Abstract: Methods and apparatus are provided for planar metal plating on a workpiece having a surface with recessed regions and exposed surface regions; comprising the steps of: causing a plating accelerator to become attached to said surface including the recessed and exposed surface regions; selectively removing the plating accelerator from the exposed surface regions without performing substantial metal plating on the surface; and after removal of plating accelerator is at least partially complete, plating metal onto the surface, whereby the plating accelerator remaining attached to the surface increases the rate of metal plating in the recessed regions relative to the rate of metal plating in the exposed surface regions.

Abstract: Environment-friendly process for descaling, pickling and finishing/passivating in a continuous, integrated and flexible manner, applicable to any type of stainless steel, regardless of its physical structure, chemical composition and nature of surface oxides to be removed, within a single plant in which the required chemical, electrochemical, mechanical and hydromechanical treatments are carried out, merely diversifying the operative conditions of each treatment according to the stainless steel type to be processed. The process and the plant according to the invention allow elevated reaction rate, excellent surface quality, low energy and chemical reagent consumption and total environmental compatibility. The figure shows the block diagram of an embodiment of the plant according to the invention.

Abstract: The present invention pertains to a method for removing a substance (X) from a solid metal or semi-metal compound (M1X) by electrolysis in a melt of M2Y, which comprises conducting the electrolysis under conditions such that reaction of X rather than M2 deposition occurs at a electrode surface, and that X dissolves in the electrolyte M2Y. The substance X is either removed from the surface (i.e., M1X) or by means of diffusion extracted from the case material. The temperature of the fused salt is chosen below the melting temperature of the metal M1. The potential is chosen below the decomposition potential of the electrolyte.

Abstract: A representative embodiment prevents breakage of antennas and accidents due to breakage of electric wires caused by ice and snow accretion by realizing a surface with a surface energy of 2 mN/m or less and providing an antenna and electric wire having an extremely great effect of preventing ice and snow accretion at midwinter. Another representative embodiment provides an ice and snow accretion-preventive antenna and electric wire wherein a surface thereof is compositely fabricated to have large roughness and small roughness, and the surface of each of the roughness is coated with a water-repellent, oil-repellent, and antifouling thin film.

Abstract: The present invention relates to electrolytic recovery of metal, and in particular methods and apparatus for producing cathode plates suitable for such electrolytic recovery. A first aspect of the invention provides a method of providing an electrically conductive coating on a cathode plate comprising inverting and submerging an upper portion of the cathode plate in an electrolytic bath adjacent at least one anode and applying a current to electroplate the upper portion of the cathode plate wherein each anode includes: i) a first base portion adapted to be positioned adjacent to a hanger bar of said cathode plate; ii) a second extended portion connected to and extending from the base portion and adapted to be positioned adjacent a blade of the cathode plate wherein the profile of each anode is shaped such that in use, a consistent thickness of coating is electroplated over said hanger bar and cathode blade.

Abstract: A bioerodible stent, having a composition comprising Fe, Mn, Si and C has desirable mechanical, erosion, and physiological characteristics.

Abstract: The present invention provides a method for separating a surface layer of a diamond, which comprises implanting ions into a diamond to form a non-diamond layer near a surface of the diamond; and etching the non-diamond layer in the diamond by applying an alternating-current voltage across electrodes in an electrolytic solution; and a method for separating a grown layer of a diamond, which further comprises the step of growing a diamond by a vapor-phase synthesis method, after forming a non-diamond layer according to the above-described method. The invention is applicable to various single-crystal and polycrystal diamonds. More specifically, even with a large single-crystal diamond, a portion of the single-crystal diamond can be efficiently separated in a reusable form in a relatively short period of time.

Abstract: An apparatus and method are provided for simultaneously electropolishing a plurality of metallic stents. A plurality of elongated members on the apparatus are movably engaged with a plate such that movement of the plate relative to the elongated members causes each of the elongated members to rotate on its respective longitudinal axis when immersed in an electrolytic solution. A continuous cathode is located in close proximity to each of the elongated members when they are immersed in the electrolytic solution.

Abstract: Plasma-electrolytic polishing (PEP) of titanium alloy and other metals where plasma effect takes place when voltage does not exceed 80V DC.

Abstract: An apparatus and process is disclosed for the electrolytic removal of metal from a device, such as a medical device. More particularly, the apparatus of the invention includes a mandrel having slots or openings therein to expose portions of a metallic device, such as a stent, to an electrolytic solution to remove metal from the exposed portion.

Abstract: In a state where a silicon base material (1) is used as an anode, a fine platinum member (2) is used as a cathode, and an electrolyte solution (4) is arranged between the anode and the cathode, anodic oxidation is performed in constant current mode under the conditions where porous formation mode and electrolytic polishing mode coexist. The platinum member (2) is fitted in the silicon base material (1) with silicon elution, and processes such as hole making, cutting, single-side pressing are performed. Since the silicon base material can be processed at a room temperature with small energy, the crystal quality of the processing surface is not deteriorated. Thus, efficient and highly accurate processing can be performed without using a mechanical method, which consumes much material in conventional processes such as cutting of solar cell silicon base material, and without using laser whose energy unit cost is high, and furthermore, without leaving a crystal damage on a processed surface.

Abstract: A method of rear surface treatment is carried out by: preparing a semiconductor device in which an integrated circuit having a plurality of electrodes is provided on the front surface of a semiconductor substrate; electrically connecting the plurality of electrodes to an anode; and electropolishing the rear surface of the semiconductor substrate by performing anodic oxidation with an electrolytic solution placed in contact with the rear surface of the semiconductor substrate.

Abstract: A method of rear surface treatment is carried out by: preparing a semiconductor or device in which an integrated circuit having a plurality of electrodes is provided on the front surface of a semiconductor substrate; electrically con netting the plurality of electrodes to an anode; and electropolishing the rear surface of the semiconductor substrate by performing anodic oxidation with an electrolytic solution placed in contact with the rear surface of the semiconductor substrate.

Abstract: Etching of copper on a card is achieved by applying an electrical voltage between a cathode (102) and the card (42), the card (42) thereby forming an anode. The cathode (102) and the card (42) are immersed in an electrolyte comprising a first component, which may be reduced from a first state in the form of an ion having a metal atom with a first positive oxidation number to a second state in the form of an ion having said metal atom with a second positive oxidation number, which is less than said first positive oxidation number. A first redox potential in the electrolyte for reduction from the first to the second state is larger than a second redox potential in the electrolyte for reduction of divalent copper ions to metallic copper. During the etching metallic copper on the card is oxidized and transferred into positively charged copper ions while the first component is reduced from its first state to its second state.

Abstract: The invention provides an electrode comprising an electrically conductive material having a surface capable of producing surface enhanced Raman scattering of incident light from a complex adsorbed at the surface of the electrode, the complex including the electrically conductive material combined with a second material that is substantially reducible and not substantially oxidizable. The surface of the electrode can be microroughened. The invention also includes a method for making various embodiments of the electrode, and a method of generating electricity using the electrode. In accordance with a further aspect of the invention, a fuel cell is provided including the electrode of the invention.

Abstract: A method of producing a personalized security document or article includes providing a substrate which is transparent at least to visible light. A diffractive optical microstructure is formed in a substantially opaque layer disposed on a surface of the substrate. The diffractive structure comprises a plurality of apertures formed in the opaque layer, such that when the structure is suitably illuminated, for example by a beam of collimated light, a projected image is generated which is unique to a particular individual. Also, personalized security documents or articles made in accordance with the method.

Abstract: To ensure a uniform flow over the surface of a product W, an apparatus is provided for the wet chemical treatment of the product W that is disposed in the apparatus 100. This apparatus comprises at least one flow member 150 that includes respectively at least one paddle-like flow element 155, wherein at least one flow member 155 is disposed situated opposite the surface of the product W and is moveable substantially parallel to the surface of the product W.

Abstract: A method and a device with the aid of which a substrate is electrochemically machined, material being removed from the surface of a conductive substrate with the aid of an also conductive tool. The removal takes place as a function of the surface structure which is incorporated into the tool. The core of the present invention is that the substrate and the tool are moved toward one another during the electrochemical etching process. However, it may alternatively also be provided that either the substrate or the tool is locally stationary, while only the counterpart is moved. In a particularly preferred embodiment of the present invention, only the tool is moved toward the substrate.

Abstract: A polishing pad for an electrochemical planarization tool comprises a patterned surface that forms appropriate electrolyte flow channels for directing an electrolyte from the center to the periphery thereof. Consequently, a continuous electrolyte flow may be established, thereby significantly reducing the accumulation of contaminants in the polishing pad, thereby contributing to enhanced process uniformity so that frequent rinsing of the polishing pad and replacement of the electrolyte solution may be avoided.

Abstract: Method of manufacturing a lead frame wherein a bare lead frame material is immersed in a salt solution. Gas bubbles are provided in the salt solution next to the bare lead frame material such that the bubbles contact a surface of the lead frame material and pop in proximity to the bare lead frame material causing chemical reactions on the surface of the lead frame, thereby forming a plurality of dimples of irregular sizes on the surface of the lead frame.

Abstract: A method of fabricating fibres of silicon or silicon-based material comprises the steps of etching pillars on a substrate and detaching them. A battery anode can then be created by using the fibres as the active material in a composite anode electrode.

Abstract: A method for making a lithographic printing plate support is disclosed comprising the steps of: (i) providing an aluminum support; (ii) treating said support in an aqueous solution; (iii) graining said treated support in an electrolyte solution by applying an alternating voltage thereby inducing a local current density J; characterized in that said local current density J at time t fulfills the following equation: J(t)??+bQ(t) for t=o to t=tf and wherein Q(t) is the integrated value of the absolute value of the local current density at time t:(I)—a is equal to 5—b is equal to 10—and tf is the time necessary to obtain a value of Q(t) equal to 50 C/dm2.

Abstract: The invention relates to a method for the electrochemical removal of a metal coating from a component. According to said method, the component is immersed in an electrolyte solution and a current is passed through the component and a secondary electrode that is in contact with the electrolyte. The current is pulsed with a routine that has a duty cycle >10 to <90%, two current densities between 5 mA/cm2 to 1000 mA/cm2 and a frequency of 5 Hz to 1000 Hz.

Abstract: An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first seal is moveable towards and away from a wafer in the processor, to move between a wafer load/unload position, and a wafer process position. The first electrode may move along with the first seal. The processor may be pivotable from a substantially horizontal orientation, for loading and unloading a wafer, to a substantially vertical orientation, for processing a wafer.

Abstract: A method for the electrochemical application or removal of a coating of components (1) is made available, in which the component (1) serves as an electrode and in which, between the component (1) and the counterelectrode (3), an electrical field is built up which leads to the deposition of a coating material dissolved in an electrolyte or to the removal of a coating material (11) located on the component surface (2). During deposition or during removal, the component (1) is covered by structures (5) consisting of an electrically insulating material.

Abstract: A work piece is electroplated or electroplanarized using an azimuthally asymmetric electrode. The azimuthally asymmetric electrode is rotated with respect to the work piece (i.e., either or both of the work piece and the electrode may be rotating). The azimuthal asymmetry provides a time-of-exposure correction to the current distribution reaching the work piece. In some embodiments, the total current is distributed among a plurality of electrodes in a reaction cell in order to tailor the current distribution in the electrolyte over time. Focusing elements may be used to create “virtual electrode” in proximity to the surface of the work piece to further control the current distribution in the electrolyte during plating or planarization.

Abstract: A porous battery electrode for a rechargeable battery includes a monolithic porous structure having a porosity in the range of from about 74% to about 99% and comprising a conductive material. An active material layer is deposited on the monolithic porous structure. The pores of the monolithic porous structure have a size in the range of from about 0.2 micron to about 10 microns. A method of making the porous battery electrode is also described.

Abstract: The present invention relates to an apparatus and a method of electrochemical mechanical polishing (ECMP) for microelectronics applications. The apparatus and method of electrochemical mechanical polishing can be used planarize NiP substrate for a magnetic storage medium and for a process which allows polishing with a controlled surface finish, and a set of corresponding polishing electrolytes and slurry.

Abstract: A machining electrode includes: a base substance including an electrolytic portion faced to a workpiece on one end face in an axial direction and having conductivity; an insulating unit provided on a face in a direction generally orthogonal to the axial direction of the base substance and having insulation; and a shielding unit provided on a face opposite to the base substance of the insulating unit.

Abstract: The invention relates to a method for machining a coated, subtantially cylindrical frictional contact surface (2) made of electrically conductive material. In said method, the frictional contact surface (2) is machined in an electrochemical manner. Also disclosed is an electrode (3) for electrochemical machining.

Abstract: This invention relates to an electrolytic processing apparatus and method useful for processing a conductive material formed in the surface of a substrate, or for removing impurities adhering to the surface of a substrate. An electrolytic processing apparatus, including, a processing electrode that can come close to a workpiece, a feeding electrode for feeding electricity to the workpiece, an ion exchanger disposed in the space between the workpiece and the processing and the feeding electrodes, a fluid supply section for supplying a fluid between the workpiece and the ion exchanger, and a power source. The processing electrode and/or the feeding electrode is electrically divided into a plurality of parts, and the power source applies a voltage to each of the divided electrode parts and can control voltage and/or electric current independently for each of the divided electrode parts.

Abstract: A catalyst-aided chemical processing method can process hard-to-process materials, especially SiC, GaN, etc. whose importance as electronic device materials is increasing these days, with high processing efficiency and high precision even for a space wavelength range of not less than several tens of ?m. The catalyst-aided chemical processing method comprises: putting a workpiece in a processing liquid in which halogen-containing molecules are dissolved; and moving the workpiece and a catalyst composed of molybdenum or a molybdenum compound relative to each other while keeping the catalyst in contact with or close proximity to a surface to be processed of the workpiece, thereby processing the surface of the workpiece.

Abstract: A number of apertures are defined within a wall of a chamber defined to maintain an electrolyte solution. A cation exchange membrane is disposed within the chamber over the number of apertures. The electrolyte solution pressure within the chamber causes the cation exchange membrane to extend through the apertures beyond an outer surface of the chamber. A cathode is disposed within the chamber. The cathode is maintained at a negative bias voltage relative to a top surface of a wafer to be planarized. When the top surface of the wafer is brought into proximity of the cation exchange membrane extending through the apertures, and a deionized water layer is disposed between the top surface of the wafer and the cation exchange membrane, a cathode half-cell is established such that metal cations are liberated from the top surface of the wafer and plated on the cathode in the chamber.

Abstract: A reverse acting rupture disc is provided having a laser defined electropolished line-of-weakness recess, and an improved method of forming an electropolished line-of-weakness recess in a reverse acting rupture disc that assures full opening of the disc upon reversal. A rupture disc blank is pre-bulged, final bulged, and then provided with a layer of resist material. A laser is used to remove at least a portion of the layer of resist material corresponding to a desired line-of-weakness recess in the concave face of the bulged rupture disc. The disc is then subjected to an electropolishing operation to remove metal from the lased area of the rupture disc, thereby forming a lustrous polished line-of-weakness recess in the disc of desired configuration and of a predetermined depth that is related to material thickness.

Abstract: Methods of enhancing contrast ratio of conductive nanostructure-based transparent conductors are described. Contrast ratio is significantly improved by reduction of light scattering and reflectivity of the nanostructures through steps of plating the conductive nanostructures followed by etching or oxidizing the underlying conductive nanostructures.

Abstract: A method of fabricating an antenna includes the step of stamping an initial set of openings within a metal strip and then plating that metal strip on all exterior surfaces. Initial openings define portions of features of the completed antenna that require plating on all surfaces. Once the metal coil has been plated the metal strips are fed through a final stamping process that makes final cuts that correspond with the initially made openings. The final cuts are on surfaces that do not require plating on all of the exterior surfaces.

Abstract: A method for machining a blank includes machining a first pocket in the blank having a first sidewall, machining a second pocket in the blank, machining a groove within material located between the first and second pockets to expose a second sidewall opposite the first sidewall, machining the first and second sidewalls, and alternately repeating machining the grove and the sidewalls to step mill the groove deeper in the blank and form a third pocket along which the second sidewall extends.

Abstract: A method and apparatus separates recoverable components (210) from conductive matrix composites (200) for further use or reuse. In an embodiment, the process uses an electrochemical apparatus that includes a cathode (220) and an anode. The conductive composite is electrically connected to the anode, and a non-acidic electrolyte (250) is supplied to an inter-electrode gap between the cathode and the anode.

Abstract: A process for electropolishing metals and metalloids and their alloys, intermetallic compounds, metal-matrix composites, carbides and nitrides in an electrolytic cell utilizing an externally applied magnetic force to enhance the dissolution process. The electropolishing process is maintained under oxygen evolution to achieve an electropolished surface of the work piece exhibiting reduced microroughness, better surface wetting and increased surface energy, reduced and more uniform corrosion resistance, minimization of external surface soiling and improved cleanability in shorter time periods.

Abstract: An electropolishing device for polishing a cylindrical medical device such as a stent includes anodes in the form of rollers arranged to contact an exterior surface of the device. A drive mechanism rotates the anodes periodically during the electropolishing process to change a contact point between the anodes and the medical device. A tilting mechanism can also be used for periodically tilting the anodes during the electropolishing process to allow bubbles to escape from one end of the stent.

Abstract: Disclosed is a method of treating the surface of an electrically conducting substrate surface wherein a tool comprising an ion-conducting solid material is brought into contact at least in some areas with the substrate surface, the tool is able to conduct the metal ions of the substrate and an electric potential is applied so that an electric potential gradient is applied between the substrate surface and the tool in such a manner that metal ions are drawn from the substrate surface or deposited onto the substrate surface by means of the tool.

Abstract: Selectively accelerated or selectively inhibited metal deposition is performed to form metal structures of an electronic device. A desired pattern of an accelerator or of an inhibitor is applied to the substrate; for example, by stamping the substrate with a patterned stamp or spraying a solution using an inkjet printer. In other embodiments, a global layer of accelerator or inhibitor is applied to a substrate and selectively modified in a desired pattern. Thereafter, selective metal deposition is performed.

Abstract: The invention provides a simple and convenient strategy for reducing the dimensions of organic micro- and nanostructures on metal surfaces. By varying electrochemical desorption conditions, organic structures patterned by Dip-Pen Nanolithography or any of the micro-contact printing procedures can be gradually desorbed in a controlled fashion. The electrochemical desorption is initiated at the exterior of the feature and moves inward as a function of time. The desorption process and adsorbate desorption are modified and controlled as a function of substrate morphology, adsorbate head and tail groups, and electrolyte solvent and salt. Different nanostructures made of different adsorbates can be miniaturized based upon judicious selection of adsorbate and supporting electrolyte.

Abstract: Methods and apparatuses for selectively removing conductive materials from a microelectronic substrate. A method in accordance with an embodiment of the invention includes positioning the microelectronic substrate proximate to and spaced apart from an electrode pair that includes a first electrode and a second electrode spaced apart from the first electrode. An electrolytic liquid can be directed through a first flow passage to an interface region between the microelectronic substrate and the electrode pair. A varying electrical signal can be passed through the electrode pair and the electrolytic liquid to remove conductive material from the microelectronic substrate. The electrolytic liquid can be removed through a second flow passage proximate to the first flow passage and the electrode pair.

Abstract: The invention relates to a method and to a device for electrochemical micro- and/or nano-structuring, which are reliable, fast, simple, easy to implement, and reproducible. For this purpose, the invention provides a method of electrochemically structuring a sample (12) of conductive or semiconductor material that has opposite front and rear faces (11 and 13).

Abstract: To enable surface treatment of the inside of a part or the like and also simplify grinding work by equipment and a procedure that are simple in comparison with convention A first semi-sintered electrode 31 that is formed in a tapered shape whose distal end portion becomes smaller in diameter toward the distal end portion is attached to an electrode supporting tube 26, is configured to be rotatable by a motor 27, is positioned near a seat portion 8 of a nozzle body 1, and generates electrical discharge by surface modifying electrical discharge machining method between the seat portion 8 and the first semi-sintered electrode 31, whereby a coating that is formed as a result of the material that forms the first semi-sintered electrode 31 being moved and deposited can be formed on the seat portion 8 and grinding treatment of the inside of the nozzle body 1 matching the outer diameter of a nozzle needle 2 as has conventionally been the case can be rendered unnecessary.

Abstract: An electropolishing system including an anode, a cathode, a rolling block and a motion controller. The anode is configured to removably retain a metal device to be electropolished, and may be formed as a bar made from a solid cylindrical piece of metal or other configurations, such as wires with hooks. The anode transfers the electricity to the metal device while grooming the surface of the metal device as it contacts the rolling block. The cathode may be configured as a mesh and completes the electrical circuit. The rolling block is formed from a relatively smooth, solid material and positioned so as to allow the metal device to roll against the surface of the block. The motion controller is configured to provide vertical and horizontal movement of the anode and metal device, using force transducers to control the compression of the metal device against the rolling block.

Abstract: A method and apparatus is described for gradually transitioning a slider from operation over a patterned data zone to landing on a patterned CSS zone. The ratio of raised area width to recessed area width of a pattern in a transition zone and/or CSS zone may be varied across the radial dimension of the disk. By changing the ratio of raised area width to recessed area width of the pattern in the transition from slider operation over the data zone to landing in the CSS zone, it is possible to gradually change the height of the slider from flying to non-flying conditions.

Abstract: A method and apparatus for removing conductive material from a microelectronic substrate. In one embodiment, the method can include engaging a microelectronic substrate with a polishing surface of a polishing pad, electrically coupling a conductive material of the microelectronic substrate to a source of electrical potential, and oxidizing at least a portion of the conductive material by passing an electrical current through the conductive material from the source of electrical potential. For example, the method can include positioning first and second electrodes apart from a face surface of the microelectronic substrate and disposing an electrolytic fluid between the face surface and the electrodes with the electrodes in fluid communication with the electrolytic fluid. The method can further include removing the portion of conductive material from the microelectronic substrate by moving at least one of the microelectronic and the polishing pad relative to the other.

Abstract: The present invention relates to a method for removing metal oxides from a substrate surface. In one particular embodiment, the method comprises: providing a substrate, a first, and a second electrode that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy to the first and/or the second electrode to generate electrons within the target area wherein at least a portion of the electrons attach to a portion of the reducing gas and form a negatively charged reducing gas; and contacting the substrate with the negatively charged reducing gas to reduce the metal oxides on the surface of the substrate.