Abstract: An apparatus is provided for handling workpieces, such as semiconductor wafers, during semiconductor processing. The apparatus includes a wafer platen having a plurality of channels each extending from a top surface to a bottom surface of the wafer platen, a plurality of lift pins in alignment with the channels, and a mechanism for engaging the lift pins in a loading position of the workpiece, a clamping position of the workpiece so that desired semiconductor processes may be performed to the workpiece, and a lift off position for removing the workpiece from the wafer platen after the semiconductor processes are completed. The mechanism places the lift pins below the surface of the wafer platen in the load position and then raises the lift pins to a first predetermined distance above the surface of the wafer platen in the clamp position such that the first predetermined distance allows the workpiece to be clamped to the wafer platen.

Abstract: A polishing puck assembly is provided for use in polishing a fiber optic connector. A slidable weight rests on the fiber optic connector to urge the ferrule of the fiber optic connector to extend below a bottom surface of the puck assembly. The puck assembly can be manipulated relative to polishing material to polish the end of the fiber optic connector. The polishing material can be circular in shape and held by a palette defining one or more circular pockets for holding the polishing material. Different polishing material can be positioned in the different pockets. A circular guide can be utilized in the circular pocket wherein the guide includes a circular opening with a center offset from a center of the circular guide.

Abstract: A method of lathing a lens, especially a contact lens, involves attaching the cylindrical blank of lens material to a first block of machineable plastic material, lathe cutting a desired first lens surface in the cylindrical blank, attaching the machined first lens surface of the blank to a second block, lathe cutting to remove the block of machineable plastic material, and lathe cutting a desired second lens surface in the blank. Both the first and second blocks may be adhered to the lens blank with an adhesive curable by ultraviolet radiation, and a two-piece block, composed of a head section and a body section, is disclosed.

Abstract: Methods and apparatuses for processing microfeature workpiece samples are disclosed herein. An apparatus in accordance with one embodiment of the invention includes a support body, a first contact surface portion, a second contact surface portion, and a sample holder configured to releasably carry the microfeature workpiece sample. The sample holder can be movable relative to the support body between a first position and a second position, wherein the sample holder has a first orientation relative to the first and second contact surface portions when in the first position and a second orientation when in the second position. At least one of the first and second contact surface portions can also be movable relative to the support body. Accordingly, an operator can move the first and/or second contact surface portions to make minor adjustments to an angle at which material is removed from the workpiece, and can move the sample holder to make more substantial adjustments.

Abstract: An apparatus for lapping a workpiece including a plurality of magnetic heads supported by a tool is disclosed. The lapping apparatus comprises a rotary-lapping table having an abrasive surface, and a lapping device assembly provided so as to be movable with respect to the abrasive surface of the lapping table. The lapping device assembly includes a device provided at a lower portion of the lapping device assembly for supporting the tool and a device for respectively applying predetermined loads to a plurality of load applying portions of the tool. The load applying portions of the tool is disposed along the longitudinal direction of the tool. The load-applying device applies the loads from a plurality of different directions to at least one of the load applying portions of the tool so that the tool is deformed into a predetermined shape.

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: Disclosed herein is a holding device, which includes a volumetrically controllable material and a volume controller in operable communication with that material. The volume controller is configured to subject the material to a condition that causes a physical change in volume of the material without a change in mass of the material. The volumetric change causes the holding power. Further disclosed herein is a method for creating a lower than atmospheric pressure between a volumetrically controllable fixed mass material and a separate object. The method includes introducing to the material an increase condition calculated to volumetrically increase the material without changing the mass of the material. The separate object is then brought to contact the material following which a decrease condition calculated to volumetrically decrease the material without changing the mass of the material is introduced to the material.

Abstract: A pneumatically operated, random orbital sander is disclosed as having an upper seal adapted to retard the entry of dust into an exposed or lowermost motor shaft supporting bearing and a lower seal adapted to retard the entry of dust into a motor shaft mounted bearing serving to couple the motor shaft to a sanding pad or disc.

Abstract: For the manufacture of shaped parts (6) from ceramics, for example for dental-technical purposes, an assembly is provided which comprises a powdery ceramic raw material compressed to form a ceramic green compact (4), an embedding mass (3) which neither damages nor reacts chemically with the ceramic green compact (4), and a holder or workpiece receiver (1) which holds the embedding mass (3) in a manner to allow the ceramic green compact (4) to be machined while being embedded in the embedding mass.

Abstract: By preventing warping of chips when detaching individual chips from a dicing sheet, improvement in quality without cracks and in productivity is realized. A collet (115) used in a step of detaching chips (110) discretely divided as bonded to a dicing sheet (109) from the dicing sheet has a flat attraction surface made of a porous material of a size equal to or larger than the chip size. Alternatively, the collet may have a chip attraction groove containing poles, balls or hemispheres, for example, to prevent warping of chips. In the step of detaching each chip from the dicing sheet, a means for reducing the bonding force of the dicing sheet, such as heating device or cooling device, may be provided. Thus, warping or cracking can be prevented in a process of thinned semiconductor substrate. Additionally, since the means for reducing the bonding force of the dicing sheet is provided in a semiconductor manufacturing equipment, breakage or cracking of chips can be prevented more reliably.

Abstract: A semiconductor wafer handler comprises a ring (70) attached to a hub (80) by a plurality of spokes (90). Vacuum is applied to the surface of the semiconductor wafer through orifices (100) containing in the ring (70). Water and/or nitrogen can be applied to the surface of the semiconductor wafer through orifices (110) contained in the spokes (90).

Abstract: A guide ring removal device. The guide ring removal device includes a column press, a first disc, a second disc, and a plurality of fasteners. The first disc is disposed on the column press. The second disc is disposed on a point of the column press to exert force on a carrier. The plurality of fasteners is disposed on the first disc, the fasteners grasping the guide ring. As the second disc exerts the primary force on the carrier, the fasteners generate reciprocal force on the guide ring, thus separating the guide ring. Engagement of the column press alters the distance between the first disc and the second disc, and the primary force is exerted on the carrier.

Abstract: A jig comprises: a main body; a retainer for retaining a block in which at least one row of sections to be sliders is aligned; a middle load application section coupled to a portion of the retainer located in the middle of the length thereof; end load application sections coupled to portions of the retainer near ends of the length thereof; middle couplers located between the middle load application section and each of the end load application sections, respectively, for coupling the main body to the retainer; and end couplers for coupling the main body to the ends of the length of the retainer. The length between the middle of the retainer and each of the ends thereof is greater than the length between the middle of the retainer and each of the end load application sections.

Abstract: A method for cutting thin film filter work pieces has two embodiments. In a first embodiment, an intermediate layer (13) binds an augmenting substrate (14) to a glass substrate (12) of the work piece (16) prior to cutting of the work piece. In a second embodiment, the work piece (23) comprises a glass substrate (22) which is thicker than a final desired thickness. After the work piece is cut, a surplus portion (222) of the glass substrate is removed. Both embodiments of the method increase the effective thickness of the work piece, which reduces the residual stress in the final thin film filter product, and reduces the risk of a film stack (11, 21) of the work piece peeling from the glass substrate during the cutting process.

Abstract: A method of manufacturing magnetic heads is provided in which a slider and a back yoke are joined to form a magnetic head main body. The main body is then fixedly bonded to a holding member that supports the magnetic head as a single unit. A plurality of such magnetic heads are placed circumferentially on a soft adhesive sheet attached to a cylindrical base block. Touch lapping is then performed to a slider surface of the magnetic heads with a slurry on a surface table. Processing faces of the heads can be positioned flush with the surface table due to an elasticity of the soft adhesive sheet, thereby equally minimizing lapping amounts.

Abstract: A lapping process fixture has a base with a mounting surface and a membrane on the mounting surface for supporting a workpiece. The membrane is bonded to the mounting surface and has adhesive on its outer surface such that the workpiece adheres to it. The membrane extends across and seals an opening to a cavity inside the base. The cavity is filled with fluid that may be sealed or externally pressurized through ports in the base. The fixture restrains the workpiece to minimize distortion of its surface during processing. The workpiece is restrained from normal-directed movement by fluidic pressure such that the normal force is uniformly distributed across the surface area of the workpiece. The external adhesive on the membrane restrains the workpiece from tangential movement.

Abstract: A cutting board for food products which is composed of a plurality of abrasive conical inserts arranged in parallel rows on a support so that a knife blade may be drawn along the channel formed between adjacent rows to sharpen the knife blade on both sides by contact with the inserts. The inserts are separately fabricated and mounted in tapered openings formed through the support.

Abstract: Process for collective production of integrated magnetic heads with a supporting surface with a determined height. According to the invention the components of a board are thinned collectively be etching the board along area overlapping polar parts.

Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.

Abstract: A gas turbine component such as a turbine blade is clamped into a fixture having a base upon which a remainder of the fixture is supported, a stop which limits the movement of the gas turbine component, and two clamp arms affixed to the base and controllably clamping against the lower side of the platform of the gas turbine component to force the gas turbine component against the stop. When the gas turbine component is clamped in this position, its root may be readily shaped as by grinding.

Abstract: The present invention has an object to provide a retention plate used in a polishing device that mirror polishes semiconductor substrates such as silicon wafers, particularly a retention plate used with the hard chuck method, that can prevent roll-off, and can achieve a high improvement in flatness. According to the present invention, by means of using a retention plate of a constitution that is of a smaller diameter than that of the wafer and which gives a region in which the area of contact with the wafer is reduced by means of groove processing, or a porous structure and the like, on the outer peripheral part, a reduction of the processing pressure of the outer peripheral part becomes possible, and, because the polishing of the region in which roll-off occurs is delayed, the amount removed by polishing becomes uniform over the wafer surface, and high precision wafer processing becomes possible.

Abstract: A cassette tub for holding at least one wafer cassette in a tilted position for accessing by a robot blade by utilizing a cassette tub pin assembly to ensure the tilt angle of the wafer cassette is described. The cassette tub is filled with water such that wafers during a chemical mechanical polishing process may be stored therein without any residual slurry solution solidified on the surface of the wafer, and thus eliminating the generation of any contaminating particles or abrasive particles which may cause severe scratching in a subsequent chemical mechanical polishing process. The cassette tub pin assembly is securely mounted to a mounting reel in the cassette tub such that the angle of the wafer cassette is ensured.

Abstract: A cassette tub for holding at least one wafer cassette in a tilted position for accessing by a robot blade by utilizing a cassette tub pin assembly to ensure the tilt angle of the wafer cassette is described. The cassette tub is filled with water such that wafers during a chemical mechanical polishing process may be stored therein without any residual slurry solution solidified on the surface of the wafer, and thus eliminating the generation of any contaminating particles or abrasive particles which may cause severe scratching in a subsequent chemical mechanical polishing process. The cassette tub pin assembly is securely mounted to a mounting reel in the cassette tub such that the angle of the wafer cassette is ensured.

Abstract: An assembly for holding a substrate in a chemical mechanical planarization (CMP) apparatus is provided. The assembly includes a holder frame insertable into the chemical mechanical planarization apparatus, the holder frame having an inner wall. The assembly further includes at least one rolling mechanism rotatably mounted in the holder frame such that at least a portion of the rolling mechanism protrudes from the inner wall. The assembly also includes a wafer chuck movably mounted in the holder frame, the wafer chuck having a first side shaped to substantially conform to the inner wall and to be in continuous contact with the at least one rolling mechanism during planarization, and a second side adapted to receive a substrate for planarization. Also provided are an improved assembly for holding a substrate in a CMP apparatus and a method for reducing friction in a gimbaling mechanism of a wafer chuck in a wafer holder in a CMP apparatus during planarization.

Abstract: A ferrule holder assembly for an optical-fiber-end-face grinding apparatus comprises a ferrule holder board supported to be moved upward and downward in parallel with a grinding board of the optical-fiber-end-face grinding apparatus, a ferrule sleeve provided at the ferrule holder board for receiving and supporting an optical fiber ferrule while putting the tip at the grinding board, an adapter for retaining the optical fiber ferrule or a connector for supporting the optical fiber ferrule in a state where the optical fiber ferrule is inserted into the ferrule sleeve, and an urging unit for urging the adapter in a direction opposite to the grinding board from the ferrule holder board.

Abstract: A circular or non-circular workpiece is ground in a plurality of grinding steps, including a final finish grinding step. A grinding wheel is caused to effect profile generation movement in synchronism with rotation of the workpiece and in accordance with profile data derived from the target shape of the workpiece. In each grinding step, the grinding wheel is advanced in such a manner that the grinding wheel causes cut-in movement within a predetermined cut-in angle defined on the workpiece. After completion of the final finish grinding step, the grinding wheel is retracted over a predetermined back-off angle defined on the workpiece. The retraction is effected in accordance with composite data obtained through combining the profile data and back-off data. The back-off angle is greater than the cut-in angle employed during the final finish grinding step.

Abstract: Disclosed is a flat-object holder for holding a flat object-and-frame assembly, which has the flat object fixed to the frame with a protection tape. The flat-object holder comprises at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.

Abstract: A ferrule holder assembly for an optical-fiber-end-face grinding apparatus comprises a ferrule holder board supported to be moved upward and downward in parallel with a grinding board of the optical-fiber-end-face grinding apparatus, a ferrule sleeve provided at the ferrule holder board for receiving and supporting an optical fiber ferrule while putting the tip at the grinding board, an adapter for retaining the optical fiber ferrule or a connector for supporting the optical fiber ferrule in a state where the optical fiber ferrule is inserted into the ferrule sleeve, and an urging unit for urging the adapter in a direction opposite to the grinding board from the ferrule holder board.

Abstract: A multi-zoned carrier for a chemical-mechanical planarization (CMP) polishing device includes a center cell, a middle cell, and an outer cell. Each of the cells are in fluid communication with each other through multiple conduits equipped with flow restrictors. The combination of cells and conduits allows more uniformity and planarity to be achieved during the chemical-mechanical planarization (CMP) polishing process.

Abstract: A method and apparatus for holding and delayering a die include an outer member (10) that receives an inner member (20), and a set screw (25) and set screw hole (12) for securing the position of the inner member (20) within the outer member (10). A die (50) is attached to the inner member (20), and the apparatus is then used to apply the die (50) to an abrasive disk (200) which is attached to a rotatable wheel (300) and is delayered by progressive abrading. The outer member (10) provides stability and precision to the delayering operation. The inner member (20) provides portability and control to the delayering operation.

Abstract: A polishing system such as a chemical mechanical belt polisher includes a hydrostatic fluid bearing that supports polishing pads and incorporates one or more of the following novel aspects. One aspect uses compliant surfaces surrounding fluid inlets in an array of inlets to extend areas of elevated support pressure around the inlets. Another aspect modulates or reverses fluid flow in the bearing to reduce deviations in the time averaged support pressure and to induce vibrations in the polishing pads to improve polishing performance. Another aspect provides a hydrostatic bearing with a cavity having a lateral extent greater than that of an object being polished. The depth and bottom contour of cavity can be adjusted to provide nearly uniform support pressure across an area that is surrounded by a retaining ring support. Changing fluid pressure to the retaining ring support adjusts the fluid film thickness of the bearing.

Abstract: A surface of a work piece 10, in which a plurality of magnetic head elements are formed on a substrate, is linearly ground. The surface is linearly ground by an outer circumferential face of a disk-shaped rotary grind stone 32. By the linear grind, linear grind traces are formed in the work piece 10. By selecting the direction of the grind traces, amount and direction of warping the work piece can be controlled. By making the direction of the grind traces parallel to a direction of cutting the work piece 10 to form a plurality of blocks, in each of which a plurality of magnetic head elements are arranged, stress in the blocks are released and amount of warping the blocks can be reduced.

Abstract: This invention pertains to a substrate holding apparatus comprising a substrate holder having a center axis for rotation and adapted to hold a substrate to be polished and urge the substrate against a polishing pad, a drive shaft for drivingly rotating the substrate holder about the center axis, and a joint for connecting the substrate holder to the drive shaft in such a manner that the substrate holder can tilt relative to the joint. The substrate holder includes a substrate holding member and a cover member placed on and secured to the substrate holding member. The substrate holding member has a lower surface for holding the substrate and an upper surface having a curved surface recess with an opening at the upper surface and a center bottom portion which is the deepest in the recess.

Abstract: An insertion arbor used in device for machining a workpiece. The workpiece includes a centered middle bore, a plurality of other bores and an equal plurality of fabrication bores. Each of the other bores defining an area of increased radius. The other bores define a axis, which axes do not intersect at one point. The insertion arbor is insertable through a fabrication bore and extends to the area of increased radius of the associated other bore.

Abstract: An angle-measurement assist device suitable for a visual inspection to determine a blade angle of a dental scaler is provided with a holder having a flat face thereof adapted to be in contact with a bladed portion of the scaler, a permanent magnet mounted to the holder, and first, second and third pins projecting from the holder in the directions which are perpendicular to one another, whereby an operator is permitted to make a visual inspection to determine whether the scaler is sharpened to have a target blade angle on the basis of an extending direction of the first pin, with the assist device magnetically retained on the scaler.

Abstract: A method and apparatus are provided for handling planar structures, such as semiconductor wafers, with reduced breakage and cracking. The method includes the step of segmenting a wafer prior to grinding. The apparatus includes a segmented vacuum table for supporting wafer portions in position to be ground to a desired thickness. In another aspect of the invention, adhesive material is employed to individually secure wafer portions in position during the grinding process.

Abstract: A device that allows the treatment of a substrate in a machine provided for the treatment of bigger substrates and a mounting system for a substrate in this device. The device comprises a ring (24) having an external diameter equal to the diameter of these substrates, this ring being capable of setting the substrate (22) of smaller diameter. The system includes means (34) of manipulating this substrate and means (36) of heating the ring or of cooling this substrate. Application in micro-electronics.

Abstract: A chip saw in which chips are brazed onto the peripheral edge thereof is clamped, and is rotated while bringing a rotational brush into contact with a honing-subjected portion of the peripheral edge. A liquid, which has dustproof oil and abrasive powder, provided with abrasive properties is supplied to a part in which the rotational brush is in contact with the honing-subjected portion. Therefore, the work efficiency of honing process is improved, and sawdust is not generated. This makes it possible to easily take countermeasures against environmental problems and effectively use resources. In addition, the liquid can be easily recycled.

Abstract: An apparatus that enables a magnification system to view the surface of optical connectors without the need to remove the connectors from a polishing workholder. A connector is placed into a centering insert that is integral to a polishing workholder. The magnification system is fitted with an adapter that engages with the centering insert. This engagement locates the ferrule of the optical connector in the focal plane of the magnification system for viewing and inspection of surface quality.

Abstract: A method of forming a support for supporting the underside of a semiconductor wafer having a circuit side, an underside, and a street index that defines dice on the semiconductor wafer, at least during dicing of the semiconductor wafer, is provided. The method includes providing a support having a surface for supporting the underside of the semiconductor wafer and forming at least one recess in the surface corresponding to the street index of the semiconductor wafer.

Abstract: A wafer holder is provided which properly protect backside of a wafer, especially when frontside of the wafer is processed, from pollution and mechanical injury. The wafer holder includes a wafer support section having a hole for locating a wafer, a cover covering the wafer but any chip on the wafer is not touched with the cover; one or more fastening devices for fastening the cover on the wafer support section, each the fastening device having a fixed terminal and a movable terminal where the fixed terminal locates on the wafer support section and the movable terminal presses the cover on the wafer support section. Addition, the wafer support section can be part of chamber wall and then it is an optional part of the present wafer holder.

Abstract: A substrate holder for holding a substrate to be polished thereon and pressing the substrate against a polishing pad includes a substrate-holding head for holding the substrate thereon and pressing the substrate against the polishing pad. The substrate-holding head is disposed to be vertically movable toward/away from the polishing pad. A pressing member for pressing a peripheral region of the substrate, except for an outer edge region thereof, against the polishing pad is attached to the substrate-holding head.

Abstract: An apparatus and method is disclosed for uniformly deglazing and finishing flat and arcuate surfaces of transmission and other automotive parts. A tapered part support engages a central opening of parts from different models and manufacturers having different size openings. Smaller parts are held in place without tightening or loosening clamps. Larger parts are simply and easily stabilized by a hold down. Operation of a power tool on the working surface of the parts continually rotates the part and part support with respect to a hand held power finishing tool. Working surfaces are thereby uniformly deglazed and roughened for replacement. High productivity is provided with an inexpensive low maintenance tool that even small shops can afford.

Abstract: A wafer carrier for polishing or planarizing semiconductor workpieces or wafers includes a pressure plate, an upper housing, and a lower housing. The pressure plate is configured to hold a wafer to be polished or planarized against a polishing pad, and further configured to rotate about the lower housing of the wafer carrier to rotate the wafer during the polishing or planarizing process. The wafer carrier includes an electric direct drive motor, with the stators of the motor disposed in the lower housing and the rotors of the motor disposed in the pressure plate, to rotate the pressure plate about the lower housing. Accordingly, when electric power is supplied to the stators of the direct drive motor, in response to the magnetic flux generated by the stators, the rotors of the motor rotate the pressure plate.

Abstract: A fixing member is provided for fixing a front end section to the rest of a base plate. The fixing member is provided with a surface fastener which is integrally molded with the fixing member.

Abstract: A tool is provided for cross-sectioning an integrated circuit in a hands-free mode of operation. The tool comprises an enclosure or cage having a passageway through which a sample—such as an integrated circuit, which may be encased in epoxy or some other substance—is brought into contact with an abrasive surface such as a milling disk. A wall or plate of the enclosure is adjustable in order to accommodate a variety of sample sizes, including both dies and packages. During the grinding or polishing of the sample the rotation of the milling disk helps stabilize the sample against the adjustable wall and one or more other walls of the enclosure. The enclosure is situated at a selectable position along a frame or guide that is mounted above the milling disk. Releasable connectors are used to secure the enclosure in a selected position yet allow it to be relocated as the milling disk becomes worn.

Abstract: A method and apparatus for controlling the amount of row distortion before and dynamically during the lapping process used to manufacture sliders for magnetic storage devices. A wafer quadrant of slider rows is bonded to an extender tool held in a carrier assembly and an actuator is used to laterally apply force to the extender tool such that it changes the profile of the wafer quadrant, and thus the foremost slider row. Multiple arms may be defined in the extender tool, permitting independent engagement with and application of the lateral force by the actuator. Bending moments in each arm are then efficiently and controllably transferred into a beam in the extender tool which is proximate to the point where the wafer quadrant is bonded.

Abstract: A method and apparatus utilizing a thermal release mounting material to adhere a laser wafer to a wafer support during a semiconductor fabrication process is provided. A first surface of the mounting material contains an adhesive and is adhered to a wafer support. The wafer support contains apertures for allowing air bubbles to escape while the mounting material is being applied to the wafer support, thus, ensuring that the film is planar to the support. The laser wafer is adhered to a second surface of the mounting material. The second surface of the mounting material comprises a thermal release material. After undergoing the fabrication process, the thermal release material of the mounting material is heated to a release temperature allowing the laser wafer to be readily removed from the wafer support.

Abstract: A method and apparatus for preparing end faces of integrated circuit chips using a cutting machine having a straight blade. The apparatus is a wedge shaped block having one surface angled at the desired angle to be imparted to the end face. The one surface has an alignment member thereon for aligning the chip on the top surface, and at least one locating member at the end of the block for positioning the end of the chip relative to the cutting blade. The block has a plurality of bores therein for applying suction to hold the chip on the one surface during cutting with the blade. The method includes the steps of placing a foot or feet on the chip, placing the chip on the block and aligning it and locating it, and applying a force thereto to hold it fixedly in position.

Abstract: An apparatus and method for polishing a rotationally symmetric object such as a glass ball lens. The apparatus includes first and second plates for securing a plurality of glass ball lenses therebetween. The plates are secured to one another and the entire apparatus is pressed against a polishing pad in order to flatten a portion of the surface of the lenses. The apparatus also serves to maintain the orientation of the rotationally symmetric objects, so that they may be easily operated upon by future processing steps.