Using High Frequency Vibratory Energy (e.g., Ultrasonic) Patents (Class 228/110.1)
  • Publication number: 20120107546
    Abstract: One or more layers of vibration damping material are placed on one or more selected surface regions of a body portion of a vibratile metal article. The layer of damping material is covered with a thin metal sheet. The selected surface may be recessed in the body portion to receive the damping material. The covering sheet may be formed of the same metal composition as body portion, or of a compatible metal composition. The peripheral edges of the covering sheet are ultrasonically welded to the surface of the article body portion to confine the damping material against the selected surface(s) so that the damping material forms a vibration damping interface(s) with the surface(s) of the article. The damping material may function as a coulomb damping material, or a viscous damping material, or both.
    Type: Application
    Filed: October 28, 2010
    Publication date: May 3, 2012
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: James G. Schroth, Thomas A. Perry, Mark T. Riefe
  • Patent number: 8167187
    Abstract: A method and a device is provided for levelling an area region on the surface of a metal or metallization layer of a carrier. The area region is made planar by the action of a stamp or of a roller.
    Type: Grant
    Filed: April 28, 2006
    Date of Patent: May 1, 2012
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Thomas Licht, Alfred Kemper
  • Publication number: 20120085812
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.
    Type: Application
    Filed: October 10, 2011
    Publication date: April 12, 2012
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Christoph Benno Luechinger, Orlando Luis Valentin
  • Patent number: 8152043
    Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: April 10, 2012
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
  • Publication number: 20120080507
    Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.
    Type: Application
    Filed: October 3, 2011
    Publication date: April 5, 2012
    Applicant: ORTHODYNE ELECTRONICS CORPORATION
    Inventors: Christoph B. Luechinger, Orlando L. Valentin
  • Patent number: 8146794
    Abstract: The present invention provides a boom and arm member of a construction machine excellent in weld zone fatigue strength and a method of improvement of its fatigue strength, that is, a boom and arm member of a construction machine superior in weld zone fatigue strength, the boom and arm member of a construction machine characterized in that toes of full penetrated weld zones of the boom and arm member have vibration strike marks, and a method of improvement of its fatigue strength. Preferably, the residual stress of the bottom surface of the vibration strike marks is a 10 MPa or higher compressive residual stress.
    Type: Grant
    Filed: July 14, 2005
    Date of Patent: April 3, 2012
    Assignee: Nippon Steel Corporation
    Inventors: Tetsuro Nose, Kiyotaka Nakashima
  • Patent number: 8129220
    Abstract: A system for bonding electrical devices using an electrically conductive adhesive to adhere the electrical devices together, the system comprising: an ultrasonic transducer to generate an ultrasonic vibration; and an ultrasonic to thermal energy apparatus operatively attached to and covering an operational end of the ultrasonic transducer, the ultrasonic to thermal energy apparatus damping the ultrasonic vibration to minimize ultrasonic vibration transmitted to a first electrical device and causing the conversion of the ultrasonic vibration to a heating pulse which is conducted through the first electrical device to the adhesive; wherein the adhesive is softened by the heating pulse to bond the electrical devices together.
    Type: Grant
    Filed: August 24, 2009
    Date of Patent: March 6, 2012
    Assignee: Hong Kong Polytechnic University
    Inventor: Derek Siu Wing Or
  • Publication number: 20120048449
    Abstract: A welding tool, such as a vibration welding tool, includes one or more relief areas for material to flow into during a welding process to help prevent deformation of a substrate that a component is being attached to.
    Type: Application
    Filed: August 25, 2010
    Publication date: March 1, 2012
    Applicant: FAURECIA INTERIOR SYSTEMS, INC.
    Inventors: Friedhelm Manzke, Douglas E. Redmond
  • Patent number: 8118209
    Abstract: An ultrasonic welding apparatus 1 includes an anvil equipped with a terminal clamp 3 for disposing an electrical contact part 31 connected to an electronic device and a core wire weld part 32 which ranges to the electrical contact part 31 and stacks a core wire 21 constructed by bundling plural strands, and a chip 7 which is disposed in a position opposed to the anvil and mutually welds the core wire to the terminal clamp by applying ultrasonic vibration in a state of pinching the core wire 21 and the terminal clamp 3 between the anvil and the chip and pressurizing the core wire and the terminal clamp in a direction of approaching each other. The ultrasonic welding apparatus 1 includes a core wire protrusion prevention wall 5 which is disposed in a position close to a terminal of the core wire 21 and prevents the terminal of the core wire 21 from moving to a place overlapping with the electrical contact part 31.
    Type: Grant
    Filed: August 23, 2010
    Date of Patent: February 21, 2012
    Assignee: Yazaki Corporation
    Inventor: Kentaro Ohnuma
  • Patent number: 8104660
    Abstract: A transducer is provided that comprises a horn having a longitudinal axis, a bonding tool attached to the horn, and an ultrasonic generator attached to the horn and spaced from the bonding tool along the longitudinal axis of the horn. A flexure is attached to the horn between the bonding tool and the ultrasonic generator for supporting the horn whereby to increase its dynamic rigidity in directions transverse to the longitudinal axis.
    Type: Grant
    Filed: May 3, 2006
    Date of Patent: January 31, 2012
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Srikanth Narasimalu, Chee Tiong Lim, Sathish Kumar Balakrishnan
  • Publication number: 20110315665
    Abstract: Disclosed is a battery casing manufacturing method which comprises: providing a casing film; providing a casing body; aligning the casing film and the casing body; and connecting the casing film and the casing body by using a welding process. The welding process transmits energy to the predetermined joint area of the casing film and/or the casing body in a non-physical contact way to make them connected.
    Type: Application
    Filed: April 22, 2011
    Publication date: December 29, 2011
    Applicant: SIMPLO TECHNOLOGY CO., LTD.
    Inventor: PEI-JAN HO
  • Publication number: 20110293971
    Abstract: The present invention discloses a battery module including a casing capable of supporting a plurality of battery cells and having a circuit board holding structure, a circuit board held by the circuit board holding structure, a plurality of conducting buses disposed on the casing for electrically connecting the plurality of battery cells and the circuit board, and a plurality of battery cell sets, each of which including a battery holder and at least two battery cells, where any two of the plurality of battery cell sets are independent in structure and thereby can be affixed to the casing or detached from the casing respectively.
    Type: Application
    Filed: August 12, 2011
    Publication date: December 1, 2011
    Inventors: Pei-Jan Ho, Yuan-Sheng Chen, Ren-Ting Chuang, Yu-Wen Wu, Nan-Chun Wu, Chao-Feng Lee, Ching-Ping Yao
  • Patent number: 8066170
    Abstract: A wire bonding machine is provided. The wire bonding machine includes a bonding tool and an electrode for forming a free air ball on an end of a wire extending through the bonding tool where the free air ball is formed at a free air ball formation area of the wire bonding machine. The wire bonding machine also includes a bond site area for holding a semiconductor device during a wire bonding operation. The wire bonding machine also includes a gas delivery mechanism configured to provide a cover gas to: (1) the bond site area whereby the cover gas is ejected through at least one aperture of the gas delivery mechanism to the bond site area, and (2) the free air ball formation area.
    Type: Grant
    Filed: June 8, 2009
    Date of Patent: November 29, 2011
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Gary S. Gillotti, Stanley Szczesniak, Peter J. Van Emmerik
  • Patent number: 8052026
    Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.
    Type: Grant
    Filed: October 6, 2006
    Date of Patent: November 8, 2011
    Assignee: Kabushiki Kaisha Shinkawa
    Inventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
  • Publication number: 20110266329
    Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.
    Type: Application
    Filed: October 7, 2009
    Publication date: November 3, 2011
    Applicant: HESSE & KNIPPS GMBH
    Inventors: Hans-Juergen Hesse, Joerg Wallaschek, Michael Broekelmann, Piotr Vasiljev
  • Patent number: 8047420
    Abstract: A method for production of a welded connection between at least one first electrical conductor and at least one second electrical conductor, in which the conductors are brought into a compression chamber enclosed by delimitation elements and welded therein by an ultrasound welding device, one of the delimitation elements forming a sonotrode which may be subjected to ultrasound vibration. According to the invention, in order to connect a first conductor in the desired circumference with second conductors, where the total cross-section of the second conductors for connection to the first conductor can optionally be greater than the usual cross-section with the ultrasound device used, the first conductor is welded sequentially with two or more second conductors in the compression chamber.
    Type: Grant
    Filed: October 7, 2006
    Date of Patent: November 1, 2011
    Assignee: Ultraschalltechnik GmbH
    Inventor: Dieter Stroh
  • Patent number: 8042721
    Abstract: An ultrasonic device includes a coupler, a mounting sleeve and an exponential horn form by both the coupler and the mounting sleeve. A flange is located on the mounting sleeve for support at a node of minimum vibratory motion. The mounting sleeve and coupler are formed separately and then metallurgically attached so they vibrate together as a substantially unitary member. The formation of the horn by the two components in this manner allows the diameter at the start of the horn to be increased to the outer diameter of the mounting sleeve, thereby increasing cross-sectional area at the horn start and increasing amplitude at the horn tip. Preferably, the coupler and mounting sleeve are made from stainless steel alloy and attached using a silver braze alloy. The device may also include a support collar attached to the mounting sleeve flange to support the mounting sleeve and primary coupler.
    Type: Grant
    Filed: June 12, 2008
    Date of Patent: October 25, 2011
    Inventor: Nicholas Maropis
  • Publication number: 20110248069
    Abstract: A weld pad for an ultrasonic welding horn for welding a battery cell tab is described. The weld pad includes a plurality of inner knurls having at least one sharp edge; and a plurality of outer knurls surrounding the plurality of inner knurls, the outer knurls being shorter than the inner knurls and having a rounded outer edge. A method of welding battery cell tabs using the weld pad is also described.
    Type: Application
    Filed: April 9, 2010
    Publication date: October 13, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: Alexander D. Khakhalev, Paul F. Spacher, Jennifer Bracey
  • Patent number: 8028886
    Abstract: A bonding tool comprises: a horn which transmits an ultrasonic vibration; a ultrasonic transducer which is provided on one end of the horn, and produces the ultrasonic vibration; a heater disposition part, in which a heater is disposed, which is provided between the one end of the horn and the other end of the horn; a bonding action part which is provided between the one end of the horn and the other end of the horn, holds an electronic component, and is heated by the heater; a first cooling part, through which a fluid flows, which is provided between the heater disposition part and the one end of the horn; and a second cooling part, through which a fluid flows, which is provided between the heater disposition part and the other end of the horn.
    Type: Grant
    Filed: December 4, 2009
    Date of Patent: October 4, 2011
    Assignee: Panasonic Corporation
    Inventors: Hiroshi Ebihara, Katsuhiko Watanabe, Ryo Fujita
  • Patent number: 8025202
    Abstract: A sealed battery includes an ultrasonic fusion process whereby layers of a positive electrode substrate exposed portion are ultrasonically fused to form a positive electrode fused portion at the positive electrode substrate exposed portion, and layers of a negative electrode substrate exposed portion are ultrasonically fused to form a negative electrode fused portion at the negative electrode substrate exposed portion; and an electrode body formation process whereby a high-energy beam is directed at the positive electrode fused portion to weld a positive electrode collector to the positive electrode fused portion, and a high-energy beam is directed at the negative electrode fused portion to weld a negative electrode collector to the negative electrode fused portion, thus forming an electrode body in which a positive electrode collector is welded to one end of the electrode group and a negative electrode collector is welded to the other end.
    Type: Grant
    Filed: September 25, 2007
    Date of Patent: September 27, 2011
    Assignee: SANYO Electric Co., Ltd.
    Inventors: Yasutomo Taniguchi, Yasuhiro Yamauchi, Naoya Nakanishi, Toshiyuki Nohma
  • Patent number: 8020747
    Abstract: Along with miniaturization of a solder connection portion in a bump repair or a local reflow, a void generated at the time of soldering remains in a solder to remarkably reduce connection strength, and there occurs a non-connection phenomenon in which the solder connection portion and a solder paste are melted, but are not fused with each other. During melting of a solder, a target component is clamped, ultrasonic oscillation is directly applied only to the target component. Further, start of solidification of the solder connection portion is detected by change of an electric impedance of a transducer while applying the ultrasonic oscillation, and the clamp is released before a substrate is warped.
    Type: Grant
    Filed: July 7, 2009
    Date of Patent: September 20, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Tetsuya Nakatsuka, Masato Nakamura
  • Patent number: 8020746
    Abstract: A method for generating a wire bond between a wire and an electrical contact member is provided. The method comprising the steps of: pressing a first surface of a portion of the wire against a second surface of the electrical contact member with a first force while vibrating the portion of the wire along the second surface in order to generate a bond; measuring the time dependent vibration amplitude of the portion of the wire at a number of discrete time steps during the generation of the bond; measuring the time dependent deformation of said portion of the wire due to said applied first force and said vibration at a number of discrete time steps during the generation of the bond; and generating a time dependent first signal from at least said vibration amplitude and said deformation at a number of discrete time steps during the generation of the bond that is a direct measure of the stability of the bond at the respective time step.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: September 20, 2011
    Assignees: Technische Universitaet Berlin, Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V.
    Inventors: Ute Geissler, Herbert Reichl, Holger Gaul, Klaus-Dieter Lang, Martin Schneider-Ramelow
  • Patent number: 8016182
    Abstract: A wire loop includes a wire connecting a first bonding point and a second bonding point therethrough, wherein an additional wire loop is formed after wire bonding at the second bonding point without cutting the wire and the additional wire loop is bonded to the second bonding point or to the vicinity thereof while part of the wire is crushed.
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: September 13, 2011
    Assignee: Kaijo Corporation
    Inventors: Mizuho Shirato, Hiromi Fujisawa, Tadahisa Akita
  • Patent number: 8011559
    Abstract: A method for controlling welding forces of a weld tip to a work piece during a vibration-welding process includes positioning an Active Material (AM) element adjacently to a welding interface, and varying a property of the AM element to regulate the welding force. The AM element may be disposed between the weld tip and a weld face thereof, or between the work piece and an anvil. The property may be varied as a function of heat generated by the welding process. A property of each of a plurality of AM elements may be independently and selectively varied via an energy source, or passively. A vibration welding system includes a weld tip and an AM element connected adjacently to a welding interface. The system regulates a welding force applied by the weld tip to a work piece during the welding process by varying a property of the AM element.
    Type: Grant
    Filed: November 9, 2009
    Date of Patent: September 6, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Wayne W. Cai, Xiujie Gao, Nancy L. Johnson, Alan L. Browne
  • Publication number: 20110206940
    Abstract: A workpiece arrangement includes at least two join regions of at least one workpiece that are joined together by a material-to-material connection seam. The material-to-material connection seam covers only a portion of a first of the at least two join regions. A thermal insulation device is disposed in an area of the material-to-material connection seam and corresponds to the first of the at least two join regions.
    Type: Application
    Filed: July 27, 2009
    Publication date: August 25, 2011
    Applicant: GSI HELMHOLTZZENTRUM FÃœR SCHWERIONENFORSCHUNG GMBH
    Inventors: Tobias Engert, Ivan Kojouharov, Juergen Gerl
  • Patent number: 8002162
    Abstract: A friction-welding device for the integral joining of components, having an oscillator, which generates a periodic movement of a component and a welding surface provided thereon relative to another, static component and a welding surface provided thereon, with directions of movement parallel to the welding surfaces, having a compression device which presses the welding surfaces together, and a cartridge which accommodates the moved component. The oscillator includes two or a greater, even number of piezoactuators, which are arranged in pairs on a line of application and are able to be prestressed with respect to the cartridge from opposite sides under pressure generation and are able to be moved in a synchronous, oscillating manner together therewith and the component.
    Type: Grant
    Filed: November 26, 2003
    Date of Patent: August 23, 2011
    Assignee: MTU Aero Engines GmbH
    Inventors: Erwin Bayer, Boris Grohmann, Frank Hermle, Peter Jaenker
  • Publication number: 20110200816
    Abstract: The present invention relates to filled polymeric materials including a polymer and a mass of metallic fibers distributed within the polymer, and to light weight composites which comprise at least a pair of metallic layers and a polymeric layer interposed between the pair of metallic layers, the polymeric layer containing the filled polymeric material. The composite materials of the present invention may be formed using conventional stamping equipment at ambient temperatures. Composite materials of the present invention may also be capable of being welded to other metal materials using a resistance welding process such as resistance spot welding. Preferred composite materials include one or any combination of the following features: metallic fibers that are ribbon fibers; a polymer selected from a polyolefin, a polyamide, or a combination thereof; or a metallic layer (e.g., one or both of the pair of metallic layers) having a surface facing the filled polymeric material that is untreated.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 18, 2011
    Applicant: PRODUCTIVE RESEARCH LLC
    Inventors: Shimon Mizrahi, Moshe Narkis
  • Patent number: 7997470
    Abstract: A transducer is provided that comprises a horn that is configured to transmit vibrations along its length during operation in the form of an oscillatory waveform, such oscillatory waveform having a plurality of vibration nodal points. An ultrasonic generator is coupled to one end of the horn and a bonding tool is coupled to an opposite end of the horn for performing bonding operations. A first flange structure is located along the length of the horn at a first vibration nodal point for mounting the transducer, and a second flange structure is located along the length of the horn at a second vibration nodal point for mounting the transducer, such that the second flange structure is separated from the first flange structure by a distance of at least two consecutive vibration nodal points.
    Type: Grant
    Filed: November 24, 2006
    Date of Patent: August 16, 2011
    Assignee: ASM Technology Singapore Pte Ltd
    Inventors: Hing Leung Marchy Li, Boon June Edwin Yeap, Ka Shing Kenny Kwan, Man Chan, Yam Mo Wong
  • Publication number: 20110195271
    Abstract: A cast metal part has a veneer made of cosmetic metal applied thereto so that the cast metal part has a cosmetic surface. A method for producing a cast metal part with a cosmetic surface comprises applying a veneer of cosmetic metal to a surface of the cast metal part. The cast metal part can be a die cast part, such as die cast aluminum or zinc. The veneer can be thin gauge highly cosmetic aluminum. The veneer of cosmetic metal can be applied to the surface of the cast metal part by placing the veneer into a casting mold used for forming the cast metal part, and casting molten metal onto the veneer in the casting mold. The veneer of cosmetic metal can also be applied to the surface of the cast metal part by solid-state welding, e.g., diffusion bonding, the veneer and the cast metal part together.
    Type: Application
    Filed: June 10, 2010
    Publication date: August 11, 2011
    Applicant: Apple Inc.
    Inventors: Stephen ZADESKY, Duco Pasmooij
  • Publication number: 20110186616
    Abstract: A welding assembly for forming a weld along a welding interface of a work piece(s) using vibrations includes a welding tool and a thermal barrier. The thermal barrier is at least a chemical and/or mechanical insulating layer positioned adjacent to the welding tool, which minimizes the rate of dissipation of heat generated by the vibrations at or along the welding interface. The welding assembly may also include a wear-resistant layer adjacent to the thermal barrier, which protects the thermal barrier from damage or wear. The welding tool is a portion an anvil assembly and/or a sonotrode assembly. A method of insulating a welding tool includes applying or connecting a thermal barrier to a surface of the welding tool, and minimizing the rate of dissipation of heat generated by the vibrations at or along the welding interface using the thermal barrier, which includes an insulating layer.
    Type: Application
    Filed: December 17, 2010
    Publication date: August 4, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS LLC
    Inventors: Wayne W. Cai, Paul F. Spacher, Edgar M. Storm, JR., Xingcheng Xiao
  • Patent number: 7980536
    Abstract: The invention is a mounting system for a vibrational element. The vibrational element has a longitudinal axis, an outer surface and an axial displacement node. The mounting system includes an isolation member which has an isolation surface, an isolating body, and an engaging portion. The engaging portion is immovably secured to the isolation member and extends radially inward from the isolation body at a point radially opposite the isolation surface. The engaging portion is disposed so as to engage the outer surface of the vibrational element. Radial displacements of the vibration element are substantially decoupled from the isolation surface through the engaging portion.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: July 19, 2011
    Assignee: 3M Innovative Properties Company
    Inventors: Gopal B. Haregoppa, Satinder K. Nayar, Donald S. Oblak, Ronald W. Gerdes
  • Patent number: 7971769
    Abstract: A weld stack includes a horn having a weld end, a polar mount adapted to receive a portion of the horn therein, a first adjustment ring coupled to the polar mount at a pre-determined distance from the weld end of the horn, and a second adjustment ring coupled to the polar mount adjacent the first adjustment ring, wherein the second adjustment ring includes a fine adjustment device for adjusting a relative position of the first adjustment ring and the second adjustment ring.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: July 5, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Edgar M. Storm, Paul F. Spacher
  • Publication number: 20110143161
    Abstract: Selected surface regions of coulomb vibration damping strips are bonded face-to-face by ultrasonic welding to a surface region of an article that may experience excessive vibration in use. In one embodiment, prior to welding, the intended facing side of the damping strip is treated to form surface regions that are oxidized, roughened, or coating so that the treated regions do not weld to the article surface. In another embodiment of the invention the ultrasonic welding process is controlled so as to produce regions (sometimes randomly interposed regions) of welded and non-welded regions between the damping strip and adjacent article surface. The unbonded regions of the otherwise welded strip lie in closely-spaced, interfacial, frictional contact with the adjacent article surface to damp vibration in the article.
    Type: Application
    Filed: October 12, 2010
    Publication date: June 16, 2011
    Applicant: GM GLOBAL TECHNOLOGY OPERATIONS, INC.
    Inventors: James G. Schroth, Thomas A. Perry
  • Patent number: 7959054
    Abstract: A device for processing workpieces using ultrasound, comprising an ultrasound sonotrode and an anvil, wherein a workpiece is processed between the ultrasound sonotrode and the anvil, the ultrasound sonotrode having a recess with open edges in the axial direction and a die is disposed in the recess in the direction towards the workpiece and/or the anvil, the die being displaceable between a rest position retracted into the ultrasound sonotrode and an operating position in which it partially projects out of the ultrasound sonotrode.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: June 14, 2011
    Assignee: Hermann Ultraschalltechnik GmbH
    Inventor: Mike Konieczka
  • Patent number: 7954690
    Abstract: An inkjet print head for which an ink flow path formation member, arranged on a printing element board, is prevented from being peeled off or being damaged, and the printing element board in an appropriate state can be mounted on a support member. According to the present invention, an ink flow path formation member is arranged on one face of a printing element board, and a peripheral area extending outward from the ink flow path formation member is prepared. Since pressure is applied to the peripheral area using a mounting tool, to bond the first terminals of the printing element board to the electrode terminals of the support member, damage to the ink flow path formation member, caused by the mounting tool, can be prevented.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: June 7, 2011
    Assignee: Canon Kabushiki Kaisha
    Inventors: Osamu Sato, Shuzo Iwanaga
  • Publication number: 20110121057
    Abstract: The present invention is a bonding apparatus which bonds a first object to be bonded and a second object to be bonded by bringing a bonding member into contact with an upper surface of the second object to be bonded placed on an upper surface of the first object to be bonded and ultrasonically vibrating the second object to be bonded by the bonding member, and the bonding member includes: a contact portion brought into contact with the second object to be bonded; and a holding portion holding the second object to bonded. With this structure, it is possible to prevent the object to bonded from sliding sideways to thereby properly bond the objects to be bonded to each other, even with a low pressing force.
    Type: Application
    Filed: February 3, 2011
    Publication date: May 26, 2011
    Applicant: Tokyo Electron Limited
    Inventor: Shinjiro WATANABE
  • Patent number: 7947933
    Abstract: A ceramic heater comprising a ceramic body, a heat generating resistor buried in the ceramic body, an electrode pad that is electrically connected to the heat generating resistor and is formed on the surface of the ceramic body and a lead member bonded onto the electrode pad.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: May 24, 2011
    Assignee: Kyocera Corporation
    Inventors: Ryuichi Nagasako, Osamu Hamada, Koji Sakamoto
  • Publication number: 20110102972
    Abstract: There is provided a chip-type electric double layer capacitor comprising: a resin case having a housing space provided therein and formed of insulating resin and first and second external terminals inserted into the resin case by insert injection molding. Each of the external terminals has a first portion exposed to an outer surface of the resin case for external contact and a second portion exposed to an inner surface of the housing space for internal contact. a sealing portion includes a groove portion provided in the resin case along a circumference of at least one of the first and second external terminals and a resin filling the groove portion. An electric double layer capacitor cell is mounted in the housing space and electrically connected to the second portion of the first and second external terminals.
    Type: Application
    Filed: October 15, 2010
    Publication date: May 5, 2011
    Applicant: SAMSUNG ELCTRO-MECHANICS CO., LTD.
    Inventors: Chang Ryul Jung, Sung Ho Lee, Dong Sup Park, Hyun Chul Jung, Yeong Su Cho, Sang Kyun Lee
  • Patent number: 7934633
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: May 3, 2011
    Assignee: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • Patent number: 7926698
    Abstract: Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.
    Type: Grant
    Filed: February 10, 2010
    Date of Patent: April 19, 2011
    Assignee: Texas Instruments Incorporated
    Inventors: Norihiro Kawakami, Yoshikatsu Umeda, Sohichi Kadoguchi
  • Patent number: 7922068
    Abstract: This invention relates to a thermite welding process for joining sections of a railway line in situ, the process including the preliminary step of mounting a suitable welding mould about the aligned sections of railway line to be welded together and sealing the mould to prevent run out; mounting a vibration means on the railway line at a suitable distance from the mould and operating it at a suitable frequency; heating the sections of railway line to a desired temperature; igniting an ignitor means and allowing it to drop into the mould to react with molten steel in the mould and fill a weld area about and between the sections of railway line in the mould; and when solidified, to vibrate the railway line for a further period of time until stress relieving of the cast weld area has occurred.
    Type: Grant
    Filed: November 21, 2008
    Date of Patent: April 12, 2011
    Inventor: Brent Felix Jury
  • Publication number: 20110079039
    Abstract: Upper and lower frames enclosing a peripheral edge of the supporting plate and each including a groove to receive a sealing member are preassembled through locking parts, and then fusion-bonded in the preassembled state. Accordingly, a waterproof effect and durability of the shelf assembly are improved.
    Type: Application
    Filed: September 23, 2010
    Publication date: April 7, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae Hoon Lim, In Yong Hwang, Woo Yeol Yoo, Jong Eun Chae, Sun Keun Lee
  • Patent number: 7909228
    Abstract: An ultrasonic bond is formed using a bond tool foot having a waffle shape of thin protrusions and gaps between the protrusions. The tool is brought in contact with the ribbon to a depth to create depressions in a ribbon approximately 150 ?m or less from the underlying bonding surface. The tool is then brought down further into the ribbon to contact the portions of the ribbon between the depressions, such as an additional 25 to 50 ?m. The result is lightly bonded regions underneath the groove portions and highly bonded regions underneath the protrusions and around the perimeter of the bond. In another embodiment, an ultrasonic bond is formed along a partial width of a ribbon.
    Type: Grant
    Filed: April 15, 2008
    Date of Patent: March 22, 2011
    Assignee: Orthodyne Electronics Corporation
    Inventors: Mark Arnold Delsman, Christoph Benno Luechinger
  • Publication number: 20110062218
    Abstract: In an ultrasonic bonding method of an electric wire in which the electric wire 1 in which a conductor end 7 made of plural core wires is exposed and a metallic connection terminal 19 formed by erecting two side walls 27 from a bottom surface are prepared and the conductor end is bonded to the connection terminal by applying ultrasonic vibration while the conductor end of the electric wire is positioned in the bottom surface between the two side walls of the connection terminal and is pushed, a cross section of the conductor end of the electric wire is made by being molded by press so that a thickness of a width direction between the side walls becomes thin toward at least one of the side positioned in the bottom surface of the connection terminal and the side to which the ultrasonic vibration is applied.
    Type: Application
    Filed: September 10, 2010
    Publication date: March 17, 2011
    Applicant: YAZAKI CORPORATION
    Inventor: Kentaro OHNUMA
  • Publication number: 20110057299
    Abstract: Height control of a capillary is performed in a stitch bonding (2nd bond) in a wire bonding, so that a thickness of a stitch portion can be controlled, thereby ensuring a bonding strength at the stitch portion and achieving an improvement in a bonding reliability. Also, the stitch portion has a thick portion, and a wire and a part (? portion) of a bonding region of an inner lead is formed to a lower portion of the thick portion, thereby sufficiently ensuring a thickness of the stitch portion and a bonding region.
    Type: Application
    Filed: September 9, 2010
    Publication date: March 10, 2011
    Inventors: Yasuki TAKATA, Kaori Sumitomo, Hiroshi Horibe, Hideyuki Arakawa
  • Publication number: 20110048762
    Abstract: A waterproofing method is provided for a wire to be arranged in a water susceptible area of a vehicle. An insulating coating layer is removed in a lengthwise intermediate part of the wire to expose a core. A heat shrinkable tube with an inner layer made of a hot-melt waterproofing agent is mounted on the exposed core section and parts of the insulating coating layer adjacent to the exposed core section and heated. As a result, the hot-melt waterproofing agent of the inner layer is melted and infiltrates into clearances between strands of the exposed core section. In addition, negative pressure is introduced into the inside of the insulating coating layer from an end of the wire, thereby sucking the waterproofing agent into the inside of the insulating coating layer to infiltrate the waterproofing agent also between the strands of the core inside the insulating coating layer.
    Type: Application
    Filed: June 30, 2008
    Publication date: March 3, 2011
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventor: Naohito Sawamura
  • Publication number: 20110048763
    Abstract: Connection of an aluminium stranded lead 2 to a connection part 10, comprising a stripped end 4 of the aluminium stranded lead 2 and a metal connection part 10 which is materially connected to the stripped end 4 of the aluminium stranded lead 2. An inexpensive welded connection can be produced in that an end face of the stripped end 4 of the aluminium stranded lead 2 is welded to the connection part 10 by means of torsional ultrasonic welding.
    Type: Application
    Filed: November 9, 2009
    Publication date: March 3, 2011
    Applicant: AUTO KABEL MANAGEMENTGESELLSCHAFT MBH
    Inventors: Martin Schloms, Sebastian Martens, Franz-Josef Lietz
  • Patent number: 7896219
    Abstract: A method and apparatus for welding of battery terminals to an interconnect includes: juxtaposing two or more battery cell terminals to each other to create a terminal stack including an innermost terminal and an outermost terminal; juxtaposing a battery cell interconnect with the innermost terminal of the stack; positioning an anvil in contact with the interconnect; directing an air stream against the outermost terminal so that the air stream compresses the terminal stack and urges the innermost terminal into contact with the interconnect; positioning a sonotrode horn in contact with the outermost terminal; and energizing the sonotrode horn to vibrate the terminal stack and thereby make an ultrasonic weld between the stacked terminals of the terminal stack and the interconnect. The air stream is directed at the terminal below the sonotrode horn to capture any debris and a suction removes the debris.
    Type: Grant
    Filed: March 3, 2009
    Date of Patent: March 1, 2011
    Assignee: GM Global Technology Operations LLC
    Inventors: Robert J. Scheuerman, Rick F. Rourke
  • Publication number: 20110042444
    Abstract: An ultrasonic welding apparatus 1 includes an anvil equipped with a terminal clamp 3 for disposing an electrical contact part 31 connected to an electronic device and a core wire weld part 32 which ranges to the electrical contact part 31 and stacks a core wire 21 constructed by bundling plural strands, and a chip 7 which is disposed in a position opposed to the anvil and mutually welds the core wire to the terminal clamp by applying ultrasonic vibration in a state of pinching the core wire 21 and the terminal clamp 3 between the anvil and the chip and pressurizing the core wire and the terminal clamp in a direction of approaching each other. The ultrasonic welding apparatus 1 includes a core wire protrusion prevention wall 5 which is disposed in a position close to a terminal of the core wire 21 and prevents the terminal of the core wire 21 from moving to a place overlapping with the electrical contact part 31.
    Type: Application
    Filed: August 23, 2010
    Publication date: February 24, 2011
    Applicant: YAZAKI CORPORATION
    Inventor: Kentaro OHNUMA
  • Patent number: 7878384
    Abstract: An ultrasound welding device for welding metallic conductors for producing a junction point includes two welding surfaces, which are located on opposite sides, and two lateral delimiting surfaces, which extend transverse to the working surfaces and which, together, define a compression space. In order to eliminate longitudinal movement of the conductors during welding, at least one of the lateral delimitation surfaces is additionally structured next to the structured welding surfaces.
    Type: Grant
    Filed: February 1, 2006
    Date of Patent: February 1, 2011
    Assignee: Schunk Ultaschalltechnik GmbH
    Inventors: Jost Eberbach, Dieter Stroh, Horst Dieterle, Heiko Stroh