Abstract: A digital processor and method of operation utilize an alias address space to implement variable length instruction encoding on a legacy processor. The method includes storing instructions of a code sequence in memory; generating instruction addresses of the code sequence; automatically switching between a first operating mode and a second operating mode in response to a transition in instruction addresses between a first address space and a second address space, wherein addresses in the first and second address spaces access a common memory space; in the first operating mode, accessing instructions in the first address space; in the second operating mode, accessing instructions in the second address space; and executing the accessed instructions of the code sequence. Instructions of different instruction lengths may be utilized in the first and second operating modes.

Abstract: Embodiments of the present invention are directed to an image processing system. The image processing system may comprise a content detection module having an input to receive a sequence of input pixels and configured to generate an adjustable parameter based on detected differences between adjacent pairs of input pixels, and a digital filter having an input for the sequence of input pixels and a control input coupled to an output of the content detection module. The digital filter may adjust filtering coefficients according to the parameter.

Abstract: A nickel-based material is used on one or both wafers to be bonded, and the two wafers are bonded at low temperature and pressure through interdiffusion of the nickel-based material with either another nickel-based material or aluminum. In various embodiments, nickel-based walls are formed on one wafer, and corresponding walls are formed on the other wafer from a nickel-based material or aluminum. The walls of the two wafers are placed in contact with one another under sufficient pressure and temperature to cause bonding of the walls through interdiffusion.

Abstract: A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

Abstract: A transceiver for use in a bidirectional optical communication link over a multimode channel is provided. The transceiver includes a single transverse mode light source in a transmitter. A waveguide or fiber based bidirectional coupler projects the transmitter mode to the high modes of the multimode channel. A detector coupled to predominantly all the modes of the channel via the waveguide or fiber based bidirectional coupler.

Abstract: An embodiment of an amplifier circuit includes a plurality of amplifiers connected between input and output terminals to form at least partially parallel amplification paths between the terminals. A first plurality of the amplification paths include series-connected pluralities of the amplifiers and share a common first series-connected amplifier, and a second plurality of the amplification paths have different first amplifiers. Optionally, a third plurality of the amplification paths include series-connected pluralities of the amplifiers and share a common last series-connected amplifier, and a fourth plurality of the amplification paths have different last amplifiers. Alternatively, a first plurality of the amplification paths include series-connected pluralities of the amplifiers and share a common last series-connected amplifier, and a second plurality of the amplification paths have different last amplifiers.

Abstract: A method of manufacturing semiconductor devices by applying a pattern of adhesive pads on an active surface of a semiconductor wafer, the semiconductor wafer product so made and a stacked die package in which an adhesive wall leaves an air gap atop a bottom die. The wall may be in the form of a ring of adhesive about a central hollow area. The wafer carrying the pattern of adhesive pads on its active surface is singulated into individual dies, each die having an adhesive pad thereon. The bottom die is attached to a base with an adhesive which cures without curing the adhesive pad.

Abstract: Reference network embodiments are provided for use in pipelined signal converter systems. The network embodiments are fast and power efficient and they generate low-impedance reference signals through the use of at least one output transistor, a diode-coupled transistor coupled to the output transistor, and a controller. The controller is configured to provide a backgate voltage to the diode-coupled transistor to thereby establish a substantially-constant output current. The controller is further configured to provide a gate voltage to the output transistor to establish a reference voltage.

Abstract: A circuit includes an NMOS transistor having a drain and a source, a p-well containing the drain and the source, an n-well under the p-well, and a first well switch configured to selectively connect the n-well to a predetermined voltage in response to an enable phase of a first switching signal. The first well switch can be configured to connect the n-well to the predetermined voltage during the enable phase of the first switching signal and to electrically float the n-well during a non-enable phase of the first switching signal.

Abstract: Channel estimation for high mobility OFDM channels is achieved by identifying a set of channel path delays from an OFDM symbol stream including carrier data, inter-channel interference noise and channel noise; determining the average channel impulse response for the identified set of channel path delays in each symbol; storing the average channel impulse responses for the identified channel path delays; generating a path delay curvature for each channel path delay in each symbol based on stored average channel impulse responses for the identified channel path delays; estimating the carrier data in the symbols in the OFDM symbol stream in the presence of inter-channel interference noise and channel noise from the OFDM symbol stream and the average impulse responses for the identified channel path delays; reconstructing the inter-channel interference noise in response to the path delay curvature, the identified set of channel path delays and estimated carrier data; and subtracting the reconstructed inter-channe

Abstract: Embodiments may include a data receiver having input for a current signal. The data receiver may further include a current generator to generate a reference current for comparison against the input current signal. The data receiver may also include a data converter having an input coupled to an intermediate node of the data receiver, the data converter comprising a plurality of cascaded stages with intermediate nodes among the stages.

Abstract: An exemplary method and system of addressing an integrated circuit within a daisy chain network. In the exemplary method, the address of the integrated circuit may be initialized to a predetermined initial address. The integrated circuit may receive a command that includes a type identifier and an address field. Based on the type identifier, the type of command may be determined. As a result of the determination, reading the address from the address field. The read address may be stored in a register. The address may be modified, and may be output. Upon receipt of the data or a command, the integrity of the data including data within the received command, may be confirmed by an error checking algorithm.

Abstract: A MEMS microphone has a base, a backplate, and a backplate spring suspending the backplate from the base. The microphone also has a diaphragm forming a variable capacitor with the backplate.

Abstract: A method and computer program product for adding additional functionality to a graphical control for use in a computer program. The method requires providing a graphical control that is displayable on a display device where the graphical control has at least one associated input or one associated output. Initially, the graphical control does not have an associated function. A user can then select a function from a list of functions to associate with the graphical control. The list of functions is associated with computer code for implementing the functions on a particular digital signal processor. The computer system determines whether a new input or output needs to be added to the graphical control based upon a selected function from the list of functions. The computer system also determines if the graphical control should be stacked or repeated. A plurality of functions may be associated with a single graphical control.

Abstract: A micromachined microphone is formed from a silicon or silicon-on-insulator (SOI) wafer. A fixed sensing electrode for the microphone is formed from a top silicon layer of the wafer. Various polysilicon microphone structures are formed above a front side of the top silicon layer by depositing at least one oxide layer, forming the structures, and then removing a portion of the oxide underlying the structures from a back side of the top silicon layer through trenches formed through the top silicon layer. The trenches allow sound waves to reach the diaphragm from the back side of the top silicon layer. In an SOI wafer, a cavity is formed through a bottom silicon layer and an intermediate oxide layer to expose the trenches for both removing the oxide and allowing the sound waves to reach the diaphragm. An inertial sensor may be formed on the same wafer, with various inertial sensor structures formed at substantially the same time and using substantially the same processes as corresponding microphone structures.

Abstract: A charge pump circuit can include a first pair of transistors having connected sources and gates configured to receive a first pump signal and an inverse first pump signal and a second pair of transistors having connected drains and gates configured to receive a second pump signal and an inverse second pump signal, sources of the second pair of transistors being connected to drains of the first pair of transistors at first and second connection nodes, wherein the first and second pair of transistors are all of the same transistor type and provide an output current in response to the first and second pump signals. The charge pump circuit can also include a voltage stabilizer circuit connected to the second connection node and configured to regulate the second connection node to have a voltage within a predetermined range about a selectable voltage. Duty cycle stabilizers and control loops such as delay locked loops can include the charge pump circuit.

Abstract: A method and apparatus for maintaining communication between an HDMI sources and an HDMI sink by monitoring data received from the HDMI source, and, based on the monitoring, dynamically switching between a first and a second mode without user intervention. The device may include a head end connector, a tail end connector and a cable. The head end connector may include a controller, a memory and an electrical signal transceiver. The controller may monitor data output from the source, and based on the outputted data; the controller may determine whether to maintain a first communication method or a second communication method.

Abstract: A voltage transformation circuit comprising a first input, a second input, a first output, first and second impedances and a current mirror having master and slave terminals, wherein the first impedance is connected between the first input and the master terminal of the current mirror, the second impedance is connected between the second input and the slave terminal of the current mirror, and the first output is connected to the slave terminal of the current mirror.

Abstract: Two or more buffers may configured and arranged such that a quiescent current that flows through and biases a first buffer also flows through and biases a second buffer. The first and second buffers may, for example, be source followers used as reference buffers that drive inputs of a switched-capacitor circuit.

Abstract: Rather than increasing the mass of the structure, the structure in a sensor system suspends its substrate from some mechanical ground. Motion of the substrate relative to the mechanical ground thus provides the movement information. To those ends, the sensor system includes a base, a substrate, and a flexible member suspended from at least a portion of the substrate. At least a portion of the flexible member is capable of moving relative to at least a portion of the substrate. In addition, the flexible member is secured to the base, thus causing the substrate to be movable relative to the base. Moreover, the mass of the substrate is greater than the mass of the flexible member. The substrate and flexible member are configured to interact to produce a motion signal identifying movement of the base.