Abstract: A computer implemented method for routing a net includes selecting, using one or more computer systems, a first spine routing track from a first multitude of routing tracks in accordance with a first cost function, and further in accordance with data associated with the net and the first multitude of routing tracks. The method further includes generating, using one or more computer systems, a first spine wire on the selected first spine routing track.

Abstract: A computer-implemented method for routing at least one conductor includes generating the at least one conductor within a bounded region on a planar surface in accordance with a template, and placing at least one slit in the conductor when the conductor overlaps a specified region of the bounded region in accordance with a specified pattern.

Abstract: A method for increasing metal density around selected vias in a semiconductor device is provided. The semiconductor device includes a plurality of vias. The method includes: generating a layout database for the semiconductor device; identifying isolated vias of the plurality of vias; selecting the isolated vias; defining a zone around each of the selected isolated vias; and increasing area of a metal layer which is above the selected isolated via and which encloses the selected isolated via within each zone to achieve a target metal density within the zone. The method improves reliability of the semiconductor device by allowing moisture to vent from around the vias.

Abstract: Exemplary embodiments of the present invention provide a V0 via unit cell with multiple keep out zones. The keep out zones are oriented concentrically and provide support for multiple sizes of through-silicon vias (TSVs). An off-center alignment between the V0 via unit cell and a probe pad is used to improve contact between the V0 vias and a probe pad. During a chip redesign, the TSV size may be changed without the need to revise the V0 mask.

Abstract: A semiconductor device has first wiring layers and a plurality of dummy wiring layers that are provided on the same level as the first wiring layers. The semiconductor device defines a row direction, and first virtual linear lines extending in a direction traversing the row direction. The row direction and the first virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the first virtual linear lines. The semiconductor device also defines a column direction perpendicular to the row direction, and second virtual linear lines extending in a direction traversing the column direction. The column direction and the second virtual linear lines define an angle of 2-40 degrees, and the dummy wiring layers are disposed in a manner to be located on the second virtual linear lines.

Abstract: One embodiment of the present invention provides a system that concurrently performs redundant via insertion and timing optimization during routing of an integrated circuit (IC) chip design. During operation, the system performs an initial routing on the IC chip design to obtain a routing solution, which includes a set of vias. The system then performs a redundant-via-insertion operation on the routing solution, wherein the redundant-via-insertion operation attempts to modify a via within the set of vias into a redundant via. Next, the system performs a timing optimization on the routing solution by iteratively: (1) performing a timing analysis on the routing solution; (2) performing a logic optimization on the routing solution; and (3) performing an incremental routing adjustment on the routing solution, wherein the incremental routing adjustment adjusts the redundant vias.

Abstract: A method of making a semiconductor device includes arranging a first cell and a second cell, determining, by a processor, a first pattern density of a first cell, determining a second pattern density of a second cell, determining a pattern density gradient from the first pattern density to the second pattern density, determining whether the pattern density gradient exceeds a pattern density gradient threshold, and indicating a design change if the pattern density gradient exceeds than the pattern density gradient threshold.

Abstract: Methodologies and an apparatus enabling a generation of color undeterminable polygons in IC designs are disclosed. Embodiments include: determining a plurality of first routes extending horizontally in an IC design, each of the plurality of first routes being placed on one of a plurality of equally spaced vertical positions of the IC design; determining whether a second route overlaps one of the vertical positions of the plurality of equally spaced vertical positions; and selecting a design rule for the second route based on the determination of whether the second route overlaps.

Abstract: A method includes forming a connection between a first metal layer and a second metal layer. The second metal layer is over the first metal layer. A via location for a first via between the first metal layer and the second metal layer is identified. Additional locations for first additional vias are determined. The first additional vias are determined to be necessary for stress migration issues. Additional locations necessary for second additional vias are determined. The second additional vias are determined to be necessary for electromigration issues. The first via and the one of the group consisting of (i) the first additional vias and second additional vias (ii) the first additional vias plus a number of vias sufficient for electromigration issues taking into account that the first additional vias, after taking into account the stress migration issues, still have an effective via number greater than zero.

Abstract: Systems and methods are disclosed for testing a stack of dies and inserting a repair circuit which, when enabled, compensates for a delay defect in the die stack, particularly where the defect is located in the inter-die data transfer path. Intra-die and inter-die slack values are determined to establish which die or dies in the die stack would benefit from the insertion of a repair circuit.

Abstract: Methods and systems for improving the reliability of C4 solder ball contacts performed at the design stage to reduce the incidence of thermally-induced failures, including those due to electromigration and thermal cycling.

Abstract: A semiconductor device includes a first layer including a number of first layer metal pads, a second layer formed on top of the first layer, the second layer including a number of second layer metal pads, and vias connecting the first layer metal pads to the second layer metal pads. A surface area overlap between the first layer metal pads and the second layer metal pads is below a defined threshold.

Abstract: Multiple level spine routing is disclosed. In some embodiments, in response to receiving a specification of a plurality of nets and a specification of a set of routing tracks available for main spines, a main spine routing track is assigned to each of the plurality of nets based at least in part on a cost function and main spine wires are generated on the assigned main spine routing tracks for each of the plurality of nets.

Abstract: An integrated circuit comprising a plurality of standard cell circuit elements is disclosed, wherein for at least one layer of the integrated circuit, a majority of minimum-width patterns are in a preferred diagonal orientation.

Abstract: A test circuit includes a substrate, a wiring section having a plurality of pieces of wiring, and a device-under-test section formed on the substrate, and having a device-under-test main body and a plurality of connecting electrodes for establishing connection between the main body and the plurality of pieces of wiring, an extending direction of a straight line connecting a position of a center of rotation in a plane of pattern formation of the main body and each electrodes being inclined at a predetermined angle to an extending direction of the pieces of wiring, and the connecting electrodes being arranged at positions such that connection relation between the electrodes and the plurality of pieces of wiring is maintained even when the main body and the electrodes are rotated about the position of the center of rotation by 90 degrees relative to the wiring section in the plane of the pattern formation.

Abstract: A technique for routing signal wires in an integrated circuit design includes applying a first rule that attempts to route a signal wire along existing power supply shapes of the integrated circuit design and applying a second rule that provides shield wires along segments of the signal wire that are not routed along one of the existing power supply shapes. The technique also includes routing the signal wire between a first endpoint and a second endpoint while applying the first and second rules to substantially minimize a route cost for the signal wire between the first and second endpoints.

Abstract: A method for designing a system to be implemented on a target device includes generating bounding boxes on the target device for nets in the system where a bounding box identifies routing resources available for routing its corresponding net. The nets in the system are assigned to a plurality of threads to be routed. The threads are executed so that a plurality of the nets are routed in parallel within their corresponding bounding box.

Abstract: An abstract decision module primitive for placement within a logical representation (i.e., a netlist) of a circuit design is described. The decision module primitive receives as inputs alternative solutions for a given function or segment of a netlist. The alternative solutions include functionally equivalent, but structurally different implementations of the function or segment of the netlist. The decision module primitive alternatively selects between connecting one of the inputs to the netlist to provide a complete functional definition for the netlist based on constraint information. The selected input of the decision module may be updated as additional constraint information is determined throughout the various stages of the design process. In addition, alternative solutions for a given function or segment of the netlist may be added to and/or removed from the inputs of a decision module as additional constraint information is identified.

Abstract: An island-based network flow processor (IB-NFP) integrated circuit includes rectangular islands disposed in rows. In one example, the configurable mesh data bus is configurable to form a command/push/pull data bus over which multiple transactions can occur simultaneously on different parts of the integrated circuit. The rectangular islands of one row are oriented in staggered relation with respect to the rectangular islands of the next row. The left and right edges of islands in a row align with left and right edges of islands two rows down in the row structure. The data bus involves multiple meshes. In each mesh, the island has a centrally located crossbar switch and six radiating half links, and half links down to functional circuitry of the island. The staggered orientation of the islands, and the structure of the half links, allows half links of adjacent islands to align with one another.

Abstract: A wiring-design aiding method for causing a computer to execute generating paths for buses so that the buses do not cross each other with respect to a wiring area including at least one wiring layer, the paths being represented by corresponding graphics The computer further executes verifying, for each bus, whether wires for nets belonging to the bus are successfully extracted from a component to which the bus is connected; and recording, in the wiring area, graphics representing the nets belonging to a bus for which it is determined in the verification that all the nets belonging to the bus are successfully extracted. The bus-path generation is re-executed with respect to the bus for which it is determined in the verification that at least one of the nets is not successfully extracted.

Abstract: A region of congestion is detected at a set of layers. The region occupies the same area of each layer in the set. A routing blockage is defined as a tuple corresponding to the region. The tuple includes a set of coordinates to describe an area of the region, a first and a second layer coordinates of a first and a second layer in the set of layers. The routing blockage is applied during an iteration of rough routing. Before an iteration of detailed routing, the routing blockage is removed. Detailed routing is performed using a g-cell in the region. The detailed routing uses a routing capacity saved in the g-cell during the iteration of rough routing due to the routing blockage. A revised IC design is produced where a revised congestion in an area corresponding to the region is reduced.

Abstract: A methodology for developing metal fill as a library device and, in particular, a method of generating a model of the effects (e.g., capacitance) of metal fills in an integrated circuit and a design structure is disclosed. The method is implemented on a computing device and includes generating a model for effects of metal fill in an integrated circuit. The metal fill model is generated prior to completion of a layout design for the integrated circuit.

Abstract: A computer implemented method for designing an integrated circuit (IC) having dimensions along first and second directions, and comprising at least a first block is presented. The method includes evaluating a demand ratio for the first block, the demand ratio being reflective of a ratio of a conductive wiring demand along the first direction and a conductive wiring demand along the second direction, when the computer is invoked to evaluate the demand ration for the first block. The method further includes creating one or more wiring reservation blocks in accordance with the demand ratio.

Abstract: Embodiments described herein provide approaches for improved circuit routing using a wide-edge pin. Specifically, provided is an integrated circuit (IC) device comprising a standard cell having a first metal layer (M1) pin coupled to a second metal layer (M2) wire at a via. The M1 pin has a width greater than a width of the via sufficient to satisfy an enclosure rule for the via, while the M1 pin extends vertically past the via a distance substantially equal to or greater than zero. This layout increases the number of available pin access points within the standard cell and thus improves routing efficiency and chip size.

Abstract: A method of assisting in the design of a logic circuit enabling the placement and wiring of cells (logic operation elements) to be optimized on an IC substrate in a short period of time even when the logic circuit has multiple levels, to provide a device assisting in the design of a logic circuit using this method, and to provide a computer program executable by this device. The cells of all levels are placed in a placement area formed on a grid, and a port enabling connection to a cell in another level is placed in a boundary portion between the placement area having cells already placed and a placement area enabling placement of new cells. Cells in the same level are wired between cells and cells in another level are wired between a cell and a port so that the sum total of the wiring lengths may be minimized.

Abstract: An integrated circuit that includes an on-chip inductor wrapped around an interface pad. On-chip inductors are arranged around an interface pad to reduce the area occupied by the inductor. Furthermore, arranging the on-chip inductors in an upper level metal layer, such us the redistribution layer (RDL), the top metal interconnect layer (MTop), or the second-to-top metal interconnect layer (MTop-1) reduces the on-chip inductor parasitic resistance, reducing the loss of signal.

Abstract: A process and apparatus are provided for automated pattern-based semiconductor design layout correction. Embodiments include: determining a portion of a layout of an IC design, the portion comprising a first pattern of a plurality of routes connecting a plurality of design connections; determining one or more sets of the plurality of design connections based on the plurality of routes; and determining, by a processor, a second pattern of a plurality of routes connecting the plurality of design connections within the portion based on the one or more sets.

Abstract: A receiving unit receives specification of two parts to be connected by wirings and the number of wirings connecting the two parts. A generating unit generates a schematic route connecting the two parts on a substrate with a width in accordance with the number of wirings received by the receiving unit. A derivation unit derives the number of arrangeable wirings by checking interference whether the schematic route generated by the generating unit is capable of being arranged on the substrate.

Abstract: Methods and apparatuses are described for creating, editing, and viewing a floorplan of a circuit design. Specifically, some embodiments enable a user to perform a graphical operation at an inference point in a circuit design layout, wherein the location of the inference point is determined based on existing graphical objects in the circuit design layout. Some embodiments substantially instantaneously update a congestion indicator in a circuit design layout in response to modifying the circuit design layout. Some embodiments substantially instantaneously update pin locations of a block or partition in response to changing the size or shape of the block or partition. Some embodiments enable a user to view a circuit design layout based on the logical hierarchy, and also based on at least one additional attribute type such as voltage, power, or clock domain.

Abstract: In one embodiment of the invention, a method for designing an integrated circuit is disclosed. The method includes automatically partitioning clock sinks of an integrated circuit design into a plurality of partitions; automatically synthesizing a clock tree from a master clock generator into the plurality of partitions to minimize local clock skew within each of the plurality of partitions; and automatically synthesizing clock de-skew circuitry into each of the plurality of partitions to control clock skew between neighboring partitions.

Abstract: A method of evaluating a layout cell for electrostatic discharge (ESD) protection can include identifying at least one feature of the layout cell for use in implementing an integrated circuit (IC) and comparing the at least one feature of the layout cell to an ESD requirement for the IC. The method can include indicating whether the feature of the layout cell complies with the ESD requirement.

Abstract: A design methodology for routing for an integrated circuit is disclosed. The method includes placement of cells having double diffusion breaks, which create an extended intercell region. Metal layer prohibit zones are defined to prohibit any M1 structures in the prohibit zones. Metal layer allow zones are placed adjacent to outer metal lines, and jogs are formed in the metal layer allow zones. Vias and viabars may then be applied on the jogs.

Abstract: Systems and techniques for multiple-instantiated-module (MIM)-aware pin assignment are described. An aggregate cost function can be determined, wherein the aggregate cost function is aggregated across all instances of an MIM for placing a pin at a particular location on the boundary of the MIM. The aggregate cost function can then be used by a pin assignment engine to place the pin in the MIM. A pin assignment engine can place one pin at a time, or place multiple pins at a time by trying to optimize the aggregate cost over multiple pins. Some embodiments can propagate pin-alignment constraints through one or more instances of one or more MIMs in the circuit design layout, and then perform pin assignment while observing the pin-alignment constraints. In some embodiments, pin assignment can be performed on MIMs in decreasing order of the number of pin-alignment constraints that are imposed on the MIMs.

Abstract: A method for designing and making an integrated circuit is described. That method utilizes statistical models of wire segments to accurately estimate the expected length of minimum-length, orthogonal wire segments within a block. From these estimates, the method accurately estimates an ratio between the horizontal and vertical routing resources required, termed the “H/V Demand Ratio.” From the H/V Demand Ratio, an accurate estimate of the height and width of the block may be determined. Thereafter, placement and routing may be performed quickly and accurately, thereby allowing the block to be designed and manufactured quickly and cost effectively. A method for designing an integrated circuit with efficient metal-1 resource utilization is also described.

Abstract: Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

Abstract: A flip-flop operating with standard threshold voltage MOS devices as compared with high threshold voltage MOS devices may have improved speed performance, but greater leakage current. Likewise, a flip-flop operating with high threshold voltage MOS devices may reduce the leakage current and have better power efficiency, but decreased speed and performance. An optimized flip-flop may include a combination of standard threshold voltage MOS devices and high threshold voltage MOS devices. The optimized flip-flop may have less leakage during stand-by mode as compared to a flip-flop with standard threshold voltage MOS devices. In addition, the optimized flip-flop may have better performance and speed as compared to a flip-flop with high threshold voltage MOS devices.

Abstract: A first linear-shaped conductive structure (LCS) forms gate electrodes (GE's) of a first transistor of a first transistor type and a first transistor of a second transistor type. A second LCS forms a GE of a second transistor of the first transistor type. A third LCS forms a GE of a second transistor of the second transistor type. A fourth LCS forms a GE of a third transistor of the first transistor type. A fifth LCS forms a GE of a third transistor of the second transistor type. A sixth LCS forms a GE of a fourth transistor of the first transistor type and a fourth transistor of the second transistor type. Transistors of the first transistor type are collectively separated from transistors of the second transistor type by an inner region. The second, third, fourth, and fifth LCS's have respective electrical connection areas arranged relative to the inner region.

Abstract: A method and apparatus for insertion of a via improving a manufacturability of a resulting device while ensuring compliance with DRC rules are disclosed. Embodiments include: determining a layer of a substrate of an IC design having a first via and a plurality of routes, the plurality of routes extending horizontally on the substrate and placed on one of a plurality of equally spaced vertical positions; comparing a region of the layer extending vertically between a first set of the plurality of routes and extending horizontally between a second set of the plurality of the routes with one or more threshold values, the region being adjacent to the first via and being separated from the plurality of routes; and inserting a second via based on the comparison.

Abstract: An assignment method of terminals of a semiconductor package executed by an assignment supporting apparatus includes: deciding a maximum allowable distance to be a constraint condition regarding a relative distance between each of the pads and a terminal to be assigned to the pad, and extracting one or a plurality of assigned terminal candidates for each of the pads so that the relative distance between each of the pads and a terminal selected for the pad falls within a range of the maximum allowable distance; and deciding one of the terminals as a assigned terminal based on the assigned terminal candidates and assigning the one of the terminals to one of the pads. The process is a process to assign one of the terminals with priority to a pad having a smallest number of assigned terminal candidates in a not-assigned condition based on the assigned terminal candidates.

Abstract: A method is disclosed for defining an integrated circuit. The method includes generating a digital data file that includes both electrical connection information and physical topology information for a number of circuit components. The method also includes operating a computer to execute a layout generation program. The layout generation program reads the electrical connection and physical topology information for each of the number of circuit components from the digital data file and automatically creates one or more layout structures necessary to form each of the number of circuit components in a semiconductor device fabrication process, such that the one or more layout structures comply with the physical topology information read from the digital data file. The computer is also operated to store the one or more layout structures necessary to form each of the number of circuit components in a digital format on a computer readable medium.

Abstract: Techniques for compacting routing in lower level blocks to free routing resources for upper level blocks are disclosed. In some embodiments, a specification of a hierarchical integrated circuit design comprising a lower level block and an upper level block is obtained. The specification includes an initial routing plan for the lower level block. Subsequently, a compacted routing plan for the lower level block using constrained routing resources comprising fewer routing tracks than the initial routing plan and resulting in at least one unused track as well as a routing plan for the upper level block using the at least one unused track are generated.

Abstract: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

Abstract: Layout information indicating locations of at least components and conductive layers in a printed circuit board, and layouts of conductive wiring patterns on the respective conductive layers and vias which electrically connect between the conductive layers is obtained from a memory. With reference to the layout information, path information indicating a path of one signal line is generated. With reference to the layout information and path information, a divide portion where a path of a return current corresponding to a signal current of the signal line is divided are detected. With reference to the layout information and path information, information indicating a detour path of the return current in a neighborhood of the divide portion is generated.

Abstract: Stacked chip systems and design structures for stacked chip systems, as well as methods and computer program products for placing thermal conduction paths in a stacked chip system. The method may include determining an availability of space in a layout of an interconnect structure of a first chip for a fill shape structure extending partially through the interconnect structure to thermally couple a metal feature in the interconnect structure with a bonding layer between the interconnect structure of the first chip and a second chip. If space is available, the fill shape structure may be placed in the layout of the interconnect structure of the first chip. The stacked chip system may include the first and second chips, the bonding layer between the interconnect structure of the first chip and the second chip, and the fill shape structure.

Abstract: An application server reads components data from a component information system (CIS) of a database server connected to the application server. The components data are converted to HDL data. If the converted HDL data includes illegal characters, a user is prompted to modify the illegal characters. If the converted HDL data does not include illegal characters, the application server amends formats of the converted HDL data according to requirements of each client connected to the application server. Each client includes a drawing unit. The application server controls the drawing unit to draw circuit diagram using the HDL data with the amended formats.

Abstract: A method, system and computer program product are provided for implementing an enhanced Z-directional macro port assignment or three-dimensional port creation for random logic macros of heterogeneous hierarchical integrated circuit chips. An initial port placement is provided on a layer for a macro. The initial port placement is expanded to provide a three-dimensional port shape including a plurality of metal layers along a z-axis. Wire routing of each of the macro level and a chip top level is defined within the expanded three-dimensional port shape. Each unnecessary metal layer of the expanded three-dimensional port shape is removed, providing a final three-dimensional port shape.

Abstract: Example implementations described herein are directed to a floor plan for a Network on Chip (NoC) topology that can include a plurality of on chip blocks of substantially non-uniform shapes and dimensions. An interconnection network is synthesized along with a plan for a physical layout of the interconnection network based on physical dimensions of the plurality of on chip blocks, the physical dimensions of the floorplan and relative placement information for placing the plurality of on chip blocks on the floorplan. Porosity information for the plurality of on chip blocks on the floorplan and required chip functionality may also be taken into consideration.

Abstract: Example implementations described herein are directed to a system on chip (SoC) that can include a plurality of blocks of substantially non-uniform shapes and dimensions, a plurality of routers, and a plurality of links between routers. The plurality of blocks and the plurality of routers are interconnected by the plurality of links using a Network-on-Chip (NoC) architecture with a sparse mesh topology. The sparse mesh topology involves a sparsely populated mesh which is a subset of a full mesh having one or more of the plurality of routers or links removed. The plurality of blocks communicate among each other by routing messages over the remaining ones of the plurality of routers and links of the sparse mesh.

Abstract: Systems and techniques for multiple-instantiated-module (MIM)-aware pin assignment are described. An aggregate cost function can be determined, wherein the aggregate cost function is aggregated across all instances of an MIM for placing a pin at a particular location on the boundary of the MIM. The aggregate cost function can then be used by a pin assignment engine to place the pin in the MIM. A pin assignment engine can place one pin at a time, or place multiple pins at a time by trying to optimize the aggregate cost over multiple pins. Some embodiments can propagate pin-alignment constraints through one or more instances of one or more MIMs in the circuit design layout, and then perform pin assignment while observing the pin-alignment constraints. In some embodiments, pin assignment can be performed on MIMs in decreasing order of the number of pin-alignment constraints that are imposed on the MIMs.

Abstract: Embodiments of the disclosure relate to methods for facilitating the design of a clock grid in an integrated circuit. The method includes propagating a chip level virtual grid across a multi-level hierarchy of the integrated circuit and customizing the grid at each macro to create a customized virtual grid for each macro. The method further includes propagating the customized virtual grid for each of the plurality of macros to one of a plurality of units and customizing the chip level virtual grid at each of the plurality of units to create the customized virtual grid for each of the plurality of units. The method also includes propagating the customized virtual grid for each of the plurality of units to the chip level and combining the plurality of customized virtual grids to form the clock grid for the integrated circuit.