Abstract: An electrosurgical generator includes primary and test sources. The primary source supplies a primary signal and the test source supplies a test signal. The electrosurgical generator includes an output circuit and an abnormality detection circuit. The output circuit is electrically coupled to the primary and test sources. The output circuit receives the primary and test signals from the primary and test sources, respectively. The output circuit is electrically coupled to a load to supply the primary signal thereto. The abnormality detection circuit is electrically coupled to the output circuit to detect an abnormality therein as a function of the test signal. The abnormality detection circuit can also determine a location of the abnormality within the output circuit.

Abstract: A processor link that couples a first processor and a second processor is selected for validation and a plurality of communication parameter settings associated with the first and the second processors is identified. The first and the second processors are successively configured with each of the communication parameter settings. One or more test data pattern(s) are provided from the first processor to the second processor in accordance with the communication parameter setting. Performance measurements associated with the selected processor link and with the communication parameter setting are determined based, at least in part, on the test data pattern as received at the second processor. One of the communication parameter settings that is associated with the highest performance measurements is selected. The selected communication parameter setting is applied to the first and the second processors for subsequent communication between the first and the second processors via the processor link.

Abstract: According to exemplary embodiments, a system, method, and computer program product are provided for BER-based wear leveling in a SSD. A block-level BER value for a block in the SSD is determined. An adjusted PE cycle count for the block is incremented or decremented based on the block-level BER value. Wear leveling is then performed in the SSD based on the adjusted PE cycle count.

Abstract: A processor link that couples a first processor and a second processor is selected for validation and a plurality of communication parameter settings associated with the first and the second processors is identified. The first and the second processors are successively configured with each of the communication parameter settings. One or more test data pattern(s) are provided from the first processor to the second processor in accordance with the communication parameter setting. Performance measurements associated with the selected processor link and with the communication parameter setting are determined based, at least in part, on the test data pattern as received at the second processor. One of the communication parameter settings that is associated with the highest performance measurements is selected. The selected communication parameter setting is applied to the first and the second processors for subsequent communication between the first and the second processors via the processor link.

Abstract: A system includes a first device, a first storage element, a comparator and a second device. The first device is configured to test memory cells in an array of memory cells to detect defective memory cells. The defective memory cells include a first memory cell and a second memory cell. The first storage element is configured to store a first address of the first memory cell. The comparator is configured to compare a second address of the second memory cell to the first address.

Abstract: Potential errors that might result from operating logic and/or memory circuits at an insufficient operating voltage are identified by electrically altering nodes of replica or operational circuits so that the electrically altered nodes are susceptible to errors. The electrically altered nodes in an embodiment are controlled using parametric drivers. A minimized operating voltage can be selected by operating at a marginal operating voltage and detecting a voltage threshold at which errors in the electrically altered nodes are detected, for example.

Abstract: An electronic device testing system is configured to test an electronic device which generates a plurality of signals while running. The electronic device testing system includes a programmable logic device (PLD) configured to monitor and control the electronic device and a computer connected to the PLD. The PLD includes a read/write control module connected to the electronic device and a controller connected to the read/write control module. The read/write control module reads the plurality of signals generated by the electronic device. The controller determines whether the plurality of signals has errors and sends error signals to the computer. The computer analyzes the error signals and displays problems associated with the error signals. The present disclosure further discloses an electronic device testing method based upon the above testing system.

Abstract: A circuitry testing module for testing an external circuit of a Light-Emitting Diode (LED) includes at least one logic unit and a latch circuit. Two input terminals of the at least one logic unit are connected to a first end and a second of the LED correspondingly. The output terminal of the at least one logic unit is connected to the latch circuit. If the external circuit works normally, the logic unit outputs a first logic operating signal to the latch unit, and the latch circuit outputs a first latch signal. If the external circuit does not work normally, the logic unit outputs a second logic operating signal to the latch unit, and the latch circuit outputs a second latch signal.

Abstract: A system for testing an integrated circuit, in which the system includes a deserializer, a frame sync module, and a diagnostic module. The deserializer is external to the integrated circuit and is configured to receive messages in a serial data format, wherein the messages include test results associated with the integrated circuit, and deserialize the messages into data frames. The frame sync module is configured to provide control code based on the data frames, wherein the control code includes, in a digital format, status information associated with the messages deserialized into the data frames. The diagnostic module is configured to generate, based on the control code, diagnostic data associated with states of the integrated circuit.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: A system for testing electronic circuits is configured to receive a test signal and an ideal response signal and output a test result signal. The system for testing electronic circuits includes a circuit portion to be tested, a comparator and a comparison result recorder. The circuit portion to be tested receives a test signal from a test instrument, and outputs a system response signal. The comparator receives the system response signal from the circuit portion to be tested and receives an ideal response signal from the test instrument. Then, the comparator outputs a comparison result according to the system response signal and the ideal response signal. The comparison result recorder receives and records the comparison result. The comparison result recorder may record comparison results within a period of test time. The test instrument can obtain a record of the comparison results from the comparison result recorder.

Abstract: Systems and methods for detection of defects on a magnetic storage medium. The method comprises: (1) receiving incoming detected data generated by reading information recorded on a storage medium, (2) identifying the defects in the storage medium based on comparison between the incoming detected data and a data pattern wherein the data pattern is predetermined; and (3) storing location information indicative of locations of the defects on the storage medium.

Abstract: Aspects of the invention relate to low power BIST-based testing. A low power test generator may comprise a pseudo-random pattern generator unit, a toggle control unit configured to generate toggle control data based on bit sequence data generated by the pseudo-random pattern generator unit, and a hold register unit configured to generate low power test pattern data by replacing, based on the toggle control data received from the toggle control unit, data from some or all of outputs of the pseudo-random pattern generator unit with constant values during various time periods. The low power test generator may further comprise a phase shifter configured to combine bits of the low power test pattern data for driving scan chains.

Abstract: Potential errors that might result from operating logic and/or memory circuits at an insufficient operating voltage are identified by electrically altering nodes of replica or operational circuits so that the electrically altered nodes are susceptible to errors. The electrically altered nodes in an embodiment are controlled using parametric drivers. A minimized operating voltage can be selected by operating at a marginal operating voltage and detecting a voltage threshold at which errors in the electrically altered nodes are detected, for example.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: Various embodiments of the present invention provide systems and methods for evaluating and debugging a data decoder. For example, a data decoder circuit is discussed that includes an input memory, a data decoder operable to decode data from the input memory in one or more iterations, an output memory operable to store decoded data from the data decoder, and a test port operable to provide access to the input memory, the data decoder and the output memory.

Abstract: A test controller applies test stimulus signals to the input pads of plural die on a wafer in parallel. The test controller also applies encoded test response signals to the output pads of the plural die in parallel. The encoded test response signals are decoded on the die and compared to core test response signals produced from applying the test stimulus signals to core circuits on the die. The comparison produces pass/fail signals that are loaded in to scan cells of an IEEE 1149.1 scan path. The pass/fail signals then may be scanned out of the die to determine the results of the test.

Abstract: An on-chip testing unit can be implemented in an integrated circuit (e.g., a SoC) to validate the operation of cache memories associated with a processor of the integrated circuit. For each testing instruction to be executed by the processor for testing a cache memory, the testing unit can intercept information (e.g., address, data, and/or control signals) generated by the processor in response to executing the instruction. The testing unit can determine whether information generated by the processor matches corresponding expected information associated with the instruction. This can enable the testing unit to determine whether the processor can correctly identify an address from which the next instruction is to be fetched, can ensure consistency between data in the cache memories and persistent storage devices, and whether the processor is operating as expected. An error notification can be generated if the information generated by the processor does not match the expected information.

Abstract: A system including a frame capture module, a serializer, and a deserializer. The frame capture module is configured to receive, from a device under test, data corresponding to test results, and package the data into first data frames. The serializer is configured serialize the first data frames to form serial messages that include serialized data. The serializer includes i) a first serial link configured to output the serial messages according to a first clock domain, and ii) a second serial link configured to output the serial messages according to a second clock domain. The deserializer is configured to deserialize the serial messages received on the first serial link and the second serial link to form second data frames.

Abstract: A method includes shifting a first logic sequence into a first scan chain having a first plurality of scan blocks coupled together, outputting a second logic sequence from each of the plurality of scan blocks in the first scan chain to a respective scan block in a second scan chain, and shifting a third logic sequence out of the second scan chain. At least one improperly functioning scan block of the first scan chain is identified based on the third logic sequence shifted out of the second scan chain.

Abstract: A method for testing electronic devices that are correspondingly connected to test units includes generating control signals for the electronic devices that are connected to one or more test units selected from the test units. A control unit adds ID codes corresponding to the selected test units to the control signals, and wirelessly transmits the control signals with the ID codes to all of the test units. Each of the test units compares the ID codes added to the control signals with its own stored ID code. When the ID code added to a control signal is in accordance with the ID code stored in one of the test units, the test unit controls the electronic device connected thereto to be turned on and off according to the control signal.

Abstract: The subject matter hereof relates to error detection. Various example embodiments for error defection are disclosed. In an example method of error detection in a Module UnderTest (MUT), a parity signal representing the parity of an MUT output is compared to a parity signal representing the parity of an errorless MUT output. In an example system, an Actual Parity Generator provides a parity signal representing the parity of on MUT output, a State Parity Generator provides a parity signal representing the parity of an errorless MUT output, and a comparator compares these two parity signals.

Abstract: A design for test (DFT) circuitry which delivers serial data serially is disclosed. The DFT circuit has a transceiver to receive serial data and then deserialize the serial data into deserialize data. The DFT circuit also has a control logic block which receives the deserialize data and stimulates at least one test element with the test data. The test element will generate an output response from the stimulus. The DFT circuit also has an output response block which receives the output from the test element and analyses the output response. Utilizing this DFT circuitry, a high speed data delivery method can be used for testing a device-under-test (DUT). Such method could reduce test time and the test cost associated with test process.

Abstract: A scan test architecture facilitates low power testing of semiconductor circuits by selectively dividing the serial scan paths into shorter sections. Multiplexers between the sections control connecting the sections into longer or shorted paths. Select and enable signals control the operation of the scan path sections. The output of each scan path passes through a multiplexer to compare circuits on the semiconductor substrate. The compare circuits also receive expected data and mask data. The compare circuits provide a fail flag output from the semiconductor substrate.

Abstract: This disclosure describes an integrated circuit with self-test features for validating functionality of external interfaces. Example external interfaces include memory interfaces and bus interfaces, such as a peripheral component interconnect (PCI) bus, an advanced high-performance bus (AHB), an advanced extensible interface (AXI) bus, and other external interfaces that operate a high frequency, e.g., 200 MHz or greater. Test logic may be embedded on the integrated circuit and configured to validate functionality of external interfaces while receiving power and non-test signals from external test equipment. Thus, external test equipment may not supply high frequency test signals to the integrated circuit. The external test equipment may, however, independently validate functionality of a pin interface of the integrated circuit. As a result, the integrated circuit may reduce cost and time required to verify functionality and timing of the external interfaces.

Abstract: A process for electrically testing electronic devices includes connecting at least one electronic device to an automatic testing apparatus suitable for testing digital circuits, and sending, through the apparatus, control signals for electrically testing the electronic device. The process further includes electrically testing the electronic device through at least one reconfigurable digital interface connected to the apparatus through a dedicated digital communication channel and comprising a limited number of communication or connection lines strictly appointed to the exchange of the testing information. Response messages are sent from the electronic device to the apparatus through the digital communication channel in response to the control signals. The response messages contain mesaurements, failure information, and data.

Abstract: In the system management server, an information processing apparatus that is an event-information acquisition target is registered as a monitored apparatus in configuration information; event information that complies with a rule stored in advance is identified from among a plurality of pieces of event information stored in the system management server; a server apparatus for a network service related to the event information is identified; and a message is displayed which indicates that the cause of the event that occurred in a client information processing apparatus which has generated event information is an event related to the network service, which occurred in the server apparatus.

Abstract: A device under test—DUT—, comprising the steps of receiving a first data sequence from the DUT in response to a first stimulus signal, wherein the data of a plurality of internal data sequences of the DUT is compressed into the first data sequence, comparing the first data sequence with expected data and for detecting errors in the first data sequence, and providing a second stimulus signal to the DUT in order to instruct the DUT to generate a second data sequence that comprises uncompressed data of the plurality of the internal data sequences at the positions where the errors have been detected.

Abstract: One or more techniques are provided for programming a flash memory device. In one embodiment, the memory device is programmed such that a data pattern written to a page in the memory device has encoded therein an expected count value corresponding to the number of times a first binary value occurs in the data pattern. The data pattern includes the program data and the expected count value, and is written to the page in a single operation. The expected count value may be stored in a count field in the management area of the page. During a page read operation, the expected count value is compared to the actual count of the number of bits having the first binary value in the data area of the page. If the expected count is equal to the actual count, then the program data is determined to be valid.

Abstract: A device and method for verifying the integrity of a memory in a remote device are provided. An exemplary memory integrity verification method compares, based on a verification parameter received from a verifier, the time for retrieving data block of a memory of a remote device with a maximum threshold time allowed to read the memory, and transmits to the verifier a remote verification code and a data status according to the result of comparison so that the verifier can verify the integrity of the memory. Instead of relying on the verifier, the remote device provides data status information for integrity verification by using the memory retrieval time. As a result, accurate integrity verification is provided, and no independent hardware is required to verify integrity.

Abstract: The present invention provides a method and system for improving memory testing efficiency, raising the speed of memory testing, detecting memory failures occurring at the memory operating frequency, and reducing data reported for redundancy repair analysis. The memory testing system includes a first memory tester extracting failed memory location information from the memory at a higher memory operating frequency, an external memory tester receiving failed memory location information at a lower memory tester frequency, and an interface between the first memory tester and the external memory tester. The memory testing method uses data strobes at the memory tester frequency to clock out failed memory location information obtained at the higher memory operating frequency. In addition, the inventive method reports only enough information to the external memory tester for it to determine row, column and single bit failures repairable with the available redundant resources.

Abstract: A waveform generation and measurement module that may be used in automated test equipment. The waveform generation and measurement module includes high speed SERDES (or other shift registers) that are used to digitally draw a test waveform. Additional high speed SERDES may also be used to receive (in serial form) a response waveform from a device under test and convert it to parallel data for high speed processing. The waveform generation and measurement module may be implemented in field programmable gate array logic.

Abstract: A power meter for monitoring current in a power cable annunciates an alarm if the current transgresses one or more alarm current limits. False alarms are avoided by delaying the activation of the alarm for a delay interval following determination that current is flowing in the monitored conductor.

Abstract: Disclosed herein are exemplary embodiments of a so-called “X-press” test response compactor. Certain embodiments of the disclosed compactor comprise an overdrive section and scan chain selection logic. Certain embodiments of the disclosed technology offer compaction ratios on the order of 1000x. Exemplary embodiments of the disclosed compactor can maintain about the same coverage and about the same diagnostic resolution as that of conventional scan-based test scenarios. Some embodiments of a scan chain selection scheme can significantly reduce or entirely eliminate unknown states occurring in test responses that enter the compactor. Also disclosed herein are embodiments of on-chip comparator circuits and methods for generating control circuitry for masking selection circuits.

Abstract: There is provided a test module comprising a random number generator that generates a pseudo random pattern and includes a controller that generates a register selection signal based on a control instruction stored on an instruction memory, a plurality of polynomial configuration registers one of which is selected by the register selection signal, each polynomial configuration register having polynomial data stored therein, a plurality of initial value configuration registers one of which is selected by the register selection signal, each initial value configuration register having an initial value stored therein, and a random number generation shift register that loads the initial value from the selected one of the plurality of initial value configuration registers and sequentially generates the pseudo random pattern based on the polynomial data stored in the selected one of the plurality of polynomial configuration registers.

Abstract: A circuitry testing module for testing an external circuit of a Light-Emitting Diode (LED) includes at least one logic unit and a latch circuit. Two input terminals of the at least one logic unit are connected to a first end and a second of the LED correspondingly. The output terminal of the at least one logic unit is connected to the latch circuit. If the external circuit works normally, the logic unit outputs a first logic operating signal to the latch unit, and the latch circuit outputs a first latch signal. If the external circuit does not work normally, the logic unit outputs a second logic operating signal to the latch unit, and the latch circuit outputs a second latch signal.

Abstract: Flip-flops 201 to 206 constitute a scan path shift register. During shift mode operation, a clock signal CLK is supplied to clock terminals of the flip-flops 201, 203, and 205, a signal obtained by having an inverted clock control circuit 303 reverse the phase of the clock signal CLK is supplied to clock terminals of the flip-flops 202 and 206, and a normal/inverted clock control circuit 404 supplies a signal having the same phase as the clock signal CLK to a clock terminal of the flip-flop 204 having no sufficient setup time.

Abstract: An extraction unit of fault assumption and a finish-point FF is provided, the fault assumption is selected from fault assumption information, and a logic trace is executed from the fault assumption toward an output side. A test result of a finish-point FF obtained as a result of the trace from the fault assumption is determined. The maximum value and the minimum value of the propagation route up to the finish-point FF are determined, and a delay margin is determined from the values. A delay range is determined by using the delay margin and the test result, and a fault candidate and a delay range of the delay fault are specified by the process of the determination of the fault candidate and the delay range.

Abstract: Mechanisms for controlling an operation of one or more cores on an integrated circuit chip are provided. The mechanisms retrieve, from an on-chip non-volatile memory of the integrated circuit chip, baseline chip characteristics data representing operational characteristics of the one or more cores prior to the integrated circuit chip being operational in the data processing system. Current operational characteristics data of the one or more cores are compared with the baseline chip characteristics data. Deviations of the current operational characteristics data from the baseline chip characteristics data are determined and used to determine modifications to an operation of the one or more cores. Control signals are sent to one or more on-chip management units based on the determined modifications to cause the operation of the one or more cores to be modified.

Abstract: In one embodiment, a programmable logic device (PLD) with configuration memory includes at least one configuration memory cell and soft error detection (SED) logic for checking for errors in data stored by the configuration memory. The SED logic calculates a present data value for the configuration memory for comparison with a pre-calculated data value. A fuse within the PLD is configurable in a first logic state to enable the SED logic to read from the configuration memory cell in calculating the present data value and configurable in a second logic state to prevent the SED logic from reading from the configuration memory cell in calculating the present data value. The SED logic may be tested for correct operation by writing data representing a soft error into the configuration memory cell and enabling the SED logic to read from the configuration memory cell in calculating the present data value.

Abstract: A low-pin-count scan compression method and apparatus for reducing test data volume and test application time in a scan-based integrated circuit. The scan-based integrated circuit contains one or more scan chains, each scan chain comprising one or more scan cells coupled in series. The method and apparatus includes a programmable pipelined decompressor comprising one or more shift registers, a combinational logic network, and an optional scan connector. The programmable pipelined decompressor decompresses a compressed scan pattern on its compressed scan inputs and drives the generated decompressed scan pattern at the output of the programmable pipelined decompressor to the scan data inputs of the scan-based integrated circuit. Any input constraints imposed by said_combinational logic network are incorporated into an automatic test pattern generation (ATPG) program for generating the compressed scan pattern for one or more selected faults in one-step.

Abstract: Identifying an optimized test bit pattern for analyzing electrical communications channel topologies, including: ranking according to channel quality, from worst to best, a set of channel topologies for an electrical communications channel; and for each ranked channel topology beginning with the worst, carrying out the following steps in an iterative loop until a concatenated test bit pattern and a previously optimized test bit pattern are functionally equally fit: concatenating to a previously optimized test bit pattern an additional test bit pattern; optimizing the concatenated test bit pattern values for a next ranked channel in the subset, leaving the optimized values of the previously optimized test bit pattern unchanged; and comparing through use of a fitness function the relative qualities of the previously optimized test bit pattern and the optimized concatenated test bit pattern.

Abstract: A method performed by an I/O unit connected to another I/O unit in a network device. The method includes receiving a packet; segmenting the packet into a group of data blocks; storing the group of data blocks in a data memory; generating data protection information for a data block of the group of data blocks; creating a control block for the data block; storing, in a control memory, a group of data items for the control block, the group of data items including information associated with a location, of the data block, within the data memory and the data protection information for the data block; performing a data integrity check on the data block, using the data protection information, to determine whether the data block contains a data error; and outputting the data block when the data integrity check indicates that the data block does not contain a data error.

Abstract: In a sophisticated semiconductor device including a large memory portion, a built-in self-test circuitry comprises a failure capturing logic that allows the capturing of a bitmap at a given instant in time without being limited to specific operating conditions in view of interfacing with external test equipment. Thus, although pipeline processing may be required due to the high speed operation during the self-test, reliable capturing of the bitmap may be achieved while maintaining high fault coverage of the test algorithm under consideration.

Abstract: Test circuits located on semiconductor die enable a tester to test a plurality of die/ICs in parallel by inputting both stimulus and response patterns to the plurality of die/ICs. The response patterns from the tester are input to the test circuits along with the output response of the die/IC to be compared. Also disclosed is the use of a response signal encoding scheme whereby the tester transmits response test commands to the test circuits, using a single signal per test circuit, to perform: (1) a compare die/IC output against an expected logic high, (2) a compare die/IC output against an expected logic low, and (3) a mask compare operation. The use of the signal encoding scheme allows functional testing of die and ICs since all response test commands (i.e. 1-3 above) required at each die/IC output can be transmitted to each die/IC output using only a single tester signal connection per die/IC output. In addition to functional testing, scan testing of die and ICs is also possible.

Abstract: Systems and methods of testing integrated circuits are disclosed. The systems include a test module configured to operate between automated testing equipment and an integrated circuit to be tested. The testing interface is configured to test the integrated circuit at a higher slew rate than the slew rate at which signals are received from the automated testing equipment. In order to do so, the testing interface includes components configured for generating addresses, commands, and test data to be conveyed to the integrated circuit. A variety of test data patterns can be produced and the test data can be address dependent. The systems are optionally configured to include a test plan memory component configured to store one or more test plans. A test plan may include a sequence of test patterns and/or conditional branches whereby the tests to be performed next are dependent on the results of the preceding tests. The test plan memory is, optionally, be detachable from the test module.

Abstract: A system for testing a logic circuit which has two or more test routine modules. Each module contains a set of instructions which is executable by (a part of) the logic circuit. The set forms a test routine for performing a self-test by the part of the logic circuit. The self-test includes the part of the logic circuit testing itself for faulty behavior, and the part of the logic circuit determining a self-test result of the testing. The system includes a test module which can execute a test application which subjects the logic circuit to a test by performing the self-test on at least a part of the logic circuit by causes the part of the logic circuit to execute a selected test routine, and determining, by the test module, an overall test result at least based on a performed self-tests. The test module includes a control output interface for activates the execution of the a selected test routine. A second test module input interface can receive the self-test result from a selected test routine.

Abstract: This invention generates the random seed patterns using simple, low-area overhead digital circuitry on-chip. This circuit is implemented as a finite state machine whose states are the seeds as contrasted to storing the seeds in the prior art. These seeds are used to control pseudo-random pattern generation for built-in self-tests. This invention provides a large reduction in chip area in comparison with storing seeds on-chip or off-chip.

Abstract: A method and a system for qualifying an integrated circuit according to a parasitic supply peak detector that it contains, including: supply of the integrated circuit to be tested under at least a first voltage; checking of a starting of the circuit; application of at least one first noise peak on the circuit power supply, while respecting an amplitude and time gauge; and comparison of average currents consumed by the circuit before and after the peak.

Abstract: An interface processes memory redundancy data on an application specific integrated circuit (ASIC) with self-repairing random access memory (RAM) devices. The interface includes a state machine, a counter, and an array of registers. The state machine is coupled to a redundancy chain. The redundancy chain includes coupled redundant elements of respective memory elements on the ASIC. In a shift-in mode, the interface shifts data from each of the elements in the redundancy chain and compresses the data in the array of registers. The interface communicates with a test access port coupled to one or more eFuse devices to store and retrieve the compressed data. In a shift-out mode, the interface decompresses the data stored in the array of registers and shifts the decompressed data to each unit in the redundancy chain. The interface functions absent knowledge of the number, bit size and type of self-repairing RAM devices in the redundancy chain.