Patents Assigned to Advanced Semiconductor Engineering
  • PASSIVE ELEMENT, ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200111774
    Abstract: An electronic device includes: a first insulation layer and a first conductive pillar. The first insulation layer has a first surface and a second surface opposite to the first surface, and the first conductive pillar comprises a first portion and a second portion. The first portion of the first conductive pillar is surrounded by the first insulation layer. The second portion of the first conductive pillar is disposed on the first surface of the first insulation layer. A height of the second portion of the first conductive pillar is equal to or greater than 10% of a height of the first portion of the conductive pillar.
    Type: Application
    Filed: October 3, 2018
    Publication date: April 9, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pei-Jen LO, Chien-Han CHIU, Wen Hung HUANG
  • SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200098700
    Abstract: A semiconductor package device includes a substrate, a sealant, a trench, a spacer and a conductive material. The substrate includes a first surface, a second surface opposite the first surface, and a lateral surface extending from the first surface to the second surface. The sealant is disposed on the first surface of the substrate and includes a first surface and a second surface opposite the first surface. The trench passes through the sealant and includes a first portion adjacent to the first surface of the sealant and a second portion between the first portion and the substrate. A width of the first portion is greater than a width of the second portion. The spacer is disposed in the trench and in contact with the sealant. The conductive material is disposed in the trench and encapsulates the spacer.
    Type: Application
    Filed: September 21, 2018
    Publication date: March 26, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Chien-Feng CHAN
  • APPARATUS AND METHOD FOR MEASURING WARPAGE
    Publication number: 20200098605
    Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.
    Type: Application
    Filed: September 21, 2018
    Publication date: March 26, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung TSAI, Hsuan Yu CHEN, Ian HU, Meng-Kai SHIH, Shin-Luh TARNG
  • DEVICE PACKAGE
    Publication number: 20200098709
    Abstract: An electronic device package includes a first substrate, a second substrate and a conductive layer. The first substrate includes a first bonding pad, and a cavity exposing the first bonding pad. The second substrate is laminated on the first substrate. The second substrate includes a second bonding pad at least partially inserting into the cavity of the first substrate. The conductive layer is disposed in the cavity and at least between the first bonding pad and the second bonding pad to connect the first bonding pad and the second bonding pad.
    Type: Application
    Filed: June 26, 2019
    Publication date: March 26, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Nan LIN, Wei-Tung CHANG, Jen-Chieh KAO, Huei-Shyong CHO
  • SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20200091036
    Abstract: A semiconductor package structure includes a package substrate, a semiconductor die, a vapor chamber and a heat dissipating device. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The vapor chamber is thermally connected to a first surface of the semiconductor die. The vapor chamber defines an enclosed chamber for accommodating a first working liquid. The heat dissipating device is thermally connected to the vapor chamber. The heat dissipating device defines a substantially enclosed space for accommodating a second working liquid.
    Type: Application
    Filed: September 10, 2019
    Publication date: March 19, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-En CHEN, Ian HU, Jin-Feng YANG
  • ELECTRONIC DEVICE
    Publication number: 20200083143
    Abstract: An electronic device includes a main substrate, a semiconductor package structure and at least one heat pipe. The semiconductor package structure is electrically connected to the main substrate, and includes a die mounting portion, a semiconductor die and a cover structure. The semiconductor die is disposed on the die mounting portion. The cover structure covers the semiconductor die. The heat pipe contacts the cover structure for dissipating a heat generated by the semiconductor die.
    Type: Application
    Filed: September 10, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung-Che TSAI, Ian HU, Chih-Pin HUNG
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200083591
    Abstract: A semiconductor device package includes a glass carrier, a package body, a first circuit layer and a first antenna layer. The glass carrier has a first surface and a second surface opposite to the first surface. The package body is disposed on the first surface of the glass carrier. The package body has an interconnection structure penetrating the package body. The first circuit layer is disposed on the package body. The first circuit layer has a redistribution layer (RDL) electrically connected to the interconnection structure of the package body. The first antenna layer is disposed on the second surface of the glass carrier.
    Type: Application
    Filed: August 19, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Sheng-Chi HSIEH, Chen-Chao WANG, Teck-Chong LEE, Chien-Hua CHEN
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20200083132
    Abstract: A semiconductor device package includes a carrier and an encapsulant disposed on the carrier. At least one portion of the encapsulant is spaced from the carrier by a space.
    Type: Application
    Filed: May 10, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yen-Chi HUANG, Hao-Chih HSIEH, Jin Han SHIH, Yung I. YEH, Tun-Ching PI
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20200083172
    Abstract: A semiconductor device package includes a number of interposers mounted to the carrier, wherein the number of interposers may be arranged in an irregular pattern.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hao-Chih HSIEH, Tun-Ching PI, Sung-Hung CHIANG, Yu-Chang CHEN
  • OPTICAL MODULE AND METHOD OF MAKING THE SAME
    Publication number: 20200080841
    Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
    Type: Application
    Filed: November 13, 2019
    Publication date: March 12, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20200075571
    Abstract: A semiconductor device package includes a carrier, an electronic component, a protection layer, a conductive layer and an integrated passive device (IPD). The electronic component is disposed on the carrier. The protection layer covers the carrier and the electronic component. The conductive layer is disposed on the protection layer and penetrates the protection layer to be electrically connected to the electronic component. The IPD is disposed on the conductive layer and electrically connected to the electronic component through the conductive layer.
    Type: Application
    Filed: September 4, 2019
    Publication date: March 5, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Teck-Chong LEE
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20200075467
    Abstract: A semiconductor device package includes a substrate, a first insulation layer and an electrical contact. The first insulation layer is disposed on the first surface of the substrate. The electrical contact is disposed on the substrate and has a first portion surrounded by the first insulation layer and a second portion exposed from the first insulation layer, and a neck portion between the first portion and the second portion of the electrical contact. Further, the second portion tapers from the neck portion.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 5, 2020
    Applicant: Advanced Semiconductor Engineering Korea, Inc.
    Inventors: Soonheung BAE, Hyunjoung KIM
  • SUBSTRATE PANEL STRUCTURE AND MANUFACTURING PROCESS
    Publication number: 20200075540
    Abstract: A substrate panel structure includes a plurality of sub-panels and a dielectric portion. Each of the sub-panels includes a plurality of substrate units. The dielectric portion is disposed between the sub-panels.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 5, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Wen-Long LU, Jen-Kuang FANG
  • SEMICONDUCTOR DEVICE PACKAGE
    Publication number: 20200066612
    Abstract: A semiconductor device package includes a substrate, a first electronic component, a second electronic component, a heat dissipation lid and a thermal isolation. The substrate has a surface. The first electronic component and the second electronic component are over the surface of the substrate and arranged along a direction substantially parallel to the surface. The first electronic component and the second electronic component are separated by a space therebetween. The heat dissipation lid is over the first electronic component and the second electronic component. The heat dissipation lid defines one or more apertures at least over the space between the first electronic component and the second electronic component. The thermal isolation is in the one or more apertures of the heat dissipation lid.
    Type: Application
    Filed: August 24, 2018
    Publication date: February 27, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Pin HUNG, Tang-Yuan CHEN, Jin-Feng YANG, Meng-Kai SHIH
  • Optica device package and method for manufacturing the same
    Publication number: 20200057201
    Abstract: An optical device package includes a semiconductor substrate, and an optical device. The semiconductor substrate has a first surface, a second surface different in elevation from the first surface, and a profile connecting the first surface to the second surface. A surface roughness of the profile is greater than a surface roughness of the second surface. The optical device is disposed on the second surface and surrounded by the profile.
    Type: Application
    Filed: August 15, 2018
    Publication date: February 20, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Huang-Hsien Chang, Po Ju Wu, Yu Cheng Chen, Wen-Long Lu
  • OPTICAL DEVICE
    Publication number: 20200035851
    Abstract: An optical device includes a substrate, an electronic component and a lid. The electronic component is disposed on the substrate. The lid is disposed on the substrate. The lid has a first cavity over the electronic component and a second cavity over the first cavity. The sidewall of the second cavity is inclined.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 30, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chang Chin TSAI, Yu-Che HUANG, Hsun-Wei CHAN
  • PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20200035654
    Abstract: A semiconductor package structure includes a plurality of transducer devices, a cap structure, at least one redistribution layer (RDL) and a protection material. The transducer devices are disposed side by side. Each of the transducer devices has at least one transducing region, and includes a die body and at least one transducing element. The die body has a first surface and a second surface opposite to the first surface. The transducing region is disposed adjacent to the first surface of the die body. The transducing element is disposed adjacent to the first surface of the die body and within the transducing region. The cap structure covers the transducing region of the transducer device to form an enclosed space. The redistribution layer (RDL) electrically connects the transducer devices. The protection material covers the transducer devices.
    Type: Application
    Filed: July 22, 2019
    Publication date: January 30, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chien-Hua CHEN, Cheng-Yuan KUNG
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE STRUCTURE
    Publication number: 20200027804
    Abstract: An electronic device includes an insulating layer, a metal layer and at least one electrical connecting element. The insulating layer has a top surface and a bottom surface opposite to the top surface, and defines an opening extending between the top surface and the bottom surface. The metal layer is disposed in the opening of the insulating layer and has a top surface and a bottom surface opposite to the top surface. The bottom surface of the metal layer is substantially coplanar with the bottom surface of the insulating layer. The electrical connecting element is attached to the bottom surface of the metal layer through a seed layer.
    Type: Application
    Filed: July 19, 2018
    Publication date: January 23, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Nan FANG, Chien-Ching CHEN
  • INTERCONNECTION STRUCTURE AND SENSOR PACKAGE
    Publication number: 20200027834
    Abstract: A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.
    Type: Application
    Filed: July 17, 2019
    Publication date: January 23, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsun-Wei CHAN, Shih-Chieh TANG
  • SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR PACKAGE, AND METHOD FOR FORMING THE SAME
    Publication number: 20200027810
    Abstract: The present disclosure provides a semiconductor substrate, including a first patterned conductive layer, a dielectric structure on the first patterned conductive layer, wherein the dielectric structure having a side surface, a second patterned conductive layer on the dielectric structure and extending on the side surface, and a third patterned conductive layer on the second patterned conductive layer and extending on the side surface. The present disclosure provides a semiconductor package including the semiconductor substrate. A method for manufacturing the semiconductor substrate and the semiconductor package is also provided.
    Type: Application
    Filed: July 17, 2018
    Publication date: January 23, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE