Patents Assigned to Advanced Semiconductor Engineering
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Publication number: 20240162612Abstract: The present disclosure provides an electronic device. The electronic device includes a first transceiving element, a second transceiving element disposed over the first transceiving element, and a radiating structure configured to radiate a first EM wave having a lower frequency and a second EM wave having a higher frequency. The first transceiving element and the second transceiving element are collectively configured to provide a higher gain or bandwidth for the first EM wave than for the second EM wave.Type: ApplicationFiled: November 10, 2022Publication date: May 16, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Po-An LIN, Guan-Wei CHEN, Shih-Wen LU
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Publication number: 20240164021Abstract: A manufacturing method of an embedded component package structure includes the following steps: providing a carrier and forming a semi-cured first dielectric layer on the carrier, the semi-cured first dielectric layer having a first surface; providing a component on the semi-cured first dielectric layer, and respectively providing heat energies from a top and a bottom of the component to cure the semi-cured first dielectric layer; forming a second dielectric layer on the first dielectric layer to cover the component; and forming a patterned circuit layer on the second dielectric layer, the patterned circuit layer being electrically connected to the component.Type: ApplicationFiled: January 23, 2024Publication date: May 16, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien-Fan CHEN, Chien-Hao WANG
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Publication number: 20240153920Abstract: An electronic device is disclosed. The electronic device includes a first conductive plate and a first electronic component. The first conductive plate includes a first connecting portion. The first electronic component supports the first conductive plate through the first connecting portion. The first connecting portion is electrically connected to the first electronic component and configured to buffer stress from the first conductive plate to the first electronic component.Type: ApplicationFiled: November 9, 2022Publication date: May 9, 2024Applicants: Advanced Semiconductor Engineering, Inc., UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.Inventors: Yi-Hung HOU, Yung-Fa CHEN, Sheng-Chia CHEN
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Publication number: 20240154642Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.Type: ApplicationFiled: January 16, 2024Publication date: May 9, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Shih-Wen LU, Chun-Jen CHEN, Po-Hsiang TSENG, Hsin-Han LIN, Ming-Lun YU
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Publication number: 20240155758Abstract: An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element is disposed over the first dielectric layer. The encapsulant encapsulates the electronic element and has a second CTE. The second dielectric layer is disposed over the encapsulant and having a third CTE. The second CTE ranges between the first CTE and the third CTE.Type: ApplicationFiled: November 4, 2022Publication date: May 9, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chien Lin CHANG CHIEN, Yuan-Chun TAI, Yu Hsin CHANG CHIEN, Chiu-Wen LEE, Chang Chi LEE
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Publication number: 20240145357Abstract: The present disclosure provides an electronic assembly including a semiconductor device package. The semiconductor device package includes a first package and a conductive element. The first package includes an electronic component and a protection layer covering the electronic component. The conductive element is supported by the protection layer and electrically connected with the electronic component through an electrical contact. A method for manufacturing a semiconductor device package is also provided in the present disclosure.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chang-Lin YEH, Jen-Chieh KAO
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Publication number: 20240145941Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Shih-Wen LU
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Publication number: 20240140785Abstract: A method of attaching a film is provided. The method includes providing a carrier tape. The carrier tape supports a film over a surface of the carrier tape. The method further includes moving the film to a position over an electronic device. The method further includes attaching the film to the electronic device.Type: ApplicationFiled: October 26, 2022Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventor: Chin-Song LEE
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Publication number: 20240145319Abstract: A semiconductor device package includes a supporting element, a transparent plate disposed on the supporting element, a semiconductor device disposed under the transparent plate, and a lid surrounding the transparent plate. The supporting element and the transparent plate define a channel.Type: ApplicationFiled: January 2, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Tsung-Yu LIN, Pei-Yu WANG, Chung-Wei HSU
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Publication number: 20240142727Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.Type: ApplicationFiled: January 9, 2024Publication date: May 2, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Sin-Yuan MU, Chia-Sheng CHENG
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Publication number: 20240128193Abstract: An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configured to transmit a power from outside of the electronic module to the electronic component. The second region is configured to dissipate heat from the electronic component.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Pao-Nan LEE, Chang Chi LEE, Jung Jui KANG
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Publication number: 20240130043Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun-Yen TING, Pao-Nan LEE, Hung-Chun KUO, Jung Jui KANG, Chang Chi LEE
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Publication number: 20240128206Abstract: A semiconductor device package comprises a semiconductor device, a first encapsulant surrounding the semiconductor device, a second encapsulant covering the semiconductor device and the first encapsulant, and a redistribution layer extending through the second encapsulant and electrically connected to the semiconductor device.Type: ApplicationFiled: December 5, 2023Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Peng YANG, Yuan-Feng CHIANG, Po-Wei LU
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Publication number: 20240126327Abstract: The present disclosure provides an electronic wearable device. The electronic wearable device includes a first module having a first contact and a second module having a second contact. The first contact is configured to keep electrical connection with the second contact in moving with respect to each other during a wearing period.Type: ApplicationFiled: October 14, 2022Publication date: April 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chao Wei LIU, Wei-Hao CHANG, Yung-I YEH, Jen-Chieh KAO, Tun-Ching PI, Ming-Hung CHEN, Hui-Ping JIAN, Shang-Lin WU
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Publication number: 20240120288Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a substrate, an encapsulant and an electronic component. The encapsulant is disposed over the substrate, and has a first top surface, a second top surface and a first lateral surface extending between the first top surface and the second top surface. A roughness of the first lateral surface is less than or equal to a roughness of the second top surface. The electronic component is disposed over the second top surface of the encapsulant and electrically connected to the substrate.Type: ApplicationFiled: October 7, 2022Publication date: April 11, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chih-Hsin LAI, Chih-Cheng LEE, Shao-Lun YANG, Wei-Chih CHO
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Publication number: 20240120640Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a carrier, an antenna element and a cladding element. The carrier defines a first area and a second area adjacent to the first area. The antenna element is in the first area. The cladding element covers the antenna element and is configured for enhancing antenna gain of the antenna element. The second area is exposed from the cladding element and is distant from the antenna element.Type: ApplicationFiled: December 18, 2023Publication date: April 11, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jenchun CHEN, Ya-Wen LIAO
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Publication number: 20240112848Abstract: A package structure is provided. The package structure includes an electronic component and a connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The connection element penetrates and contacts the magnetic layer and the conductive wire.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Wu Chou HSU, Hung Yi CHUANG
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Publication number: 20240112978Abstract: An electronic package is provided. The electronic package includes an insulating carrier, a first conductive layer, and an electronic component. The first conductive layer is disposed over the insulating carrier. The electronic component is disposed over the first conductive layer and electrically connected to the first conductive layer, wherein the insulating carrier is configured to dissipate heat from the electronic component to a second side of the insulating carrier opposite to a first side facing the electronic component.Type: ApplicationFiled: September 29, 2022Publication date: April 4, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Vikas GUPTA, Mark GERBER
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Publication number: 20240109768Abstract: A sensor device package and method of manufacturing the same are provided. The sensor device package includes a carrier, a sensor component, an encapsulation layer and a protection film. The sensor component is disposed on the carrier, and the sensor component includes an upper surface and edges. The encapsulation layer is disposed on the carrier and encapsulates the edges of the sensor component. The protection film covers at least a portion of the upper surface of the sensor component.Type: ApplicationFiled: December 11, 2023Publication date: April 4, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chieh-An YEH, Tai-Hung KUO
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Publication number: 20240113061Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.Type: ApplicationFiled: December 5, 2023Publication date: April 4, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Chi-Han CHEN, Chang-Yu LIN, Jr-Wei LIN, Chih-Pin HUNG
