Abstract: A method for testing a memory chip includes the following: test data is written into memory cells of a memory chip to be tested; stored data is read from memory cells; a test result of the memory chip to be tested is generated according to the test data and the stored data. A current voltage of bit line precharge (VBLP) of the memory chip to be tested is smaller than a standard VBLP of the memory chip to be tested, and/or a current sensing delay time (SDT) of the memory chip to be tested is smaller than a standard SDT of the memory chip to be tested.

Abstract: A method and device for testing a memory and a method for simulated testing include operations as follows. First data is written into a to-be-tested storage unit through a Sense Amplifier (SA), second data different from the first data is written into the storage unit through the SA, and an amplification duration of the SA is shortened during the writing the second data, and data stored in the storage unit is read, and whether the storage unit is abnormal is determined according to the read data.

Abstract: A package structure includes the following: a logic die; and a plurality of core dies sequentially stacked on the logic die along a vertical direction, in which the plurality of core dies include a first core die and a second core die interconnected through a hybrid bonding member; the hybrid bonding member includes: a first contact pad located on a surface of the first core die; and a second contact pad located on a surface of the second core die; the first contact pad is in contact bonding with the second contact pad.

Abstract: A voltage detection circuit and a charge pump circuit using the voltage detection circuit are provided. The voltage detection circuit includes: a voltage raising circuit configured to adjust a voltage to be measured and then output an adjusted voltage, where the adjusted voltage is equal to the sum of the voltage to be measured and a reference voltage; and the reference voltage is generated by a combination of a first voltage with a positive temperature coefficient and a second voltage with a negative temperature coefficient.

Abstract: A memory circuit includes a pre-charging circuit and a control circuit. The pre-charging circuit includes a first pre-charging unit, a second pre-charging unit, a first power supply terminal, a second power supply terminal, a first control terminal, a second control terminal and a data terminal; the first pre-charging unit is connected with the first power supply terminal, the first control terminal and the data terminal; the second pre-charging unit is connected with the second power supply terminal, the second control terminal and the data terminal. The control circuit is configured to in response to a memory being in a row active state and not performing a reading-writing operation, control, through the second pre-charging unit, the data terminal and the second power supply terminal to be disconnected, and control, through the first pre-charging unit, the data terminal and the first power supply terminal to be disconnected.

Abstract: A latch circuit includes a latch module, a set control module, a reset control module and a clock module, wherein the latch module is employed for latching data input by a data module, the set control module is employed for controlling the latch module to output a high-level signal, the reset control module is employed for controlling the latch module to output a low-level signal, and the clock module is employed for providing a readout clock signal to the latch module.

Abstract: Embodiments of the present application provide a method and apparatus for determining a refresh counter of a DRAM. The method includes: writing data to a target memory cell connected with a target word line in the DRAM, and controlling the DRAM to perform refreshes starting from a preset word line according to a preset rule; determining, according to whether the data can be read accurately from the target memory cell after the refreshes, an intermediate refresh counter of refreshes on the target word line; and controlling, based on the intermediate refresh counter, the DRAM to perform refreshes starting from the target word line according to the preset rule, and determining the refresh counter of the DRAM according to whether the data can be read accurately from the target memory cell after the refreshes.

Abstract: A clock generation circuit, equidistant four-phase signal generation method and memory are provided. The circuit includes: a four-phase clock generation circuit for receiving an internal clock signal and complementary clock signal of a memory to which the clock generation circuit belongs, configured to generate a first, second, third and fourth clock signals with the same cycle; a signal delay circuit configured to perform signal delay on the first clock signal, second clock signal, third clock signal and fourth clock signal respectively based on the delay command, herein the delays of the first clock signal, second clock signal, third clock signal and fourth clock signal are different; a signal loading circuit configured to generate a first indication signal and second indication signal; and a test circuit configured to perform a duty cycle test based on the first indication signal and second indication signal to acquire equidistant parallel clock signals.

Abstract: Embodiments of the disclosure, there is provided a method, a system for adjusting the memory, and a semiconductor device. The method for adjusting the memory includes: acquiring a mapping relationship between a temperature of a transistor, an equivalent width-length ratio of a sense amplifier transistor in a sense amplifier and an actual time at which the data is written into the memory; acquiring a current temperature of the transistor; and adjusting the equivalent width-length ratio, based on the current temperature and the mapping relationship, so that the actual time at which the data is written into the memory corresponding to the adjusted equivalent width-length ratio is within a preset writing time.

Abstract: A storage container includes: a sidewall portion, a seal portion and a movable member. The sidewall portion, the seal portion and the movable member define an accommodation space. The seal portion is adapted to seal a top of the sidewall portion, and the seal portion is provided with a hole communicated with the accommodation space. The movable member is adapted to seal a bottom of the sidewall portion, and further adapted to move up and down in parallel to a direction of the bottom of the sidewall portion pointing to the top. The movable member is configured to connect a control device. The control device controls the movable member to move up and down in a direction of the bottom of the sidewall portion pointing to the top.

Abstract: A method for manufacturing a semiconductor device includes providing a semiconductor substrate including a first and second regions; forming a first dielectric layer on the semiconductor substrate; forming a temporary layer on the first dielectric layer; performing a first heat treatment process on the first dielectric layer and the temporary layer; removing the temporary layer to expose the first dielectric layer; and performing a second heat treatment process on the first dielectric layer.

Abstract: An ejector pin structure at least includes an end part and an ejector rod. The end part includes a convex structure and an inverted trapezoid-like structure located below the convex structure. The convex structure is configured to support an object to be processed. A projection area of the convex structure in a horizontal plane is less than a projection area of the inverted trapezoid-like structure in the horizontal plane.

Abstract: A device for wafer bonding alignment includes: a first fixing apparatus, configured to fix a first wafer, a first alignment mark being disposed on the first wafer; a second fixing apparatus, configured to fix a second wafer, a second alignment mark being disposed on the second wafer, the second fixing apparatus being disposed opposite to the first fixing apparatus; a reflection apparatus, located between the first fixing apparatus and the second fixing apparatus; and a mark reader, reading position information of the first alignment mark and the second alignment mark using the reflection apparatus to align the first wafer fixed on the first fixing apparatus and the second wafer fixed on the second fixing apparatus.

Abstract: The method for forming overlay marks includes: providing a substrate, a surface of the substrate having a mark layer and a first mask layer; forming first trenches and second trenches in the first mask layer; forming a spacer layer covering side walls of the first trenches and side walls of the second trenches; backfilling the first trenches and the second trenches; removing the spacer layer; and etching the mark layer and forming main overlay marks and dummy overlay marks.

Abstract: A wafer bonding device includes: a first fixing apparatus fixing a first wafer, on which a first alignment mark is disposed; a second fixing apparatus fixing a second wafer, on which a second alignment mark is disposed, the second fixing apparatus being disposed opposite to the first fixing apparatus; a reflection member between the first and second fixing apparatuses; a mark reader which reads position information about the first and second alignment marks by means of the reflection member, for aligning the first wafer with the second wafer; and a heating apparatus, configured to heat the first wafer or the second wafer to thermally expand the first wafer or the second wafer so that the first alignment mark or the second alignment mark is located at a central position of a field of view of the mark reader. A wafer bonding method also is involved.

Abstract: An apparatus for analyzing a circuit includes: an information module, configured to obtain a plurality of layout cells; an environment configuration module, configured to set, based on types or parameters or combinations of the types and the parameters of the plurality of layout units, a plurality of LPE environments, each corresponding to a respective one of the types, the parameters, or the combinations; and a batch processing module, configured to, for each of the LPE environments, extract parasitic parameter netlists of more than one of the plurality of layout units in the LPE environment in batches.

Abstract: An address decoding circuit includes a decoding unit corresponding to a bank group and including first NAND gates, an address selection signal outputted by each first NAND gate controls a corresponding bank in the bank group corresponding to the decoding unit. The first NAND gate includes a first input end connected to an address signal of a bank corresponding to the first NAND gate and a second input end connected to an output end of a second NAND gate or a third NAND gate, the second NAND gate includes a first input end connected to an enable signal and a second input end connected to a control signal, and the third NAND gate includes a first input end connected to the enable signal and a second input end connected to an inverted signal of the control signal.

Abstract: A method for forming a semiconductor device includes: providing a substrate and a stacked structure covering the substrate and including alternately stacked dielectric layers and sacrificial layers; forming multiple isolation layers extending in a first direction and arranged in a second direction in the stacked structure, the first direction being perpendicular to the substrate surface and the second direction being perpendicular to the first direction; forming a bit line between two adjacent ones of the isolation layers and removing the sacrificial layers; forming capacitor via holes along a third direction at vacancies of the dielectric structure formed after removing the sacrificial layers, the third, first and second directions being perpendicular; forming transistors and capacitors sequentially in the capacitor via holes based on bit lines, the capacitors being parallel to the substrate surface; and forming a word line extending in the second direction between two adjacent ones of the transistors.

Abstract: A control amplifying circuit includes a power supply output circuit, an isolation control circuit and an amplifying circuit. The power supply output circuit is configured to receive a power supply switching signal, and select one preset voltage value from at least two preset voltage values according to the power supply switching signal to output as a preset power supply signal. The isolation control circuit is configured to receive a control command signal and the preset power supply signal, and generate an isolation control signal according to the control command signal. The amplifying circuit is configured to receive the isolation control signal and a signal to be processed, and amplify the signal to be processed based on the isolation control signal to obtain a target amplified signal.

Abstract: An equalization circuit structure includes a semiconductor substrate including an equalization active region; a gate layer including a gate pattern and a power supply line, wherein the gate pattern is disposed on the equalization active region and configured for forming a transistor unit with the equalization active region, and the power supply line electrically connects the equalization active region with an external power supply and is configured for supplying power to the transistor unit.