Abstract: A titanium coupling agent of the formula ##STR1## wherein R.sub.3 is methyl, ethyl or isopropyl and R.sub.4 and R.sub.5 are long chain alkyl groups of 8-20 carbon atoms, when added to a fractionated methyl alkyl siloxane lubricant for capacitive electronic discs, improves the playback performance of the discs.

Abstract: A thin coating of poly(isobutylene) is applied to the edge of a record turntable to prevent the record on the turntable from slipping during acceleration and deceleration of the turntable for playback.

Abstract: A lenticular array in silicon is made by anisotropically etching a V-shaped groove in a 100 silicon wafer wherein the walls of the V are made by intersecting 111 planes and exposing the surface having the V-grooves therein to a polishing etch whereby a series of lenses is formed between the V-grooves.

Abstract: A system for positioning a body having two opposed edges and having a first axis oriented to pass through the two edges. A beam of light oriented along a second axis orthogonal to the first axis images one or both of the edges onto all or a portion of a photodetector array which is aligned in a direction parallel to the first axis. The array is scanned to obtain a light intensity transition profile of all or part of the projected image whereby the profile has either one or two 50% intensity points. The body is then shifted until both of the 50% intensity points strike predetermined locations on the array indicating that both the edges are included in the image. The body is shifted along the first axis until the fifty percent (50%) intensity point along the transition profile strikes a predetermined location along the photodetector array. The body is also moved along the second axis until the slope of the intensity transition profile is maximized, thereby obtaining an in-focus position.

Abstract: An improved method and apparatus is provided for the manufacture of stampers in which the stampers are electroformed from a relatively hard metal in a flat configuration and then, either before or after shaping of the shaped inner and outer edges, but prior to the use in the pressing of records, the inner and/or outer edges are selectively annealed to increase the ductility of these portions while retaining hardness of the remainder of the stamper.

Abstract: A semiconductor laser having an active layer which has a non-zero thickness in a region adjacent to at least one of the mirror facets which is less than that of the remainder of the active layer in the longitudinal direction. In the region adjacent to the mirror facet the laser light propagates primarily in a non-absorbing guide layer adjacent to the active layer thus, reducing optical absorption and heat generation at the mirror facet.

Abstract: A semiconductor laser wherein the major surface of a substrate having a pair of channels therein is misoriented from a member of the {100} family of crystallographic planes by a tilt angle between about 0.2.degree. and 1.5.degree.. The misorientation angle of the substrate surface with respect to the axis of the channels is between about 5.degree. and 45.degree..

Abstract: A constricted heterostructure laser in which the active layer does not extend to an emitting facet. The light from the active layer is coupled into an underlying guide layer which provides lateral guidance of the laser beam to the emitting facet. The shape of the output laser beam in both the lateral and transverse directions may be varied by varying the shape of the guide layer in that portion of the laser where the active layer does not overlie the guide layer.

Abstract: An improved conductive molding composition for the preparation of high density capacitance electronic discs is disclosed. The disclosed compositions are improved by the utilization of a solid plasticizer, cumylphenyl isophthalate, represented by the formula ##STR1## The use of this plasticizer permits the formulation of a conductive molding composition wherein all ingredients are solids.

Abstract: A semiconductor device having a multi-level metallization system wherein the first level is of aluminum containing up to 3 of percent silicon and the second level is either aluminum or aluminum containing silicon in an amount less than that contained in the first level. The two levels where they contact each other are sintered together with some of the silicon from the first level being diffused into the second level so that the second level has a region adjacent the junction between the two levels which has a higher content of silicon than the remaining portion of the second level. When making the device, the surface of the first level where it is to be joined with the second level is etched to remove some of the aluminum, but not the silicon, which roughens this surface. The second level is applied on this roughened surface and the device is heated to sinter the two levels together and diffuse the silicon into the second level.

Abstract: A packingless shaft seal between an apparatus housing and a rotatable shaft. The shaft seal includes a sleeve mounted on the shaft and a seal housing mounted on the apparatus housing and around the sleeve. The sleeve has a variable pitch thread extending from its ends within the apparatus housing to the seal housing and a cylindrical portion within and spaced from the inner surface of the seal housing. The variable pitch thread is directed toward the interior of the apparatus housing so that upon rotation of the shaft, material entering the thread is moved back into the apparatus housing. The seal housing has a chamber therein through which a temperature control material flows to control the temperature of the material passing between the seal housing and the sleeve.

Abstract: A semiconductor device having a rectifying junction after passivation is exposed to a humid ambient while being tested for humidity-induced leakage currents indicative of passivant defects such as pinholes, cracks, etc. The amplitude of the reverse biased humidity-induced current is indicative of the integrity of the passivant coverage.

Abstract: A transfer apparatus is provided for transferring a molded record from the record pressing station to the record trimming station of an automated record press. The transfer apparatus is comprised of a clamp which is circular in its closed position with an interior diameter large enough to hold a record by the flash formed about the outside diameter of the record. The clamp is pivotally mounted so as to oscillate between the record pressing station and the record trimming station. In use, the clamp is positioned in the closed position between the upper and lower molding platens so as to form a molding surface against which the flash is formed in a uniform configuration during molding. After the record is molded, the clamp in the closed position is oscillated to a position in alignment with the record trimming station. The clamp is then opened which releases the record for trimming. The clamp then returns to the record pressing station for the next molding cycle.

Abstract: In order to reduce the mechanical stress that occurs at the interface of a layer of a refractory metal silicide and a layer of silicon dioxide, it is proposed that a buffer layer of polycrystalline silicon be interposed between the two layers. To accomplish this and prior to forming contact openings, the buffer layer of polycrystalline silicon is deposited on the layer of silicon dioxide and the structure is then provided with an apertured mask to define the contact openings. The structure is then initially etched through both the buffer layer and the underlying layer of silicon dioxide in order to expose portions of the buried contact regions followed by a second etch of only the buffer layer to only expose portions of the layer of silicon dioxide in order to form a gate member and any required interconnects. The process further includes the formation of a layer of metal silicide on the interconnects, in the contact openings and on the gate member.

Abstract: A method and apparatus is provided for trimming flash from the outer edge of thermoplastic molded records and then finishing the outer edge. A molded record having flash on its outer edge is supported on a turntable and then rotated about its center. The flash and the outer edge of the record immediately adjacent the flash are selectively heated, preferably by using a focused infrared lamp, to a temperature above the glass transition temperature. A cutter is then advanced tangentially through the flash to remove the heat-softened flash from the record. The trimmed outer edge is then finished by bringing a shaped surface into contact with the softened edge and holding it there while rotating the record until the outer edge has the desired finished configuration. The heating is discontinued and the trimmed and finished outer edge is allowed to solidify.

Abstract: An apparatus for deflashing a molded recorded disc includes a turntable support for the disc and a scissors type knife having a pair of blades pivotally mounted together with one of the blades being mounted on a support which is positioned adjacent the turntable so that a portion of the flash of the disc extends between the blades. A pneumatic cylinder has a piston rod connected to a knife support to selectively move with the support and the knife toward and away from the disc. The blades have cooperating cutting edges for cutting through the flash and one of the blades has a front end cutting surface for removing the flash when the disc is rotated by the turntable. In the operation of the apparatus the knife first removes a major portion of the flash and then the knife is moved slowly inwardly against the edge of the disc to remove additional portions of the flash until the desired diameter of the disc is reached.

Abstract: An improved conductive molding composition for the preparation of high density capacitance electronic discs is disclosed. The disclosed compositions are improved by the replacement of most or all of the conventionally used stabilizer ingredient with a tin mercapto ester or alkyl mercaptide represented by the formulae ##STR1## wherein R is a straight-chain alkyl radical having 4 to 8 carbon atoms; R.sub.1 is selected from --S-CH.sub.2 -COOR.sub.3 and --S-R.sub.3 ;R.sub.2 is R or R.sub.1 ; andR.sub.3 is a straight-chain alkyl radical having from 8 to 18 carbon atoms.

Abstract: Sandwich-type capacitive electronic discs having thin conductive layers are prepared by adding a thermally processed conductive molding composition comprising a thermoplastic resin, conductive carbon black particles and suitable additives to a suitable solvent to form a dispersion of the conductive carbon black in a solution of the remaining ingredients. The dispersion is filtered to remove impurities larger than a predetermined particle size and coated onto a core disc. The coating is dried to form a conductive layer which is embossed with the desired information.

Abstract: An improved process for electroplating bonding pads, such as of gold, onto semiconductor devices is disclosed. Upon electrically connecting a masked semiconductor body and a suitable anode to the negative and positive terminals respectively of a power supply and submerging the wafer and anode into a suitable electrolyte, a modulated, rather than direct, current is applied to the electrolyte. A low stress, fine grain bonding pad layer is provided and, unexpectedly, non-planarities in the semiconductor body surface having a depth of about 1-3 microns can be substantially planarized when the thickness of the layer deposited is about 6-8 microns or more.

Abstract: Enhanced micromachining rates are observed when lapping discs with standard SiO.sub.x lapping coatings are doped with trivalent or pentavalent additives, such as boron or phosphorous. Doping can be accomplished by subjecting the SiO.sub.x material to a "post glow", i.e., an argon plasma in the presence of a source of the dopant.