Abstract: The present disclosure relates to a semiconductor structure and a manufacturing method thereof. The method of manufacturing a semiconductor structure includes: providing a base; forming a plurality of first trenches arranged in parallel at intervals and extending along a first direction, and an initial active region between two adjacent ones of the first trenches, wherein the initial active region includes a first initial source-drain region close to a bottom of the first trench, a second initial source-drain region away from the bottom of the first trench, and an initial channel region located between the first initial source-drain region and the second initial source-drain region; forming a protective dielectric layer, wherein the protective dielectric layer covers a sidewall of the second initial source-drain region and a sidewall of the initial channel region; thinning the first initial source-drain region.

Abstract: Embodiments of the present application provide a memory and a method for forming the memory. The method includes: providing a substrate, and forming a bit line structure on the substrate and a first protective layer; forming a dielectric layer with which a gap between the adjacent bit line structures is filled; forming a second protective layer to cover a top surface of the first protective layer and a top surface of the dielectric layer; removing part of the dielectric layer and part of the second protective layer to form a capacitor contact hole, and exposing the first protective layer between two adjacent ones of the capacitor contact holes; forming a conductive layer with which the capacitor contact hole is filled and the top surface of the exposed first protective layer is covered, and etching part of the conductive layer to form a separate capacitor contact structure.

Abstract: A base die is configured to: receive a first data and a first encoded data in a writing phase, where the first encoded data is obtained by performing a first error correction code (ECC) encoding processing on the first data, perform a second ECC encoding processing on a first sub-data to generate a second encoded data, and transmit a second data to a memory die in the writing phase; where the second data includes the first sub-data, a second sub-data, the first encoded data, and the second encoded data; the base die is further configured to: receive the second data from the memory die in a reading phase, perform first error checking and correction processing on the first sub-data and the second encoded data, and transmit a third data in the reading phase.

Abstract: A refresh circuit and a memory. The refresh circuit includes: a row hammer address generation module, configured to receive a row activate command, a precharge command, and a single row address corresponding to the row activate command, and output a row hammer address corresponding to the single row address, where each of the single row addresses corresponds to a word line, the row activate command is configured to activate a word line pointed to by the single row address, and the precharge command is configured to inactivate the word line; and output the row hammer address if a single activation time of the word line is greater than a preset time; and a signal selector, configured to receive the row hammer address and a regular refresh address, and at least output the row hammer address.

Abstract: A state detection circuit of an anti-fuse memory cell includes a first switching element, having a first end connected to a power supply, a second end connected to a first node, and a control end connected to a controller; an anti-fuse memory cell array including a plurality of anti-fuse memory cell sub-arrays, bit lines of the plurality of anti-fuse memory cell sub-arrays being all connected to the first node, and word lines of the plurality of anti-fuse memory cell sub-arrays being all connected to the controller; and a comparator, having a first input end connected to the first node, and a second input end connected to a reference voltage.

Abstract: The data transmission circuit includes: at least two data transmission structures. Each data transmission structure includes a memory transmission terminal, a bus transmission terminal, and an interactive transmission terminal. Data inputted from the memory transmission terminal is outputted through the bus transmission terminal or the interactive transmission terminal. Data inputted from the bus transmission terminal is outputted through the memory transmission terminal or the interactive transmission terminal. Data inputted from the interactive transmission terminal is outputted through the bus transmission terminal or the memory transmission terminal. A control module receives an input control signal and an adjustment control signal that are provided by the memory; the control module is configured to output the input control signal in a delayed manner based on the adjustment control signal, so as to generate an output control signal corresponding to the input control signal.

Abstract: The embodiments of the present disclosure relate to the technical field of semiconductors and provide a storage system and a data reading method thereof. The storage system is configured to: enter a read data copy mode in response to a read-copy enable signal; if at least two groups of data in multiple groups of data exported from a memory array are a same in the read data copy mode, define the at least two groups of data as a category; export an identification signal that is used to indicate a data copy; transmit one group of data in the category to a corresponding data port; and disconnect a transmission path that is used to transmit another group of data in the category to a corresponding data port.

Abstract: Embodiments provide a method for packaging a semiconductor, a semiconductor package structure, and a package. The method includes: providing a substrate wafer having a first surface and a second surface arranged opposite to each other, the first surface having a plurality of grooves, a plurality of electrically conductive pillars being provided at a bottom of the groove, and the electrically conductive pillar penetrating through the bottom of the groove to the second surface; providing a plurality of semiconductor die stacks; placing the semiconductor die stack in the groove; and covering a cover plate wafer on the first surface of the substrate wafer to seal up the groove so as to form a semiconductor package structure, a gap between the substrate wafer, the semiconductor die stack and the cover plate wafer being not filled with a filler.

Abstract: The present disclosure provides a method for manufacturing a memory, including: providing a substrate, and forming a sacrificial layer on the substrate; patterning the sacrificial layer, and forming a plurality of discrete pseudo bit line layers on the substrate; forming a support layer, the support layer filling areas between the adjacent pseudo bit line layers; removing the pseudo bit line layers to form bit line spaces between adjacent parts of the support layer; forming bit line structures, the bit line structures filling the bit line spaces, and the bit line structures including a bit line conductive layer and a bit line insulating layer sequentially stacked; and removing the support layer, and forming openings between the adjacent bit line structures.

Abstract: This application relates to a memory device and a method for manufacturing the same, including: a substrate on which an insulation structure and a plurality of first active structures are formed is provided. The plurality of first active structures are arranged at intervals in the insulation structure. A word line conductive layer is formed on the substrate by a physical vapor deposition process. The word line conductive layer is patterned and etched to obtain a plurality of word line structures arranged in parallel and at intervals and filling slots located between adjacent word line structures. The filling slots comprise first filling slots that expose both parts of top surfaces of the first active structures and parts of the top surface of the insulation structure. Second active structures are formed in the first filling slots, and isolation structures are formed in the first filling slots.

Abstract: The disclosed semiconductor structure includes a semiconductor substrate, a metal pad, a bump, a first solder layer, a barrier layer, and a second solder layer. The metal pad is disposed on the semiconductor substrate; the bump is arranged on the metal pad; the barrier layer is configured on the side of the bump away from the metal pad. The barrier layer includes a first surface and a second surface. The first solder layer is arranged between the bump and the first surface of the barrier layer. The second solder layer is configured on the second surface of the barrier layer. Since the first solder layer and the second solder layer are formed by reflowed and melt solder at a high temperature and can be stretched, the height of the second solder can be adjusted automatically, which reduces the non-wetting problem caused by the package substrate deformation after reflow.

Abstract: The present disclosure provides a semiconductor structure, a forming method thereof, and a semiconductor device, and relates to the technical field of semiconductor packaging processes. The method includes: providing a semiconductor substrate; forming an oxide layer on a surface of the semiconductor substrate, and etching the oxide layer to form a recess, where a through-silicon via (TSV) is provided in the semiconductor substrate and the oxide layer, and an upper end of the TSV is connected to the recess; depositing a metal layer on a surface of the recess, and forming an opening in the metal layer on a bottom surface of the recess, where the opening is connected to the TSV; and filling a second conductive material into the recess, and forming a hole in the second conductive material above the opening.

Abstract: A Fail Bit (FB) repair method includes: a bank to be repaired of a chip to be repaired is determined; first repair processing is performed on a first FB using a redundant circuit; a bit position of a second FB in each target repair bank is determined, and second repair processing is performed on the second FB; an unrepaired FB in each target repair bank is determined, and candidate repair combinations of the unrepaired FBs and a candidate combination count are determined; and if the candidate combination count is greater than a combination count threshold, a target repair position is determined, and repair processing is performed on the target repair position using a Redundant Word-Line (RWL), the target repair position being a position of an FB that maximally reduces the candidate combination count after repair processing.

Abstract: The present disclosure provides an electrical test structure, a semiconductor structure and an electrical test method. In the electrical test structure, in a first direction, the electrical test structure includes a first layer, an interconnect hole and a second layer arranged in a stack, and the interconnect hole is in contact with the first layer; the second layer includes a body part and a test part, and the test part is connected to the body part; the interconnect hole is configured as, when an offset distance of the interconnect hole relative to a preset position in a second direction is less than a first preset distance, or an offset distance of the interconnect hole relative to the preset position in a third direction is less than a second preset distance, the interconnect hole is spaced apart from the test part.

Abstract: The present application relates to track barcode automatic mounting system and method of an automatic material handling system (AMHS), which system comprises: a running track, at whose position corresponding to an unloading port is provided a barcode mounting region; an overhead hoist transport, installed on the running track, and being moveable along the running track; a locating device, for determining whether the overhead hoist transport has moved to a designated barcode mounting region; a barcode automatic printing and mounting device, disposed on the overhead hoist transport; and a manually operated controller, for sending a movement instruction to the overhead hoist transport to control the overhead hoist transport to move to the designated barcode mounting region, and sending a print confirmation instruction to the barcode automatic printing and mounting device after the overhead hoist transport has moved to the designated barcode mounting region.

Abstract: A sense amplifier, a control method of the sense amplifier, and a memory are provided. The sense amplifier includes: a first power input terminal, a second power input terminal, a first switch transistor, a second switch transistor, a third switch transistor, a fourth switch transistor, a fifth switch transistor, a first negative-channel metal-oxide semiconductor (NMOS) transistor, a second NMOS transistor, a first positive-channel metal-oxide semiconductor (PMOS) transistor and a second PMOS transistor.

Abstract: Embodiments of the present application relate to a method for manufacturing a semiconductor structure, includes: forming a contact metal layer on a silicon substrate; performing a plasma treatment process, and forming an oxygen isolation layer on a surface of the contact metal layer; and performing a silicidation reaction process, and converting the contact metal layer into a metal silicide layer.

Abstract: A method for manufacturing a semiconductor memory includes: providing a portion to be processed, and performing a preset process step on the portion to be processed at least after a minimum waiting time; before performing the preset process step, performing a thermal oxidation process on the portion to be processed; and before performing the preset process step, performing a cleaning process, the cleaning process being used to remove oxides from the surface of the portion to be processed, the oxides being wholly or partly generated by the thermal oxidation process.

Abstract: The present disclosure provides a standard cell template and a semiconductor structure. The standard cell template includes a first well region and a second well region, arranged along a first direction; a first gate pattern, located in the first well region and extending along the first direction, for defining a first gate; a second gate pattern, located in the second well region and extending along the first direction, for defining a second gate; and a gate electrical connection pattern, located between the first gate pattern and the second gate pattern, for defining a gate electrical connection structure; where the gate electrical connection structure is arranged on the same layer as the first gate and the second gate to electrically connect the first gate and/or the second gate.

Abstract: A preparation method of a semiconductor structure includes: providing a substrate, and forming a groove on the substrate by etching; forming a first dielectric layer on a side wall of the groove; forming a first electrode on the bottom of the groove and on an inner surface of the first dielectric layer; forming a second dielectric layer on a surface of the first electrode; and forming a second electrode on a surface of the second dielectric layer.