Abstract: A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (21) corresponding to the first working groove therein. The driving component is configured for sliding in the first working groove to remove workpieces from the first base, and sliding in the second working groove to cooperate with the second base to hold workpieces in the second working groove.

Abstract: An extremely precise computer controlled grinding machine having the capability to write its own computer programs for controlling the grinding machine to perform individual tasks, including both grinding and dressing to several millionths of an inch. A new device for dressing is included which is directly on the machine, alleviating the need for a separate dressing machine. The Windows-based computer program is easy to use, and includes numerous features for self-maintenance and reproducibility.

Abstract: The workpiece centering apparatus is capable of highly reducing damage of a workpiece. The workpiece centering apparatus comprises: a guide plate being provided in a tray and covering a water inlet so as to horizontally introduce water into the tray; and at least three overflow outlets for overflowing the water from the tray, the overflow outlets being formed in a peripheral wall of the tray and arranged in the circumferential direction at regular intervals. The workpiece, which is horizontally fed on a surface of the water stored in the tray, is received and floated by surface tension of the water. Then, the workpiece is centered in the tray by water flows radially overflowing from the tray via the overflow outlets.

Abstract: Disclosed herein is a chemical mechanical polishing apparatus. The apparatus comprises a carrier to hold a wafer and being capable of lifting, lowering and rotating, a polishing pad compressed onto the wafer through the lowering of the carrier to polish the wafer, a contact pressure sensor to detect contact pressure between the polishing pad and the wafer when the polishing pad is compressed onto the wafer, a support physical property controller to generate control signals corresponding to the contact pressure detected by the contact pressure sensor, a variable physical property support being adapted to come into close contact with the polishing pad and having physical properties varied in response to the control signals generated by the support physical property controller, and a rotational table to hold the variable physical property table.

Abstract: A polishing apparatus is configured to simultaneously polish both surfaces of a work, and includes a carrier having a hole configured to house the work, and a fixing member that contacts and fixes the work located in the hole.

Abstract: A mechanically releasable slider process utilizes silicone rubber or PDMS to take the function of a planarization material for individual sliders or slider rows. Mechanical debonding takes advantage of the rubber-elastic property of PDMS. A gripper is used in a virtually solvent-free, air bearing patterning UV-molding process and resist-based processes. A PDMS-based fixture is used during both the lapping process and the photo or UV-mold patterning of the ABS surface. This fixture can mechanically hold sliders by large area reversible adhesion while allowing gimbaling, electrical connection, actuation, UV-molding or photolithography, and mechanical release, thus reducing the number of slider manipulations to two.

Abstract: The present invention relates to a substrate holding apparatus for holding and pressing a substrate against a polishing surface. The substrate holding apparatus includes a top ring body for holding the substrate, an elastic pad for contacting the substrate, and a support member for supporting the elastic pad. The substrate holding apparatus further includes a contact member mounted on a lower surface of the support member and disposed in a space formed by the elastic pad and the support member. The contact member has an elastic membrane for contacting the elastic pad. A first pressure chamber is defined in the contact member, and a second pressure chamber is defined outside of the contact member. The substrate holding apparatus also includes a fluid source for independently supplying a fluid into, or creating a vacuum in, the first pressure chamber and the second pressure chamber.

Abstract: A retainer is used with an apparatus for polishing a substrate. The substrate has upper and lower surfaces and a lateral, substantially circular, perimeter. The apparatus has a polishing pad with an upper polishing surface for contacting and polishing the lower face of the substrate. The retainer has an inward facing retaining face for engaging and retaining the substrate against lateral movement during polishing of the substrate. The retaining face engages a substrate perimeter at more than substantially a single discrete circumferential location along the perimeter.

Abstract: A polishing pad, platen, method of monitoring, method of manufacturing, and method of detecting using a pseudo window area, where the pseudo window area has a thickness less than a thickness of a polishing layer and a thickness greater than zero.

Abstract: A method of transferring a wafer is disclosed. The method comprises providing a pedestal and at least one spray orifice extending through the pedestal; disposing a wafer above the pedestal using a first robot, wherein the wafer has a first surface and a second surface, the first surface faces the pedestal, a fluid is sprayed onto the first surface simultaneously to avoid a contact of the first surface with the pedestal, and the fluid contains a charge-forming chemical substance dissolved therein; and taking the wafer using a robot for delivery. Due to the charge-forming chemical substance dissolved in the fluid, the waterfall effect to cause discharge damage on the wafer is avoided in the spraying of the fluid.

Abstract: A workpiece holding jig for holding a workpiece having a plurality of first dividing lines extending in a predetermined direction and a plurality of second dividing lines formed in a direction intersecting the plurality of first dividing lines on the workpiece holding table of a processing machine for cutting the workpiece along the plurality of first dividing lines and the plurality of second dividing lines, wherein the workpiece holding jig has a plurality of through-grooves corresponding to the plurality of first dividing lines and the plurality of second dividing lines formed on the workpiece, a plurality of suction-holes which are open at the top and formed at positions corresponding to a plurality of areas sectioned by the plurality of first dividing lines and the plurality of second dividing lines of the workpiece and suction-passages that are formed at positions where they do not intersect the plurality of through-grooves and connected to the plurality of suction-holes.

Abstract: A glass substrate for an information recording medium is manufactured by polishing the surface of a raw material glass plate. The polishing of the raw material glass plate is divided into a step for performing a first polishing process to roughly polish the surface of the raw material glass plate to be smooth and a step for performing a second polishing process to finely polish the surface of the roughly polished raw material glass plate to be smoother. The first polishing process uses a polishing pad made of a synthetic resin foam and slides the polishing pad on the raw material glass plate surface while supplying a polishing agent to roughly polish the surface. A pad dressing process is performed on the polishing pad before being used in the first polishing process. The pad dressing process polishes the surface of the polishing pad by sliding the polishing pad on a pad dresser including abrasive grains.

Abstract: A method and apparatus for ultra thin wafer backside processing are disclosed. The apparatus includes an outer ring holding a high temperature grinding and/or dicing tape to form a support structure. An ultra thin wafer or diced wafer is adhered to the tape within the ring for wafer backside processing. The wafer backside processing includes ion implantation, annealing, etching, sputtering and evaporation while the wafer is in the support structure. Alternative uses of the support structure are also disclosed including the fabrication of dies having metalized side walls.

Abstract: A method, device and system for polishing and/or finishing one or more optical fibers. The method comprising securing an optical fiber connector to at least one holder, generating a tilting motion at the end of the optical fiber, adjusting the tilting motion of the optical fiber to create the desired optical fiber end shape and positioning a stage to provide planar motion to the at least one holder. A desired tilting motion of the optical fiber is generated by adjusting tension of at least one spring in operable connection with the at least one holder. Further adjustments to the tilting motion may be accomplished by further changes in tension of the at least one spring. A desired fiber optic end shape may be provided by the method, system and device described herein. Such shapes include dome, circular, or flat.

Abstract: A fixture for grinding machines includes a first base (10), a second base (20) and a driving component (40). The first base defines a first working groove (11) therein. The second base defines a second working groove (12) corresponding to the first working groove therein. The driving component is able to slide in the first working groove, and the driving component cooperates with the first base and the second base to releasably hold workpieces.

Abstract: A fixture (10) for grinding apparatuses includes a base (12), a plurality of supporting components (14), and a pressure controlling apparatus (16). The base includes a cavity (126) containing a fluid medium (129), and the base defines a plurality of through holes (122) communicating with the cavity. One section of each supporting component is movably mounted in a through hole, and an end of each supporting component is exposed through its respective through hole and is configured for supporting an apparatus to be ground. The pressure controlling apparatus is connected to the base and facilitates selectable adjustment of a pressure of the medium.

Abstract: During centerless cylindrical grinding, attention must be paid to the fact that the workpiece (3) is placed in a very specific position between the grinding wheel (1), the regulating wheel (2) and the support guide (4). The optimal position of the workpiece (3) initially set cannot be maintained as a result of the progression of the grinding process and the changes caused by said process in the diameter and contour of the workpiece (3). The invention provides a solution to said problem, whereby height adjustment and/or the oblique position of the support guide (4) are automatically modified in accordance with the progression of the grinding process and during said grinding process with the purpose of achieving operationally optimal readjustment. The progression of the grinding process can be detected using measuring techniques, e.g. by measuring the diameter of the workpiece (3) or its deviation from roundness and using said measurement as output variable for adjusting the support guide (4).

Abstract: The present invention provides a holder (20) for wafers (14) which makes it possible to more easily manipulate the wafer (14) and makes it more suitable than prior art devices for to liquid handling, wafer handling and on-wafer manipulation of substances, while it also makes it possible to align the wafer (14) accurately and furthermore allows to create a well controlled ambient in the neighbourhood of the wafer (14).

Abstract: A cutting workstation which includes a cutter mounted on an arm type configuration. The arm configuration is slidably moveable relative to a divided work piece support table, the cutter moveable there between. Further, the cutter is capable of elevating the arm either above or below the worktable. Not only is the arm capable of being lengthened and shortened, but also it is also of capable of rotation producing a variety of miter cuts. The arm is also capable of rotating to a vertical axis to produce a chop cut motion. The bifurcated table or work piece support is capable of being rotated through a number of degrees relative to the cutter also producing mitered or angled cuts. The bifurcated worktable is also capable of being elevated above or below or at the level of the cutter. The cutter, if in the form of a circular cutter blade, is preferably provided with the conventional pivotal spring-loaded blade guard.

Abstract: This apparatus includes a unit for adhering an elastic seal to a lens holder, a unit for causing the lens holder, to which the elastic seal is adhered, to hold a lens, a pivotal arm, an arm driving unit for pivoting the pivotal arm, a clamp unit attached to the pivotal arm to be vertically movable to hold the lens holder, and a clamp driving unit for vertically moving the clamp unit. The pivotal arm is pivoted to sequentially adhere the elastic seal to the lens holder and hold the lens by the lens holder.

Abstract: Disclosed is a device for grinding a liquid crystal display panel improving the efficiency of using equipment by independently operating first and second grinding units for grinding the unit liquid crystal display panel. The present invention includes a first grinding unit grinding edges of short or long sides of the unit liquid crystal display panel in a normal mode and a second grinding unit grinding the edges of the short or long sides of the unit liquid crystal display panel that are not ground by the first grinding unit in the normal mode or grinding the edges of the long and short sides of the unit liquid crystal display panel in an emergency mode.

Abstract: An apparatus that mass polishes a variety of fiber optic cable connectors simultaneously. The apparatus includes a plurality of polishing plates, each capable of holding its own polishing film and pad, and having a varying height. The apparatus further includes a plurality of connector fixtures that may receive a variety of connectors at varying angles. Each connector fixture communicates with a corresponding polishing pad. Thus, fiber optic cable connectors having a variety of polished end faces may be provided with the apparatus. The apparatus also eliminates the potential for contamination among polishing films, reduces polishing steps, and saves labor and maintenance costs.

Abstract: A method and apparatus for creating a groove in the surface of a collector ring for use in an electrical device. The method and apparatus can be used to create a new groove in the surface of a collector ring having none, or can be used to enhance or re-form an existing groove in the surface of a collector ring. In some embodiments, the groove in the surface of the collector ring is created using a cutting tool that has a cutting action that functions independently from the motion of the collector ring. In other embodiments, a masking material is positioned over a portion of the surface of the collector ring to create a masked portion and an exposed portion of the surface of the collector ring. A groove is then created in the exposed portion of the surface of the collector ring. The masking material is then removed from the surface of the collector ring.

Abstract: A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal direction and independent from said main body, said load-applied portions receiving a load which presses the surface to be lapped to the lapping surface tightly from at least the lapping device; a plurality of connection members connecting said holding portion and said main body along said longitudinal direction at intervals; and a plurality of wrist portions connecting said connection members and said holding portion; wherein at least one wrist portion is disposed between said adjacent connection members; at least one wrist portion is disposed at each outer side of the connection members which are located at both ends of the longitudinal direction.

Abstract: Electronic device support and processing methods are described. One embodiment includes a method of processing an electronic device including solder bumps extending therefrom. The method includes providing at least one fluid selected from the group consisting of electrorheological fluids and magnorheological fluids on a support structure. The solder bumps extending from the electronic device are positioned in the fluid. The fluid is activated by applying a field selected from the group consisting of an electric field and a magnetic field to the fluid. The activated fluid mechanically holds the electronic device in place. A surface of the electronic device is polished while the electronic device is held in place by the activated fluid. The fluid is deactivated by removing the applied field from the fluid, and the electronic device is separated from the deactivated fluid. Other embodiments are described and claimed.

Abstract: A center clamp used with a machining tool having an annular edge has a C-shaped body having an inner end inside the edge and an outer end outside the edge and spaced from it along a clamp axis. A push rod extends along the axis through the outer body end. A rotary joint centered on the axis has an inner part on the inner body end and an outer part rotatable on the inner part about the axis. An axial actuator relatively axially shifts the body and the push rod and thereby clamps a workpiece between an end face of the rod and the outer part of the joint. An angular actuator pivots the push rod about the axis and thereby, when the workpiece is clamped between the rod and the joint, pivots the workpiece about the axis.

Abstract: A lapping system for eliminating crowning in a surface to be lapped includes a first lapping carrier adapted to carry a first workpiece and a second lapping carrier adapted to carry a second workpiece. A stabilizer assembly interconnects the first and second lapping carriers in a mutually stabilizing arrangement that stabilizes the first and second workpieces against rotation. The stabilizer assembly includes first and second stabilizer arms extending between the first lapping carrier and the second lapping carrier. Each lapping carrier and an associated stabilizer arm collectively defines a fixture having a carrier portion and a stabilizer portion, and which may be generally T-shaped. One end of each stabilizer arm is cantilevered from its associated lapping carrier, while the free end of each stabilizer arm is pivotally mounted to the opposite lapping carrier. Downward lapping forces are applied independently to each lapping carrier.

Abstract: A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is included. The electromagnetic field causes the chuck to change from the compliant state to the rigid state. A method for supporting a semiconductor substrate and a system for cleaning a substrate and an apparatus are also provided.

Abstract: A tool for gripping ophthalmic lenses including a vacuum gripper, a shaft associated with said vacuum gripper, the shaft having two ends and being slidably attached at one end thereof to a support structure, a resilient member which biases the vacuum gripper in a direction away from said support structure and a locking member which locks the shaft in a desired position during a lens gripping operation. Another embodiment of the present invention includes a lens hold down mechanism for holding lenses in a lens tray. Another embodiment of the present invention includes an electronic communications scheme for a robotic manufacturing operation. Another embodiment of the present invention includes an ophthalmic lens manufacturing cell layout wherein ophthalmic edging machines have an opening that faces away from a robotic arm. Another embodiment of the present invention includes an arrangement for holding an ophthalmic edging machine within an ophthalmic manufacturing cell.

Abstract: A polishing jig for mounting a working object lens on a polishing apparatus that polishes the concave surface of the working object lens, a conveyor tray for exclusive use for conveying the polishing jig, and a conveying method and a conveying apparatus for conveying the polishing jig or the like with the working object lens held thereon to a working apparatus such as the polishing apparatus. The polishing jig (1) includes a mounting potion (2) to be mounted on a chuck of a polishing apparatus, a ring-shaped closely contacting portion (3) for closely contacting with a convex surface (11) of a working object lens (10), and a filling gap portion (4) having an opening at the closely contacting portion for being filled with adhesive substance (7) which adheres to the convex surface of the working object lens closely contacted by the closely contacting portion to hold the working object lens.

Abstract: A carrier head for a chemical mechanical polishing apparatus is described. The carrier head has a base, a rigid body, a membrane and a pressurizing structure. The rigid body is movable relative to the base and includes a downwardly-extending projection. The membrane has a mounting surface for a substrate. The membrane extends below the base to provide a chamber between the base and the membrane. The pressurizing structure applies a downward pressure on the rigid body to cause a lower surface of the rigid body to press on an inner surface of the membrane.

Abstract: A method of manufacturing a transmission electron microscope inspection sample. The sample is mounted into a recess in the mount and the sample is grinded to a preset target thickness. A recess for mounting the sample and a groove for separating the sample from the recess are formed on a top surface of the mount. The sample is fixed into the recess using mounting wax. The protruding portion of the sample protrudes above the mount and is grinded by the grinder. The depth of the recess is based on the target thickness of the sample. The protruding portion of the sample is grinded to the top surface of the mount.

Abstract: A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. The surfaces of the hydropads which face the workpiece are of nonplanar configuration, contoured in such a manner that the spacing between the surface and the workpiece adopts a minimum value near the edge of the hydropads proximate the grinding wheels, this spacing increasing at increasing distance from the grinding wheels. In a further embodiment, at least one bore, through which liquid and abraded material can be discharged from the vicinity of the dynamic pressure tube, is proximate each dynamic pressure tube.

Abstract: A holder for an optical fiber ferrule end face grinding apparatus is provided which can grind an increased number of optical fiber ferrules simultaneously. The holder comprises a holder plate provided with a plurality of ferrule insertion holes, a seat extending to at least one insertion hole and having a first wall, and a second wall on a side of the insertion hole opposing the seat. A slidable holding member including a front face facing the second wall, and an inclined rear face is disposed on the seat. A depression member is mounted on the holder plate that presses downwardly on a rod member disposed on the inclined rear face. As the depression member is operated, the rod member is pressed downwardly along the first wall, and the holding member is pushed forward such that a ferrule is clamped between the front face and the second wall.

Abstract: A machine for machining workpieces of wood or plastic material has at least one longitudinal profiling unit with at least one longitudinal profiling spindle. At least one advancing unit is provided for moving a workpiece past the at least one longitudinal profiling unit. The advancing unit has upper clamping jaws arranged above the workpiece and lower clamping jaws arranged below the workpiece such that at least some of the upper clamping jaws are staggered relative to the lower clamping jaws, when viewed in a plan view onto the advancing unit. A small free space is provided between the upper and lower clamping jaws, when viewed in a plan view. During transfer between the machining processes, the workpieces remain clamped at all times so that precise machining is ensured.

Abstract: A method of predicting the lapping property of a charged lapping plate uses samples with a known lap surface. The samples are lapped on the plate and a non-invasive sensor is used to determine the lapping rate under a fixed load and rotation speed. The total frictional force of the samples is measured during the lapping to calculate the friction and Preston coefficients of the plate. The samples are held in place while the plate rotates and the sensor measures the distance to the plate. The plate rotates for a specific time so that adequate removal of the pad material has occurred. The lapping rate is determined from a change in the gap distance over a time interval. The lapping rate and friction are then assessed to determine if the plate is lapping worthy.

Abstract: A method and apparatus for removing layers from a circuit side of a semiconductor die includes the use of a holder, for example a semiconductor wafer having an opening therein for receiving the semiconductor die. Additionally the holder can include one or more layers thereover which are removed at a similar rate as those layers which comprise the semiconductor die. A die is placed into the opening and a circuit side of the die is aligned with a front side of the holder, for example using a generally planar surface, and is secured to the holder with an adhesive material. Using a holder reduces uneven layer removal which is known to occur in conventional processing, for example excessive removal at the edges of the die. A potting jig which aids in aligning and securing the die to the holder is also described.

Abstract: A lens processing system (1) includes a lens stocking device (400a; 400b) capable of stocking a plurality of lenses (LE); and a lens grinding device (100a; 100b); and a lens conveying device (200) which conveys one of the plurality of lenses between the lens stocking device and the lens grinding device.

Abstract: An apparatus for grinding center bearings of crankshafts includes a clamping unit for clamping and driving a crankshaft; a grinding spindle, positionable perpendicular to the crankshaft; a plurality of grinding wheels on the grinding spindle, corresponding to the number of center bearings to be ground; a plurality of steadies, for supporting the crankshaft, opposite the grinding spindle; and an additional processing unit for performing preliminary grinding on the center bearing, by forming an elevated bearing seat for the steadies, opposite the bearing, such that the steadies are continuously guidable during grinding of the center bearings. In a method for grinding center bearings of a crankshaft using the apparatus, the center bearings are simultaneously ground using a multilayer grinding wheel set, and prior to a final grinding of the center bearings to their final dimensions, a bearing seat for a steady is ground on at least one center bearing.

Abstract: This invention relates to an improvement of a clip mechanism on a grinding cloth platform wherein the clip mechanism includes a jack post, a movable knob, and a clamp, providing for a bottom side of the movable knob to engage the clamp at the two sides of the jack post, thereby providing a precise clamp force to the clamp. The clamp is put on a non-circular driving portion of the jack post so as to disallow the clamp to turn around the non-circular shaft and to make it move stably downward, thereby making clamping teeth provided at the bottom side of the clamp precisely align with the table board to clamp the grinding cloth to the grinding cloth platform for smooth and stable grinding when a surface of an object is ground on the platform.

Abstract: A carrier head for chemical mechanical polishing of a substrate having a front surface, a back surface and an edge. The carrier head has a base, an inner retaining ring positioned beneath the base, and an outer retaining ring surrounding the inner retaining ring to retain the inner retaining ring. The inner retaining ring has a main portion with a first surface to apply a load to a perimeter portion of the back surface of the substrate and an annular lower projection protruding downwardly from the main portion with a second surface to circumferentially surround the edge of the substrate to retain the substrate.

Abstract: A method and apparatus are disclosed wherein, while holding an optical fiber 1 by an optical fiber holder section 4 so as to serve a distal end 1a of the optical fiber 1 as a free end and holding the distal end 1a of the optical fiber 1 in contact with a grinding flat portion 5b to cause the distal end 1a of the optical fiber 1 to be flexed on the grinding flat portion 5b, reciprocating movement for causing the distal end 1a of the optical fiber 1 to slide on the grinding flat portion 5b in a first sliding direction and an oppositely orientated second sliding direction is relatively implemented a plural number of times between the grinding flat portion 5b and the distal end 1a of the optical fiber 1.

Abstract: A pneumatically operated, random orbital sander is disclosed as having an upper seal adapted to retard the entry of dust into an exposed or lowermost motor shaft supporting bearing and a lower seal adapted to retard the entry of dust into a motor shaft mounted bearing serving to couple the motor shaft to a sanding pad or disc.

Abstract: Fabrication techniques for polishing fibers engaged in grooves on substrates. A protection template assembly is disclosed to protect the unpolished portions of fibers. Chemical mechanical polishing may be used to achieve high fabrication throughput and high polishing uniformity. Optical monitoring may be used to monitor the polishing in real time.

Abstract: A panel turning apparatus which turns a panel from a first orientation to a second, desired orientation. The apparatus has a rotatable portion rotatable about an axis of rotation thereof, and a base portion which supports the rotatable portion for rotation about the axis of rotation. The rotatable portion has a panel carrying portion aligned with the axis of rotation, a supported portion which supports the rotatable member for rotation and a driving portion by which the rotatable member is rotated to carry a panel carried by the panel carrying portion from the first orientation to the second, desired orientation. The apparatus permits a panel, even a large and heavy panel, to be turned safely and easily by one person.

Abstract: A carrier head for a chemical mechanical polishing apparatus. The carrier head includes a housing, a base, a loading mechanism, a gimbal mechanism, and a substrate backing assembly. The substrate backing assembly includes a support structure positioned below the base, a substantially horizontal, annular flexure connecting the support structure to the base, and a flexible membrane connected to the support structure. The flexible membrane has a mounting surface for a substrate, and extends beneath the base to define a chamber.

Abstract: An apparatus and method of lapping of rows of magnetic recording heads uses multiple fluid-filled ports with variable pressure against a flexible adhesive tape to secure to and support the row. The tape provides the necessary tangential restraining force to drag the workpiece along a lapping plate. The multiple ports beneath the tape provide the necessary normal force to press the workpiece against the lapping plate to allow lapping to occur. The amount of material removal from the row is varied by adjusting the pressure in the ports such that higher pressure is applied to those heads with higher stripe height, and lower pressure is applied to recording heads with lower stripe height. To set or adjust the port pressures, measurements of the read sensor resistance are taken to calculate the stripe height. The stripe height is roughly proportional to the reciprocal of resistance.

Abstract: An angle-measurement assist device suitable for a visual inspection to determine a blade angle of a dental scaler is provided with a holder having a flat face thereof adapted to be in contact with a bladed portion of the scaler, a permanent magnet mounted to the holder, and first, second and third pins projecting from the holder in the directions which are perpendicular to one another, whereby an operator is permitted to make a visual inspection to determine whether the scaler is sharpened to have a target blade angle on the basis of an extending direction of the first pin, with the assist device magnetically retained on the scaler.

Abstract: A polishing fixture is provided for polishing the optic ends of a fiber optic cable terminated in a fiber optic connector. A holding plate has a receptacle for receiving the fiber optic connector, with at least a portion of each of a first side and a second side of the connector exposed. A clamping arm is disposed for linear movement relative to the holding plate and the received connector, as well as for pivotal movement relative to the holding plate and the received connector. The clamping arm has first and second clamping portions for engaging the first and second sides, respectively, of the connector. An actuator mechanism is operatively associated with the clamping arm for moving the clamping arm linearly to bring the first clamping portion of the arm into clamping engagement with the first side of the connector and then pivoting the clamping arm to bring the second clamping portion of the arm into clamping engagement with the second side of the connector.

Abstract: A ski sharpening arrangement includes a portable powered grinder adapted to be manipulated by one hand of a user. The arrangement includes a motor assembly spaced from a ski having a top surface, a base, a side edge and a bottom edge coplanar with the base. The motor assembly drives an endless belt having an abrasive surface about an axis of rotation transverse to a plane of the base. The endless belt is entrained about a mounting framework extending from the motor assembly, and engaged against the side edge of the ski to provide sharpening thereof. A support structure is suspended from the mounting framework of the belt and is adapted to be manipulated by another hand of the user for guiding, stabilizing and changing the angle of the abrasive surface relative to the side edge of the ski.