Abstract: A sense amplifier includes an amplifying circuit and a voltage equalizing circuit. The amplifying circuit includes: a first P-type transistor, having a first terminal connected to a third node, a second terminal connected to a first node, and a gate connected to a first bit line; a second P-type transistor, having a first terminal connected to the third node, a second terminal connected to a second node, and a gate connected to a second bit line; a first N-type transistor, having a first terminal connected to the first node, a second terminal connected to a fourth node, and a gate connected to the first bit line; a second N-type transistor, having a first terminal connected to the second node, a second terminal connected to the fourth node, a gate connected to the second bit line. The voltage equalizing circuit is connected between the first node and the second node.

Abstract: A test method for testing connectivity of a semiconductor structure includes operations as follows. A semiconductor structure and a detection transistor are provided. The semiconductor structure includes a through silicon via structure having a first terminal and a second terminal arranged to be opposite. An intrinsic conductivity factor of the detection transistor is obtained. The detection transistor is turned on upon receiving a test signal, and a test voltage is provided to the second terminal, to enable the detection transistor to operate in a deep triode region, and a current flowing through the second terminal is obtained during operation of the detection transistor in the deep triode region. A resistance of the through silicon via structure is obtained based on the intrinsic conductivity factor, an operating voltage, the test voltage, and the current flowing through the second terminal.

Abstract: An electrostatic protection circuit connected with an internal circuit is provided. The electrostatic protection circuit includes: a first circuit, a first diode connected in parallel with the first circuit, a second circuit, and a second diode connected in parallel with the second circuit. The first circuit is connected between a power supply pad and an internal circuit input terminal. The second circuit is connected between the internal circuit input terminal and a ground pad. The first circuit and the second circuit are diode-triggered silicon controlled rectifier circuits. The technical solution of the disclosure can improve electrostatic protection capability of a charged device model of a chip.

Abstract: A semiconductor memory includes storage arrays, at least one verification module and gating circuits. Each verification module corresponds to multiple storage arrays. The verification module is configured to verify whether an error occurs in data information of the corresponding storage arrays. Each verification module is connected to a group of global data buses. The gating circuits are respectively connected to the storage arrays and the global data buses, and the gating circuits are configured to control on and off of a data transmission path connecting the global data buses to the storage arrays.

Abstract: An anti-fuse memory circuit includes: a memory array including multiple anti-fuse memory cells; bit lines, each connected to the anti-fuse memory cells arranged in extension direction of the bit line, each anti-fuse memory cell being electrically connected to respective one of bit lines through first switch transistor; word lines, each connected to first switch transistors arranged in extension direction of word line; a second switch transistor connects one of the bit lines to transmission wire; a reading circuit, having first input terminal connected to the transmission wire, second input terminal for receiving reference voltage, and sampling input terminal for receiving sampling signal; and a signal generation circuit for generating sampling signal according to precharge voltage and precharge signal, where precharge signal is used for instructing to precharge transmission wire to precharge voltage, and delay duration between sampling signal and precharge signal is positively correlated with voltage amplitud

Abstract: A detection method includes: determining process data of a new process; according to the process data of the new process, detecting, by a first production system, whether a wafer carrier type of the new process matches an acceptable level of a corresponding process step or not and whether the new process matches a flag of the corresponding process step or not; if not, determining that the process data does not pass the detection and outputting first detection information; or if the wafer carrier type of the new process matches the acceptable level of the corresponding process step and the new process matches the flag of the corresponding process step, detecting, by a second production system, if the second production system detects a mismatch, determining that the process data does not pass the detection and outputting second detection information.

Abstract: A Non Conductive Film (NCF) at least includes a first film layer and a second film layer. A surface of the first film layer is provided with a grid-shaped groove structure, and a depth of each groove of the groove structure is less than a thickness of the first film layer. The second film layer is located in the groove in the surface of the first film layer. The fluidity of the first film layer is greater than the fluidity of the second film layer under the same condition.

Abstract: A method for manufacturing a semiconductor structure includes: providing a substrate; forming a first shielding layer on the substrate; forming a first electrode penetrating the first shielding layer; forming a storage structure on the first electrode; forming a second shielding layer on the top surface and sidewalls of the storage structure, wherein the first shielding layer and the second shielding layer combine into one integrated shielding layer; and forming a second electrode which penetrates the shielding layer and electrically connects to the storage structure.

Abstract: A data synthesizer includes a first input circuit, a second input circuit, and an output circuit. The first input circuit is configured to latch a first data under control of a first latch clock signal. The second input circuit is configured to latch a second data under control of the first latch clock signal. A phase of the first data is the same as a phase of the second data. The output circuit is connected to the first input circuit and the second input circuit. The output circuit is configured to output the first data and the second data in sequence.

Abstract: The present disclosure relates to the technical field of integrated circuits, and specifically to a delay-locked loop, a control method for a delay-locked loop, and an electronic device. The delay-locked loop includes: a secondary path configured to perform frequency division on an input clock signal to generate a frequency-divided clock signal, adjust the frequency-divided clock signal having a first frequency to obtain an output clock signal in a locking process of the delay-locked loop, and adjust the frequency-divided clock signal to make the frequency-divided clock signal have a second frequency when the delay-locked loop is locked in a standby state, wherein the second frequency is lower than the first frequency; and a primary path configured to output, when obtaining a target instruction, an output clock replica signal having a same phase as the output clock signal.

Abstract: A memory cell includes a transistor, a storage node contact and a capacitor that are connected sequentially, wherein the capacitor includes a lower electrode, an upper electrode and a dielectric layer disposed between the lower electrode and the upper electrode. The lower electrode includes: a first electrode layer having a first sub-electrode region and a plurality of second sub-electrode regions connected to the first sub-electrode region, where the first sub-electrode region is in contact with a surface of the storage node contact, each of the second sub-electrode regions extends along a direction away from the storage node contact and has a first end face and a second end face facing each other in an extension direction, the first end face being in contact with the surface of the storage node contact; and a second electrode layer, covering at least part of a surface of the first electrode layer.

Abstract: A method for manufacturing a semiconductor structure includes: forming first shallow trench isolation structures in a substrate, which isolate a plurality of active areas extending in first direction in the substrate, in which a first shallow trench isolation structure includes a sacrificial layer and a first dielectric layer stacked from bottom up in sequence; forming a plurality of word line isolation grooves in the substrate, in which a word line isolation groove is located above the sacrificial layer and extends in second direction; forming a second dielectric layer on sidewalls of the word line isolation groove, in which a pore penetrating to the substrate is provided inside the second dielectric layer; metallizing a lower part of an active area based on the pore to form a bit line extending in first direction; and removing the sacrificial layer based on the pore to form an air gap between adjacent bit lines.

Abstract: A semiconductor structure includes a substrate and a gate stack structure located on the substrate. The gate stack structure includes: a high-K dielectric layer, a first barrier layer in contact with the high-K dielectric layer, a work function layer located on a side of the high-K dielectric layer away from the substrate, and a gate electrode layer located on a side of the work function layer away from the substrate. The first barrier layer contains the same metal element as the high-K dielectric layer.

Abstract: A data processing circuit includes a primary transmission path, multiple secondary transmission paths and multiple storage arrays which share the primary transmission path. Each storage array includes at least two sub-arrays, and the secondary transmission path is formed between each sub-array and the primary transmission path, and the sub-array transmits a signal through the secondary transmission path and the primary transmission path.

Abstract: Provided are a data transmission circuit and a memory. The data transmission circuit includes: a normal reading module, which is connected to a normal storage array and configured to read and output data from the normal storage array; a redundant reading module, which is connected to a redundant storage array, and configured to read and output data from the redundant storage array; and an error detection operation module, which is connected to the normal reading module and the redundant reading module respectively, and configured to synchronously receive the read data output from the normal reading module and the redundant reading module, and perform error detection operation on the read data.

Abstract: Provided is a die extraction method, comprising the following steps: removing solder balls; polishing a front side of the sample to remove a part on a front side of the target die, and retain a part of a die attach film (DAF) layer on the front side of the target die and a bonding wire located in the part; attaching the front side of the sample to the polishing jig and flattening the sample and the polishing jig by the flattener; polishing the back side of the sample to remove a part on a back side of the target die, and retain a DAF layer on the back side of the target die; removing the DAF and a packaging material remaining on the sample to obtain the target die; and attaching the back side of the target die to a glass slide, thus completing extraction of the target die.

Abstract: A method for manufacturing a semiconductor structure includes: providing a substrate, a first mask and a second mask, etching the substrate by respectively using the first mask and the second mask, so as to form first grooves and second grooves on the substrate, wherein regions, in the substrate, where the first grooves and the second grooves are located form bit line grooves; and forming a conductive layer in each of the bit line grooves.

Abstract: A package structure includes at least two semiconductor structures that are stacked onto one another. The first surface of one semiconductor structure of the at least two semiconductor structures that are stacked onto one another directly faces toward the second surface of another semiconductor structure of the at least two semiconductor structures which is adjacent to said one semiconductor structure; the first metal layer of said one semiconductor structure is in contact with and bonded to the third metal layer of said another semiconductor structure; and the second metal layer of said one semiconductor structure is in contact with and bonded to the fourth metal layer of said another semiconductor structure.

Abstract: A semiconductor structure includes a well area of first conductive type, which includes: a first device area, where a first active area is formed in the first device area, a first device unit is formed in the first active area and configured to provide a first type driving current; and a second device area, connected to the first device area in a length direction of the well area of first conductive type, where a second active area is formed in the second device area, a second device unit is formed in the second active area and configured to provide a second type driving current. A current value of the second type driving current is greater than a current value of the first type driving current. A width of well area of the first device area is the same as a width of well area of the second device area.

Abstract: A semiconductor structure includes: a substrate, a first pad being provided on the substrate; an adapter plate located on the substrate, and the bottom surface of the adapter plate covering the first pad, in which the adapter plate includes a second pad and a connecting structure, the second pad is located on any surface other than the bottom surface of the adapter plate, one end of the connecting structure is connected with the first pad, and the other end of the connecting structure is connected with the second pad.