Abstract: A wire bond apparatus and method can include wire bonder head having a capillary there through and a bond wire within the capillary. A forming gas inlet to the capillary allows injection of forming gas directly into the wire bond head capillary. The forming gas can be forced from the end of the capillary to accurately envelop an end of the bond wire in forming gas during free-air ball formation, which can decrease oxidation of the free-air ball during formation, reduce a quantity of forming gas used, and result in a more symmetrical free-air ball and an improved bond wire attachment.

Abstract: An ultra low permeability fluid member for conveying a fluid (e.g., a hose, tube, etc.) having a metal vapor barrier layer (22) formed around an inner tube (14). The metal vapor layer (22) is formed from one or more metal strips (40a, 40b) having edge portions (44) that are bonded so as to seal the vapor barrier layer (22) preventing permeation of vapor.

Abstract: The invention relates to a ultrasonic welding device for welding two components (B1, B2), wherein a rod-shaped first sonotrode (1) for the generation of longitudinal waves (W1) is coupled on its first end (E1) to a first converter (3) and on its second end (E2) opposite the first end (E1) to a second converter (5), wherein a first welding surface (9) is provided in the middle of the first sonotrode (1). To improve durability and to increase welding performance at the same time, the invention suggests that a second sonotrode (11) which is coupled to at least one third converter (13) and is configured as a torsion sonotrode has a second welding surface (15) arranged opposite the first welding surface (9), wherein the first (1) and the second sonotrode (11) can be moved relatively against each other such that a clamping force between the first (9) and the second welding surface (15) can be applied to the components (B1, B2) to be connected.

Abstract: In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

Abstract: A sealed battery includes a battery container. The battery container houses an electrode winding body, on which positive and negative electrode plates are wound via separators, together with a non-aqueous electrolytic solution. A positive electrode tab is bonded to a positive current collector ring arranged at an upper side of the electrode winding body. A battery lid to be a positive electrode external terminal is crimped and fixed to the battery container. The battery lid has a diaphragm in which a cleaving valve is formed. A coupling part is bonded to the diaphragm, and a stack lead with a plurality of thin plates being laminated is bonded to the coupling part. In the stack lead, a total sum t of thicknesses of the thin plates is not more than a thickness T of the coupling part. Melting from the stack lead to the coupling part by laser irradiation is optimized.

Abstract: A process control procedure for a bonding process includes predetermining a deformation limit and a deforming time limit is for deforming a bonding precursor member. The bonding precursor member is deformed while monitoring instantaneous deformation values and instantaneous deforming time values for the bonding precursor member. A deforming shut-down time value is set at an instantaneous deforming time value corresponding to an occurrence of a first condition or a second condition. The first condition is an instantaneous deformation value for the bonding precursor member reaching the deformation limit and the second condition is an instantaneous deforming time value for the bonding precursor member reaching the deforming time limit. Deformation of the bonding precursor member is shut down at the deforming shut-down time value, thereby producing a deformed bond member from the bonding precursor member.

Abstract: The invention relates to a method for connecting a cable to an electrical connection element (14), in particular a plug connector, cable shoe or similar, during which the connection elements (14) are transported successively by a transport unit (6, 7) to an ultrasonic welding device (8), each of the connection elements (14) is brought into contact with a cable end section in the ultrasonic welding device (8) and is then connected by ultrasonic welding. To increase the production speed of a cable provided with a connection element (14), it is suggested according to the invention that the next connection element (14) to be connected is transported by the transport unit (6, 7) to the ultrasonic welding device (8) during production of the ultrasonic welded connection.

Abstract: An assembly line for manufacturing filter canisters is disclosed. The method for assembling filter canisters provides a unique serial number for each canister and a database that associates the component lot numbers, activated charcoal weight, and quality assurance test results with the serial number for the filter canister. The manufacturing method can be adapted for assembly of canisters with activated charcoal and an aerosol HEPA filter, canisters with activated charcoal only, and canisters with an aerosol HEPA filter only. Some embodiments can also enable different testing conditions and specifications, activated charcoal loading requirements, labeling specifications, and packaging requirements.

Abstract: A system and method for maintaining a substantially constant gap between a horn and an anvil includes the act of positioning a horn proximal an anvil, so that a gap is established between the horn and the anvil. An alternating current (AC) signal is applied to a converter coupled to the horn. The AC signal exhibits an amplitude. The amplitude of the AC signal is adjusted during operation of the horn, so as to maintain the gap between the horn and the anvil substantially constant.

Abstract: In an ultrasonic mounting apparatus, a pressing shaft coupled with a voice coil motor to apply a load on a part to be mounted is placed independently from components including a bonding tool, ultrasonic horn, transducer, and horn support member. The components can move coaxially with the pressing shaft which is an application axis of a driving force. Abutting position of the bonding tool and pressing shaft is brought into coincidence with a node of a standing wave generated in the bonding tool.

Abstract: In a method of mounting an electronic component on a substrate, electrode terminals on at least one of the substrate and the electronic component are composed of solder bumps. The electrode terminals of the substrate and the electrode terminals of the electronic component are placed in contact and ultrasonic vibration is applied to at least one of the substrate and the electronic component to provisionally bond the electrode terminals together. A gap between the substrate and the electronic component is then filled with flux fill, and the electrode terminals of the substrate and the electronic component are bonded by reflowing the solder bumps.

Abstract: An apparatus and method for detecting the oscillation amplitude of a bonding tool includes a sensing unit disposed adjacent to and at a distance from the bonding tool. The sensing unit includes a pair of electrodes, a piezoelectric sensing layer located between the pair of electrodes, and a membrane associated with the piezoelectric sensing layer. The piezoelectric sensing layer becomes sensitive to ultrasonic vibrations and generates electrical voltage signals after being activated by a poling process. An optional pre-amplifier is used to amplify the signals generated from the sensing unit, and an oscilloscope is used to further process the signals.

Abstract: An aluminum tubular unit for long-term, leak-free storage of fluids is formed in which an aluminum cap is ultrasonically welded to an end of the aluminum tube. The ultrasonic weld is formed from a device capable of producing a torsional vibration pattern. The ultrasonic welding of the cap to the tube eliminates the use of seals and pins to seal the cap to the tube and further eliminates the need for having a hole in the cap to mechanically couple the respective end cap to the cylindrical tube. Furthermore, since ultrasonic welding does not generate significant heat, highly volatile and flammable fluids can be present within the tube when the caps are ultrasonically welded to the cylindrical body. In addition, one or more fins used may also be welded to the outside diameter of the cylindrical body using a related ultrasonic welding process.

Abstract: A method of minimizing mechanical resonance in an assembly during formation of a vibration-welded joint therein includes positioning work pieces such that they are directly adjacent to each other, and generating a set of control signals that cause one or more sonotrode weld heads to vibrate. A waveform characteristic of a mechanical oscillation of the sonotrode(s) and weld head(s) is varied to minimize the mechanical resonance occurring in the assembly, such as a multi-cell battery for a vehicle. An apparatus for forming the welded joint includes at least one sonotrode having a weld head or heads formed integrally therewith, and a weld controller. The controller is connected to a converter, sonotrode(s), and weld head(s), with the mechanical oscillation occurring in the sonotrode(s) and weld head(s). Variation of the control signals during formation of the welded joint varies a waveform characteristic of the mechanical oscillation, thus minimizing the mechanical resonance.

Abstract: A sonotrode for an ultrasound welding device including at least one working surface and a front surface that extends perpendicularly to the working surface. To avoid or reduce a deviation perpendicular to the longitudinal axis of the sonotrode, the front surface has at least one reinforcing element.

Abstract: Devices and methods of welding dissimilar materials are contemplated in which an adaptor is used in an intermediate position between the dissimilar materials. Most preferred adaptors are manufactured by friction stir welding from two dissimilar materials that are identical or similar to the dissimilar materials to be welded together. Therefore, coupling of dissimilar materials in the field via the adaptors is greatly simplified as conventional welding methods can now be employed.

Abstract: The disclosure is directed to ultrasonic bonding equipment, in which the anvil and horn include protrusions of varying height to grip the material being bonded. The outer protrusions may form smaller or differently shaped indentations in the material to reduce material stresses of the material at the outer region of the material. An exemplary embodiment of an ultrasonic bonding system includes an anvil and a horn arranged facing the anvil to ultrasonically bond a gripped portion of two or more layers of material. The gripped portion of the layers includes an inner region and an outer region. The anvil and the horn apply a gripping force to the outer region that is less than a gripping force applied to the inner region of the gripped materials.

Abstract: A method and apparatus for welding of battery terminals to an interconnect includes: juxtaposing two or more battery cell terminals to each other to create a terminal stack including an innermost terminal and an outermost terminal; juxtaposing a battery cell interconnect with the innermost terminal of the stack; positioning an anvil in contact with the interconnect; directing an air stream against the outermost terminal so that the air stream compresses the terminal stack and urges the innermost terminal into contact with the interconnect; positioning a sonotrode horn in contact with the outermost terminal; and energizing the sonotrode horn to vibrate the terminal stack and thereby make an ultrasonic weld between the stacked terminals of the terminal stack and the interconnect. The air stream is directed at the terminal below the sonotrode horn to capture any debris and a suction removes the debris.

Abstract: There is provided an electronic component mounting apparatus including: a component holder which holds an electronic component; a pressing unit which applies pressure to the held electronic component through the component holder; and an ultrasonic transducer which applies ultrasonic vibration to the held electronic component through the component holder. The component holder includes a horn at one end of which is mounted the ultrasonic transducer and a holding tool which is fixed to the other end of the horn by using bolts and holds the electronic component. The horn has a surface A1 and a surface A2 at the other end and the holding tool has a surface B1 in intimate contact with the surface A1 and a surface B2 in intimate contact with the surface A2.

Abstract: The present invention provides a bonding method in which a bonded portion having a sufficient bonding strength can be obtained at a relatively low temperature, for example, in die bonding a semiconductor chip. A metal paste 20 was applied to a semiconductor chip 10, the metal paste 20 consisting of metal powder of one or more kinds selected from gold powder, silver powder, platinum powder, and palladium powder having a purity not lower than 99.9 wt % and an average particle diameter of 0.005 ?m to 1.0 ?m and an organic solvent. After being applied, the metal paste 20 was dried in a vacuum in a dryer. The chip was heated at 230° C. for 30 minutes to sinter the metal paste, by which a metal powder sintered compact 21 was formed. Next, a nickel plate 30 was placed on the semiconductor chip 10, and bonded to the semiconductor chip 10 by heating and pressurization.

Abstract: The present invention discloses a novel structure for the connector of electronic cards. The invented connector comprises a mode defining the outer shape of an electronic card, a first guide arm slidably provided at one side of said mode and a second guide arm slidably provided at the other side of said mode. The connector may further comprise a triangular guide rail and/or a card ejector. The connector may be affixed to a connector main body to form a connector assembly. The method for preparing the invented connector comprises the steps of: Preparing a mode defining an electronic card; slidably affixing a first guide arm at one side of the mode; and slidably affixing a second guide arm at one side of the mode. The invented method may further comprise the step of providing an ejector and/or a triangular guide rail at one guide arm. The invented method may further comprising the step of installing the first and second guide arms in a connector main body.

Abstract: A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other.

Abstract: A flexible conductive ribbon is ultrasonically bonded to the surface of a die and terminals from a lead frame of a package. Multiple ribbons and/or multiple bonded areas provide various benefits, such as high current capability, reduced spreading resistance, reliable bonds due to large contact areas, lower cost and higher throughput due to less areas to bond and test.

Abstract: A horn attachment arm for a bonding apparatus that performs high speed bonding with high accuracy to a large sized workpiece is provided. The horn attachment arm includes a fixing bracket fixed to a moveable member of a driving motor and a ultrasonic horn attaching bracket for attaching an ultrasonic horn on a tip end side to be fixed by being sandwiched between flat plates made of carbon fiber reinforced plastic. A flat plate space keeping member is attached between the flat plates so as to extend between the brackets. Flanges of the brackets and the longitudinal structure member are fixed to respective flat plates using a screw and an adhesive agent. The carbon fiber reinforced plastic that constitutes the flat plates has a greater number of reinforced fibers in a longitudinal direction than in a width direction, and is high in strength and rigidity in the longitudinal direction.

Abstract: A system and method for adjusting the gap between a horn and an anvil in an ultrasonic welding system includes the act of positioning a horn proximal to an anvil, so that a gap is established between the horn and the anvil. A force is applied to the horn, so as to urge the horn toward the anvil. A deformable stop is positioned at a location, such that application of the urging force causes a member operatively connected to the horn to abut the deformable stop, and to deform the stop. The urging force is iteratively adjusted during operation of the horn, so as to adjust the extent of the deformation of the deformable stop, and to maintain the gap between the horn and the anvil substantially constant.

Abstract: A battery module includes an electrochemical battery cell having a pair of cell tabs and conductive interconnecting members having one or more interconnect extensions. The cell tabs are welded to different interconnecting members to form welded joints, and each interconnect extension is hemmed with respect to the cell tabs to overlap and reinforce the welded joint. The welded joint can be ultrasonically-welded, while the interconnecting member can have a generally U-shaped profile with side walls formed integrally with the interconnect extensions. A method of minimizing effects of a shearing stress in the battery module includes fusing a cell tab or tabs to the interconnecting member to form a welded joint, and then hemming an interconnect extension of the interconnecting member to form a hem seam overlapping the cell tabs. Fusing can include ultrasonically welding the cell tabs to the side walls or other suitable means.

Abstract: A process for ultrasonic welding of a shaft to a golf club head is disclosed herein. The process involves positioning a tip end of a shaft within a bore of a hosel of the golf club head and imparting vibrational energy at least 20 kiloHertz to the interface to ultrasonically weld the shaft to the interior wall of the hosel. The diffusion of materials creates a strong attachment off the shaft to the golf club head.

Abstract: A transducer assembly for a bonding apparatus is provided that comprises a horn having first and second base ends and a bonding tool attached to the horn between the first and second base ends. First and second ultrasonic generators are secured to the first and second base ends respectively. A first fastening mechanism is located on the horn between the bonding tool and the first ultrasonic generator and a second fastening mechanism is located on the horn between the bonding tool and the second ultrasonic generator such that the horn is releasably attachable to a mounting interface using the first and second fastening mechanisms. There are also transducer mounting positions disposed on the mounting interface for mounting the mounting interface to a bond head.

Abstract: A method of ultrasonic welding aluminum parts together includes placing the aluminum parts in an ultrasonic welding apparatus and contacting at least one of the aluminum parts with a horn tip of a weld horn of the ultrasonic welding apparatus. A weld amplitude is profiled during a weld cycle of the ultrasonic welding apparatus by producing a high weld amplitude above 55 ?m at the horn tip of the weld horn during an initial period of a weld cycle and producing a low weld amplitude below 55 ?m at the horn tip after the initial period.

Abstract: An ultrasound welding device and a method for connecting stranded wires in an electrically conducting manner with a metal U-shaped support by ultrasound welding, where the stranded wires are made of individual wires that are essentially aluminum. The sonotrode used according to the invention is a sonotrode has a welding surface which is shaped like an open trapezoid having short base sides as the bottom face during welding, the stranded wires directly contacting the bottom face and the lateral faces that extend therefrom and form an obtuse angle. The overall cross-sectional area FL of the stranded wires inserted in the U-shaped support and the cross-sectional area FS of the space surrounded by the bottom face and the lateral faces have a relationship FS<FL<2FS in the welded state.

Abstract: An ultrasonic welding apparatus having an extractable sonotrode. The sonotrode having a non-threaded outer peripheral surface and a tapered mating surface that meets with a correspondingly tapered aperture formed in the end of the reed of the ultrasonic welding apparatus. In the preferred embodiment the ultrasonic welding apparatus includes a sonotrode removal mechanism for extracting the sonotrode from the reed.

Abstract: A method of forming a metallic container includes the steps of providing body and lid portions, placing the body and lid portions together, keeping portions of the body and lid portions in contact with one another, and reciprocally rotating the lid portion with respect to the body portion, thereby generating frictional heat and forming a friction weld therebetween. An apparatus for attaching the lid and body portions of a metallic container includes a base to support the body, a support assembly to support a flange of the body, and a sonitrode for contacting a flange of the lid, wherein the flanges of the lid and body are held together between the support assembly and the sonitrode. A motor reciprocally rotates the sonitrode relative to the support assembly, thereby moving the flanges relative one another to generate frictional heat and create a friction weld therebetween.

Abstract: A wire bonding apparatus including a bonding arm provided at a tip end thereof with an ultrasonic horn that has a capillary at its tip end, wherein the bonding arm is provided therein with a pressure sensor that detects the pressing load applied by the capillary on a workpiece when bonding is executed. The bonding arm has a supporting point which is a thin-connecting portion and located at a height which is the same as the height of the center of gravity of a part formed by the capillary, ultrasonic horn body portion, ultrasonic vibrator, ultrasonic horn connecting portion, etc., and at a point where a balance between inertial mass including the capillary, ultrasonic horn body part, ultrasonic horn connecting portion, horn securing screws and pressure screws and inertial mass of the ultrasonic vibrator is maintained, when the bonding arm is turned about a bonding arm supporting shaft.

Abstract: An ultrasonic joining method and apparatus is provided, by which a large joined area can be obtained in a short period of operating time without damage. The ultrasonic joining apparatus includes a chip and an anvil, between which the first conductor of the first flexible flat cable and the second conductor of the second flexible flat cable as an object to be joined are put. An end surface of the chip facing the anvil is formed flat. The end surface is provided with a plurality of the first straight grooves. The first straight groove is formed extending straight. The plurality of the first straight grooves are arranged in parallel with each other.

Abstract: A vehicle seat (1) structure (10) is provided in which at least two structural parts (12, 14) are connected to each other at least at one contact point (P) by means of ultrasonic welding.

Abstract: In a heat exchanger, a core portion includes a plurality of plate fins each shaped like a flat plate and a plurality of tubes in which a fluid flows and each of which is inserted into each of the plate fins to be mechanically bonded thereto. Further, an end portion in a longitudinal direction of each of the tubes is bonded to a header plate which constructs a part of a header tank. The manufacturing method for this heat exchanger includes inserting the tube into the plate fins; expanding the tube to attach the plate fins; connect the tube into the header plate; and vibrate the tube with respect to the plate while applying a load to the tube in the direction of the header plate.

Abstract: To provide a novel multilayer printed wiring board in which a conductor on the outermost resin layer is positioned properly. Furthermore, to provide a novel multilayer printed wiring board in which productivity is enhanced when forming solder bumps on the pads for mounting a semiconductor element. In multilayer printed wiring board, multiple pads for connection with a semiconductor chip are formed on one surface, and on its opposite surface, external connection terminals for connection with another substrate are formed. The pads for connection with a semiconductor chip are formed in the central region of one surface, stiffener is formed in the peripheral region surrounding the pads for connection with a semiconductor chip, pads for connection with a semiconductor chip and stiffener are formed with the same material and are set to be the same height, and the actual area of the stiffener is determined according to the total area of the multiple pads for connection with a semiconductor chip.

Abstract: When a semiconductor chip is mounted using ultrasonic vibration, a method of mounting makes it possible to bond the semiconductor chip and bonding patterns with sufficient bonding strength without making the construction of a circuit board complex. The method of mounting a semiconductor chip causes ultrasonic vibration to act on the semiconductor chip to mount the semiconductor chip on a circuit board by flip-chip bonding. As the circuit board, a circuit board is used where protrusion patterns are provided at positions on bonding patterns to which the semiconductor chip is bonded corresponding to antinodes of vibration for a case where the bonding patterns resonate due to ultrasonic vibration applied by the semiconductor chip.

Abstract: A flip-chip block structure with block bumps comprises a die, a substrate, a first block bump, and a second block bump. The die comprises an active side and a backside, a first die pad and a second die pad are disposed on the active surface, and an electrode layer is disposed on the backside. The first die pad and the second die pad are connected to the pattern side of the substrate via the first block bump and the second block bump respectively. Besides, the first block bump and the second block bump are formed by a wedge bonding method, therefore, the block bumps are more easily formed into larger sizes, which enhance electrical performance and thermal dissipation performance of the flip-chip structure due to a lower contact resistance and a larger contact area between the die and the substrate.

Abstract: A method for relieving residual stress in an object includes: (a) applying a vibration energy to the object over a frequency range; (b) monitoring vibration behavior of the object over the frequency range so as to identify a reference frequency, where the vibration amplitude of a fundamental wave component of the wave pattern is approximately one third of a maximum vibration amplitude of a resonate frequency of the object, and an optimum frequency, where the frequency and the vibration amplitude of the harmonic wave component of the wave pattern are respectively larger than those of the harmonic wave component of the wave pattern of the reference frequency; and (c) applying the vibration energy to the object at the identified optimum frequency for an extended period of time.

Abstract: A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load.

Abstract: An apparatus and method for joining adjacent members, wherein the members are placed in an overlapping layered relationship. The members are clamped between a die and a blank holder. Once clamped, a clinching operation is performed on the members to create at least a partial bond between them. In addition to the clinching operation, a level of vibrational energy is imparted to at least one of the members to reduce clamping force requirements, promote material flow and deformation and provide increased joint strength.

Abstract: An ultrasonic rotary welding apparatus and methods of using the same are disclosed. The ultrasonic welding device includes an ultrasonic horn and an anvil. The ultrasonic horn is constrained by a mounting system. The mounting system permits the horn to exhibit two degrees of freedom. The first degree of freedom permits translational motion in a direction perpendicular to the longitudinal axis of the horn. The second degree of freedom permits rotation about an axis perpendicular to both the longitudinal axis of the horn and the direction of translational motion.

Abstract: In a direction parallel to a direction 5 of ultrasonic vibrations imparted from an ultrasonic vibrator 1, the shape of a center portion 3a of a tool 3 and the shape of an end portion 3b of the tool 3 are changed such that the cross-sectional areas are different, whereby ultrasonic amplitudes 9 in a direction perpendicular to the direction 5 of ultrasonic vibrations are substantially equal. By this means, the difference in ultrasonic vibration between at the center portion 3a of the tool 3 and at the end portion 3b of the tool 3 can be eliminated or reduced.

Abstract: The invention provides a wire bonding method which enables formation of a low loop having a height not exceeding two times the wire diameter and secures sufficient pull strength of the wire even with the low loop shape. After having formed a contact-bonded ball at a first bonding point, a capillary moves upward and then toward a second bonding point to press a side surface of an upper portion of the contact-bonded ball, so that a protruded portion is formed on a top portion of the contact-bonded ball on the side of the second bonding point. After having formed the protruded portion of the contact-bonded ball, the capillary moves upward, and then downward while moving toward the second bonding point to press the protruded portion, so that a wire drawing portion for drawing the wire from the top portion of the contact-bonded ball horizontally is formed.

Abstract: The invention is directed to firm bonding between semiconductor dies etc bonded to a lead frame and wire-bonding portions of the lead frame by ultrasonic Al wire bonding, and the prevention of shortcircuit between the semiconductor dies etc due to a remaining portion of the outer frame of the lead frame after the outer frame is cut. By extending the wire-bonding portion etc on the lead frame in a wire-bonding direction and connecting the wire-bonding portion etc to the outer frame of the lead frame through a connection lead etc, the ultrasonic vibration force in the ultrasonic Al wire bonding is prevented from dispersing and the Al wire and the wire-bonding portion etc are firmly bonded. The outer frame is cut after a resin sealing process is completed.

Abstract: A procedure for squeezing off and sealing a tube, in which the tube is positioned between a sonotrode and an associated anvil, counter electrode, of an ultrasonic device, and the sonotrode is activated and displaced relative to the counter electrode for squeezing off and sealing the tube. In order to enable automatic squeezing off and sealing of a tube without individually entering the data of the tube into an ultrasonic welding device in advance, the invention proposes positioning the tube and fixing it between the sonotrode and the counter electrode, retrieving stored welding parameters on the basis of the characteristic variable and activating the sonotrode and moving the sonotrode and counter electrode in relation towards each other for consolidating and sealing the tube.

Abstract: Batteries are disclosed having a vent opening that is sealed by a metal foil. Methods and tooling for manufacturing such batteries and methods of venting sealed batteries are also disclosed. In some implementations, sealing is performed using ultrasonic metal welding.

Abstract: A horn for vibratory solid-state ultrasonic welding of metals and similarly-behaved materials “self-levels” to produce wide continuous seams or large-area spot-welds between delicate workpieces without damage, even if the workpieces are not perfectly flat and parallel to the nominal toolface angle. The horn toolface flexes under pressure to conform to skew-angled workpieces because it is disposed on a tool head supported by a tool neck cut from the tool body. The tool head, the tool neck, or both are anisotropically compliant. When resonances are properly optimized for typical VSS modes of vibration, atypical but useful localized modes are excited at the compliant toolface edges, actually intensifying the bond energy where one might normally expect unwanted damping. Various design approaches optimize the characteristics of the tool head and tool neck to various materials and bonding configurations. The horns can be configured for use with existing ultrasonic welders.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.