Abstract: Disclosed is a method of manufacturing a semiconductor device comprising: forming a first layer on a sidewall of a trench formed on a main surface of a semiconductor substrate, filling up the trench with a protective film, etching back the protective film by a dry etching method so that a height of a surface of the protective film is lower than an opening of the trench and removing the first layer exposed by the etching-back.

Abstract: A semiconductor memory device comprises a memory cell array and a sense amplifier circuit. The memory cell array includes a first NMOS transistor which has a gate electrode connected to a word line and has one source/drain region connected to a bit line. The sense amplifier circuit includes a second NMOS transistor which has a gate electrode connected to the bit line and has one source/drain region connected to a predetermined voltage. In the semiconductor memory device, each of the first and second MOS transistors is a floating body type NMOS transistor, and the predetermined voltage is supplied to the bit line at least in a precharge operation, thereby preventing characteristic deterioration due to accumulation of holes in the floating body.

Abstract: A semiconductor device is provided with first and second main word lines, and a control circuit. The control circuit, in response to a command signal received from outside of the semiconductor device, activates the first main word line at a first timing, and activates the second main word line at a second timing different from the first timing, the first main word line maintaining an activation state at said second timing.

Abstract: To provide a semiconductor device including a skew detecting circuit activated in a write leveling mode, and an ODT control circuit that activates a terminating resistance circuit connected to a data strobe terminal by using an ODT signal. The ODT control circuit selects a first resistance mode when a dynamic ODT is in an unused state in the write leveling mode, and selects a second resistance mode when the dynamic ODT is in a used state in the write leveling mode. With this configuration, a resistance in a used state of the dynamic ODT and that in an unused state of the dynamic ODT can be reproduced in an actual write operation. Consequently, a more accurate write leveling operation can be performed.

Abstract: The present invention provides a novel wiring method for LR-DIMM of VLP type that conforms to LR-DIMM technology. The LR-DIMM comprises a plurality of DRAMs mounted on a board, two connectors mounted on the board for receiving data, and a buffer device mounted on the board for redriving data applied to the two connectors to supply the data to the plurality of DRAMs. The buffer device is located near the center of the board on which the two connectors are arranged at both ends thereof, and supplies data from each connector to DRAMs arranged on the opposite side to the connector.

Abstract: A method of forming a semiconductor device includes the following processes. A groove is formed in a semiconductor substrate. A first spin-on-dielectric layer is formed over a semiconductor substrate. An abnormal oxidation of the first spin-on-dielectric layer is carried out. A surface of the first spin-on-dielectric layer is removed. A second spin-on-dielectric layer is formed over the first spin-on-dielectric layer. A non-abnormal oxidation of the first and second spin-on-dielectric layers is carried out to modify the second spin-on-dielectric layer without modifying the first spin-on-dielectric layer.

Abstract: A method of manufacturing a semiconductor device includes the following processes. A first resist layer covering an etching object is patterned to form a first resist pattern. Then, a filling layer that covers the first resist pattern and has a flat upper surface is formed. Then, a second resist layer covering the flat upper surface is patterned to from a second resist pattern.

Abstract: The invention provides a semiconductor device having, in each of stacked chip dies, not only vias the number of which corresponds to the number of signals input to and output from a single chip die but also vias the number of which corresponds to the number of signals input to and output from the stacked chip dies, and switches for controlling the input and output to and from the vias. The conduction and non-conduction of the switches are controlled by means of ROMs, whereby signals from the plurality of chip dies stacked can be output in parallel. This eliminates the need of increasing the data transfer speed of each chip die in accordance with the transfer speed of the system.

Abstract: A semiconductor device reduces the impedance of a wiring for supplying the circuit excluding a data output circuit with a power source voltage or a ground voltage and of speedup of data signal transmission in the data output circuit. Additional substrates 2a, 2b are on the upper surface of semiconductor chip 1. First additional wiring layer for power source 10d and first additional wiring layer for ground 10s formed on respective additional substrates 2a, 2b form prescribed conductive areas on semiconductor chip 1. First power source wiring 40C1d or first ground wiring 40C1s are interconnected through additional wiring layers 10d and 10s. Second power source wiring 40C2d and second ground wiring 40C2s, which is extended in the same direction as with DQ system signal wiring 40CDQ, forms a feedback current path. Second power source wiring 40C2d and second ground wiring 40C2s are disposed adjacent to DQ system signal wiring 40CDQ.

Abstract: A semiconductor device comprises a material layer including a first surface and a trench with an opening in the first surface. The trench is formed in the material layer. The trench comprises a tapered portion and a vertical portion. The tapered portion is in contact with the opening and comprises a scalloping-forming trench. The vertical portion has a substantially vertical sidewall. A width of the scalloping-forming trench is larger than a width of the vertical portion.

Abstract: A semiconductor device includes a selection circuit for selecting a specific pad of a semiconductor memory. The semiconductor device is configured to produce a signal determined by a pin array by the selection circuit.

Abstract: In a stacked-type semiconductor device, a first semiconductor device and at least one second semiconductor device are stacked. The first semiconductor device includes a wiring board and a first semiconductor chip mounted on the wiring board. The second semiconductor device includes a wiring board and a second semiconductor chip mounted on the wiring board. The thickness of the second semiconductor chip of each second semiconductor device is thicker than the thickness of the first semiconductor chip.

Abstract: Read data that are output from core chips are accurately captured into an interface chip. Each of the core chips includes a data output circuit that outputs read data to the interface chip in response to a read command, and an output timing adjustment circuit that adjusts the period of time required from the reception of the read command to the outputting of the read data from the data output circuit. The interface chip includes a data input circuit that captures read data, and an input timing adjustment circuit that adjusts the timing for the data input circuit to allow the capturing of the read data after issuing the read command. In this manner, a sufficient latch margin for read data on the interface chip side can be secured.

Abstract: A semiconductor device comprises a sense amplifier circuit amplifying a signal transmitted through the bit line, first/second data lines transmitting the signal amplified by the sense amplifier circuit, a read amplifier circuit driven by a first voltage and amplifying the signal; first/second switch circuits controlling connection between the above components, first/second voltage setting circuits setting the second/third data lines to a second voltage lower than the first voltage. A predetermined voltage obtained by adding the second voltage to a threshold voltage of a transistor in the second/third switch circuit is applied to the gate terminal thereof, and ends of the data lines are connected to the source and drain terminals thereof.

Abstract: A semiconductor device comprises a sense amplifier circuit amplifying a signal transmitted through the bit line, first/second data lines transmitting the signal amplified by the sense amplifier circuit, a read amplifier circuit driven by a first voltage and amplifying the signal; first/second switch circuits controlling connection between the above components, first/second voltage setting circuits setting the second/third data lines to a second voltage lower than the first voltage. A predetermined voltage obtained by adding the second voltage to a threshold voltage of a transistor in the second/third switch circuit is applied to the gate terminal thereof, and ends of the data lines are connected to the source and drain terminals thereof.

Abstract: In a memory module including a plurality of DRAM chips which transmit/receive a system data signal with a predetermined data width and at a transfer rate and which transmit/receive an internal data signal having a larger data width and a lower transfer rate as compared with the system data signal, the transfer rate of the system data signal is restricted. Current consumption in DRAMs constituting the memory module is large, hindering speed increases. For this memory module, a plurality of DRAM chips are stacked on an IO chip. Each DRAM chip is connected to the IO chip by a through electrode, and includes a constitution for mutually converting the system data signal and the internal data signal in each DRAM chip by the IO chip. Therefore, wiring between the DRAM chips can be shortened, and DLL having a large current consumption may be disposed only on the IO chip.

Abstract: A semiconductor device includes first and second lines, and a switch between the first and second lines. The switch temporary and electrically connects the first and second lines to each other, when the first signal line is transitioned from a first level to a second level while the second signal line is transitioned from the second level to the first level.

Abstract: To provide a semiconductor device including a skew detecting circuit activated in a write leveling mode, and an ODT control circuit that activates a terminating resistance circuit connected to a data strobe terminal by using an ODT signal. The ODT control circuit includes counters that delay the ODT signal, activates the terminating resistance circuit by using the ODT signal having passed the counters in a normal operation mode, and activates the terminating resistance circuit by using the ODT signal having bypassed the counters in the write leveling mode. With this configuration, in the write leveling mode, a write leveling operation can be performed quickly without waiting for latency of the ODT signal.

Abstract: A semiconductor device includes: a semiconductor substrate; a silicon pillar provided perpendicularly to a main surface of the semiconductor substrate; a gate dielectric film that covers a portion of a side surface of the silicon pillar; an insulator pillar that covers remaining portions of the side surface of the silicon pillar; a gate electrode that covers the silicon pillar via the gate dielectric film and the insulator pillar; an interlayer dielectric film provided above the silicon pillar, the gate dielectric film, the insulator pillar, and the gate electrode; and a gate contact plug embedded in a contact hole provided in the interlayer dielectric film, and in contact with the gate electrode and the insulator pillar. A film thickness of the insulator pillar in a lateral direction is thicker than a film thickness of the gate dielectric film in a lateral direction.

Abstract: Such a device is disclosed that includes first and second chips stacked to each other, and a third chip controlling the first and second chips, stacked on the first and second chips, and including first, second and third output circuits. The first output circuit supplies a first command signal to the first chip. The second output circuit supplies the first command signal to the second chip. The third output circuit supplies a second command signal to the first and second chips.