Routing Patents (Class 716/126)
  • Patent number: 12125777
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, an electronic package comprises a first buildup layer and a second buildup layer over the first buildup layer. In an embodiment, a void is disposed through the second buildup layer. In an embodiment the electronic package further comprises a first pad over the second buildup layer. In an embodiment, the first pad covers the void.
    Type: Grant
    Filed: October 28, 2019
    Date of Patent: October 22, 2024
    Assignee: Intel Corporation
    Inventors: Zhiguo Qian, Gang Duan, Kemal Aygün, Jieying Kong, Brandon C. Marin
  • Patent number: 12111811
    Abstract: An EDA pad package library updating/application method and system, a medium, and a terminal. The method includes: extracting a graphic data of a pad and setting information of a component based on the pad from an EDA wiring data; querying and downloading a graphic model of the component according to attribute information of the component; forming a simulated package pad by simulating and assembling the graphical model of the component and the graphical data of the pad according to setting information of the component based on the pad; storing the simulated package pad in a model database, updating an existed EDA pad package library by associating the simulated package pad to a predetermined keyword/words in the model database. A package pad created by others can be quickly obtained without a package pad library. The best pads that have been verified can be updated continuously and quickly.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: October 8, 2024
    Assignee: Vayo (Shanghai) Technology Co. Ltd.
    Inventors: Shengjie Qian, Fengshou Liu
  • Patent number: 12086525
    Abstract: A system including computer readable storage media including executable instructions and one or more processors configured to execute the executable instructions to obtain a schematic netlist and a performance specification for an integrated circuit, determine electrical constraints for nets in the schematic netlist based on the performance specification, determine physical constraints from the electrical constraints, rout the nets in the schematic netlist based on the electrical constraints and the physical constraints, and provide a data file of a layout.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: September 10, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien Yu Tseng, Guan-Ruei Lu, Wei-Ming Chen, Chih.Chi. Hsiao
  • Patent number: 12072687
    Abstract: A method, system and apparatus for flexible component routing design, wherein a flexible component includes a first end and a second end, includes moving the second end relative to the first end to simulate an operational motion state of the flexible component, scanning the flexible component to obtain a first set of routing data for the flexible component, changing position of the second end from a first position to a second position, moving the second end relative to the first end to simulate an operational motion state of the flexible component, scanning the flexible component to obtain a second set of routing data for the flexible component, and comparing the first set of routing data with the second set of routing data to determine a routing design for the flexible component.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: August 27, 2024
    Assignee: Ford Global Technologies, LLC
    Inventors: Cherry Xie, Jason Zhang, Ethan Wang, Chris Nie
  • Patent number: 12063773
    Abstract: A semiconductor device includes first and second active areas, a first gate, a first conductive segment, a first via and a first continuous gate. The first and second active areas extend in a first direction. The first gate crosses over the first active area and the second active area. The first gate includes a first gate portion and a second gate portion electrically isolated from each other. The first conductive segment crosses over the first active area and the second active area. The first via is arranged above the first conductive segment. The first active area and the second active area are coupled through the first conductive segment to the first via. The first continuous gate is disposed between the first conductive segment and the first gate, and crossing over the first active area and the second active area.
    Type: Grant
    Filed: January 31, 2022
    Date of Patent: August 13, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Meng-Sheng Chang, Chia-En Huang, Wan-Hsueh Cheng, Yao-Jen Yang, Yih Wang
  • Patent number: 11907632
    Abstract: A system includes one or more data processors and a non-transitory computer-readable storage medium containing instructions which, when executed on the one or more data processors, cause the one or more data processors to perform operations. The operations include receiving a design schematic, extracting keywords from the design schematic, and sorting the design schematic by the extracted keywords. The operations further include extracting a part number of a component from the sorted design schematic, comparing the component associated with the part number with a reference component associated with the part number, and displaying a result of the comparison indicating whether the component and the reference component match.
    Type: Grant
    Filed: April 16, 2021
    Date of Patent: February 20, 2024
    Assignee: QUANTA COMPUTER INC.
    Inventors: Kuo-Chan Hsu, Yun-Teng Shih, Shou-Fu Li
  • Patent number: 11881855
    Abstract: A superconducting integrated circuit design method based on placement and routing by different-layer JTLs comprises: cutting a bias line at a cell data interface of a cell library, and reserving a position of a via; placing and arranging cells on a logic cell layer according to a schematic circuit logic diagram; connecting clock lines of each of the cells by using a JTL and a splitter of the logic cell layer; and performing data connection on each of the cells by using JTLs of a transverse JTL routing layer and a longitudinal JTL routing layer which are not in the same layer as the logic cell layer, wherein the JTL of the transverse JTL routing layer is used as a transverse routing cell for data between the cells, the JTL of the longitudinal JTL routing layer is used as a longitudinal routing cell for data between the cells.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: January 23, 2024
    Assignee: SHANGHAI INSTITUTE OF MICROSYSTEM AND INFORMATION TECHNOLOGY CHINESE ACADEMY OF SCIENCES
    Inventors: Jie Ren, Ruo Ting Yang, Xiao Ping Gao, Zhen Wang
  • Patent number: 11790147
    Abstract: Embodiments include herein are directed towards a method for electronic circuit design. Embodiments may include receiving, using a processor, an electronic design library including a plurality of design rules. Embodiments may include generating a routing graph, based upon, at least in part, the plurality of design rules, wherein the routing graph is a virtual representation of all of the available routing space for all routing layers associated with an electronic design. Embodiments may further include dynamically updating the routing graph at a graphical user interface, based upon, at least in part, a creation of a routing segment or a via at the graphical user interface.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: October 17, 2023
    Assignee: Cadence Design Systems, Inc.
    Inventors: Hongzhou Liu, Rahaprian Premavathi Mudiarasan, Sandipan Ghosh, Hui Xu, Chris (Shyh-Chang) Lin, Joshua Baudhuin, Ron Pyke, Juno Lin, Allen You, Yu Liu, Jiulong Zhang, Thomas Richards
  • Patent number: 11741289
    Abstract: The present disclosure relates to routing superconducting wires in superconducting circuits and in particular to efficiently routing superconducting wires that meet inductance requirements. The superconducting wire routing technique involves modeling the target location not only as a physical location, but as a physical location (e.g., x, y, and z dimensions) combined with inductance (e.g., a target inductance range). One or more other constraints may also be included in the modeling, such as a number of wires that would need to be moved/lifted, a number of circuit-vias allowing passage through layers of the circuit, an amount of cross-coupling with other inductors, and a number of wire segments.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: August 29, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Michael B Goulding, Matus Lipka, Kenneth Reneris, Jason Lee
  • Patent number: 11704466
    Abstract: Routing a circuit path includes selecting pixels on the circuit path based at least on penalty values associated with the pixels. Pixels on a rejected circuit path are penalized by increasing their penalty values. Re-routing a rejected circuit path allows for pixels on previously rejected paths to be considered when rerouting the rejected circuit path, rather than being eliminated outright.
    Type: Grant
    Filed: August 15, 2022
    Date of Patent: July 18, 2023
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Matus Lipka, Kenneth Reneris
  • Patent number: 11688678
    Abstract: A wiring board includes a first wiring layer, a high-speed wiring disposed in the first wiring layer, a second wiring layer, and a signal wiring disposed in the second wiring layer. The signal wiring transmits a signal slower than that through the high-speed wiring. A third wiring layer between the first and second wiring layers includes a power supply wiring and/or a ground wiring, which is not disposed in a portion where a land of the first wiring layer and the signal wiring do not overlap. The power supply wiring and/or the ground wiring overlap the signal wiring in a portion where the land of the first wiring layer and the signal wiring overlap each other.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: June 27, 2023
    Assignee: KIOXIA CORPORATION
    Inventors: Yukifumi Oyama, Mitsumasa Nakamura, Yuichi Sano
  • Patent number: 11669662
    Abstract: An information processing apparatus calculates a value based on the lengths of wires included in inner layers selecting the inner layers other than outermost layers and layers adjacent to the outermost layers from among a plurality of layers included in circuit data. The information processing apparatus generates training data including first layer data corresponding to the patterns of the outermost layers, second layer data corresponding to the patterns of the layers adjacent to the outermost layers, and the value based on the lengths of the wires. The information processing apparatus trains a machine learning model by using the training data.
    Type: Grant
    Filed: September 13, 2021
    Date of Patent: June 6, 2023
    Assignee: FUJITSU LIMITED
    Inventors: Shohei Yamane, Hiroaki Yamada, Takashi Yamazaki, Yoichi Kochibe, Toshiyasu Ohara
  • Patent number: 11663485
    Abstract: A system performs distributed or parallel pattern extraction and clustering for pattern classification of large layouts of electronic circuits. The system identifies circuit patterns with a layout representation. The system encodes the circuit patterns using a neural network based autoencoder to generate encoded circuit patterns that can be stored efficiently. The system clusters the encoded circuit patterns into an arbitrary number of clusters based upon a high degree of similarity. The clusters of circuit patterns may be used for training and evaluation of machine learning based models.
    Type: Grant
    Filed: May 18, 2020
    Date of Patent: May 30, 2023
    Assignee: Synopsys, Inc.
    Inventor: Thomas Christopher Cecil
  • Patent number: 11558259
    Abstract: A system and methods are disclosed that generate a physical roadmap for the connectivity of a network, such as a network-on-chip (NoC). The roadmap includes a set of possible positions for placement of edges and nodes, which are known to be an acceptable and good position for placement of these network elements, that honors the constraints of the network. These known positions are made available to the system for synthesis of the network and generating the connectivity and placement based on the physical roadmap.
    Type: Grant
    Filed: August 25, 2020
    Date of Patent: January 17, 2023
    Assignee: ARTERIS, INC.
    Inventors: Moez Cherif, Benoit de Lescure
  • Patent number: 11528239
    Abstract: A time-sensitive networking communication method and an apparatus, where the method may include: determining, by an application function network element, a virtual switching node identifier corresponding to a port identifier of a user plane function network element; determining a virtual port identifier of a virtual switching node identified by the virtual switching node identifier; obtaining attribute information of the virtual switching node, where the attribute information includes attribute information of a port identified by the port identifier of the user plane function network element and attribute information of a virtual port identified by the virtual port identifier; and sending the attribute information of the virtual switching node to a time-sensitive network, where the attribute information of the virtual switching node is used to request the time-sensitive network to register or update the virtual switching node based on the attribute information of the virtual switching node.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: December 13, 2022
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Hancheng Li, Han Zhou, Wenfu Wu
  • Patent number: 11416249
    Abstract: Techniques described herein may be utilized to serialise and de-serialise arithmetic circuits that are utilized in the execution of computer programs. The arithmetic circuit may be utilized to build a Quadratic Arithmetic Problem (QAP) that is compiled into a set of cryptographic routines for a client and a prover. The client and prover may utilize a protocol to delegate execution of a program to the prover in a manner that allows the client to efficiently verify the prover correctly executed the program. The arithmetic circuit may comprise a set of symbols (e.g., arithmetic gates and values) that is compressed to produce a serialised circuit comprising a set of codes, wherein the set of symbols is derivable from the set of codes in a lossless manner. Serialisation and de-serialisation techniques may be utilized by nodes of a blockchain network.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 16, 2022
    Assignee: nChain Licensing AG
    Inventors: Alexandra Covaci, Patrick Motylinski, Simone Madeo, Stephane Vincent, Craig Steven Wright
  • Patent number: 11392749
    Abstract: A method of generating a netlist of an IC device includes receiving gate region information of the IC device. The gate region information includes a width of the gate region, the width extending at least from a first edge of an active region to a second edge of the active region, a location of a gate via positioned within the active region and along the width, and a first gate resistance value corresponding to the gate region. The method includes determining a second gate resistance value based on the location and the width, and modifying the netlist based on the second gate resistance value.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: July 19, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ke-Ying Su, Jon-Hsu Ho, Ke-Wei Su, Liang-Yi Chen, Wen-Hsing Hsieh, Wen-Koi Lai, Keng-Hua Kuo, KuoPei Lu, Lester Chang, Ze-Ming Wu
  • Patent number: 11360789
    Abstract: Methods are provided for configuring a reconfigurable hardware device to execute a user application. Such a method includes providing static shell logic on the device. The static shell logic is controlled by a primary management core for managing operation of the device, and has a predetermined hardware interface. The method includes configuring on the device, via the primary management core, dynamic shell logic for implementing dynamically-selected shell functionality. The dynamic shell logic includes a secondary management core, adapted to communicate with the primary management core via the hardware interface, for managing operation of the dynamic shell logic. The method further comprises configuring on the device, via the primary management core, application logic, having an interface with the dynamic shell logic, for executing the user application. The secondary management core uploads to the primary management core dynamic code to adapt the primary management core for use with the dynamic shell logic.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: June 14, 2022
    Assignee: International Business Machines Corporation
    Inventors: Burkhard Ringlein, Francois Abel, Beat Eugen Weiss
  • Patent number: 11275881
    Abstract: The present disclosure relates to a computer-implemented method for electronic design is provided. Embodiments may include receiving, using at least one processor, an electronic design having one or more unoptimized nets. Embodiments may further include applying a genetic algorithm to the electronic design, wherein the genetic algorithm includes a multi-stage routing analysis. A first stage analysis may apply a device-level global routing analysis, a second stage analysis may include an intra-row routing analysis, a third stage may include an inter-row routing analysis, and a fourth stage may include a post-routing optimization analysis. Embodiments may also include generating an optimized routing of the one or more unoptimized nets and displaying the optimized routing at a graphical user interface.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: March 15, 2022
    Assignee: Cadence Design Systems, Inc.
    Inventors: Weifu Li, Elias Lee Fallon, Supriya Ananthram, Weiyi Qi, Sheng Qian
  • Patent number: 11250197
    Abstract: Various embodiments may include integrated circuits (ICs) and methods for designing an integrated circuit (IC), such as a system-on-chip (SOC). Embodiments include methods for planning and producing ICs without communication channels, also referred to as channel-less ICs. Embodiments may include overlay hard macros that support routing and communication design without dedicated communication channels being needed between functional hard macros, such as cores of a SOC. Various embodiments may include an IC in which one or more interconnect hard macros and wires connecting a first functional hard macro, a second functional hard macro and the one or more interconnect hard macros are located within a third functional hard macro. In some embodiments, no communication channel may be present between the first functional hard macro, the second functional hard macro, and the third functional hard macro.
    Type: Grant
    Filed: October 26, 2020
    Date of Patent: February 15, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Vinod Kumar Lakshmipathi, Venugopal Sanaka, Babu Suriamoorthy, Madan Krishnappa, Pavan Kumar Patibanda
  • Patent number: 11163933
    Abstract: A method that includes operations below and at least one of the operations is performed by a processor. Whether at least one condition is present in a signal to be received or transmitted by a terminal of a cell of an integrated circuit is determined. When the at least one condition is present in the signal, a plurality of conductive segments of the integrated circuit is assigned, to transmit the signal to the terminal of the cell. Each conductive segment of a first set of conductive segments of the plurality of conductive segments has a first predetermined width, and a distance between adjacent two conductive segments of the first set of conductive segments is greater than the first predetermined width.
    Type: Grant
    Filed: April 24, 2020
    Date of Patent: November 2, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Jack Liu
  • Patent number: 11163925
    Abstract: A simulator models an energy and power system. The simulator allows a user to manipulate digital representations of nodes, which represent one or more components of power and energy assets. The simulator also allows a user to manipulate digital representations of edges, which connect the nodes, to form a power and energy network. A plurality of object classes correspond to the nodes and edges. The object classes comprise class inheritance structures so that constraints of a parent class are retained by one or more child classes. The interface on the simulator allows a user to model a power and energy system by allowing the user to connect the nodes with edges to construct a power and energy system, wherein the object classes for the nodes, when executed by the simulator, implement one or more dynamical models to model the power and energy assets.
    Type: Grant
    Filed: April 28, 2019
    Date of Patent: November 2, 2021
    Assignee: Enernet Global, LLC
    Inventor: Stephen Schneider
  • Patent number: 11151299
    Abstract: A system includes at least one Input/Output (I/O) interface and a processor. The processor is coupled to the at least one I/O interface. The processor is configured to perform, according to a file or a rule inputted from the at least one I/O interface, operations below. When the at least one condition is present in a signal to be received or transmitted by a terminal of a cell, a plurality of conductive segments is assigned to the terminal of the cell, to transmit the signal to the terminal of the cell. When the at least one condition one is not present in the signal, a single route is assigned to the terminal of the cell, to transmit the signal to the terminal of the cell. The single route and each of the conductive segments are configured to have the same width.
    Type: Grant
    Filed: April 29, 2020
    Date of Patent: October 19, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventor: Jack Liu
  • Patent number: 11138361
    Abstract: An integrated circuit includes a first and second set of gate structures. A center of each of the first set of gate structures is separated from a center of an adjacent gate of the first set of gate structures in a first direction by a first pitch. A center of each of the second set of gate structures is separated from a center of an adjacent gate of the second set of gate structures in the first direction by the first pitch. The first and second set of gate structures extend in a second direction. A gate of the first set of gate structures is aligned in the second direction with a corresponding gate of the second set of gate structures. The gate of the first set of gate structures is separated from the corresponding gate of second set of gate structures in the second direction by a first distance.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: October 5, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Jung Chang, Chin-Chang Hsu, Hsien-Hsin Sean Lee, Wen-Ju Yang
  • Patent number: 11106842
    Abstract: Systems and methods for selecting equipment for use in buildings are disclosed. The system may include at least one processor configured to perform operations that include accessing a floor plan demarcating a plurality of rooms. The operations further include accessing functional requirements associated with the rooms and accessing technical specifications associated with the functional requirements. The operations include performing floor plan analysis on the floor plan to ascertain room features associated with the functional requirements and technical specifications. The operations include generatively analyzing the room features to determine a customized equipment configuration for at least some of the rooms, and generating a manufacturer dataset including a room identifier, an equipment identifier, and the customized equipment configuration. The manufacturer dataset enables a manufacturer to customize equipment for the rooms and package the customized equipment to display the room identifier.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: August 31, 2021
    Assignee: BEAMUP LTD.
    Inventors: Tom Segev, Stephane Levy, Guy Austern, Yonatan Goyhman
  • Patent number: 11106632
    Abstract: An illustrative data storage management system relies on a specially configured proxy server to operate software containers on a proxy server, maintain resources needed by the software containers, and interwork with other system components. Illustratively, a catalog service on the proxy server maintains a software cache according to maintenance rules and also maintains an associated cache catalog. The software containers are generally managed and operated by an illustrative container manager also hosted by the proxy server. The illustrative software cache comprises contents needed by the software containers, such as pre-configured container templates, DBMS software components, lightervisors representing target operating systems, and storage management software for performing test and storage operations. The maintenance rules govern when cache contents should be purged and moved into offline archive copies.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: August 31, 2021
    Assignee: Commvault Systems, Inc.
    Inventors: Prashanth Nagabhushana Bangalore, Diptiman Basak, Girish Ramohalli Gopala Rao, Shankar Reddy Vullupala, Saamaja Vupputuri
  • Patent number: 11087054
    Abstract: Systems and methods for generating wiring diagrams for equipment are disclosed. The system may include at least one processor configured to perform operations that may include accessing a floor plan defining a plurality of rooms, receiving input associating at least one of a plurality of functional requirements with at least one room of the plurality of rooms, and accessing, in a data structure, technical specifications associated with electrical equipment. Operations may include selecting, from the data structure, a plurality of the technical specifications, generatively analyzing the at least one room in conjunction with the functional requirement and the selected technical specifications in order to select a piece of equipment for the at least one room and select an equipment placement location, accessing structural data associated with the at least one room, and generating a wiring diagram for the at least one room using the selected technical specifications and the structural data.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: August 10, 2021
    Assignee: BEAMUP LTD.
    Inventors: Guy Austern, Tom Segev, Stephane Levy, Yonatan Goyhman
  • Patent number: 11030377
    Abstract: Various embodiments described herein provide for routing of wires of a network of a circuit design based on pin placement within a routing blockage. In particular, various embodiments provide a routing solution for a circuit design with zero blockage violation when there is no pin inside routing blockage of the circuit design, and uses a parameter (e.g., an adjustable parameter) that controls accuracy at which a routing process handles a pin (e.g., as placed by a placement stage) in routing blockage of the circuit design. For example, the parameter can control how much detour is acceptable when handling routing for a pin inside a routing blockage.
    Type: Grant
    Filed: June 8, 2020
    Date of Patent: June 8, 2021
    Assignee: Cadence Design Systems, Inc.
    Inventors: Wing-Kai Chow, Mehmet Can Yildiz
  • Patent number: 11010236
    Abstract: Embodiments are directed towards the visualization of machine data received from computing clusters. Embodiments may enable improved analysis of computing cluster performance, error detection, troubleshooting, error prediction, or the like. Individual cluster nodes may generate machine data that includes information and data regarding the operation and status of the cluster node. The machine data is received from each cluster node for indexing by one or more indexing applications. The indexed machine data including the complete data set may be stored in one or more index stores. A visualization application enables a user to select one or more analysis lenses that may be used to generate visualizations of the machine data. The visualization application employs the analysis lens to produce visualizations of the computing cluster machine data.
    Type: Grant
    Filed: April 30, 2020
    Date of Patent: May 18, 2021
    Assignee: SPLUNK INC.
    Inventors: Cary Glen Noel, Kirubakaran Pakkirisamy, Alex Raitz, Pierre Tsai
  • Patent number: 10977421
    Abstract: A method of manufacturing an integrated circuit includes generating a first layout design based on design criteria, performing a color mapping between the first layout design and a standard cell layout design thereby generating a via color layout design, and manufacturing the integrated circuit based on the via color layout design. The first layout design has a first set of vias divided into sub-sets of vias based on a corresponding color indicating that vias of the sub-set of vias with a same color, and vias of the sub-set of vias with a different color. The standard cell layout design has a second set of vias arranged in standard cells. The via color layout design has a third set of vias including a portion of the second set of vias and corresponding locations, and color of the corresponding sub-set of vias.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: April 13, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Cheng Lin, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Shih-Wei Peng, Wei-Chen Chien
  • Patent number: 10963616
    Abstract: Embodiments disclosed herein describe systems, methods, and products for aligning wires in an integrated circuit (IC) design. An illustrative computer may identity multiple references in a first set of wires and multiple targets in a second set of wires in the IC design. The computer may determine reference target pairs from the multiple references and multiple targets. The computer may calculate a path difference for each of the reference target pairs and align the corresponding wires based upon the path difference while obeying minimum spacing rules. The computer may also allow a circuit designer to modify or override the computer selected references, targets, or reference target pairs. Embodiments disclosed herein therefore mitigate the alignment problems of shorting and incorrect spacing.
    Type: Grant
    Filed: December 30, 2019
    Date of Patent: March 30, 2021
    Assignee: Cadence Design Systems, Inc.
    Inventors: Vidhi Bansal, Devendra Deshpande
  • Patent number: 10936773
    Abstract: Systems and methods to perform integrated circuit development include identifying one or more multi-sink nets in a design of the integrated circuit. Each of the one or more multi-sink nets includes a source that supplies signals to two or more sinks. A method includes determining a wire tag for each of the two or more sinks of each of the one or more multi-sink nets. Each wire tag defines characteristics of a wire connecting the source to the sink, and the characteristics include a wire width and a range of metal layers within the integrated circuit for traversal of the wire. The method also includes providing the design and the wire tags for fabrication of the integrated circuit.
    Type: Grant
    Filed: August 26, 2019
    Date of Patent: March 2, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Lukas Daellenbach, Sven Peyer
  • Patent number: 10854291
    Abstract: Briefly, embodiments of claimed subject matter relate to backup of parameters, such as binary logic values, stored in nonvolatile memory, such as one or more SRAM cells. Binary logic values from a SRAM cell, for example, may be stored utilizing resistance states of a magnetic random-access memory (MRAM) element. Parameters stored in one or more MRAM elements may be restored to SRAM memory cells following a backup.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: December 1, 2020
    Assignee: Arm Limited
    Inventors: Akhilesh Ramlaut Jaiswal, Mudit Bhargava, George McNeil Lattimore
  • Patent number: 10827387
    Abstract: [Object] To make it possible to reduce a load on a controller configured to perform centralized control of a network. [Solution] There is provided an apparatus including: an acquisition unit configured to acquire traffic information relating to traffic of a cell group including two or more cells; and a provision unit configured to provide the traffic information for a control device, the control device being configured to perform routing control of traffic of a plurality of cell groups including the cell group.
    Type: Grant
    Filed: October 20, 2018
    Date of Patent: November 3, 2020
    Assignee: SONY CORPORATION
    Inventor: Shinichiro Tsuda
  • Patent number: 10817642
    Abstract: Various embodiments are directed to a mechanism for reserving power resources to address non-uniform and complex routings on a redistribution layer of a flip-chip. Reserving power resources may be performed by rerouting RDL nets by, for example, identifying an initial RDL net route for a RDL net; defining an outer boundary relative to the initial RDL net route, wherein a perimeter of the outer boundary is defined at a defined distance away from the initial RDL net route; defining one or more blockages extending from bumps to intersect the outer boundary; subdividing the initial RDL net route into a plurality of net portions, wherein each net portion is bounded by a portion of the outer boundary and one or more of the blockages; and rerouting at least one of the plurality of net portions to be adjacent at least one blockage bounding the circuit net portion.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: October 27, 2020
    Assignee: SYNOPSYS, INC.
    Inventor: Hsien-Shih Chiu
  • Patent number: 10796056
    Abstract: Original cell design rule violations with respect to a second wiring layer are identified, while conductors of the second wiring layer are in an original position. The conductors of the second wiring layer are offset into different offset positions, and then the process of identifying violations is repeated for each of the offset positions. With this, metrics are generated for the original cell for the original position and each of the offset positions. Then, the original cell or the pitch of the second wiring layer are altered to produce alterations. The processes of identifying violations, offsetting conductors in the second wiring layer, repeating the identification of violations for all offsets, and generating metrics are repeated for each of the alterations. The original cell or one of the alterations is then selected, based on which cell produces the lowest number of violations of the design rules.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: October 6, 2020
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Gregory A. Northrop, Lionel Riviere-Cazaux, Lars Liebmann, Kai Sun, Norihito Nakamoto
  • Patent number: 10790223
    Abstract: An integrated circuit package element provided includes a chip element and a package module coupled to the chip element. The chip element includes two driving units that are electrically connected to each other. The package module includes a grounding area, two individual power distributed networks and a grounded shielding structure which is completely disposed between the individual power distributed networks, electrically connected to the chip element, and configured to block power noise coupling between the first electric power distribution network and the second electric power distribution network. The grounding area is electrically connected to the individual electric power distribution networks and the grounded shielding structure.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: September 29, 2020
    Assignees: GLOBAL UNICHIP CORPORATION, TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Sheng-Fan Yang, Yuan-Hung Lin, Yu-Cheng Sun, Steve S. A. Wan
  • Patent number: 10769825
    Abstract: A matched array technology system and method for displaying in a two-dimensional array the structured interaction between the expectations of manager and employee in an organization. Proxy values of employee and manager perspectives are defined and scaled so the axes of the array contain corresponding indicators resulting in a “matched array” and an embedded, unique “alignment vector” of the cells where employee and manager expectations are equivalent. The matched array display shows all possible manager and employee value intersections, and the geometry of the alignment vector designates optimal alignment between employee and manager for each stage of job performance from entry to advancement. The plotted position of an employee on the array in relation to its location and distance from the alignment vector measures employee performance, potential, and risk, and indicates the direction and extent of adjustment needed by either employee or manager to achieve and maintain alignment.
    Type: Grant
    Filed: May 15, 2020
    Date of Patent: September 8, 2020
    Assignee: EffectiveTalent Office LLC
    Inventor: Craig M. Watson
  • Patent number: 10733353
    Abstract: A method for forming an integrated device includes the following operations. A first circuit layout is provided. The first circuit layout includes a first device and a connecting portion. A first voltage level is applied to the first circuit layout. The first circuit layout is analyzed according to the first voltage level to determine if a failing signal occurs in the first circuit layout. The first device is analyzed when the failing signal occurs. It is determined, according to a second voltage level, whether a violation occurs in the first device. The first circuit layout is modified when a violation occurs.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: August 4, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yu-Tao Yang, Yung-Chow Peng
  • Patent number: 10719656
    Abstract: Techniques related to triple and quad coloring of shape layouts are provided. A computer-implemented method comprises coloring, by a system operatively coupled to a processor, a shape layout with a plurality of colors in accordance with a defined design rule based on a determination that a first defined shape within the shape layout satisfies a layout specification and a second defined shape within the shape layout satisfies a defined rule.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: July 21, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Alexey Y. Lvov, Gi-Joon Nam, Gustavo Enrique Tellez
  • Patent number: 10706201
    Abstract: Various embodiments provide for circuit design routing using a track assignment based on a plurality of panels (also referred to herein as a multi-panel track assignment). According to some embodiments, a track assignment of a wire within a particular panel is performed based on a primary panel bound or limit and a secondary panel bound or limit. For instance, during a track assignment for a particular wire falling within a particular panel, an embodiment can first attempt to assign the particular wire to a track that falls within panels within the primary panel bound and, if deemed not possible (e.g., due to a DRC, violation or congestion issue), the embodiment can then assign the particular wire to a track that falls within panels within the secondary panel bound.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: July 7, 2020
    Assignee: Cadence Design Systems, Inc.
    Inventors: Yi-Xiao Ding, Mehmet Can Yildiz
  • Patent number: 10691859
    Abstract: A method of designing a layout of an integrated circuit (IC) includes placing a first cell in the layout, placing a second cell in the layout adjacent to the first cell at a first boundary between the first and second cells, and generating a plurality of commands executable by a processor to form a semiconductor device based on the layout. The first cell includes a first pattern and a second pattern. The first and second patterns are adjacent to the first boundary, the first and second patterns have different colors, and a first boundary space between the first pattern and the first boundary is different from a second boundary space between the second pattern and the first boundary.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: June 23, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Woo Seo, Ha-Young Kim, Hyun-Jeong Roh
  • Patent number: 10684862
    Abstract: A processor synthesis device inserts a stop circuit into a circuit configuration, which is defined by processor model information and includes a plurality of operators, based on instruction set information that defines an instruction set including a plurality of instructions, the stop circuit stopping an operator not used in an instruction to be executed among the plurality of operators when each of the plurality of instructions is executed. The processor synthesis device generates processor synthesis information which is an RTL description defining a circuit configuration into which the stop circuit is inserted.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: June 16, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takumi Hoshi, Tetsuo Yano, Hiroyuki Yamamoto, Seidai Takeda
  • Patent number: 10565348
    Abstract: A method of fabricating an integrated circuit is disclosed. The method includes defining a via grid, generating a first layout design of the integrated circuit based on at least the via grid or design criteria, generating a standard cell layout design of the integrated circuit, generating a via color layout design of the integrated circuit based on the first layout design and the standard cell layout design, performing a color check on the via color layout design based on design rules, and fabricating the integrated circuit based on at least the via color layout design. The first layout design has a first set of vias arranged in first rows and first columns based on the via grid. The standard cell layout design has standard cells and a second set of vias arranged in the standard cells. The via color layout design has a third set of vias.
    Type: Grant
    Filed: July 1, 2019
    Date of Patent: February 18, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Cheng Lin, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Shih-Wei Peng, Wei-Chen Chien
  • Patent number: 10468426
    Abstract: A nonvolatile memory (“NVM”) bitcell with one or more active regions capacitively coupled to the floating gate but that are separated from both the source and the drain. The inclusion of capacitors separated from the source and drain allows for improved control over the voltage of the floating gate. This in turn allows CHEI (or IHEI) to be performed with much higher efficiency than in existing bitcells, thereby the need for a charge pump to provide current to the bitcell, ultimately decreasing the total size of the bitcell. The bitcells may be constructed in pairs, further reducing the space requirements of the each bitcell, thereby mitigating the space requirements of the separate capacitor/s. The bitcell may also be operated by CHEI (or IHEI) and separately by BTBT depending upon the voltages applied at the source, drain, and capacitor/s.
    Type: Grant
    Filed: December 13, 2017
    Date of Patent: November 5, 2019
    Assignee: Synopsys, Inc.
    Inventor: Andrew E. Horch
  • Patent number: 10366200
    Abstract: A method of forming a layout design for fabricating an integrated circuit is disclosed. The method includes generating a first layout of the integrated circuit based on design criteria, generating a standard cell layout of the integrated circuit, generating a via color layout of the integrated circuit based on the first layout and the standard cell layout and performing a color check on the via color layout based on design rules. The first layout having a first set of vias arranged in first rows and first columns. The standard cell layout having standard cells and a second set of vias arranged in the standard cells. The via color layout having a third set of vias. The third set of vias including a portion of the second set of vias and corresponding locations, and color of corresponding sub-set of vias.
    Type: Grant
    Filed: September 7, 2016
    Date of Patent: July 30, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Cheng Lin, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Jiann-Tyng Tzeng, Kam-Tou Sio, Ru-Gun Liu, Shih-Wei Peng, Wei-Chen Chien
  • Patent number: 10346579
    Abstract: Embodiments relate to an interactive routing of connections in a circuit where connections associated with an initial pin of a circuit element (e.g., a row of FinFETs) are replicated in association with at least one other pin of the circuit element or a different circuit element in the circuit. The replication of connections can be performed intelligently by taking into account mapping of pins as well as design rules or other restrictions imposed on the circuit. The connections can be in form of trunks and branches, and are displayed as user inputs are received. A digital representation of the circuit with the connections as displayed is also generated. At least some of the connections in the circuit are replicated without individual user inputs based on user inputs associated with a connection to the initial pin.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: July 9, 2019
    Assignee: Synopsys, Inc.
    Inventors: Philippe Aubert McComber, Hsiang-Wen Jimmy Lin
  • Patent number: 10340180
    Abstract: The present disclosure relates to semiconductor structures and, more particularly, to merged mandrel lines and methods of manufacture. The structure includes: at least one metal line having a first dimension in a self-aligned double patterning (SADP) line array; and at least one metal line having a second dimension inserted into the SADP line array, the second dimension being different than the first dimension.
    Type: Grant
    Filed: January 16, 2018
    Date of Patent: July 2, 2019
    Assignee: GLOBALFOUNDRIES INC.
    Inventors: Hsueh-Chung Chen, Martin J. O'Toole, Terry A. Spooner, Jason E. Stephens
  • Patent number: 10325052
    Abstract: The present embodiments relate generally to techniques for creating and/or modifying multi-layer buses in an IC design. According to some more particular aspects, embodiments relate to techniques for allowing an IC designer to efficiently transition a multi-layer bus section made of N wires and M layers to another multi-layer bus section made of N wires and any other M? layers. In some embodiments, the user describes, programmatically, one or several custom transitions called a custom transition procedure and saved in a human-readable text file that can also be read by a layout editor tool. By a command associated with the custom transition procedure that is exposed to the user in the layout editor tool, a multi-layer bus is automatically transitioned from a set of layers to another.
    Type: Grant
    Filed: September 15, 2016
    Date of Patent: June 18, 2019
    Assignee: CADENCE DESIGN SYSTEMS, INC.
    Inventor: Christophe Fouassier
  • Patent number: 10312441
    Abstract: A tunable resistive element, comprising a first terminal, a second terminal, a dielectric layer and an intercalation layer. The dielectric layer and the intercalation layer are arranged in series between the first terminal and the second terminal. The dielectric layer is configured to form conductive filaments of oxygen vacancies on application of an electric field. The intercalation layer is configured to undergo a topotactic transition comprising an oxygen intercalation in combination with a change in the resistivity of the intercalation layer. A related memory device and a related neuromorphic network comprise resistive memory elements as memory cells and synapses respectively and a corresponding design structure.
    Type: Grant
    Filed: April 9, 2018
    Date of Patent: June 4, 2019
    Assignee: International Business Machines Corporation
    Inventors: Jean Fompeyrine, Stefan Abel, Veeresh Vidyadhar Deshpande