Patents Assigned to Advanced Semiconductor Engineering
  • SEMICONDUCTOR DEVICE PACKAGE INCLUDING PROMOTERS AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230088723
    Abstract: The subject application discloses a substrate. The substrate includes a first conductive layer, a first bonding layer, a first dielectric layer, and a conductive via. The first bonding layer is disposed on the first conductive layer. The first dielectric layer is disposed on the first bonding layer. The conductive via penetrates the first dielectric layer and is electrically connected with the first conductive layer.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wen Hung HUANG
  • ANTENNA MODULE AND SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20230086019
    Abstract: The present disclosure provides an antenna module including a substrate, a first antenna disposed on the substrate and a second antenna disposed on the substrate and spaced apart from the first antenna. The first antenna is configured to have a first operating frequency and the second antenna is configured to have a second operating frequency different from the first operating frequency. The antenna module further includes an element configured to focus an electromagnetic wave transmitted or received by the first antenna and the second antenna. A semiconductor device package is also disclosed.
    Type: Application
    Filed: November 29, 2022
    Publication date: March 23, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • Leadframe including conductive pillar over land of conductive layer
    Patent number: 11610834
    Abstract: A leadframe includes a first conductive layer, a plurality of conductive pillars and a first package body. The first conductive layer has a first surface and a second surface opposite to the first surface. The plurality of conductive pillars are disposed on the first surface of the first conductive layer. The first package body is disposed on the first surface of the first conductive layer and covers the conductive pillars. The conductive pillars and the first conductive layer are integratedly formed.
    Type: Grant
    Filed: October 16, 2019
    Date of Patent: March 21, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: You-Lung Yen, Bernd Karl Appelt
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230078564
    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.
    Type: Application
    Filed: November 18, 2022
    Publication date: March 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN, Meng-Wei HSIEH, Yu-Pin TSAI
  • OPTOELECTRONIC DEVICE
    Publication number: 20230081194
    Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU, Jung Jui KANG
  • PHOTONIC PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230077877
    Abstract: A photonic package and a method of manufacturing a photonic package are provided. The photonic package includes a carrier, an electronic component, and a photonic component. The carrier has a first surface and a recess portion exposed from the first surface. The electronic component is disposed in recessed portion. The photonic component is disposed on and electrically connected to the electronic component and is configured to communicate optical signals.
    Type: Application
    Filed: September 10, 2021
    Publication date: March 16, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yuan KUNG, Hung-Yi LIN
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11605877
    Abstract: A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: March 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Sheng-Chi Hsieh, Chen-Chao Wang, Teck-Chong Lee, Chien-Hua Chen
  • Semiconductor package structure and method for manufacturing the same
    Patent number: 11605597
    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first passivation layer, a first metal layer and a first semiconductor die. The first metal layer is embedded in the first passivation layer. The first metal layer defines a first through-hole. The first semiconductor die is disposed on the first passivation layer.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: March 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsu-Nan Fang, Chun-Jun Zhuang
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11605598
    Abstract: A semiconductor device package includes a substrate having a surface, a conductive element disposed on the surface of the substrate, and an encapsulant disposed on the surface of the substrate and covering the conductive element. The conductive element has an upper surface facing away from the substrate and exposed from the encapsulant. Further, a roughness of the upper surface of the conductive element is greater than a roughness of a side surface of the conductive element.
    Type: Grant
    Filed: April 17, 2020
    Date of Patent: March 14, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei Da Lin, Meng-Jen Wang, Hung Chen Kuo, Wen Jin Huang
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20230075021
    Abstract: A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The electronic device includes a first carrier having a first surface, an interposer disposed over the first surface of the first carrier, wherein the interposer has a first thickness and a second thickness in a direction substantially perpendicular to the first surface of the first carrier; and a plurality of electrical connections between the first carrier and the interposer and configured to compensate a difference between the first thickness and the second thickness of the interposer.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ching-Feng CHENG
  • OPTICAL ADAPTIVE DEVICE AND WEARABLE DEVICE
    Publication number: 20230074105
    Abstract: The present disclosure provides an optical adaptive device and a wearable device. The optical adaptive device includes a carrier, a first light adjusting element, and a second light adjusting element. The first light adjusting element is in or on the carrier and configured to focus a first light from a first article on a visual area. The second light adjusting element is in or on the carrier and configured to focus a second light from a second article on the visual area. The second article is further away from the area than the first article.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ko-Fan TSAI, Tien-Chia LIU, Kuo Sin HUANG, Cheng-Te CHOU
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230075336
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Application
    Filed: November 15, 2022
    Publication date: March 9, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG
  • Semiconductor device package and method for manufacturing the same
    Patent number: 11600567
    Abstract: A semiconductor device package includes a first circuit layer, a second circuit layer, a first semiconductor die and a second semiconductor die. The first circuit layer includes a first surface and a second surface opposite to the first surface. The second circuit layer is disposed on the first surface of the first circuit layer. The first semiconductor die is disposed on the first circuit layer and the second circuit layer, and electrically connected to the first circuit layer and the second circuit layer. The second semiconductor die is disposed on the second circuit layer, and electrically connected to the second circuit layer.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Cheng Lee, Kuang Hsiung Chen
  • Apparatus and method for deformation measurement
    Patent number: 11598625
    Abstract: An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsuan-Yu Chen, Ming-Han Wang
  • Semiconductor device and semiconductor package
    Patent number: 11600590
    Abstract: A semiconductor device and a semiconductor package including the same are provided. The semiconductor device includes a semiconductor element; a protective layer disposed adjacent to the surface of the semiconductor element, the protective layer defining an opening to expose the semiconductor element; a first bump disposed on the semiconductor element; and a second bump disposed onto the surface of the protective layer. The first bump has a larger cross-section surface area than the second bump.
    Type: Grant
    Filed: March 22, 2019
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Wei-Wei Liu, Huei-Siang Wong
  • Semiconductor device package and method of manufacturing the same
    Patent number: 11600901
    Abstract: A semiconductor device package includes a substrate and an antenna module. The substrate has a first surface and a second surface opposite to the first surface. The antenna module is disposed on the first surface of the substrate with a gap. The antenna module has a support and an antenna layer. The support has a first surface facing away from the substrate and a second surface facing the substrate. The antenna layer is disposed on the first surface of the support. The antenna layer has a first antenna pattern and a first dielectric layer.
    Type: Grant
    Filed: July 9, 2019
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Lin Ho, Chih-Cheng Lee, Chun Chen Chen, Yuanhao Yu
  • Optoelectronic device
    Patent number: 11598927
    Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jr-Wei Lin, Mei-Ju Lu, Jung Jui Kang
  • ELECTRONIC PACKAGE STRUCTURE, ELECTRONIC SUBSTRATE AND METHOD OF MANUFACTURING ELECTRONIC PACKAGE STRUCTURE
    Publication number: 20230061684
    Abstract: An electronic package structure, an electronic substrate, and a method of manufacturing an electronic package structure are provided. The electronic package structure includes a substrate. The substrate includes a bonding region and an alignment structure. The bonding region is located at a side of the substrate and configured to bond with an electronic component. The alignment structure is located at the side of the substrate and out of the bonding region and configured to providing a fiducial mark for position-aligning, wherein the alignment structure comprises a first region and a second region visually distinct from the first region.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shun-Tsat TU, Pei-Jen LO
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230060538
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Ya-Wen LIAO
  • OPTICAL MODULE
    Publication number: 20230063405
    Abstract: The present disclosure provides an optical module. The optical module includes an optical component disposed in or on a carrier and configured to receive a first light. The optical component is further configured to transmit a second light to a first portion of the carrier and transmit a third light to a second portion of the carrier.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Shih-Chieh TANG, Lu-Ming LAI, Yu-Che HUANG, Ying-Chung CHEN