Abstract: The invention is a method of soldering a light emitting device to a substrate which uses a vee-groove to hold the substrate, solder and light emitting device in accurate alignment to one another during the melting and solidification of the solder.

Abstract: A keel-tipped stylus for playback of video information from a disc record is formed on a lapping disc having a spiral signal track on the land between a spiral lapping groove. The respective pitches of the signal track and groove are different whereby the signal track and lapping groove cross each other. A playback stylus riding in the groove will detect a signal from the track to monitor the lapping process.

Abstract: The present method can determine the presence and amount of silvery white metallic impurities in a silvery white molten solder composition. In accordance with the method of this invention, a transparent substrate which has sequential layers of metal deposited on one of the surfaces thereof is prepared. A first layer is formed directly on the substrate of a thin film of a colored metal such as copper or gold. A second thicker layer of a silvery white metal, the presence and amount of which is desired to be evaluated in the solder composition, deposited over the first layer. In use, the substrate is placed in contact with the molten solder. The amount of time required for the second layer to dissolve into the solder bath and the exposed first colored layer to change color due to alloying with the metal of the solder, is measured. The time required for the color change to occur is correlated to the level of contamination of the silvery white metal in the solder bath.

Abstract: A plurality of wafers is serially disposed between a reactant gas inlet portion and an exhaust gas outlet portion of a deposition chamber. The reactant gas comprises a predetermined mixture of N.sub.2 O and SiH.sub.4, and a positive, monotonically decreasing temperature gradient is provided between the wafer closest to the inlet portion to the wafer closest to the outlet portion, such that the thickness and resistivity of the deposited SIPOS (semi-insulating polycrystalline silicon) are substantially similar on each wafer.

Abstract: An epoxy composition derived from tetraglycidated methylene dianiline cured with a methylated maleic acid adduct of phthalic anhydride has a high glass-transition temperature and a low curing temperature and when cured has very high bond strength. This epoxy can be used to bond a diamond cutterhead stylus to a piezoelectric element.

Abstract: A cured multi-component epoxy composition made from a high molecular weight diglycidyl ether of bisphenol A, a second diglycidyl ether, a high molecular weight polyamide-amine curing agent, and an accelerator, is an excellent damping material and can be used in a cutterhead assembly for the manufacture of high-density information discs.

Abstract: Chlorophenyl trialkoxysilane, when added to a fractionated methyl alkyl siloxane lubricant for capacitive electronic discs, improves the playback performance and surface quality of the discs.

Abstract: A pair of protection circuits, each forming a silicon controlled rectifier (SCR) for protecting a circuit against either negative or positive voltage transients, are formed in a single isolated region together with a bond pad. A second embodiment also includes a sense resistor in the isolated region.

Abstract: An apertured mask layer is disposed on a substrate having a monocrystalline portion at a surface thereof. Essentially all edges of the mask apertures are parallel to a predetermined crystallographic direction. A monocrystalline layer is then deposited such that it grows within the mask apertures and over the mask in a direction perpendicular to the aperture edges.

Abstract: Variations in topography and material properties of the surface layer of a body are observed in microscopic imaging using a scanning capacitance probe. The acronym SCaM identifying the process and apparatus is derived from the phrase scanning capacitance microscope. The material properties observable by SCaM are the surface-electric property representative of the complex dielectric constant of the surface material and the surface-mechanical property representative of the elastic constant of the surface material.

Abstract: An improved method for the deposition of a semiconductor layer from the positive column of a glow discharge is disclosed. The improvement comprises dividing an electrically conducting layer on a surface of an insulator into a plurality of electrically isolated segments. The width of each segment is preferably less than or equal to the maximum allowable difference in the relative plasma potential over the conducting substrate divided by the plasma potential gradient. Data for amorphous silicon photovoltaic devices are also disclosed which show a greatly improved uniformity in V.sub.oc and J.sub.sc with relative position in the positive column for segmented as compared to unsegmented devices.

Abstract: An improved method for the manufacture of stampers having formed inner and outer edges is provided in which the inner and outer edges are electroformed in the required configuration by using electroforming guides at the inner edge, the outer edge and preferably both edges.

Abstract: An improved process for the batch distillation or purification by stripping of a bis(hydroxyalkyl)disiloxane, which purified product is useful as a video disc lubricant additive or dopant. In accordance with the process, the feedstock of bis(hydroxyalkyl)disiloxane is subjected to a vacuum evaporation of the light volatiles by gradually reducing the pressure to about 2.times.10.sup.-1 Torr. After the low boiling materials have been distilled off, the temperature is gradually increased and the pressure gradually reduced (final temperature of about 135.degree. C. and final pressure of about 4.times.10.sup.-2 Torr) so as to produce a distill and having a viscosity of about 210.+-.30 centipoise at 25.degree. C.

Abstract: A light emitting assembly comprising a light emitting device, an optical fiber and an optical coupling medium which is contacted to both a facet of the light emitting device and an end face of the fiber and whose maximum diameter is comparable to the diameter of the end face of the fiber. The invention is also a method of making this light emitting assembly which comprises positioning the end face of the optical fiber adjacent to the emitting portion of the facet, interposing an optical coupling medium between the facet and the end face of the fiber and increasing the space between the facet and the end face of the fiber until the maximum amount of light is coupled into the fiber.

Abstract: An improved ink composition suitable for the formation of thick film resistor inks which can be terminated directly to copper foil conductors. The subject compositions comprise an epoxy resin, conductive carbon particles, a suitable solvent and particulate alumina, wherein the alumina is present in an amount at least equal to the resin content on a weight basis.

Abstract: A sputtering apparatus for the deposition of thin films of material upon substrates is disclosed having an improved target mounting mechanism. The improved mounting mechanism provides the capability to easily raise and lower the target with respect to the substrate while maintaining critical alignment of the vacuum seal components. Additionally, capability is provided to easily adjust the angular position of the target with respect to the substrate being coated.

Abstract: An apparatus for molding an article, such as a preform, used in making information recorded discs, includes top and bottom mold members having recesses in their approved surfaces. The top mold member is mounted on the end of the piston rod of a pneumatic cylinder which is adapted to move the top mold member into mating relation with the bottom mold member so that the mold recesses form a mold cavity. The bottom mold member includes means for injecting a plastic mold material into the mold cavity. To mold a preform, the top mold member is moved by the pneumatic cylinder toward the bottom mold member to a collapsed position of the mold members where the mold cavity is of a volume less than the desired volume of the preform being molded. Plastic mold material is injected into the mold cavity until it is filled and additional mold material is injected into the mold forcing the top mold member away from the bottom mold member until the cavity is of the desired volume of the preform.

Abstract: A technique for passivating a PN junction adjacent a surface of a semiconductor substrate comprises coating the area of the surface adjacent the PN junction with a layer of hydrogenated amorphous silicon containing between about 5 and about 50 atomic percent of hydrogen.

Abstract: Video discs are cleaned with a water-based solution to remove water soluble salts from the surface of the discs, thereby reducing the moisture sensitivity of the discs.

Abstract: In making a semiconductor device wherein a film of a non-single crystalline silicon, such as polycrystalline or amorphous silicon, is deposited on a substrate and then doped, particularly by ion implantation, to make the film conductive, the conductivity of the film is increased by pre-annealing the film at a temperature of 1000.degree. C. to 1200.degree. C. in an inert ambient before doping the film.