers in the IC, including wrappers in cores embedded within other cores, with separate enable signals.

Abstract: A test architecture accesses IP core test wrappers within an IC using a Link Instruction Register (LIR). An IEEE P1500 standard is in development for providing test access to these individual cores via a test structure called a wrapper. The wrapper resides at the boundary of the core and provides a way to test the core and the interconnections between cores. The test architecture enables each of the plural wrappers in the IC, including wrappers in cores embedded within other cores, with separate enable signals.

Abstract: A semiconductor device includes a first CPU, a second CPU having a configuration that is the same as or comparable to a configuration of the first CPU, and a comparator that compares an output of the first CPU with an output of the second CPU. The second CPU is made so as to have a lower operating margin than the first CPU. By supplying a same signal to the first CPU and the second CPU and then detecting a mismatch between the outputs of the first CPU and the second CPU as a result of comparison, the abnormality is predicted. The semiconductor device includes a reset control circuit that resets the device when the result of comparison by the comparator indicates an error.

Abstract: Methods and structure are provided for routing internal operational signals of a circuit for output via an external interface. The structure includes an integrated circuit. The integrated circuit comprises a block of circuitry components operable to generate internal operational signals for performing designated functions during normal operation of the circuit, a control unit, a test signal routing hierarchy, and an external interface. The test signal routing hierarchy is coupled to receive the internal operational signals and controllably selects the internal operational signals for acquisition and applies them to the control unit. The external interface provides communications between the integrated circuit and an external device during normal operation of the integrated circuit.

Abstract: Methods and structure for correlating internal operational signals routed via different paths of a test signal selection hierarchy. The structure includes a functional block of circuitry operable to generate internal operational signals and clock signals. The integrated circuit also comprises a test signal selection hierarchy operable to receive the internal operational signals and the clock signals and to selectively route the internal operational signals and the clock signals. Further, structure includes a control unit operable to receive the clock signals from the test signal selection hierarchy, to determine a delay between received clock signals routed via different signaling pathways of the test signal selection hierarchy. The control unit is further operable to program a delay line based upon the delay between the clock signals and based upon internal operational signals correlated with the clock signals.

Abstract: The present invention provides a conversion circuit including: an inputting unit, a DAC connected to the inputting unit, an ADC connected to an output end of the DAC, and a comparing unit connected to an output end of the ADC. The comparing unit compares a test code set output by the ADC with a second standard test code set, and if the comparison result is in a preset error range, notify a test data collecting unit; otherwise, output the comparison result to a correcting unit. The correcting unit obtains a complementary code set according to the comparison result, and output the complementary code set to the inputting unit, so that the inputting unit updates the standard test code set according to the complementary code set and obtains the updated first standard test code set. The test data collecting unit obtains a voltage value of an input end of the ADC.

Abstract: A semiconductor device include a first wrapper including a first scan flip-flop, first control flip-flops and a first pad, the first scan flip-flop receiving a first value and second values and storing the second value for determining a function of the first pad; a second wrapper including a second scan flip-flop, second control flip-flops and a second pad, the second scan flip-flop receiving the first value from the first wrapper and storing the first value for determining a function of the second pad; and an input/output controller configured to provide a shift input signal having the first and second values to the first wrapper.

Abstract: Methods and devices for using high-speed serial links for scan testing are disclosed. The methods can work with any scheme of scan data compression or with uncompressed scan testing. The protocol and hardware to support high speed data transfer reside on both the tester and the device under test. Control data may be transferred along with scan data or be partially generated on chip. Clock signals for testing may be generated on chip as well. In various implementations, the SerDes (Serializer/Deserializer) may be shared with other applications. The Aurora Protocol may be used to transport industry standard protocols. To compensate for effects of asynchronous operation of a conventional high-speed serial link, buffers may be used. The high-speed serial interface may use a data conversion block to drive test cores.

Abstract: A test card includes a power interface, a controller, a test interface, and a test point. The test interface includes a power pin, a start pin, and a data signal pin. The power interface is connected to the controller and the power pin, and also connected to an external power to receive a work voltage. The controller transmits a turn-on signal to the start pin. The test point is connected to the data signal pin. When an interface of a motherboard is connected to the test interface, the power pin, the start pin, and the data signal pin are connected to corresponding pins of the interface of the motherboard. The motherboard outputs a data signal to the test point through the motherboard interface and the test interface after the controller receives the turn-on signal.

Abstract: A system for testing an integrated circuit, in which the system includes a deserializer, a frame sync module, and a diagnostic module. The deserializer is external to the integrated circuit and is configured to receive messages in a serial data format, wherein the messages include test results associated with the integrated circuit, and deserialize the messages into data frames. The frame sync module is configured to provide control code based on the data frames, wherein the control code includes, in a digital format, status information associated with the messages deserialized into the data frames. The diagnostic module is configured to generate, based on the control code, diagnostic data associated with states of the integrated circuit.

Abstract: An architecture for testing a plurality of circuits on an integrated circuit is described. The architecture includes a TAP Linking Module located between test pins on the integrated circuit and 1149.1 Test Access Ports (TAP) of the plurality of circuits to be tested. The TAP Linking Module operates in response to 1149.1 scan operations from a tester connected to the test pins to selectively switch between 1149.1 TAPs to enable test access between the tester and plurality of circuits. The TAP Linking Module's 1149.1 TAP switching operation is based upon augmenting 1149.1 instruction patterns to affix an additional bit or bits of information which is used by the TAP Linking Module for performing the TAP switching operation.

Abstract: A system and method for sharing a communications link between multiple protocols is described. A system includes a communications interface configured to exchange information with other systems using at least one of a plurality of protocols; a protocol select register that stores a value that selects a protocol from among the plurality of protocols to become an active protocol; and a state machine accessible to the communications interface, the state machine used to control the exchange of information through the communications interface according to the active protocol. The active protocol is used by the communications interface to exchange information while the remaining protocols of the plurality of protocols remain inactive. The state machine sequences through a series of states that cause the communications interface to operate according to the active protocol, and that are designated as inert sequences under the remaining protocols.

Abstract: A micro controller includes an input and output unit having a reset terminal, a plurality of input terminals, and a test enable terminal, a test mode setting unit which allocates a first input terminal of the plurality of input terminals to a test clock terminal and allocates the remaining N input terminals to L test terminals, in response to a signal output from the input and output unit, and a processor which controls the input and output unit and the test mode setting unit. The test mode setting unit includes M flip-flops which receives a test clock signal from the first input terminal, a test signal from the N input terminals, and a test enable signal from the test enable terminal, and a decoder which decodes a signal output from the M flip-flops and determines whether or not to allocate the N input terminals to the L test terminals.

Abstract: A processor includes a TCU TAP for access of a TCU for running functional tests and a DAP TAP for access of a debugger. A TAP selection module selects reversibly TAP access by default through the TCU TAP when the processor is a bare die, or by default through the DAP TAP when the processor is packaged, the selection of TAP access being reversible by the TCU. The processor also includes a fuse for irreversibly disabling the selection by the TAP selection module of the TAP access by default through the TCU TAP. Functional tests on bare dies are run with a TCU probing the dies through the TCU TAP by default. Packaged engineering samples can be supplied for debugging with the DAP TAP selected by default, but access possible for the TCU through the TCU TAP.

Abstract: Embedded logic is implemented in a partially reconfigurable programmable logic device (PLD), thus allowing debugging of implemented instantiations of logic after partial reconfiguration. Several instantiations of logic are received at the PLD. One instantiation of logic is implemented in a reconfigurable region of logic within the PLD. The instantiation of logic includes a port that provides a constant interface between the reconfigurable region of logic and a fixed region of logic within the PLD. The port may receive signals from probe points implemented within the reconfigurable region of logic. The port may provide the signals to a signal interface implemented within a fixed region of logic. Furthermore, an embedded logic analyzer may be implemented in either the reconfigurable region of logic or the fixed region of logic. The embedded logic analyzer receives signals from the probe points and provides signal visibility to an external computing system.

Abstract: Aspects of the invention relate to low power BIST-based testing. A low power test generator may comprise a pseudo-random pattern generator unit, a toggle control unit configured to generate toggle control data based on bit sequence data generated by the pseudo-random pattern generator unit, and a hold register unit configured to generate low power test pattern data by replacing, based on the toggle control data received from the toggle control unit, data from some or all of outputs of the pseudo-random pattern generator unit with constant values during various time periods. The low power test generator may further comprise a phase shifter configured to combine bits of the low power test pattern data for driving scan chains.

Abstract: An integrated circuit comprises scan test circuitry and additional circuitry subject to testing utilizing the scan test circuitry. The scan test circuitry comprises transition control circuitry configured to detect transitions between binary logic levels in a scan test signal, and responsive to a number of detected transitions reaching a threshold, to limit further transitions associated with a remaining portion of the scan test signal. In an illustrative embodiment, the transition control circuitry limits further transitions associated with the remaining portion of the scan test signal by replacing at least part of the remaining portion of the scan test signal with a limited transition signal. The limited transition signal may be maintained at a constant binary logic level such that it has no transitions. By limiting the number of transitions associated with the scan test signal, the transition control circuitry serves to reduce integrated circuit power consumption during scan testing.

Abstract: According to one embodiment, a semiconductor integrated circuit includes at least one memory and at least one built-in self test (BIST) circuit. In the memory, data can be stored. The BIST circuit tests the memory and includes an address generator. The address generator operates in one of a first operating mode and a second operating mode. In the first operating mode, address signals corresponding to all addresses of the memory are generated. In the second operating mode, the address signals are generated such that each bit of an address input of the memory can be one signal state of both 0 and 1 and such that different bits constitute a set of pieces of data in which the bits choose different signal states at least once.

Abstract: An integrated circuit or circuit board includes functional circuitry and a scan path. The scan path includes a test data input lead, a test data output lead, a multiplexer, and scan cells. A dedicated scan cell has a functional data output separate from a test data output. Shared scan cells each have a combined output for functional data and test data. The shared scan cells are coupled in series. The test data input of the first shared scan cell is connected to the test data output of the dedicated scan cell. The combined output of one shared scan cell is coupled to the test data input lead of another shared scan cell. The multiplexer has an input coupled to the test data output, an input connected to the combined output lead of the last shared scan cell in the series, and an output connected in the scan path.

Abstract: The present disclosure describes a novel method and apparatus of using the JTAG TAP's TMS and TCK terminals as a general purpose serial Input/Output (I/O) bus. According to the present disclosure, the TAP's TMS terminal is used as a clock signal and the TCK terminal is used as a bidirectional data signal to allow serial communication to occur between; (1) an IC and an external controller, (2) between a first and second IC, or (3) between a first and second core circuit within an IC.

Abstract: A system and method for efficiently debugging an integrated circuit with on-die hardware. A processor core includes an on-die debug state machine (DSM). The DSM includes multiple programmable storage elements for storing parameter values corresponding to multiple contexts. Each context is associated with a given one of multiple instruction sequences, such as at least threads and power-performance states. The DSM detects a sequence identifier (ID) and selects a context based on the sequence ID. The corresponding parameter values are used by transition conditions (triggers) and taken debug actions in a finite state machine (FSM) within the DSM. Each state and transition in the FSM is used by each one of the multiple contexts. The programmable DSM shares many resources, rather than replicating them, while being used for multiple sequences.

Abstract: A method and system for compiling a representation of a source circuit including one or more source subchannels associated with portions of source logic driven by a plurality of clock domains are described. Each source subchannel may generate packets carrying signal data from one of the portions of the source logic. A representation of a destination circuit may be compiled to include one or more destination subchannels associated with portions of destination logic replicating the source logic. Each destination subchannel may forward the signal data via the packets to one of the portions of the destination logic. A switching logic may be configured to map the source subchannels to the destination subchannels as virtual channels to forward the packets from the source subchannels to the destination subchannels. A single queue may be configured to couple with the switching logic to record packets from the source subchannels into a packet stream for a delay period to distribute to the destination subchannels.

Abstract: An address and command port interface selectively enables JTAG TAP domain operations and Trace domain operations within an IC. The port carries TMS and TDI input and TDO output on a single pin and receives a clock signal on a separate pin. The addressable two pin interface loads and updates instructions and data to the TAP domain within the IC. The instruction or data update operations in multiple ICs occur simultaneously. A process transmits data from an addressed target device to a controller using data frames, each data frame comprising a header bit and data bits. The logic level of the header bit is used to start, continue, and stop the data transmission to the controller. A data and clock signal interface between a controller and multiple target devices provides for each target device to be individually addressed and commanded to perform a JTAG or Trace operation.

Abstract: A panel driving circuit that produces a panel test pattern and a method of testing a panel are provided. The driving circuit includes a pattern generation unit and a selection unit. The pattern generation unit responds to a system clock and produces pattern test data and pattern test signals. The selection unit responds to a test signal and selects and outputs either (a) the pattern test data and the pattern test signals that are outputted from the pattern generation unit, or (b) the pattern test data and pattern test signals that are directly applied from the outside. The driving circuit and the method of the panel test generates the panel test data, the horizontal synchronizing signal, the vertical synchronizing signal, and the data activating signal within the driving circuit using a system clock so that the testing of the panel can be carried out without using a separate test device.

Abstract: The disclosure describes a novel method and apparatus for improving interposers that connected stacked die assemblies to system substrates. The improvement includes the addition of IEEE 1149.1 circuitry within interposers to allow simplifying interconnect testing of digital and analog signal connections between the interposer and system substrate it is attached too. The improvement also includes the additional 1149.1 controlled circuitry that allows real time monitoring of voltage supply and ground buses in the interposer. The improvement also includes the additional of 1149.1 controlled circuitry that allows real time monitoring of functional digital and analog input and output signals in the interposer. The improvement also provides the ability to selectively serially link the 1149.1 circuitry in the interposer with 1149.1 circuitry in the die of the stack.

Abstract: A data processing system and method for regulating a voltage supply to functional circuitry configured to operate from a variable voltage supply, the functional circuitry having at least one error correction circuit configured to detect and repair errors in operation of the functional circuitry. Voltage regulator circuitry provides the voltage supply to the functional circuitry, and modifies the voltage level of the voltage supply based on a feedback control signal. Error rate history circuitry receives error indications from the error correction circuit during operation of the functional circuitry and generates error rate history information therefrom. An adaptive controller then generates the feedback control signal in dependence on the error rate history information such that the adaptive controller adjusts the feedback control signal over time having regard to the error rate history information in order to obtain a predetermined target non-zero error rate within the functional circuitry.

Abstract: A test system having a sub-system to sub-system bridge may be provided that utilizes the useful attributes of a plurality of circuit testing techniques, while reducing deficiencies associated with certain types of circuit testing. A bridged test system structure is utilized to facilitate circuit testing that is more effective and time efficient. The method analyzes performance data acquired by a first component for one or more circuits, and sends that performance data to a second test component. The second test component provides test signals to the circuits, using the performance date to enhance the use of the test signals, and also provides test response data for the circuits in response to the provided test signals.

Abstract: Various embodiments of the present invention provide systems and methods for evaluating and debugging a data decoder. For example, a data decoder circuit is discussed that includes an input memory, a data decoder operable to decode data from the input memory in one or more iterations, an output memory operable to store decoded data from the data decoder, and a test port operable to provide access to the input memory, the data decoder and the output memory.

Abstract: A system and method for sharing a communications link between multiple protocols is described. A system includes a communications interface configured to exchange information with other systems using at least one of a plurality of protocols; a protocol select register that stores a value that selects a protocol from among the plurality of protocols to become an active protocol; and a state machine accessible to the communications interface, the state machine used to control the exchange of information through the communications interface according to the active protocol. The active protocol is used by the communications interface to exchange information while the remaining protocols of the plurality of protocols remain inactive. The state machine sequences through a series of states that cause the communications interface to operate according to the active protocol, and that are designated as inert sequences under the remaining protocols.

Abstract: One embodiment of a Test Signal generated by Test Signal Synthesis 10 being coupled, by a method of Coupling 12, to an Antenna 14, a Receiver 16 and a Method of Verification 18; for the transmission of a Test Signal to verify the operation of the Receiver Chain of equipment in Applications receiving Intermittent Signals.