Abstract: The invention concerns a method and an apparatus for the application of solder onto a work piece, wherein the solder is soldered on at a soldering temperature TL and subject to the influence of ultrasound. In order to be able to solder without difficulties the solder onto work pieces that exhibit sensitivity to breakage it is proposed that the solder is heated, is applied to the work piece that is supported in particular in a spring-mounted manner, and is soldered-on subject to the influence of ultrasound.

Abstract: A system includes host and learning machines in electrical communication with sensors positioned with respect to an item of interest, e.g., a weld, and memory. The host executes instructions from memory to predict a binary quality status of the item. The learning machine receives signals from the sensor(s), identifies candidate features, and extracts features from the candidates that are more predictive of the binary quality status relative to other candidate features. The learning machine maps the extracted features to a dimensional space that includes most of the items from a passing binary class and excludes all or most of the items from a failing binary class. The host also compares the received signals for a subsequent item of interest to the dimensional space to thereby predict, in real time, the binary quality status of the subsequent item of interest.

Abstract: The present invention relates to an ultrasonic soldering tool for soldering wires to a solder tab of an electrochromic device located between the layers of an insulated glass unit. The soldering tool includes an ergonomically designed handle and soldering tip head to increase operator comfort during use while also providing features to ensure that the surface of the insulated glass unit is not contacted by the soldering tip. One embodiment of the invention provides an automatic feed soldering tool which may have a soldering tip with a trough to create an ideal solder joint. The invention also includes a clamp for securing a wire to a substrate in a correct position while serving as a guide for the soldering tool to provide further protection from errant contact between the soldering tip and the insulated glass unit. The invention also includes a method of creating an ideal solder joint.

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.

Abstract: In a method for ultrasonic bonding, two longitudinal ultrasonic waves propagating in a common working plane oriented parallel to a substrate are induced in one or more ultrasonic transducers and are passed through ultrasound-conducting arms from different spatial directions onto a common connection point of the arms. At the connection point the ultrasonic waves cause an ultrasonic tool arranged directly or indirectly at said connection point to oscillate in two or three dimensions. At least one of the ultrasonic transducers induces an ultrasonic wave with a first harmonic oscillation component and a second oscillation component.

Abstract: Microvalves are composed in a stacked design of a plurality of components comprising at least two housing parts, a membrane clamped between the two housing parts, and an actuator. A plurality of identical components are respectively arranged on a common, individual support plate and positioned next to each other in one plane. The manufacturing method for the microvalves comprises the steps of: providing the support plates with respectively identical components positioned in a grid pattern each having with the same grid dimension, inserting the support plates on top of one another in a retaining device, connecting at least some of the stacked components arranged on the support plates on an outer edge delimiting the components by a joining method, separating the microvalves by punching, and punching the membrane from a membrane support plate during connection of the components.

Abstract: The invention describes a device and method for making corrugated products. The device can be used with any substrate and includes, at least, first and second drive rollers for driving a middle substrate and a single wall corrugated product. In other embodiments the invention includes upper drive rollers, lower drive rollers and middle drive rollers for driving an upper substrate, a lower substrate and a middle substrate. The middle substrate is driven between the upper and lower substrates at a higher velocity to form flutes that are anchored between the upper an lower substrates thereby forming a corrugated product. The invention also provides for customized corrugated products having multiple fluted substrates in various desirable arrangements. Examples of such products include mattresses, partition panels, other furniture, construction products such as tubes or pipes previously made from metals or concrete.

Abstract: The invention relates to a tool for an ultrasonic welding device, wherein a contact face of a carrier body (1) produced from a metal facing a component to be welded is provided with a diamond coating (3). To improve the durability, it is proposed in accordance with the invention for the diamond coating to be produced by means of CVD methods and to have a thickness (D2) in the range from 0.5 to 20 ?m.

Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).

Abstract: Sputtering targets are described that comprise: a) a target surface component comprising a target material; b) a core backing component having a coupling surface, a back surface and at least one open area, wherein the coupling surface is coupled to at least part of the target surface component; and wherein at least part of the target surface component fits into at least one open area of the core backing component. In some embodiments, the target surface component, the core backing component or a combination thereof have at least one surface area feature coupled to or located in the back surface of the core backing component, the target surface component or a combination thereof, wherein the surface area feature increases the cooling effectiveness of the target surface component.

Abstract: An ultrasonic welding machine and method are provided. The machine includes a base portion having a first aperture that defines first internal threads. The machine further includes an electrically non-conductive member disposed on the base portion having a second aperture that is aligned with the first aperture. The machine further includes an anvil portion disposed on the electrically non-conductive member having a third aperture that is aligned with the second aperture. The machine further includes a first bolt disposed through the third aperture and the second aperture that is threadably received in the first internal threads, and the first bolt and the anvil portion are electrically isolated from the base portion.

Abstract: A process for reducing aluminum pick-up and adherence during the ultrasonic welding of aluminum braids which are welded in a vertically and/or horizontally adjustable compression chamber of an ultrasonic welding device. The static tool parts which delimit the compression chamber have working surfaces made from polycrystalline diamond (PCD).

Abstract: A vibration welding system includes an anvil, a welding horn, a thin film sensor, and a process controller. The anvil and horn include working surfaces that contact a work piece during the welding process. The sensor measures a control value at the working surface. The measured control value is transmitted to the controller, which controls the system in part using the measured control value. The thin film sensor may include a plurality of thermopiles and thermocouples which collectively measure temperature and heat flux at the working surface. A method includes providing a welder device with a slot adjacent to a working surface of the welder device, inserting the thin film sensor into the slot, and using the sensor to measure a control value at the working surface. A process controller then controls the vibration welding system in part using the measured control value.

Abstract: The invention relates to a method and to a device for force-fit connecting glass-like components to metals, particularly for connecting a glass plate (2) to a large-scale mounting element (19) as a central connecting element, particularly made of metal, having the following characteristics: a) an input and control device (6) for inputting process data, b) a storage and positioning device (15) for supplying individual fastener elements (1) as support elements of a central connection element (20), c) having mounting and fixing means (3) for fixing a glass plate (2), d) a thickness measuring device (7) for measuring the thickness of each of the components to be connected and layers of the same, e) a measuring machine (8) for measuring the resonant frequency of the glass plate (2) and a surface sensor (10) for determining the roughness of the glass plate (2), f) a sliding device (11) for pressing together the components to be connected by means of an ultrasonic horn (4), g) a device for generating ultrasonics by

Abstract: The present invention refers to a method for joining at least two workpieces, the method comprising the following method steps: providing and positioning the workpieces to be joined; providing at least one joining element; heating the joining element to a temperature substantially equal to its plasticizing temperature with at least one heat source; heating the workpieces at least in the region of a joint to a predetermined reaction temperature; and applying material of the joining element to the region of the joint with a relative movement taking place between the joining element and the region of the joint.

Abstract: Disclosed is a wedge bonder, comprising a wedge for bonding a wire to surfaces to form an electrical interconnection therebetween, a cleaning device for cleaning the wedge, and a positioning device to which the wedge is mounted. In particular, the positioning device is operative to move the wedge to the cleaning device for cleaning. A method of cleaning a wedge of a wedge bonder is also disclosed.

Abstract: The invention relates to a torsion sonotrode, comprising two mutually opposing end faces (S1, S2) and a circumferential surface (U) which surrounds a torsion axis (T) and on which at least one working surface (A1, A2, A3, A4) is provided at a radial distance from the torsion axis (T).

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.

Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.

Abstract: An ultrasonic bonding system is provided. The system includes: a) a bond head assembly carrying an ultrasonic bonding tool; b) a conductive material supply; c) a conductive material feeding system for guiding a length of the conductive material supply to a position proximate the ultrasonic bonding tool; and d) a vapor generation system for supplying a vapor proximate the ultrasonic bonding tool, the vapor including a carrier gas and a lubricating vapor.

Abstract: A method of manufacturing a fiber reinforced metal matrix composite article, the method comprises forming a first metal component, forming a second metal component and forming at least one fiber preform comprising at least one metal coated fiber. The metal at least one first portion of the at least one metal coated fiber of the at least one fiber preform is bonded to the metal at least one second portion of the at least one metal coated fiber of the at least one fiber preform to hold the at least one fiber in position. The at least one fiber preform is placed between the first metal component and the second metal component. The second metal component is sealed to the first metal component, and heat and pressure is applied such as to consolidate the at least one fiber preform and to diffusion bond the metal on the fiber of the at least one fiber preform, the first metal component and the second metal component to form a unitary composite article. The bonding comprises ultrasonic welding.

Abstract: An ultrasonic jointing method is provided for performing an ultrasonic joint of a conductor part which is exposed by removing a coating of an electric wire with respect to a terminal. The ultrasonic jointing method includes: holding the conductor part of the electric wire and the terminal between an anvil and a horn in which a concave part is formed; and applying an ultrasonic vibration to the conductor part of the electric wire and the terminal that are held between the anvil and the horn. The conductor part is received in the concave part which has a space area of 0.89 to 1.46 times as large as a cross-sectional area of the conductor part of the electric wire.

Abstract: A system and method for terminating a wire having an aluminum conductor includes a terminal having a conductor receiving area adapted to receive the aluminum conductor, and a welding buffer sized and shaped to fit within the conductor receiving area of the terminal with the aluminum conductor disposed between the welding buffer and the terminal. The terminal, the welding buffer and the aluminum conductor are ultrasonically welded together to form an integrated unit, such that the welding buffer forms a part of a finished terminated wire assembly.

Abstract: An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads.

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is moveable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.

Abstract: An ultrasonic bonding machine is provided. The ultrasonic bonding machine includes a support structure configured to support a workpiece during a bonding operation. The ultrasonic bonding machine further includes an upper bonding tool positioned above the support structure and configured for bonding an upper bonding material to an upper side of the workpiece, and a lower bonding tool positioned below the support structure and configured for bonding a lower bonding material to a lower side of the workpiece. The ultrasonic bonding machine may also be an ultrasonic ribbon bonding machine configured to bond an upper and lower conductive ribbon to a solar substrate.

Abstract: The invention relates to a method for dispensing solder and a method for mounting a semiconductor chip on the dispensed solder. The substrate is heated to a temperature which lies above the melting temperature of the solder and a solder portion is applied. A pin is thereafter immersed in the solder portion until it touches the solder portion and presses against the substrate. The pin is subjected to ultrasonic sound in such a way that ultrasonic waves are generated in the pin, which are directed perpendicularly or angularly in relation to the surface of the substrate, and is then moved along a predetermined path in order to distribute the solder. The treatment with ultrasonic sound locally improves the wettability of the substrate. The temperature of the pin is preferably lower than the melting temperature of the solder.

Abstract: Provided are a battery module and an electrode tab ultrasonic wave welding method. The present invention relates to a battery module and an electrode tab ultrasonic wave welding method by forming the electrode tab in a zigzag form in which the electrode tab extending upwardly is bent downwardly and then, again bent upwardly to allow the electrode tab formed in the zigzag form to absorb vibrations even when a welding portion formed in parallel with a battery cell is fused by ultrasonic wave vibrations, thereby minimizing damage to the battery cell.

Abstract: An ultrasonic welding structure includes a welding plane and an energy-directing edge. The welding plane is formed on a first object or a second object. The energy-directing edge is formed on the first object or the second object and corresponds in position to the welding plane. The welding plane is oblique to a lamination direction of an ultrasonic device. The first object and the second object are welded together by ultrasonic welding which requires laminating the first object to the second object in the lamination direction so as for the energy-directing edge to exert a contact pressure upon the welding plane. Due to the welding plane and the energy-directing edge, ultrasonic welding thus performed requires less welding area and alignment structure than are taught by the prior art and is conducive to miniaturization of mobile electronic products.

Abstract: Provided is a bonding apparatus capable of forming even loops at high speed. According to a bonding apparatus 1, a capillary 5 is lowered to a bonding position to bond an initial ball 10 to a pad 104 on an overhanging die 100. Here, a position of the capillary 5 in a Z direction and a load detected by a load sensor 7 are detected and stored every predetermined time period. A load change point is detected by referring to the stored load and the stored position. By subtracting the bonding position from a load changing position of the capillary 5 at the load change point, a movement amount Z of the capillary 5 from the load changing position to the bonding position is calculated. After the capillary 5 is lifted by the movement amount Z, a wire loop is formed between the pad 104 and a lead 105.

Abstract: In a method for mounting an element or component having at least one metal surface in or on a circuit board containing at least one conducting layer made of metal material, a connection between the at least one metal surface of the element and the at least one conducting layer of the circuit board is formed using ultrasonic welding or high-frequency friction welding in order to create a mechanically stable and resistant connection or attachment having good conductivity. Furthermore, a circuit board is disclosed in which at least one element or component having a metal surface is or can be connected to a conducting or conductive layer of the circuit board using ultrasonic welding or high-frequency friction welding.

Abstract: An apparatus including a bond head, a supplemental support, a reduction module, and a transducer is provided. The bond head holds a first substrate that contains a first set of metal pads. The supplemental support holds a second substrate that contains a second set of metal pads. The aligner forms an aligned set of metal pads by aligning the first substrate to the second substrate. The reduction module contains the aligned substrates and a reduction gas flows into the reduction module. The transducer provides repeated relative motion to the aligned set of metal pads.

Abstract: An exemplary semiconductor module includes a substrate formed of a ceramic insulator, and at least one metallic layer formed on the substrate. The metallic layer includes a deepening for placing and fixing a contact element. The contact element is at least partially “L”-shaped and includes a first arm for fixing the contact element at the deepening, and a second arm for interconnecting the contact element with an external device. The deepening has a horizontal dimension which is about ?0.5 mm bigger than the horizontal dimension of the contact element.

Abstract: A piezoelectric resonator plate includes at least a pair of excitation electrodes and at least a pair of extraction electrodes. The pair of extraction electrodes are respectively extracted from the pair of excitation electrodes to electrically and mechanically bond the pair of excitation electrodes to an external electrode. The pair of extraction electrodes each include a distal end portion. The distal end portion includes a connecting electrode extracted to a vicinity of one end portion on one principal surface of the piezoelectric resonator plate. The connecting electrodes each include a top surface where a first metal film to be bonded to the external electrode is formed. The first metal film includes a top surface with two or more protruding portions. The first metal film has a larger surface roughness and a smaller area compared with the respective connecting electrodes. The protruding portions are formed with cross-sections in curvature shapes.

Abstract: In accordance with an aspect of the present disclosure, a vibratory welder for welding parts together has a vibratory tool made from a material having a low thermal conductivity of no greater than 5 watt/meter degree Kelvin and also having a sufficient strength and toughness for vibratory welding. In an aspect, the vibratory tool is made of a material having a compressive strength of at least 80 MPa (megapascals) tensile and a fracture toughness (Klc) of at least 3 MPa(m)1/2.

Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.

Abstract: A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads positioned thereon. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires includes a first portion extending upward from one of the second plurality of bond pads substantially along a z-axis and curving outward substantially along x and y axes in a direction towards the first semiconductor die. The bonding wire also includes a second portion coupled to the first portion and extending from the first portion downward to one of the first plurality of bond pads on the upper surface of the first semiconductor die.

Abstract: The present invention is a metal paste for sealing comprising a metal powder and an organic solvent characterized in that the metal powder is one or more kinds of metal powders selected from a gold powder, a silver powder, a platinum powder and a palladium powder which has a purity of 99.9% by weight or more and an average particle size of 0.1 ?m to 1.0 ?m and that the metal powder is contained in a ratio of 85 to 93% by weight and the organic solvent is contained in a ratio of 5 to 15% by weight. This metal paste preferably contains an additive such as a surfactant in accordance with the application method. As a sealing method using this metal paste, there is a method of applying and drying a metal paste, sintering it at 80 to 300° C. to form a metal powder sintered body and after that pressurizing the base member and the cap member while heating the metal powder sintered body.

Abstract: The described embodiment relates generally to the field of ultrasonic bonding. More specifically, an apparatus for bonding a number of wires directly to a metal substrate in a single operation without the use of any kind of adhesive or solder is disclosed. The apparatus is an ultrasonic bonder. The ultrasonic bonder has a horn with a cavity specifically sized for the number of wires to be bonded. The ultrasonic bonder is driven at a frequency that corresponds to a resonant frequency of the wires to be bonded.

Abstract: A wire end processing method includes tree steps. In a core wire portion exposing step, a sheath of a wire is stripped so as to expose a core wire portion composed of a plurality of element wires. In a core wire portion unifying step, ultrasonic vibration is applied to the exposed core wire portion while applying a pressure thereto, thereby causing the plurality of the element wires to rub against one another so as to unify the core wire portion. In a terminal connecting step, the unified core wire portion is press-contacted or press-fitted to the terminal.

Abstract: The present invention relates to a method for manufacturing a printed circuit board, which includes: preparing a base substrate with an electrode pad; providing a conductive material having a predetermined height; disposing the conductive material on the electrode pad; and forming a conductive post on the electrode pad by bonding the electrode pad and the conductive material, and can achieve a fine pitch and easily implement a conductive post with a high aspect ratio.

Abstract: An electric storage battery including a jelly roll type electrode assembly having a mandrel. The mandrel includes a positive portion, negative portion and removable portion. The mandrel has two faces with grooves dimensioned to accommodate positive and negative feedthrough pins. Electrodes are welded to the mandrel using an ultrasonic weld to the face on which the electrodes are attached. An additional weld is made to at least one ultrasonic weld using a through-mandrel laser weld, incident on the opposite face from which the ultrasonic weld. The laser melts the mandrel such that molten mandrel material fills the area under the foil at the area of the ultrasonic weld, the surface area of the foil being significantly increased by knurls formed by ultrasonic welding. Electrodes are wrapped around the mandrel using the removable portion to wind the mandrel. The mandrel allows tighter wrapping of the jelly roll assembly increasing battery miniaturization.

Abstract: A method and apparatus for welding lines having metallic braids or strands to form an end node or transit node by introducing a first portion of each line into a compression space of an ultrasonic welding apparatus, wherein the first portions run along a straight line, wherein at least one line has a component at a distance from the end node or transit node to be welded, and at least the line which has the component is attenuated between the compression space and the contact element in a second portion by a change in profile of the line which is imposed using a deflection device. To this end, the line which has the component is oriented in extension of the straight line.

Abstract: The invention relates to an adjusting ring (1) for adjusting the blades of the VTG distributor of exhaust gas turbochargers, comprising a bearing ring (2) and a lever engagement ring (3) connected to said bearing ring (2), the bearing ring (2) and lever engagement ring (3) being separately manufactured individual parts which are connected to each other by means of a separate connection means (4).

Abstract: An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool supported by the bond head assembly. The system further includes a pressing member adapted to press against a bonding material bonded using the bonding tool. The pressing member is supported by the bond head assembly and is movable with respect to the bond head assembly independent of the bonding tool. The ultrasonic bonding system may also be an ultrasonic ribbon bonding system or a solar cell ribbon bonding system for bonding a ribbon material to portions of a solar cell.

Abstract: The invention relates to a torsion sonotrode (S) having a contact surface (1, 1?) for transferring a torsional oscillation directed about a torsion axis (T) onto a component (4) to be welded. To ensure that the welded joint has a uniform strength, it is proposed according to the invention that the contact surface (1, 1?) has a flat stop surface (2, 2?) which runs substantially perpendicular to the torsion axis (T) and from which elevations (3, 3?) of insular design extend with a pointed form.

Abstract: An electrode bonding method according to the present invention includes: a plasma cleaning step of irradiating an electrode surface to be cleaned of at least either one of a part, such as a semiconductor device, and a substrate with atmospheric pressure plasma for cleaning; an inert gas atmosphere maintaining step of covering the electrode surface to be cleaned and its vicinity with a first inert gas before the irradiation of the atmospheric pressure plasma is ended, and maintaining that state even thereafter; and a bonding step of bonding an electrode of the part and an electrode on the substrate before the inert gas atmosphere maintaining step is ended. The electrode surface is thereby plasma-cleaned without the possibility of damaging the part to be bonded to the substrate, and the cleaned state is maintained while bonding the electrodes to provide an electrode bonding state of high bonding force and high reliability.

Abstract: A system and method for providing multi-mode control of an ultrasonic welding system. In one embodiment, the control modes include the energy of the weld, the time of the welding process and the compression displacement of the parts being welded during the welding process. The method includes providing thresholds for each of the modes, and terminating the welding process after the threshold for each mode has been reached, the threshold for more than one mode has been reached or the threshold for one of the modes has been reached. The welding control can be either open-loop or closed-loop, where the open-loop process provides the mode thresholds and once one or more of those thresholds is reached the welding process is terminated. The closed-loop control provides feedback of the weld energy and/or the compression displacement so that the weld power and/or weld pressure can be increased or decreased accordingly.

Abstract: Connection of an aluminum stranded lead 2 to a connection part 10, comprising a stripped end 4 of the aluminum stranded lead 2 and a metal connection part 10 which is materially connected to the stripped end 4 of the aluminum stranded lead 2. An inexpensive welded connection can be produced in that an end face of the stripped end 4 of the aluminum stranded lead 2 is welded to the connection part 10 by means of torsional ultrasonic welding.

Abstract: A welding assembly for forming a weld along a welding interface of a work piece(s) using vibrations includes a welding tool and a thermal barrier. The thermal barrier is at least a chemical and/or mechanical insulating layer positioned adjacent to the welding tool, which minimizes the rate of dissipation of heat generated by the vibrations at or along the welding interface. The welding assembly may also include a wear-resistant layer adjacent to the thermal barrier, which protects the thermal barrier from damage or wear. The welding tool is a portion an anvil assembly and/or a sonotrode assembly. A method of insulating a welding tool includes applying or connecting a thermal barrier to a surface of the welding tool, and minimizing the rate of dissipation of heat generated by the vibrations at or along the welding interface using the thermal barrier, which includes an insulating layer.