Using High Frequency Vibratory Energy (e.g., Ultrasonic) Patents (Class 228/110.1)
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Patent number: 8439247Abstract: An ultrasonic welding system for securing a first work piece to a second work piece includes a welding assembly and a loading assembly disposed adjacent to the welding assembly. The welding assembly includes an ultrasonic controller, an ultrasonic transducer, and a welding tip. The ultrasonic transducer is configured to impart an ultrasonic vibration to the welding tip in response to an electrical signal received from the ultrasonic controller. The loading assembly is configured to generate a pressure load between the welding tip and the first work piece, and includes a first actuator and a second actuator. The first actuator is configured to apply a substantially constant load to the welding assembly, and the second actuator is configured to apply a dynamically variable load to the welding assembly.Type: GrantFiled: November 4, 2011Date of Patent: May 14, 2013Assignee: GM Global Technology Operations LLCInventors: John Patrick Spicer, Benjamin R. Christian, Jeffrey A. Abell
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Publication number: 20130112735Abstract: An ultrasonic ribbon bonding system is provided. The ultrasonic ribbon bonding system includes a workholder for supporting a workpiece during a ribbon bonding operation. The workholder defines a first plurality of standoffs extending above a surface of the workholder, the first plurality of standoffs configured to contact the workpiece during the ribbon bonding operation. The ultrasonic ribbon bonding system also includes a bond head assembly carrying a ribbon bonding tool, the ribbon bonding tool being configured to bond a ribbon to the workpiece during the ribbon bonding operation.Type: ApplicationFiled: July 18, 2011Publication date: May 9, 2013Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8434659Abstract: A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head (2) which can be rotated about a geometric axis of rotation (D), in particular a vertical axis, and on which a bonding tool (5) and an ultrasonic transducer (35) are disposed for ultrasonic vibration excitation of the bonding tool (5). It is proposed that the main direction of extension (36) of the ultrasonic transducer (35) and/or the direction of extension thereof in the direction of the axis of the minimum moment of inertia extends parallel to the geometric axis of rotation (D) of the bonding head (2). The invention further relates to a bonding device or an ultrasonic transducer.Type: GrantFiled: October 7, 2009Date of Patent: May 7, 2013Assignee: Hesse & Knipps GmbHInventors: Hans-Juergen Hesse, Joerg Wallaschek, Michael Broekelmann, Piotr Vasiljev
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Patent number: 8434656Abstract: An ultrasonic horn used in, for instance, a wire bonding apparatus and formed with mounting flanges, including a slit and a cross-sectional shape varying portion; the slit being on the central axis in the horn's longitudinal direction and extending fore and aft relative to the center of the mounting flanges, the length of the slit(s) being equal to or greater than the width direction of a flange region that is between the opposing flanges, and at least a part of the cross-sectional shape varying portion being on the outer surface of the horn at a slit region in which the slit is formed. The stress center point in the cross-section of the ultrasonic horn at the flange region is positioned more to the inside than a straight line joining the stress center points in the cross-sections of the ultrasonic horn at the front and rear end portions of the slit.Type: GrantFiled: September 23, 2011Date of Patent: May 7, 2013Assignee: Kabushiki Kaisha ShinkawaInventors: Osamu Kakutani, Yutaka Kondo, Kohei Seyama
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Publication number: 20130107549Abstract: The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).Type: ApplicationFiled: November 1, 2011Publication date: May 2, 2013Applicant: Taiwan Semiconductor Manufacturing Company, Ltd. ("TSMC")Inventor: Wei-Yu Yeh
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Publication number: 20130104982Abstract: Methods and devices are described for allowing the ultrasonic welding of a junction box, having at least one overmolded element, to a cover panel of a photovoltaic module.Type: ApplicationFiled: October 31, 2012Publication date: May 2, 2013Applicant: FIRST SOLAR, INC.Inventor: FIRST SOLAR, INC.
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Patent number: 8433433Abstract: A system and a method for determining whether an ultrasonic horn is aligned with an anvil of an ultrasonic welding system are provided. The first and second accelerometer sensors generate first and second signals indicative of first and second accelerations of first and second positions on a bracket coupled to the anvil when the ultrasonic horn is vibrating and contacting the anvil. The system further includes a microprocessor that receives the first and second signals. The microprocessor determines a difference between an amplitude of the first signal at a first time and an amplitude of the second signal at the first time. The microprocessor stores a first identifier value in a memory device indicating that the ultrasonic horn is aligned with the anvil if the difference between the amplitude of the first signal and the amplitude of the second signal is less than or equal to a threshold value.Type: GrantFiled: December 16, 2010Date of Patent: April 30, 2013Assignee: LG Chem, Ltd.Inventor: Alex Khakhalev
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Publication number: 20130098972Abstract: Methods of attaching cutting elements to earth-boring tools, comprising abutting a portion a cutting element against at least one surface of an earth-boring tool with a braze material disposed therebetween; and brazing the cutting element to the earth-boring tool by applying high-frequency vibrations to cause the braze material to become flowable. Methods of securing cutting elements to earth-boring tools may comprise at least partially coating a cutting element with a braze material. The cutting element may be at least partially disposed in a pocket formed in a body of an earth-boring tool with the braze material adjacent surfaces defining the pocket. The cutting element and the braze material may be ultrasonically torsionally oscillated to braze the cutting element within the pocket.Type: ApplicationFiled: September 14, 2012Publication date: April 25, 2013Applicant: BAKER HUGHES INCORPORATEDInventors: Tu Tien Trinh, Eric C. Sullivan, Xiaomin Chris Cheng
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Patent number: 8424745Abstract: A method of forming a composite sheet includes disposing an untextured metal or alloy first sheet in contact with a second sheet in an aligned opposing position; bonding the first sheet to the second sheet by applying an oscillating ultrasonic force to at least one of the first sheet and the second sheet to form an untextured intermediate composite sheet; and annealing the untextured intermediate composite sheet at a temperature lower than a primary re-crystallization temperature of the second sheet and higher than a primary re-crystallization temperature of the first sheet to convert the untextured first sheet into a cube textured sheet, wherein the cube texture is characterized by a ?-scan having a FWHM of no more than 15° in all directions, the second sheet remaining untextured, to form a composite sheet.Type: GrantFiled: April 18, 2012Date of Patent: April 23, 2013Assignee: UT-Battelle, LLCInventors: Craig A. Blue, Amit Goyal
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Patent number: 8418911Abstract: The invention allows for the contacting of preferably microcomponents using electrical wires. By growing metallic microdepositions on cut surfaces of microcables, a contact region is generated which simplifies the dosing and application of a contact auxiliary and allows ultrasonic bonding, comprising a defined size of the electrically conductive area and allowing the contacting of very stably insulated wires. The application of this method in a panelized manner and in series is inexpensive.Type: GrantFiled: December 8, 2009Date of Patent: April 16, 2013Inventors: Thorsten Meiss, Tim Rossner
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Patent number: 8413874Abstract: A synchronous ultrasonic metal welding device with double-heads has two sets of ultrasonic welding mechanisms which are installed side by side on a middle frame (18). The middle frame (18) is composed of assembling flanges (19) and two sliding stop rods (11) which are in parallel each other. The ultrasonic welding mechanisms are located on the assembling flanges (19) which are connected with driving devices (3) respectively. The driving devices (3) drive the ultrasonic welding mechanisms moving toward each other and welding synchronously. By using the welding device of the invention, multi-layer metal pieces of the power battery can be double-sided welded simultaneously by way of spot welding or roll welding, so the work efficiency can be improved, and the welding layer can be strong in one time.Type: GrantFiled: August 4, 2010Date of Patent: April 9, 2013Assignee: Guangzhou Newpower Ultrasonic Electronic Equipment Co., Ltd.Inventors: Zhuosheng Yan, Zhuoli Yan, Jinxuan Yan, Rukun Yang, Xiaobin Lu, Xingtao Zhong, Weishu Huang
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Patent number: 8408445Abstract: A vibration welding system includes a controller, welding horn, an active material element, and anvil assembly. The assembly may include an anvil body connected to a back plate and support member. The element, e.g., a piezoelectric stack or shape memory alloy, is positioned with respect to the assembly. The horn vibrates in a desirable first direction to form a weld on a work piece. The element controls any vibrations in a second direction by applying calibrated response to the anvil body in the second direction. A method for controlling undesirable vibrations in the system includes positioning the element with respect to the anvil assembly, connecting the anvil body to the support member through the back plate, vibrating the horn in a desirable first direction, and transmitting an input signal to the element to control vibration in an undesirable second direction.Type: GrantFiled: March 1, 2012Date of Patent: April 2, 2013Assignee: GM Global Technology Operations LLCInventors: Wayne W. Cai, Bongsu Kang, Chin-An Tan
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Publication number: 20130075454Abstract: The invention relates to a torsion sonotrode, comprising two mutually opposing end faces (S1, S2) and a circumferential surface (U) which surrounds a torsion axis (T) and on which at least one working surface (A1, A2, A3, A4) is provided at a radial distance from the torsion axis (T).Type: ApplicationFiled: May 5, 2011Publication date: March 28, 2013Applicant: TELSONIC HOLDING AGInventor: Albert Buettiker
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Publication number: 20130062397Abstract: A method for welding together at least two planar metal components oriented with respect to one another using ultrasound, wherein for the welding operation the components are arranged between a tool transmitting ultrasonic vibrations and a counter-holder and fixed between same by the application of pressure. In order for the components to have a desired orientation with respect to one another after the welding operation that corresponds to the orientation prior to the welding operation, according to the invention the components, prior to applying the ultrasonic vibrations for welding the same together, are deformed by means of at least one projection that projects from the tool and/or the counter-holder beyond the respective working surface using the application of force such that a translatable and rotatable relative movement is suppressed, or substantially suppressed, between the components and that the welding operation is carried out after the deformation.Type: ApplicationFiled: April 8, 2011Publication date: March 14, 2013Applicant: SCHUNK SONOSYSTEMS GMBHInventors: Dieter Stroh, Heiko Stroh
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Patent number: 8393523Abstract: A method of performing ultrasonic stir welding uses a welding head assembly to include a plate and a rod passing through the plate. The rod is rotatable about a longitudinal axis thereof. In the method, the rod is rotated about its longitudinal axis during a welding operation. During the welding operation, a series of on-off ultrasonic pulses are applied to the rod such that they propagate parallel to the rod's longitudinal axis. At least a pulse rate associated with the on-off ultrasonic pulses is controlled.Type: GrantFiled: June 14, 2012Date of Patent: March 12, 2013Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space AdministrationInventor: R. Jeffrey Ding
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Patent number: 8393520Abstract: An ultrasonic stir welding system includes a welding head assembly having a plate and a rod passing through the plate. The rod is rotatable about a longitudinal axis thereof. During a welding operation, ultrasonic pulses are applied to the rod as it rotates about its longitudinal axis. The ultrasonic pulses are applied in such a way that they propagate parallel to the longitudinal axis of the rod.Type: GrantFiled: September 22, 2011Date of Patent: March 12, 2013Assignee: The United States of America as Represented by the Administrator of the National Aeronautics and Space AdministrationInventor: R. Jeffrey Ding
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Publication number: 20130052511Abstract: Interconnection assemblies and methods are provided. An interconnection assembly includes a first cell tab constructed of a first metal, and a second cell tab disposed against the first cell tab. The second cell tab is constructed of a second metal having a hardness greater than the first metal. The assembly further includes an interconnect member disposed against the second cell tab. The assembly further includes a weld assisting layer disposed against the first cell tab such that the first and second cell tabs are disposed between the weld assisting layer and the interconnect member.Type: ApplicationFiled: August 31, 2011Publication date: February 28, 2013Applicant: LG Chem, Ltd.Inventor: Alex Khakhalev
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Publication number: 20130042959Abstract: An ultrasonic welding machine and method are provided. The machine includes an ultrasonic welding horn operably coupled to a housing. The machine further includes an anvil operably coupled to the housing. The machine further includes a removable collar assembly that is coupled around a portion of an outer surface of the ultrasonic welding horn. The removable collar assembly has at least first and second set screws that contact the housing such that when at least one of the first and second set screws are moved inwardly toward the housing, the removable collar assembly rotates the ultrasonic welding horn to align the ultrasonic welding horn relative to the anvil.Type: ApplicationFiled: August 19, 2011Publication date: February 21, 2013Applicant: LG CHEM, LTD.Inventors: Alex Khakhalev, Lee Nelson Cole, Eric Hicks
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Patent number: 8375577Abstract: The present inventions relate to methods and arrangements for using a thin foil to form electrical interconnects in an integrated circuit package. In one embodiment, a foil carrier structure is formed by ultrasonically bonding portions of a conductive foil to a metallic carrier. The bonded portions define panels in the foil carrier structure. In some embodiments, the foil carrier structure is cut to form multiple isolated panels that are sealed along their peripheries. Each isolated panel may be approximately the size of a conventional leadframe strip or panel. As a result, existing packaging equipment may be used to add dice, bonding wires and molding material to the panel. The ultrasonic welding helps prevent unwanted substances from penetrating the foil carrier structure during such processing steps. After the carrier portion of the molded foil carrier structure is removed, the structure is singulated into integrated circuit packages.Type: GrantFiled: June 4, 2008Date of Patent: February 19, 2013Assignee: National Semiconductor CorporationInventors: Will Wong, Nghia Thuc Tu, Jaime Bayan, David Chin
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Patent number: 8371014Abstract: A method of forming a metallic container includes the steps of providing body and lid portions, placing the body and lid portions together, keeping portions of the body and lid portions in contact with one another, and reciprocally rotating the lid portion with respect to the body portion, thereby generating frictional heat and forming a friction weld therebetween. An apparatus for attaching the lid and body portions of a metallic container includes a base to support the body, a support assembly to support a flange of the body, and a sonitrode for contacting a flange of the lid, wherein the flanges of the lid and body are held together between the support assembly and the sonitrode. A motor reciprocally rotates the sonitrode relative to the support assembly, thereby moving the flanges relative one another to generate frictional heat and create a friction weld therebetween.Type: GrantFiled: January 20, 2010Date of Patent: February 12, 2013Assignee: New Sonic Technologies, LLCInventor: James T. Williamson
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BONDING TOOL, APPARATUS FOR MOUNTING ELECTRONIC COMPONENT, AND METHOD FOR MANUFACTURING BONDING TOOL
Publication number: 20130026211Abstract: In some cases, it is difficult to carry out ultrasonic joining of high quality with a conventional bonding tool. A bonding tool includes: a horn that transmits an ultrasonic vibration; an ultrasonic vibrator that is provided at one end of the horn, and generates the ultrasonic vibration; and an electronic component holding part that holds an electronic component, wherein the electronic component holding part has a male fitting part in a shape of a tapering-off, and an electronic component holding face that holds the electronic component on an opposite side to the male fitting part, a female fitting part in a shape according to a shape of the male fitting part is formed in a predetermined face of the horn, and the male fitting part is fitted into the female fitting part via an adhesion layer.Type: ApplicationFiled: April 12, 2011Publication date: January 31, 2013Applicant: Panasonic CoporationInventors: Ryo Fujita, Hiroshi Ebihara -
Publication number: 20130029215Abstract: A housing for an energy storage cell includes an interior which provides beneficial properties to fabricators of the cell. The cell may be hermetically sealed by conventional laser welding techniques.Type: ApplicationFiled: July 27, 2012Publication date: January 31, 2013Applicant: FastCAP Systems CorporationInventors: Riccardo Signorelli, John J. Cooley, Christopher J.S. Deane, James Epstein
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Patent number: 8360300Abstract: A method and an apparatus for ultrasonic welding of a first workpiece to a second workpiece is disclosed. The two workpieces are clamped between a sonotrode and an anvil so that the two workpieces are in mechanical contact with each other, the first workpiece is in mechanical contact with the sonotrode and the second workpiece rests on the anvil. Fluid is introduced between the second workpiece and the anvil so that the second workpiece at least partly rests on the fluid. Ultrasonic vibrations are applied to the first workpiece by the sonotrode for a period of time.Type: GrantFiled: September 30, 2011Date of Patent: January 29, 2013Assignee: Infineon Technologies AGInventors: Guido Strotmann, Peter Koechling, Christian Steininger
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Publication number: 20130009442Abstract: Seat pan assemblies and methods of making the same are disclosed. In one embodiment, a plastic seat pan is disclosed which encapsulates a metal front lift rod and a portion of a metal mesh seat support. Other embodiments are also disclosed.Type: ApplicationFiled: February 9, 2012Publication date: January 10, 2013Inventor: Matthew Burnham
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Publication number: 20130005196Abstract: An electrical connection includes an electrically conductive first contact member, an electrically conductive second contact member, an interface, and an attachment. The first contact member includes a first contact surface for passing current. The second contact member includes a second contact surface for passing current that directly contacts the first contact surface. The interface includes one of a cold weld and a fused section that physically joins the first contact member and the second contact member, and that forms a primary conductive path between the first contact member and the second contact member. The interface is formed by ultrasonic vibration of the first contact surface relative to the second contact surface. The attachment is separate from the interface and mechanically joins the first contact member and the second contact member. A method for forming the electrical method is also provided.Type: ApplicationFiled: January 18, 2012Publication date: January 3, 2013Applicant: GM Global Technology Operations LLCInventors: Leonid C. Lev, Nikolay Kondratyev
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Publication number: 20130000949Abstract: To provide an ultrasonic welding method for conductors that is capable of suppressing occurrence of insufficient weld strength and a separation which may occur when terminals of a plurality of wires are ultrasonically welded. In a wire arranging step, a plurality of wires are arranged in accordance with a predetermined arrangement. In a conductor moving step, conductors (2) are pressed in a predetermined direction by a grinding jaw (12), and thereby relative positions among the conductors (2) are changed. In a first ultrasonic welding step, ultrasonic welding is performed on the conductors (2) in a state of being pressed by the grinding jaw (12). In a second ultrasonic welding step, the pressing applied by the grinding jaw (12) is released, and ultrasonic welding is performed on the conductors (2).Type: ApplicationFiled: March 15, 2011Publication date: January 3, 2013Applicants: FURUKAWA AUTOMOTIVE SYSTEMS INC., FURUKAWA ELECTRIC CO., LTD.Inventors: Yukihiro Torimoto, Shizuka Yamaguchi
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Publication number: 20120321821Abstract: A method for sealing vacuum glass and a vacuum glass product processed by said method are provided. The method specifically is: preparing metallized layers (6) consolidated with glass plates on the surface to be sealed at the edge of the glass plates by the known sintering process; enabling hermetically sealing the edges of the two glass plates (1, 2) by welding and connecting metal sealing sheet (7) between the metallized layers (6) of the tow glass plates to be hermetically sealed. A brand new technology for manufacturing vacuum glass is provided by sintering metallized layers on the surface of the glass plates, and hermetically sealing the edges of the glass plates by use of the metallized layers and metal sealing sheet.Type: ApplicationFiled: October 29, 2010Publication date: December 20, 2012Applicant: LUOYANG LANDGLASS TECHNOLOGY CO., LTDInventors: Yanbing Li, Zhangsheng Wang
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Publication number: 20120321907Abstract: A metal inter-diffusion bonding method for forming hermetically sealed wafer-level packaging for MEMS devices. A stack of a first metal is provided on a surface of both a first wafer and a second wafer, the first metal being susceptible to oxidation in air; providing a layer of a second metal, having a melting point lower than that of the first metal, on an upper surface of each stack of the first metal, the layer of second metal being sufficiently thick to inhibit oxidation of the upper surface of the first metal; bringing the layer of the second metal on the first wafer into contact with the layer of second metal on the second wafer to form a bond interface; and applying a bonding pressure to the first and second wafers at a bonding temperature lower than the melting point of the second metal to initiate a bond, the bonding pressure being sufficient to deform the layers of the second metal at the bond interface.Type: ApplicationFiled: March 1, 2011Publication date: December 20, 2012Applicant: SENSONOR TECHNOLOGIES ASInventors: Nils Hoivik, Birger Stark, Anders Elfing, Kaiying Wang
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Patent number: 8328066Abstract: A bonding tool, including: a component mounting unit including a horn that has a heater insertion hole, in which a heater is inserted with a predetermined clearance, and transmits ultrasonic vibration, an ultrasonic transducer that is fixed on the horn and produces the ultrasonic vibration, and an electronic component holder that is fixed on the horn, holds an electronic component and is heated by the heater; a leg that supports the horn on both sides of the horn at nodal points of the ultrasonic vibration on the horn; a supporter that holds the leg; and a heater holder that holds the heater on both sides of the horn, wherein the leg and the heater holder are formed integrally with each other.Type: GrantFiled: February 24, 2010Date of Patent: December 11, 2012Assignee: Panasonic CorporationInventors: Ryo Fujita, Hiroshi Ebihara, Katsuhiko Watanabe
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Patent number: 8317078Abstract: A method and an apparatus for ultrasonic welding of a first workpiece to a second workpiece is disclosed. The two workpieces are clamped between a sonotrode and an anvil so that the two workpieces are in mechanical contact with each other, the first workpiece is in mechanical contact with the sonotrode and the second workpiece rests on the anvil. Fluid is introduced between the second workpiece and the anvil so that the second workpiece at least partly rests on the fluid. The fluid is frozen so that the fluid forms a solid body. Ultrasonic vibrations are applied to the first workpiece by the sonotrode for a period of time.Type: GrantFiled: December 15, 2011Date of Patent: November 27, 2012Assignee: Infineon Technologies AGInventors: Guido Strotmann, Achim Cordes
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Patent number: 8308050Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: GrantFiled: July 2, 2012Date of Patent: November 13, 2012Assignee: Orthodyne Electronics CorporaitionInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8308049Abstract: A bonding method of applying vibrations to a metal unit including copper while pressing the metal unit onto a bonding object to bond the metal unit to the bonding object is provided. The method includes: applying vibrations to the metal unit and bringing the metal unit into contact with the bonding object while applying the vibrations; gradually increasing a pressing load of the metal unit on the bonding object to a first pressing load; and reducing the pressing load to a second pressing load smaller than the first pressing load and gradually increasing an output power of the vibrations from a first output power to a second output power after the pressing load reaches the first pressing load, the first output power being applied during the first pressing load.Type: GrantFiled: September 10, 2009Date of Patent: November 13, 2012Assignee: Kabushiki Kaisha ToshibaInventor: Mitsuhiro Nakao
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Publication number: 20120273554Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a bond head assembly including a bonding tool for bonding a ribbon material to a plurality of solar substrates. The system also includes a ribbon feeding system successively supplying portions of a continuous length of the ribbon material to the bonding tool such that the bonding tool forms ultrasonic bonds between the portions of the continuous length of the ribbon material and a plurality of solar substrates.Type: ApplicationFiled: July 2, 2012Publication date: November 1, 2012Applicant: ORTHODYNE ELECTRONICS CORPORATIONInventors: Christoph B. Luechinger, Orlando L. Valentin
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Patent number: 8251274Abstract: An ultrasonic solar substrate bonding system is provided. The system includes a first ribbon bonder including a first bonding tool, and a first ribbon feeding system configured to continuously supply a first ribbon material to the first bonding tool during bonding of the first ribbon material to a backside of each of a plurality of solar substrates. The system also includes a mechanism configured to manipulate each of the plurality of solar substrates after bonding by the first ribbon bonder to expose an opposite, frontside of each of the plurality of solar substrates for bonding. The system also includes a second ribbon bonder including a second bonding tool, and a second ribbon feeding system configured to continuously supply a second ribbon material to the second bonding tool during bonding of the second ribbon material to the frontside of each of the plurality of solar substrates.Type: GrantFiled: April 19, 2012Date of Patent: August 28, 2012Assignee: Orthodyne Electronics CorporationInventors: Christoph Benno Luechinger, Orlando Luis Valentin
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Patent number: 8251275Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.Type: GrantFiled: August 10, 2010Date of Patent: August 28, 2012Assignee: Kulicke and Soffa Industries, Inc.Inventors: Dominick A. DeAngelis, Gary W. Schulze
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Patent number: 8235276Abstract: In an ultrasonic bonding method of an electric wire in which the electric wire 1 in which a conductor end 7 made of plural core wires is exposed and a metallic connection terminal 19 formed by erecting two side walls 27 from a bottom surface are prepared and the conductor end is bonded to the connection terminal by applying ultrasonic vibration while the conductor end of the electric wire is positioned in the bottom surface between the two side walls of the connection terminal and is pushed, a cross section of the conductor end of the electric wire is made by being molded by press so that a thickness of a width direction between the side walls becomes thin toward at least one of the side positioned in the bottom surface of the connection terminal and the side to which the ultrasonic vibration is applied.Type: GrantFiled: September 10, 2010Date of Patent: August 7, 2012Assignee: Yazaki CorporationInventor: Kentaro Ohnuma
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Publication number: 20120196173Abstract: A secondary battery and a method of manufacturing the same in which the secondary battery includes an electrode assembly having a number of electrode plates and a number of separators. Each separator is disposed between each of the electrode plates of the plurality of electrode plates. Further included is a number of electrode tabs extending from and electrically connected to each of the plurality of electrode plates. The electrode tabs form a stack of electrode tabs by placing each electrode tab of the plurality of electrode tabs one upon another. Still further included is a number of lead members having two ends in which a first end has a space that forms a first part and a second part in the first end of each lead member with the first part and the second part are independent and separate from each other. In addition, the first part and the second part of each lead member are each coupled to the stack of electrode tabs within the battery case.Type: ApplicationFiled: July 1, 2011Publication date: August 2, 2012Applicant: SAMSUNG SDI CO., LTD.Inventor: Chan-Seok KIM
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Patent number: 8231046Abstract: A wire bonding method involves bonding a wire in order at a first bonding point and a second bonding point; raising a capillary, through which the wire is inserted, on the second bonding point; cutting the wire by closing a clamper provided above the capillary at a time when the capillary has reached a prescribed height; and measuring a load incurred on the wire at a time of cutting of the wire.Type: GrantFiled: September 22, 2009Date of Patent: July 31, 2012Assignee: Kabushiki Kaisha ToshibaInventors: Mitsuhiro Nakao, Junya Sagara, Katsuhiro Ishida, Noboru Okane
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Patent number: 8220696Abstract: This invention provides a manufacturing method of printed wiring board which enables a plate-like substrate to be carried and processed without any contact to its product surface. End portions of plate-like copper clad laminates are overlapped vertically and then joined linearly by rotating an ultrasonic horn along the end portions. Consequently, copper foils can be metal-joined and a joining strength necessary for transportation with a roller is obtained. Because belt-like copper clad laminate is obtained by joining the plate-like copper clad laminates and after that, processed, thus, the belt-like copper clad laminate can be carried without any contact to its product surface as it is carried with the roller, and then processed.Type: GrantFiled: September 13, 2006Date of Patent: July 17, 2012Assignee: IBIDEN Co., Ltd.Inventor: Hideya Kawada
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Patent number: 8210420Abstract: A method of forming a composite sheet includes the steps of: providing a first sheet having a surface and including a metal or alloy, the first sheet having a given strength characteristic; providing a second sheet having a surface and a strength characteristic that is superior to the given strength characteristic of the first sheet; disposing the first sheet and the second sheet in an aligned opposing position with at least a portion of the surface of the first sheet touching the surface of the first sheet to form a contact area; and bonding the first sheet to the second sheet at least in part by applying an oscillating ultrasonic force to at least one of the first sheet and the second sheet to form a composite sheet, the first sheet having a cube texture characterized by a ?-scan having a FWHM of no more than 15° in all directions.Type: GrantFiled: February 3, 2011Date of Patent: July 3, 2012Assignee: UT-Battelle, LLCInventors: Craig A. Blue, Amit Goyal
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Publication number: 20120155954Abstract: A method for welding an add-on part to a component, in particular for a motor vehicle, using the in per se known torsional ultrasonic welding method having a sonotrode for transferring the vibrations generating the welding add-on part has a coupling flange for coupling the vibrations of the sonotrode and the add-on part has coupling elements for coupling the vibrations induced by the sonotrode in the welding region facing the weld interface area of the component, and the coupling elements thereby melt during the welding process and thus well the add-on part to the component.Type: ApplicationFiled: July 6, 2010Publication date: June 21, 2012Inventors: Dirk Bücker, Hergen Görse, Anton Sautner, Florian Ortner
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Patent number: 8201722Abstract: A resonator for joining metal members utilizing ultrasonic vibration includes an ultrasonic horn having a length of at least half wavelength of a resonance frequency of ultrasonic vibration transmitted from a vibrator, and a joining tool provided on the ultrasonic horn so as to project in a direction normal to a vibration transmission direction of the ultrasonic horn at a position of a point of a maximum vibration amplitude of the ultrasonic horn. The joining tool is formed into a linear bar made of a material excellent in acoustic property and is provided on a distal end thereof with a tool head projecting laterally.Type: GrantFiled: June 3, 2010Date of Patent: June 19, 2012Assignee: Ultex CorporationInventors: Shigeru Sato, Mayumi Kouya, Mitsugu Katsumi, Ryoichi Ishii, Takahiro Ito
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Patent number: 8196797Abstract: An ultrasonic welding tool fabricated of powder metal material includes a body and a welding tip extending axially from the body to a working end. The powder metal material can be ferrous-based and admixed with additives, such as alumina, carbide, ferro-molybdenum, ferro-nickel, chrome or tribaloy. An exposed surface of the welding tip can comprise Fe3O4 oxides. The tool is compacted to the desired shape and sintered. The body can include a different second material compacted separately from the welding tip and then joined to the tip and sintered.Type: GrantFiled: May 4, 2009Date of Patent: June 12, 2012Assignee: Federal-Mogul CorporationInventor: Denis Christopherson, Jr.
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Patent number: 8186566Abstract: A process for cohesive bonding between a metal surface and a nonmetallic substrate is provided. The non-metallic substrate may comprise a plurality of microfilaments and/or nanofilaments dispersed into and below the surface of the substrate. The application of pressure and laterally-oriented high frequency and low amplitude vibration may allow for diffusion bonding between the metal surface and material of the nanofilaments. Another method includes discharging energy from a bank of capacitors to melt adjoining surfaces of the metal surface and nonmetallic substrate. Additionally, a cohesive bonding method may further comprise converting electrical oscillations of ultrasonic frequency into ultrasonic vibrations which are transmitted to the metal body and/or substrate for fusing the two materials together.Type: GrantFiled: March 10, 2008Date of Patent: May 29, 2012Assignee: Nexgeneering Technology LLCInventors: Eugen Abramovici, David E. Gevers, Lucian M. Silvian
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Patent number: 8186565Abstract: An aluminum-boron-carbon (ABC) ceramic-metal composite bonded to a metal or metal-ceramic composite other than ABC composite is made by forming a porous body comprised of particulates being comprised of a boron-carbon compound that has a particulate layer of titanium diboride powder on the surface of the porous body. The porous body is infiltrated with aluminum or alloy thereof resulting in the simultaneous infiltration of the TiB2 layer, where the layer has an aluminum metal content that is at least about 10 percentage points greater by volume than the (ABC) composite. The ABC composite is then fused to a metal or metal-ceramic body through the infiltrated layer of titanium diboride, wherein the metal-ceramic body is a composite other than an aluminum-boron-carbon composite.Type: GrantFiled: October 17, 2007Date of Patent: May 29, 2012Assignee: Dow Global Technologies LLCInventors: Aleksander J. Pyzik, Robert A. Newman
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Publication number: 20120125976Abstract: A process for reducing aluminum pick-up and adherence during the ultrasonic welding of aluminum braids which are welded in a vertically and/or horizontally adjustable compression chamber of an ultrasonic welding device. The static tool parts which delimit the compression chamber have working surfaces made from polycrystalline diamond (PCD).Type: ApplicationFiled: November 7, 2008Publication date: May 24, 2012Applicant: SCHUNK SONOSYSTEMS GMBHInventor: Ernst Steiner
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Publication number: 20120125977Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.Type: ApplicationFiled: August 10, 2010Publication date: May 24, 2012Applicant: KULICKE AND SOFFA INDUSTRIES, INC.Inventors: Dominick A. DeAngelis, Gary W. Schulze
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Patent number: 8181845Abstract: An electrical bond connection system between a first electrical contact surface and a second electrical contact surface having at least one first electrical conductor, which is bonded to at least one of the contact surfaces via at least one first bond connection. At least one additional second electrical conductor (9) is bonded to the first electrical conductor (8) via at least one second bond connection (10, 13), the two bond connections (10) being offset from one another. The present invention also relates to a method for manufacturing an electrical bond connection system existing between a first electrical contact surface and a second electrical contact surface.Type: GrantFiled: April 3, 2009Date of Patent: May 22, 2012Assignee: Robert Bosch GmbHInventors: Manfred Reinold, Immanuel Mueller
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Publication number: 20120118476Abstract: The present invention relates to an ultrasound welding device for welding material webs, for example, films, having an anvil (1) with an anvil welding surface, and a sonotrode (2) with a sonotrode welding surface, wherein the anvil is movable relative to the sonotrode.Type: ApplicationFiled: April 26, 2010Publication date: May 17, 2012Applicant: HERRMANN ULTRASCHALLTECHNIK GMBH & CO. KGInventor: Klaus Weiler
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Publication number: 20120111629Abstract: A system and method for terminating a wire having an aluminum conductor includes a terminal having a conductor receiving area adapted to receive the aluminum conductor, and a welding buffer sized and shaped to fit within the conductor receiving area of the terminal with the aluminum conductor disposed between the welding buffer and the terminal. The terminal, the welding buffer and the aluminum conductor are ultrasonically welded together to form an integrated unit, such that the welding buffer forms a part of a finished terminated wire assembly.Type: ApplicationFiled: October 6, 2011Publication date: May 10, 2012Inventor: Mike Patrikios