Patents Assigned to Advanced Semiconductor Engineering
  • OPTICAL MODULE AND METHOD OF MAKING THE SAME
    Publication number: 20240102799
    Abstract: An optical module includes: a carrier; an optical element disposed on the upper side of the carrier; and a housing disposed on the upper side of the carrier, the housing defining an aperture exposing at least a portion of the optical element, an outer sidewall of the housing including at least one singulation portion disposed on the upper side of the carrier, wherein the singulation portion of the housing is a first portion of the housing, and wherein the housing further includes a second portion and a surface of the singulation portion of the housing is rougher than a surface of the second portion of the housing.
    Type: Application
    Filed: December 5, 2023
    Publication date: March 28, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Chung CHEN, Hsun-Wei CHAN, Lu-Ming LAI, Kuang-Hsiung CHEN
  • OPTOELECTRONIC PACKAGE
    Publication number: 20240094460
    Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Mei-Ju LU
  • FLEXIBLE PACKAGE
    Publication number: 20240096779
    Abstract: A flexible package is provided. The flexible package includes a first carrier and a second carrier. The second carrier is electrically connected to the first carrier. The second carrier is at least partially embedded in the first carrier, and an electrical connection interface between the first carrier and the second carrier is within the first carrier.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Wei-Hao CHANG
  • OPTICAL DEVICE INCLUDING AN OPTICAL COMPONENT AN ELECTRICAL COMPONENT, ASSEMBLY STRUCTURE INCLUDING AN OPTICAL COMPONENT AN ELECTRICAL COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240096864
    Abstract: An optical device includes an optical component and an electrical component. The optical component has a sensing surface and a backside surface opposite to the sensing surface. The electrical component is disposed adjacent to the backside surface of the optical component and configured to support the optical component. A portion of the backside surface of the optical component is exposed from the electrical component.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsiang-Cheng TSAI, Ying-Chung CHEN
  • OPTICAL MODULE
    Publication number: 20240094052
    Abstract: An optical module is disclosed. The optical module includes a carrier, an optical emitter disposed over the carrier, and a monitor disposed over the carrier and configured to adjust a property of a first light emitted from the optical emitter.
    Type: Application
    Filed: September 20, 2022
    Publication date: March 21, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Kuo Sin HUANG, Tien-Chia LIU, Ko-Fan TSAI, Cheng-Te CHOU, Yan-Te CHOU
  • SEMICONDUCTOR PACKAGE
    Publication number: 20240096862
    Abstract: A semiconductor package and a lid structure are disclosed. The semiconductor package includes a carrier, a lid structure, a first die, and a second die. The lid structure is disposed over the carrier and includes a gas inlet and a gas outlet. The first die is disposed over the carrier. The second die is disposed over the carrier. The lid structure includes a first protrusion pattern protruding toward the carrier and extending between the first die and the second die.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Ying-Chung CHEN
  • SEMICONDUCTOR DEVICE PACKAGE, ELECTRONIC ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240088001
    Abstract: A semiconductor device package includes a carrier, an electronic component, a connection element and an encapsulant. The electronic component is disposed on a surface of the carrier. The connection element is disposed on the surface and adjacent to an edge of the carrier. The encapsulant is disposed on the surface of the carrier. A portion of the connection element is exposed from an upper surface and an edge of the encapsulant.
    Type: Application
    Filed: September 19, 2023
    Publication date: March 14, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Lin HO, Chih-Cheng LEE, Chun Chen CHEN, Cheng Yuan CHEN
  • METHOD FOR MANUFACTURING A PACKAGE STRUCTURE
    Publication number: 20240088091
    Abstract: A method for manufacturing a package structure includes: providing a first electrical element and a second electrical element on a surface of a first carrier, wherein the second electrical element is shifted with respect to the first electrical element; and moving the first electrical element along at least one direction substantially parallel with the surface of the first carrier until a first surface of the first electrical element is substantially aligned with a first surface of the second electrical element from a top view.
    Type: Application
    Filed: September 8, 2022
    Publication date: March 14, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Lin SHIH, Chih-Cheng LEE
  • ELECTRONIC DEVICE
    Publication number: 20240072413
    Abstract: An electronic device is provided. The electronic device includes an antenna array including a plurality of antenna patterns collectively configured to provide a scan-angle coverage. Each of the antenna patterns includes a curved surface.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Cheng-Yu HO, Meng-Wei HSIEH, Chih-Pin HUNG
  • ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20240071945
    Abstract: An electronic device and a method for manufacturing the same are provided. The electronic device includes a first electronic component, a second electronic component and a conductive element. The conductive element includes a first portion and a second portion. The first portion is configured to block an electromagnetic interference between the first electronic component and the second electronic component. The second portion protrudes from the first portion and contacts a shielding layer.
    Type: Application
    Filed: August 31, 2022
    Publication date: February 29, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Zhi-Yuan LIN
  • PACKAGE STRUCTURES AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20240063159
    Abstract: A package structure is disclosed. The package structure includes a substrate including a conductive element and a plurality of wires having a surface area through which heat of the conductive element can be dissipated, lowering a bonding temperature of the conductive element. The package structure also includes a conductive layer disposed between the conductive element of the substrate and the plurality of wires. The conductive contact layer attaches the plurality of wires over the conductive element.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: An-Hsuan HSU, Chin-Li KAO
  • SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240063163
    Abstract: A semiconductor package structure includes a semiconductor device with an active surface, a conductive pillar on the conductive pad, an adhesion strengthening layer, and an encapsulant in contact with the adhesion strengthening layer. The conductive pillar has a side surface and a top surface. The adhesion strengthening layer is conformally disposed on the side surface of the conductive pillar and the active surface of the semiconductor device.
    Type: Application
    Filed: October 31, 2023
    Publication date: February 22, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin TSAI, Ming-Chi LIU, Yu-Ting LU, Kai-Chiang HSU, Che-Ting LIU
  • ELECTRONIC DEVICE
    Publication number: 20240055365
    Abstract: An electronic device is disclosed. The electronic device includes a first interconnection structure, and a first electronic component disposed over the first interconnection structure and having an active surface and a lateral surface. The electronic device also includes a power connection disposed between the first interconnection structure and the active surface of the first electronic component, and a first non-power connection extending along the lateral surface of the first electronic component and electrically connected to the first interconnection structure. The electronic device also includes a second non-power connection disposed between the first interconnection structure and the active surface of the first electronic component. The second non-power connection is configured to block an electromagnetic interference (EMI) between the power connection and the first non-power connection.
    Type: Application
    Filed: August 11, 2022
    Publication date: February 15, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Po-I WU, Jung Jui KANG, Chang Chi LEE, Pao-Nan LEE, Ming-Fong JHONG
  • ELECTRONIC DEVICE
    Publication number: 20240038678
    Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsin-Yu CHEN, Huei-Shyong CHO, Shih-Wen LU
  • PACKAGE STRUCTURE
    Publication number: 20240038698
    Abstract: A package structure is provided. The package structure includes a substrate, a conductive pad, and a conductive wire. The conductive pad is disposed over the substrate. The conductive wire includes an end portion connected to the conductive pad, wherein a grain arrangement of the end portion is distinct from a grain arrangement of the conductive pad.
    Type: Application
    Filed: June 6, 2023
    Publication date: February 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventor: Erh-Ju LIN
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240038677
    Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a protective element, and a sensor device. The protective element encapsulates the carrier. The sensor device is embedded in the carrier and the protective element. The sensor device includes a sensing portion and a protective portion adjacent to the sensing portion, and the protective portion of the sensor device has a first surface exposed from the protective element and the carrier.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Chung CHEN, Lu-Ming LAI
  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20240038712
    Abstract: A semiconductor device package and a method of manufacturing a semiconductor device package are provided. The semiconductor device package includes a carrier, a first component, a second component, and a protective element. The first component and the second component are arranged side by side in a first direction over the carrier. The protective element is disposed over a top surface of the carrier and extending from space under the first component toward a space under the second component. The protective element includes a first portion and a second portion protruded oppositely from edges of the first component by different distances, and the first portion and the second portion are arranged in a second direction angled with the first direction.
    Type: Application
    Filed: July 28, 2022
    Publication date: February 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Shih-Yuan SUN, Chieh-Chen FU
  • ELECTRONIC DEVICES
    Publication number: 20240038679
    Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component, a first conductive element, and a voltage regulator. The voltage regulator is disposed adjacent to the first electronic component. The voltage regulator is configured to regulate a first voltage from the first EMI shielding layer and to provide the first electronic component with a second voltage.
    Type: Application
    Filed: July 29, 2022
    Publication date: February 1, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Jung Jui KANG, Chang Chi LEE
  • ELECTRONIC DEVICE
    Publication number: 20240030135
    Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first region and a second region distinct from the first region. The electronic device also includes an electronic component covering the first region and at least partially exposing the second region. The electronic device also includes a first power regulating element in the second region of the carrier and a second power regulating element. The second power regulating element is disposed adjacent to the first power regulating element and electrically connected to the electronic component through the first power regulating element to provide a first power path.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Pao-Nan LEE, Jung Jui KANG, Chang Chi LEE
  • ELECTRONIC DEVICE
    Publication number: 20240030125
    Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a first die, a second die, and a third die. The first die is disposed below the first circuit structure. The second die is disposed below the first circuit structure. The third die is disposed above the first circuit structure and electrically connects the first die to the second die. The first die communicates with the second die through the third die.
    Type: Application
    Filed: July 21, 2022
    Publication date: January 25, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung Jui KANG, Chang Chi LEE