Abstract: A semiconductor device includes an electronic component that includes an oscillator and has terminals on one face. A semiconductor chip is electrically connected to the electronic component and also includes terminals on one face thereof. The electronic component and the semiconductor chip are mounted to a mounting base such that the terminals of the electronic component and the terminals of the semiconductor chip face in the same direction. First bonding wires are connected to the terminals of the semiconductor chip, and second bonding wires having an apex height smaller than that of the first bonding wires connect the terminals of the electronic component to the terminals of the semiconductor chip. A sealing member completely seals within at least the electronic component.

Abstract: In wire bonding in assembling of a semiconductor device, an Al wire is coupled to a lead section by a wedge which is a bonding tool, thereafter, the wedge is withdrawn from the top of the lead section and a cutter is lowered and the Al wire is cut off in this state. Lowering of the cutter is stopped at a point in time that a stopper which is lowered simultaneously with lowering of the cutter has truck against the lead section and cutting of the Al wire is terminated by stopping of lowering of the cutter.

Abstract: Systems and methods in accordance with embodiments of the invention fabricate objects including metallic glass-based materials using ultrasonic welding. In one embodiment, a method of fabricating an object that includes a metallic glass-based material includes: ultrasonically welding at least one ribbon to a surface; where at least one ribbon that is ultrasonically welded to a surface has a thickness of less than approximately 150 ?m; and where at least one ribbon that is ultrasonically welded to a surface includes a metallic glass-based material.

Abstract: The present invention is to provide an hermetic-sealing package member including a substrate and at least one frame-like sealing material for defining a sealing region formed on the substrate, in which the sealing material is formed of a sintered body obtained by sintering at least one metal powder selected from gold, silver, palladium, or platinum having a purity of 99.9 wt % or greater and an average particle size of 0.005 ?m to 1.0 ?m, and with respect to an arbitrary cross-section toward an outside from the sealing region, a length of an upper end of the sealing material is shorter than a length of a lower end. Examples of a cross-sectional shape of the sealing material may include one formed to have a base portion having a certain height and at least one mountain portion protruding from the base portion or one formed to have a mountain portion having substantially a triangular shape in which the length of the lower end of the sealing material is a bottom.

Abstract: Disclosed herein is a method of making a structure by ultrasonic welding and superplastic forming. The method comprises assembling a plurality of workpieces comprising a first workpiece including a first material having superplastic characteristics; ultrasonically welding the first workpiece to a second workpiece, to form an assembly; heating the assembly to a temperature at which the first material having superplastic characteristics is capable of superplastic deformation, and injecting a fluid between the first workpiece and the second workpiece to form a cavity between the first workpiece and the second workpiece.

Abstract: An embodiment bump on trace (BOT) structure includes a contact element supported by an integrated circuit, an under bump metallurgy (UBM) feature electrically coupled to the contact element, a metal ladder bump mounted on the under bump metallurgy feature, the metal ladder bump having a first tapering profile, and a substrate trace mounted on a substrate, the substrate trace having a second tapering profile and coupled to the metal ladder bump through direct metal-to-metal bonding. An embodiment chip-to-chip structure may be fabricated in a similar fashion.

Abstract: An integrated circuit wire bond connection is provided having an aluminum bond pad (51) that is directly bonded to a copper ball (52) to form an aluminum splash structure (53) and associated crevice opening (55) at a peripheral bond edge of the copper ball (54), where the aluminum splash structure (53) is characterized by a plurality of geometric properties indicative of a reliable copper ball bond, such as lateral splash size, splash shape, relative position of splash-ball crevice to the aluminum pad, crevice width, crevice length, crevice angle, and/or crevice-pad splash index.

Abstract: A friction stir welding apparatus has a probe rotatable and vertically movable with respect to a processing target member, a welding tool having an interposed member that covers a part of an outer periphery of the probe and is rotatable relative to the probe, a mounting member on which the processing target member is mounted, a movement mechanism having an arm fitted with the welding tool that can move the welding tool with respect to the processing target member by moving the arm, and a correction mechanism having a correction member that can correct a moving direction of the welding tool so as to be matched with a predetermined processing direction, by bringing the interposed member into contact with the processing target member when the welding tool is moved with respect to the processing target member by moving the arm, and fixed to the mounting member.

Abstract: A device for deflecting mechanical oscillations, at an oscillation receiver location may be set into oscillation along a first axis, and transmits such an oscillation into an oscillation along a second axis at an oscillation output location, wherein the first and the second axis form an angle to one another. The device includes an elongate, bent oscillation element, on whose one end a coupling-in point and at whose other end a coupling-out point is arranged, wherein the device is designed such that the oscillation element oscillates transversally at the coupling-in point and at the coupling-out point, when the oscillation receiver location is subjected to an oscillation.

Abstract: One embodiment is directed to a welding pad capable of receiving a ball-shaped copper wire at its end, including a first copper pad coated with a protection layer and topped with a second pad containing aluminum having dimensions smaller than those of the first pad and smaller than the ball diameter once said ball has been welded to the welding pad.

Abstract: A method of attaching bond wires to bond pads on an active surface of a semiconductor die, where the bond pads are disposed along four side edges of the die, and have aluminum top layers. The method includes attaching first bond wires to first bond pads on first and second opposing sides of the die using a first group of settings and attaching second bond wires to the bond pads on third and fourth sides of the die that oppose each other and are adjacent the first and second sides, using a second group of settings. The first and second groups of settings include first and second scrub settings that are different from each other. Employing two separate scrub settings allows for reduced splashing of the aluminum cap layer on the die pad from splashing onto passivation edges of the bond pads.

Abstract: A coil component is provided with a coil, a base supporting the coil having a first surface parallel to an extending direction of the terminal section of the coil, and a terminal electrode having a first terminal portion printed on the first surface of the base. The first surface has a stepped surface including an upper stage surface and a lower stage surface. The first terminal portion has a stepped shape including an upper stage portion formed on the upper stage surface and a lower stage portion formed on the lower stage surface. The upper stage portion has a first terminal surface contacting the terminal section of the coil. The lower stage portion has a second terminal surface positioned on an extension line of the terminal section of the coil and not contacting the terminal section of the coil.

Abstract: Friction stir spot-welding is performed to join together a stack of a plurality of metal foils and a metal sheet by using a double-acting type rotary tool including a hollow member and a pin member which are movable independently of each other in their axial directions, and a clamp member which is fitted on an outer circumferential surface of the hollow member and which is movable in its axial direction. While an outer annular part of a portion to be friction-stirred is pressed with the clamp member, the pin member is inserted into the above-described portion and the hollow member is retracted, whereby a metal mass is accommodated within a space formed between the above-described portion and the hollow member. Then, the hollow member is advanced to press the metal mass into a hole formed by retraction of the pin member, whereby the hole is filled with the metal mass.

Abstract: An integrated circuit copper wire bond connection is provided having a copper ball (32) bonded directly to an aluminum bond pad (31) formed on a low-k dielectric layer (30) to form a bond interface structure for the copper ball characterized by a first plurality of geometric features to provide thermal cycling reliability, including an aluminum minima feature (Z1, Z2) located at an outer peripheral location (42) under the copper ball to prevent formation and/or propagation of cracks in the aluminum bond pad.

Abstract: An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.

Abstract: A method for manufacturing an electronic device using ultrasonic joining, when the component members of the electronic device includes different structures. The method includes obtaining a joining condition that provides press-down amounts for the materials to be joined at predetermined values. The press-down amount generated by a horn and a supporting member biting into the materials during ultrasonic joining is predetermined for each specific structure of the component member of the electronic device.

Abstract: A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.

Abstract: The present disclosure provides a lighting module. The lighting module includes a heat sink, a board disposed over the heat sink, and a bonding component that bonds the heat sink and the board together. The bonding component contains a combination of a first metal and a second metal. The lighting module also includes a photonic lighting device disposed over the board.

Abstract: In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.

Abstract: A method for manufacturing a printed wiring board, including providing a support board having a metal foil secured to the support board, forming a resin insulation layer on the metal foil, forming openings in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the openings via conductors to electrically connect the conductive circuit and the metal foil, separating the support board and the metal foil, and forming from the metal foil external terminals to electrically connect to another substrate or electronic component.

Abstract: A jointed body that has been solid-phase jointed at normal temperature and that has a non-conventional structure is presented. The jointed body is formed by solid-phase joining a first jointed member to a second jointed member, and has a junction interface between the first member and the second member. This jointed body includes an average crystal grain size in a near interface structure that constitutes a near interface area having a total width of 20 micrometers and extending at both sides of the junction interface as a center is 75-100% of an average crystal grain size in an around interface structure that constitutes around interface areas located at both outer sides of the near interface area. In the jointed body, the near interface structure after the joining is almost the same as the structure before the joining, allowing the jointed body to exert similar characteristics to the jointed members.

Abstract: Systems and methods for fabricating multi-functional articles comprised of additively formed gradient materials are provided. The fabrication of multi-functional articles using the additive deposition of gradient alloys represents a paradigm shift from the traditional way that metal alloys and metal/metal alloy parts are fabricated. Since a gradient alloy that transitions from one metal to a different metal cannot be fabricated through any conventional metallurgy techniques, the technique presents many applications. Moreover, the embodiments described identify a broad range of properties and applications.

Abstract: An apparatus and method for producing an insulating structural element from substrates is provided. The substrates may be connected to one another at a periphery by applied pieces and may be insulated from one another by a vacuum. The apparatus may include a washing device, a cleaning device, a heating device for pre-heating the substrates, a positioning device for positioning the applied pieces on the substrates, an ultrasonic soldering device for soldering the applied pieces to the substrates, an automatic spacer and getter element setting unit, a plasma sputtering device in a vacuum, a substrate displacing device for transporting the substrates, a mechanical substrate placing device for joining the substrates, and a connecting device for welding or soldering the applied pieces of the substrates to each other.

Abstract: A method for fabricating a wire bonding structure is disclosed, which includes: providing a substrate having a plurality of bonding pads; and foaming a ball end of a bonding wire on at least one of the bonding pads by performing a scrubbing process along a path around a periphery of the bonding pad, thereby preventing delamination of the ball end of small size from the bonding pad.

Abstract: A method includes applying solder to conductive pads of a semiconductor device, applying solder to conductive pads of a substrate, aligning the solder on the semiconductor device with the solder on the substrate such that portions of the solder on the semiconductor device contact corresponding portions of the solder on the substrate, heating the semiconductor device and the substrate to liquefy the solder, and exerting an oscillating force operative to oscillate the semiconductor device relative to the substrate at a frequency.

Abstract: An electromagnetic interference shield used in room construction materials for the protection from satellite surveillance that has a first surface, a second surface where the first surface and the second surface are configured to attach to each other and where the first surface and the second surface are separable from each; a third surface where the second surface and the third surface are configured to attach to each other and where the second surface and third surface are separable from each other; a fourth surface where the third surface and fourth surface are configured to attach to each other and where the third surface and fourth surface are separable from each other.

Abstract: Interconnection assemblies and methods are provided. An interconnection assembly includes a first cell tab constructed of a first metal, and a second cell tab disposed against the first cell tab. The second cell tab is constructed of a second metal having a hardness greater than the first metal. The assembly further includes an interconnect member disposed against the second cell tab. The assembly further includes a weld assisting layer disposed against the first cell tab such that the first and second cell tabs are disposed between the weld assisting layer and the interconnect member.

Abstract: An electric wire connecting method for connecting together a wire having a conductor and a stranded wire having a plurality of strands which are twisted, the electric wire connecting method is provided. The electric wire connecting method includes a forming step and a welding step. In the forming step, the conductor is formed into a plate element by pressing the conductor. In the welding step, the strands are welded to the plate element in a state where the strands are superposed on the plate element.

Abstract: A method is disclosed for manufacturing a shield conductor by connecting a metallic braid part formed of tubularly braided metallic wire to a part to be connected provided with a tubular part having electrical conductivity. The method includes fitting the metallic braid part to an outer peripheral surface of an end part of the tubular part to form a fitting region; attaching a metallic welding band formed in a ring shape in the fitting region with the metallic braid part fitted to the end part of the tubular part; melting the welding band that is attached in the fitting region; and welding the tubular part to the metallic braid part along a circumferential direction of the tubular part.

Abstract: A system includes host and learning machines. Each machine has a processor in electrical communication with at least one sensor. Instructions for predicting a binary quality status of an item of interest during a repeatable process are recorded in memory. The binary quality status includes passing and failing binary classes. The learning machine receives signals from the at least one sensor and identifies candidate features. Features are extracted from the candidate features, each more predictive of the binary quality status. The extracted features are mapped to a dimensional space having a number of dimensions proportional to the number of extracted features. The dimensional space includes most of the passing class and excludes at least 90 percent of the failing class. Received signals are compared to the boundaries of the recorded dimensional space to predict, in real time, the binary quality status of a subsequent item of interest.

Abstract: Disclosed is an apparatus for mounting a transducer to a bond head of a wire bonder. In particular, the bond head of the wire bonder is operative to mechanically drive the transducer when forming electrical interconnections between separate locations within a semiconductor package. Specifically, the apparatus comprises: i) a flexural structure having a connector for connecting to the transducer, the flexural structure being configured to bend; and ii) at least one actuator attached to the flexural structure, the at least one actuator being operative to bend the flexural structure to thereby cause a displacement of the transducer connected thereto via the connector.

Abstract: Multi-stranded wires are clamped between an ultrasonic welding tip and an opposing anvil. The multi-stranded wires are made of a material that is more malleable than copper, or of a material that has a malleability that is substantially the same or greater than the malleability of aluminum. The plurality of multi-stranded wires can be clamped between opposing side surfaces to further form the wire bundle. Ultrasonic energy is applied to a first side of the wire bundle adjacent the ultrasonic welding tip. After termination of ultrasonic energy to the first side, the wire bundle is rotated 180 degrees relative to the anvil and ultrasonic energy is applied to a second side of the wire bundle, wherein the second side is oppositely disposed relative to the first side.

Abstract: Selected surface regions of coulomb vibration damping strips are bonded face-to-face by ultrasonic welding to a surface region of an article that may experience excessive vibration in use. In one embodiment, prior to welding, the intended facing side of the damping strip is treated to form surface regions that are oxidized, roughened, or coating so that the treated regions do not weld to the article surface. In another embodiment of the invention the ultrasonic welding process is controlled so as to produce regions (sometimes randomly interposed regions) of welded and non-welded regions between the damping strip and adjacent article surface. The unbonded regions of the otherwise welded strip lie in closely-spaced, interfacial, frictional contact with the adjacent article surface to damp vibration in the article.

Abstract: An integrated circuit wire bond connection is provided having an aluminum bond pad (51) that is directly bonded to a copper ball (52) to form an aluminum splash structure (53) and associated crevice opening (55) at a peripheral bond edge of the copper ball (54), where the aluminum splash structure (53) is characterized by a plurality of geometric properties indicative of a reliable copper ball bond, such as lateral splash size, splash shape, relative position of splash-ball crevice to the aluminum pad, crevice width, crevice length, crevice angle, and/or crevice-pad splash index.

Abstract: An electric wire connecting device connects a conductor of an electric wire formed of a plurality of core wires to a terminal. The connecting device includes a pair of clamping members for clamping a part of an end portion of the conductor, and a ultrasonic welding horn for connecting the conductor to the terminal via ultrasonic welding in a state where the end portion of the conductor clamped by the clamping members is placed at the terminal.

Abstract: A method for sealing vacuum glass and a vacuum glass product processed by said method are provided. The method specifically is: preparing metallized layers (6) consolidated with glass plates on the surface to be sealed at the edge of the glass plates by the known sintering process; enabling hermetically sealing the edges of the two glass plates (1, 2) by welding and connecting metal sealing sheet (7) between the metallized layers (6) of the tow glass plates to be hermetically sealed. A brand new technology for manufacturing vacuum glass is provided by sintering metallized layers on the surface of the glass plates, and hermetically sealing the edges of the glass plates by use of the metallized layers and metal sealing sheet.

Abstract: A method for sealing the curved vacuum glass comprises: first preparing metallized layer bonded with the glass plate on the edge surface of the curved glass to be sealed by locally heating the metal slurry coating; then air-tightly sealing the edges of two glass plates by using the metal brazing technology, or air-tightly sealing the edges of two glass plates by air-tightly welding the metal sealing sheet between the metallized layers of two glass plates to be sealed. A curved vacuum glass is also provided. The method makes the sealing part have firm connection, good air tightness and good thermal shock resistance. The sealing structure made of the metal sealing sheet is well compatible with the temperature deformation caused by the temperature difference between the internal and external glass plates of the vacuum glass.

Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).

Abstract: Disclosed herein is a method of making a structure by ultrasonic welding and superplastic forming. The method comprises assembling a plurality of workpieces comprising a first workpiece including a first material having superplastic characteristics; ultrasonically welding the first workpiece to a second workpiece, to form an assembly; heating the assembly to a temperature at which the first material having superplastic characteristics is capable of superplastic deformation, and injecting a fluid between the first workpiece and the second workpiece to form a cavity between the first workpiece and the second workpiece.

Abstract: A method and apparatus for welding lines having metallic braids or strands to form an end node or transit node by introducing a first portion of each line into a compression space of an ultrasonic welding apparatus, wherein the first portions run along a straight line, wherein at least one line has a component at a distance from the end node or transit node to be welded, and at least the line which has the component is attenuated between the compression space and the contact element in a second portion by a change in profile of the line which is imposed using a deflection device. To this end, the line which has the component is oriented in extension of the straight line.

Abstract: Systems and methods in accordance with embodiments of the invention fabricate objects including metallic glass-based materials using ultrasonic welding. In one embodiment, a method of fabricating an object that includes a metallic glass-based material includes: ultrasonically welding at least one ribbon to a surface; where at least one ribbon that is ultrasonically welded to a surface has a thickness of less than approximately 150 ?m; and where at least one ribbon that is ultrasonically welded to a surface includes a metallic glass-based material.

Abstract: An adjusting drive, in particular for a steering column adjuster or a vehicle seat of a motor vehicle, and a method for producing an adjusting drive, are provided in which an axial play of the output shaft is reliably and permanently compensated. The compensating element for ensuring the axial-play-free arrangement of the output shaft is connected, in its operating position, to the housing by ultrasound welding.

Abstract: A welding horn for a secondary battery, used in ultrasonic welding includes a body portion having coupling portions respectively provided at one and the other ends thereof; and a tip portion provided at a central portion of the body portion and having protruding portions provided on a surface thereof. In the welding horn, a nitride is coated on at least one surface of the welding horn.

Abstract: Disclosed herein is a method of making a structure by ultrasonic welding and superplastic forming. The method comprises assembling a plurality of workpieces comprising a first workpiece including a first material having superplastic characteristics; ultrasonically welding the first workpiece to a second workpiece, to form an assembly; heating the assembly to a temperature at which the first material having superplastic characteristics is capable of superplastic deformation, and injecting a fluid between the first workpiece and the second workpiece to form a cavity between the first workpiece and the second workpiece.

Abstract: The invention relates to a device (1) for welding metal parts by means of ultrasound, in particular for welding strands, comprising a sonotrode (3) having a sonotrode head (3.1), which can be excited by an oscillation generator (9) to perform torsional oscillations with respect to a torsion axis (B). The sonotrode head (3.1) comprises at least one welding surface (3.4) relative to the torsion axis (B) on the circumference side. Furthermore, an anvil (18) having a counter/compacting surface (18.1) is provided, which can be arranged opposite the welding surface (3.4) of the sonotrode (3) in a stationary position relative thereto. In the case of an opposite arrangement, the welding surface (3.4) and the compacting surface (18.1) delimit a compaction space (8) in a direction perpendicular to the torsion axis (B), said space being provided to receive the parts to be welded.

Abstract: Presented herein are stud bump bonding techniques for electrically connecting an elongate conductor, such as a wire or pin, to a bonding pad. A plurality of stud bumps are bonded to a surface of a bonding pad and an elongate electrical conductor is positioned in proximity to the plurality of stud bumps. The elongate conductor is bonded to one or more of the stud bumps.

Abstract: A method to electrically and mechanically connect at least one wire conductor to a terminal includes the steps of cutting and stripping a portion of an insulation outer layer along an end section of the at least one wire conductor to expose a lead of the at least one wire conductor. A further step includes applying a bonding process to the exposed lead to break down oxides disposed on the lead. A further step in the method is crimping the lead having the applied bonding process to the terminal to form a crimp connection connecting the at least one wire conductor to the terminal.

Abstract: A sample chamber array is provided. The sample chamber array may comprise at least one reservoir in fluid communication with at least one sample chamber, and a movable portion defining the sample chamber. The reservoir is fillable with a liquid biological sample. The movable portion may be movable with respect to the remainder of the sample chamber from a first position to a second position. In the first position the movable portion is concave and the sample chamber is without biological sample. In the second position the movable portion is convex and the sample chamber comprises biological sample. The movement of the movable portion to the second position causes a pressure drop to transport the biological sample into the sample chamber from the at least one reservoir. Methods for processing a biological sample and methods of making a sample chamber array are also provided.

Abstract: The described embodiment relates generally to the field of ultrasonic bonding. More specifically, an apparatus for bonding a number of wires directly to a metal substrate in a single operation without the use of any kind of adhesive or solder is disclosed. The apparatus is an ultrasonic bonder. The ultrasonic bonder has a horn with a cavity specifically sized for the number of wires to be bonded. The ultrasonic bonder is driven at a frequency that corresponds to a resonant frequency of the wires to be bonded.

Abstract: A method for quality control during ultrasonic bonding, in which a transducer bonding tool unit and an ultrasonic generator are used and in which, during the bonding, one or more sensors are used to sense measurement signals for one or more parameters, which can vary during the bonding, for assessing the bond quality and/or for influencing the bonding, and which proposes that, during the bonding, at least one speed profile measurement signal representing the time/speed profile of the tip of the ultrasonic tool in the direction of oscillation thereof be sensed. The invention also relates to a bonding apparatus which is suitable for carrying out the method. Furthermore, the invention relates to other quality control methods for ultrasonic bonding and to bonding apparatuses which are suitable for carrying out these methods.