Abstract: A computer implemented method, data processing system, and computer program product for reworking a plurality of cells initially placed in a circuit design. An expander allocates cells to tiles, wherein some tiles have cells. The expander determines a high detailed routing cost tile class, wherein the high detailed routing cost tile class is a class of tiles that are high detailed routing cost tiles. The expander selects a cell within a tile of the high detailed routing cost tile class to form a selected cell and a selected tile. The expander places an expanded bounding box around the selected cell, wherein the bounding box extends to at least one tile adjacent the selected tile. The expander expands the selected cell within the bounding box to form a modified design, determines an aggregate routing cost among other steps, and affirms the modified design for further processing.

Abstract: A skewed placement grid for an integrated circuit (IC) is disclosed. In one embodiment, an IC includes a placement grid which includes a plurality of cells. Each of the plurality of cells includes one of a corresponding plurality of circuits. A center point of each of the cells is located at a unique coordinate along a first axis and a second axis with respect to each of the other ones of the plurality of cells. The IC further includes a first plurality of signal interconnections, wherein each of the plurality of signal interconnections is coupled to a corresponding one of the first plurality of circuits.

Abstract: A routing fabric using multiple levels of switching networks along with associated routing matrices to allow a more uniform and shorter interconnection or routing path among logic modules or routing modules compared with those in the conventional designs. The resulting routing fabric can be used in electronic devices, such as switching networks, routers, and programmable logic circuits, etc.

Abstract: A method and apparatus for manufacturing an integrated circuit (IC), the method including, generating, by a graphical construction unit, a first graph corresponding to a first net of the IC, the first graph representing a pin of the first net as a vertex, and a connection between two pins of the first net as an edge, the first graph further corresponding to a first IC layout; identifying a first and a second pair of unconnected vertices in the first graph for inserting a first and a second redundant edge, respectively, the first redundant edge and the second redundant edge forming a first connected loop and a second connected loop, respectively, each loop further including at least two edges of the first graph; calculating a tolerance ratio for the first redundant edge and the second redundant edge; sorting the first and second redundant edge based on their tolerance ratio; calculating a yield rate change of the first IC layout associated with inserting one of the first or second redundant edge with a highest

Abstract: A system of automatically routing interconnect of a integrated circuit design while taking into consideration the parasitic issues of the wiring as it is created. The system will be able to select an appropriate wiring pattern so that signals meet their performance requirements.

Abstract: An iterative technique is used to automatically route nets and alter spacing of an integrated circuit design to achieve a fully routed and compact result. After identifying solid and hollow channels, the technique automatically places route paths to connect pins of cells in the solid channels, where route paths may be placed within the solid channels or hollow channels. The technique can reduce a width of at least one hollow channel when an entire space of the hollow channel is not occupied by a placed route path.

Abstract: In a method of designing a double patterning mask set, a chip is first divided into a grid that includes grid cells. A metal layer of the chip is laid out. In substantially each of the grid cells, all left-boundary patterns of the metal layer are assigned with a first indicator, and all right-boundary patterns of the metal layer are assigned with a second indicator. Starting from one of the grid cells in a row, indicator changes are propagated throughout the row. All patterns in the grid cells are transferred to the double patterning mask set. All patterns assigned with the first indicator are transferred to a first mask of the double patterning mask set, and all patterns assigned with the second indicator transferred to a second mask of the double patterning mask set.

Abstract: A re-routing method for a circuit diagram includes the following steps. At least one pair of the signal lines is obtained from a routed circuit diagram. The routed circuit diagram is adapted to be laid out on a substrate of a Printed Circuit Board (PCB). The substrate includes warp wires and weft wires. At least one pair of the signal lines includes two signal lines in parallel. The pair of signal lines includes several pairs of line segments. It is determined whether at least one pair of parallel line segments exists in the pairs of line segments parallel to the warp or weft wires. If at least one pair of parallel line segments exists, at least one pair of parallel line segments on the routed circuit diagram is replaced with several pairs of 10-degree lines. Respective angle between the 10-degree lines and the warp or weft wires are 10 degrees.

Abstract: A circuit and methods for placing a circuit block on an integrated circuit (IC) are disclosed. An embodiment of the disclosed method includes dividing the IC into multiple regions based on pre-determined value. This pre-determined value may be a voltage drop value measured on specific regions on the IC. The performance requirement for the circuit block is determined and placed in one of the regions on the IC. In one embodiment, the placement of the circuit block is based on the performance requirement and the measured value at specific regions on the IC. The measured value may be a voltage drop value and a circuit block with a higher performance may be placed in a region with a lower voltage drop value.

Abstract: A method for tiling selected vias in a semiconductor device is provided. The semiconductor device includes a plurality of vias. The method includes: generating a layout database for the semiconductor device; identifying isolated vias of the plurality of vias; selecting the isolated vias; defining a zone around each of the selected isolated vias; and adding tiling features on a metal layer above the selected isolated vias and within the zone. The method improves reliability of the semiconductor device by allowing moisture to vent from around the vias.

Abstract: Disclosed are methods, systems, and structures for implementing interconnect modeling by using a test structure which include a variation of physical wire structures between local interconnects and distant interconnects. According to one approach, the impact of variations of the physical properties for neighborhood wires are considered for the electrical modeling of interconnects. This variation between the local and distant wire characteristics allows more accurate and robust interconnect modeling to be created.

Abstract: An improved method and system for stitching one or more islands of an integrated circuit design is disclosed. Multiple connected island objects in the IC design are first identified. At least one of the multiple identified connected island objects is then modified to form a modified island object. The modified island object may then be stitched into the multiple identified connected island objects. In some embodiments, stitching a modified island object may be implemented by tracking the endpoint(s), port(s), or node(s) of the connected island object being modified and stitched.

Abstract: A layout region in which a wiring pattern and a special pattern are placed is divided into division regions. The minimum pitch for the special pattern is larger than the minimum pitch for the wiring pattern. With respect to each division region, the special pattern included in a predetermined region surrounding the each division region is extracted as a peripheral pattern, and a dummy pattern placement region included in the each division region is determined. The dummy pattern placement region is apart from at least one of boundaries between adjacent division regions. A dummy pattern is added in the dummy pattern placement region with avoiding a design rule error with the peripheral pattern existing around the each division region. Then, the plurality of division regions to which the dummy pattern is added are coupled with each other.

Abstract: According to one embodiment, a design method of a semiconductor integrated circuit is a design method of a semiconductor integrated circuit including a first wiring layer, a second wiring layer formed on the first wiring layer, and a third wiring layer formed on the second wiring layer. This method includes a process in which plural spare wirings are arranged on the second wiring layer along a first direction, and plural spare wirings are arranged on the third wiring layer in a second direction orthogonal to the first direction. The method also includes a process of arranging a cell on the first wiring layer after the arrangement of the spare wirings, a process of arranging a signal wiring on at least any one of the first to the third wiring layers after the arrangement of the cell, and a process of performing an engineering change order of the wiring by using the spare wirings.

Abstract: A method of configuring a semiconductor integrated circuit (IC) includes arranging a circuit region in the center of a unit cell. Capacitor/resistor regions are arranged along the left and right edge portions of the unit cell. The capacitor/resistor regions include a plurality of active resistors having the same length and a capacitor having a width equal to the length of the plurality of active resistors. In addition, a first conductive layer is arranged longitudinally in each of the capacitor/resistor regions so as to contact the left and right edge portions of the unit cell.

Abstract: A method for dummy metal and dummy via insertion is provided. In one embodiment, dummy metals are inserted using a place and route tool, where the place and route tool has timing-awareness. Then, dummy vias arrays are inserted inside an overlap area of dummy metals using a design-rule-checking utility. Fine-grained dummy vias arrays are inserted in available space far away from main patterns. The dummy-patterns resulting from the inserted dummy vias are compressed using the design-rule-checking utility to reduce the size of a graphic data system file generated from the integrated circuit design. The dummy vias can be inserted with relaxed via spacing rules. The dummy metals are inserted with a constant line-end spacing between them for better process control and the maximum length of the dummy metal can be limited for smaller coupling effects. The dummy vias can have various sizes and a square or rectangular shape.

Abstract: The embodiments of bump-on-trace (BOT) structures and their layout on a die described reduce stresses on the dielectric layer on the metal pad and on the metal traces of the BOT structures. By orienting the axes of the metal bumps away from being parallel to the metal traces, the stresses can be reduced, which can reduce the risk of delamination of the metal traces from the substrate and the dielectric layer from the metal pad. Further, the stresses of the dielectric layer on the metal pad and on the metal traces may also be reduced by orienting the axes of the metal traces toward the center of the die. As a result, the yield can be increased.

Abstract: A computer-implemented method of implementing a circuit design that includes an initial network within a programmable logic device can include generating a first choice network from the circuit design according to a first synthesis technique and determining a placement for the first choice network. At least a second choice network can be generated from the first choice network according to a second synthesis technique. A placement for the second choice network can be determined. The placement for the first choice network can be compared with the placement for the second choice network. A placement and corresponding choice network can be selected according to the comparison, and output.

Abstract: Some embodiments of the invention provide a process for designing and manufacturing an integrated circuit (“IC”). The process selects a wiring configuration and an illumination configuration. The process uses the selected wiring configuration to design an IC layout. The process then uses the selected illumination configuration to manufacture the IC based on the designed IC layout. Some embodiments concurrently select an optimal pair of wiring and illumination configurations. Other embodiments select an illumination configuration based on the selected wiring configuration. Yet other embodiments select a wiring configuration based on the selected illumination configuration. In some embodiments, selecting the illumination configuration entails selecting at least one stepper lens for the IC layout, where the stepper lens illuminates at least one mask for at least one particular layer of the IC layout. In some embodiments, this selection entails selecting a stepper lens for each particular layer of the IC layout.

Abstract: A standard cell library is used in design of a semiconductor integrated circuit. A driving force sequence of cells for a single function is in the form of geometric progression with a geometric ratio of the “pth root of 2,” where p is a natural number of 2 or more. A transistor in an output signal driving section of each of the cell is laid out using only layout devices which are limited to p types of sizes. Even if p is small, the driving force sequence can be formed in geometric progression with an extremely low increasing rate. At the same time, sizes of layout devices are discrete and limited, thereby easily securing accuracy of a performance model of a cell. As a result, the standard cell library allows a high-performance circuit to be designed in a highly reliable model.

Abstract: A method of determining signal routing in an integrated circuit includes providing first coordinates of an input/output cell and second coordinates of an input/output pad to a parametric routing module. The parametric routing module receives at least one wire path parameter. The parametric routing module uses the at least one connection path parameter to determine a physical dimension of a wire path between the first coordinates and the second coordinates.

Abstract: A method for designing a system to be implemented on a target device includes generating bounding boxes on the target device for nets in the system where a bounding box identifies routing resources available for routing its corresponding net. The nets in the system are assigned to a plurality of threads to be routed. The threads are executed so that a plurality of the nets are routed in parallel within their corresponding bounding box.

Abstract: A routing system is improved by performing three steps sequentially to complete an execution process. The first step estimates a normalized criticality score for each design net. The second step arranges the scores for each design net in descending order. Third step rips up and reroutes the design so as to make it more feasible.

Abstract: An innovative routing method for an integrated circuit design layout. The layout can include design netlists and library cells. A multiple-level global routing can generate topological wire for each net. An area oriented graph-based detail routing on the design can be performed. A post route optimization after the detail routing can be performed to further improve the routing quality. Some methods can be single threaded all or some of the time, and/or multi-threaded some or all of the time.

Abstract: A design support program stored in a computer readable recording medium and executed by the computer includes computer readable program code stored thereon for causing a computer to execute operations of: selecting a first hierarchy which has different first characteristic information included in wiring layer structure information in a storage device; generating second characteristic information including the first characteristic information; copying wiring layer structure information; and converting the first characteristic information included in the copied wiring layer structure information into the second characteristic information to obtain a converted wiring layer structure information.

Abstract: A semiconductor device includes a plurality of transistors formed on a semiconductor substrate, a first local wiring which is electrically connected to at least one of the plurality of transistors and extending in a first direction, a second local wiring which is formed above the first local wiring and which electrically connects to at least one of the plurality of transistors and extends in a second direction, a plurality of first wirings which are formed above the second local wiring and which extend in a third direction, at least each of the plurality of first wirings being electrically connected to the first local wiring and the second local wiring, respectively, and a second wiring which is formed above the first wiring and which electrically connects to at least one of the plurality of first wirings and extends in a fourth direction.

Abstract: Methods and apparatuses to design an Integrated Circuit (IC) with a shielding of wires. In at least one embodiment of the present invention, a shielding mesh of at least two reference voltages (e.g., power and ground) is used to reduce both the capacitive coupling and the inductive coupling in routed signal wires in IC chips. In some embodiments, a type of shielding mesh (e.g., a shielding mesh with a window surrounded by a power ring, or a window with a parser set of shielding wires) is selected to make more routing area available in locally congested areas. In other embodiments, the shielding mesh is used to create or add bypass capacitance. Other embodiments are also disclosed.

Abstract: A macro layout verification apparatus for verifying a layout of a macro to be placed as a functional block on a semiconductor device. The apparatus includes: a unit, which assumes as a virtual wiring line, a wiring line that uses an unused intra-macro channel located adjacent to an intra-macro wiring line; a unit which calculates a parallel wiring length along which the virtual wiring line and the intra-macro wiring line run; and a unit which outputs information concerning the virtual wiring line when the parallel wiring length exceeds a reference value defined as a design rule.

Abstract: Some embodiments provide a method that defines a set of connections that connect the nodes in a configurable node array. The method identifies different sets of connections for connecting a set of the nodes. For each identified set of connections, the method computes a metric score that quantifies a quality of the identified set of connections. The method then selects one of the identified sets of connections to connect the configurable nodes in the array.

Abstract: A device includes a definition unit which defines a directional graph having a grid point as a node and a line connecting adjacent grid points as a branch, a generation unit which sets a branch connecting a grid pointing a wiring prohibited area in the branches of the directional graph to the capacity of “0”, and which sets another branch to the capacity of “1”, and which connects the starting point or the end point to each grid point of the wiring terminal indicated by wiring information, thereby generating a flow network, a search unit which searches the flow network for a path of a flow having the maximum amount of flow from the starting point to the end point, and a determination unit which determines a wiring path connecting the grid point indicated by the wiring information according to the search result of the path.

Abstract: A semiconductor integrated circuit includes a first wiring formed on a first wiring layer and prolonged in a first direction, a second wiring formed on a second wiring layer and prolonged in a second direction, a third wiring formed on the first wiring layer and prolonged in the first direction, a fourth wiring formed on the second wiring layer and prolonged in the second direction, a multi-cut via formed to connect the first wiring to the second wiring, the multi-cut via including a first via and a second via formed in the first direction, and a single-cut via formed to connect the third wiring to the fourth wiring. A first overhang is provided in a direction opposite to the first direction, the first overhang being larger than a second overhang, the second overhang being smaller than a third overhang.

Abstract: Systems and methods for wire routing using virtual landing pads (VLPs) are described. In an embodiment, a method includes routing a wiring path between an output of a first circuit component and a VLP that represents an input of a second circuit component. For example, the VLP may have an area larger than the area of a physical pin of the second circuit component. The method may also include identifying a connection point on the VLP that is separated from an actual terminal of the second circuit, and completing the path between the connection point and the actual terminal. In some embodiments, the output of the first circuit component may also be represented by its own VLP. As such, systems and methods described herein may allow a circuit designer to perform routing procedures in a complex, highly integrated circuit, while reducing the circuit's overall capacitance and associated power consumption.

Abstract: Some embodiments of the present invention provide a system that routes nets over circuit blocks in a hierarchical circuit design. During operation, the system can receive a set of circuit blocks. At least some terminals of the circuit blocks may be desired to be electrically linked together using a net which is expected to be routed over one or more circuit blocks. The system may divide an area associated with a block (e.g., an area in a metal layer which is situated above the block) into a set of tiles. Next, the system may assign costs to at least some of the tiles in the set of tiles. The system can then use the costs during routing. Note that using the costs of the tiles during routing makes it more likely that buffers can be used wherever required to meet slew and timing requirements.

Abstract: A system and method for constructing a clock tree based on replica stages is described. The system and method may comprise determining a size of an input buffer for driving a load capacitance of the output buffer based on a fanout, determining a wire width and a wire length based on the size of the output buffer, the fanout and a replica stage mathematical model, and connecting the output buffer and the corresponding input buffer to a conductor routed on one or more predetermined metal layers and having the wire length and the wire width. The conductor is placed within ground shields having a fixed width.

Abstract: A computing device and a method selects a signal transmission line from a circuit board, computes an actual length of each line segment of the selected signal transmission line, and computes an actual distance between each line segment of the selected signal transmission line and a corresponding line segment of each neighboring signal transmission line. If each actual length is less than or equal to a corresponding reference length and each actual distance is more than or equal to a corresponding reference distance, the device and method determines a design of the selected signal transmission line satisfies the design standards. Otherwise, if any actual length is more than a corresponding reference length, or if any actual distance is less than a corresponding reference distance, the device and method determines the design of the signal transmission line does not satisfy the design standards.

Abstract: A designing apparatus includes an initial estimating portion, a general power supply noise analyzing portion, a layout designing portion, a detail estimating portion, a detail power supply noise analyzing portion, and a layout adjusting portion. The initial estimating portion estimates general values of an entire consumed current and an entire on-chip capacitance. Based on the estimated general values, the general power supply noise analyzing portion creates a lumped constant circuit model so as to conduct a power supply noise analysis, for computing a current-capacitance ratio. Based on the current-capacitance ratio, the layout designing portion performs placement of cells for each of predetermined regions obtained by dividing a placement region. The detail estimating portion creates a lumped constant circuit model for each of the predetermined regions so as to estimate detail values of the consumed current and the on-chip capacitance for each of the predetermined regions.

Abstract: A routing method for a multilayer circuit design layout that has a set of possible preferred local routing directions and a default preferred routing direction for each layer. The method receives a set of user specified constraints on routing directions for particular regions of the design layout. The method tessellates the available routing space into separate tiles and automatically defines a preferred local routing direction for each tile based on the user specified constraints. The set of user specified constraints includes user designated flows, locked etches, “etch keep-out” areas, user “planned” data, etc. A routing method for a multilayer design layout that receives a first set of user specified preferred routing directions for particular regions of the multilayer design layout. The method tessellates the available routing space into separate tiles and automatically defines a second preferred local routing direction for each tile based on the user specified preferred routing directions.

Abstract: In one embodiment, a method for routing of a circuit design netlist is provided. A processing cost is determined for each net in the netlist. A plurality of regions are defined for the target device such that the total processing costs of nets are balanced between the plurality of regions. Concurrent with routing one or more nets of a first one of the plurality of regions, one or more nets are routed in at least one other of the plurality of regions. Synchronization and subsequent routing are performed for unrouted nets of the netlist.

Abstract: Some embodiments provide a system that facilitates the creation of a schematic in an electronic design automation (EDA) application. During operation, the system obtains a source point and a destination point in the schematic from a user of the EDA application. Next, the system uses a line-probe-search technique to generate a set of route variants between the source point and the destination point. The system then provides the route variants to the user through a graphical user interface (GUI) in the EDA application and obtains, from the user, a selection of a route variant from the route variants through the GUI. Finally, the system uses the selected route variant as a route in the schematic.

Abstract: A method for defining and producing a power grid structure (having stripe, rail, and via components) of an IC. The method reduces the number of vias in the power grid structure and the diagonal wiring blockage caused by the vias while still meeting design specifications. Other embodiments provide a method for locating vias in the power grid structure in such a way as to be especially beneficial to 45° or 135° diagonal wiring paths. The method includes processes of a power grid planner, power grid router, power grid verifier, and global signal router that are used iteratively to define and produce a power grid structure. Other embodiments of the invention provide for arrangements of vias in via arrays where diagonal wiring paths are facilitated near the edges of the via arrays. A bounding box enclosing these via arrays have an aspect ratio that is approximately equal to 1.

Abstract: High density circuit modules are formed by stacking integrated circuit (IC) chips one above another. Unused input/output (I/O) locations on some of the chips can be used to connect other I/O locations, resulting in decreased impedance between the chips. Additional apparatus, systems, and methods are disclosed.

Abstract: A method includes receiving an identification of a plurality of cells to be included in an integrated circuit (IC) layout, including a list of pairs of cells within the plurality of cells to be connected to each other. First routing paths are identified, to connect a maximum number of the pairs of cells using one-dimensional (1-D) routing between cells within those pairs of cells. Second routing paths are selected from a predetermined set of two-dimensional (2-D) routing patterns to connect any of the pairs of cells which cannot be connected by 1-D routing. The first and second routing paths are output to a machine readable storage medium to be read by a control system for controlling a semiconductor fabrication process to fabricate the IC.

Abstract: A method includes receiving an identification of a plurality of circuit components to be included in an IC layout. Data are generated representing a first pattern to connect two of the circuit components. The first pattern has a plurality of segments. At least two of the segments have lengthwise directions perpendicular to each other. At least one pattern-free region is reserved adjacent to at least one of the at least two segments. Data are generated representing one or more additional patterns near the first pattern. None of the additional patterns is formed in the pattern-free region. The first pattern and the additional patterns form a double-patterning compliant set of patterns. The double-patterning compliant set of patterns are output to a machine readable storage medium to be read by a system for controlling a process to fabricate a pair of masks for patterning a semiconductor substrate using double patterning technology.

Abstract: An integrated circuit including a first wire of a first level of wiring tracks, a second wire of a second level of wiring tracks, a third wire of a third level of wiring tracks, and a fourth wire located at a first distance from the second wire in the second level of wiring tracks. A first via connects the first and second wires at a first location of the second wire. A second via connects the second and third wires at the first location, the second via is approximately axially aligned with the first via. A third via connecting the third and fourth wires at a second location of the fourth wire. A fourth via connecting the first and fourth wires at the second location, the fourth via is approximately axially aligned with the third via. The second, third, and fourth vias, and the third and fourth wires form a path between the first and second wires redundant to the first via.

Abstract: Assigning pins to macro-blocks of an Integrated Circuit (IC) chip is described. The macro-block pin assignments are automatically placed using Constraint Programming (CP) techniques to position the pins on the periphery of a macro-block. Bus-ordering and pin-spacing constraints are performed considering all the nets forming the IC design simultaneously. The CP formulation includes modeling detailed and discrete constraints required to achieve an optimal pin-assignment. A stochastic CSP solver is used to define the cost function on search points giving full assignments to all the variables. The macro-block pins are ultimately moved to computed locations.

Abstract: Integrated structures having high performance CMOS active devices mounted on passive devices are provided. The structure includes an integrated passive device chip having a plurality of through wafer vias, mounted to a ground plane. The structure further includes at least one CMOS device mounted on the integrated passive device chip using flip chip technology and being grounded to the ground plane through the through wafer vias of the integrated passive device chip.

Abstract: Disclosed are embodiments of a method, service, and computer program product for performing yield-aware IC routing for a design. The method performs an initial global routing which satisfies wiring congestion constraints. Next, the method performs wire spreading and wire widening on the global route, layer by layer, based on, for example, a quadratic congestion optimization. Following this, timing closure is performed on the global route using results of the wire spreading and wire widening. Post-routing wiring width and wire spreading adjustments are made using the critical area yield model. In addition, the method allows for the optimization of already-routed data.

Abstract: A design method of a semiconductor integrated circuit carried out by a computer, including: a DRC step of performing a design rule check (Design Rule Check) with reference to layout information on an internal wiring in a capacitor cell and layout information on a signal wiring in the semiconductor integrated circuit; an integration step of integrating layout information on the internal wiring into layout information on the signal wiring when being determined in the DRC step that there is an error; and an elimination step of eliminating an error portion in the internal wiring from the integrated layout information.

Abstract: A method of placing clock circuits in an integrated circuit is disclosed. The method comprises receiving a circuit design to be implemented in the integrated circuit; identifying portions of the circuit design comprising clock circuits; determining an order of clock circuits to be placed based upon resource requirements of the clock circuits; and placing the portions of the circuit design comprising clock circuits in sites of the integrated circuit. A system for placing clock circuits in an integrated circuit is also disclosed.

Abstract: A method includes providing a wafer representation including a metal layer and a plurality of bump pads over the metal layer, wherein the metal layer includes directly-under-bump-pad regions. A solid metal pattern is inserted into the metal layer, wherein the solid metal pattern includes first parts in the directly-under-bump-pad regions and second parts outside the directly-under-bump-pad regions. Portions of the second parts of the solid metal pattern are removed, wherein substantially no portions of the first parts of the solid metal pattern are removed. The remaining portions of the solid metal pattern not removed during the step of removing form dummy metal patterns. The dummy metal patterns and the plurality of bump pads are implemented in a semiconductor wafer.