Abstract: A temperature-compensated voltage comparator (301) that compares first and second input voltages includes first and second bipolar junction transistors (BJTs) (221 and 222) that convert the first and second input voltages to first and second input currents, respectively. The first and second BJTs share a same thermal environment and their currents are dependent upon temperature. A temperature-compensating circuit (350), which includes a zero thermal coefficient reference (419), generates a logarithmic temperature-compensating factor that compensates for temperature dependency of the first and second BJTs. The temperature-compensating circuit receives one of the input currents, and outputs a temperature-compensated current that is said input current multiplied by the logarithmic temperature-compensating factor. The temperature-compensating circuit shares a thermal environment with the first and second BJTs.

Abstract: A voltage translator having an input which receives an input signal and an output which provides a level shifted output signal includes a first inverter having an input coupled to receive the input signal, a second inverter having an input coupled to an output of the first inverter, a third inverter having an input coupled to an output of the second inverter, a fourth inverter having an input coupled to receive the input signal and an output coupled to an output of the third inverter, a fifth inverter having an input coupled to an output of the fourth inverter and having an output coupled to the input of the third inverter, and a sixth inverter having an input coupled to the output of the fifth inverter and an output coupled to the output of the voltage translator. The second and fourth inverters are coupled to a calibration voltage supply terminal.

Abstract: An arrangement and method for interconnecting fail-uncontrolled processor nodes in a dependable distributed system. A node has a bus guardian with input switches which act in combination with a logic element as an input multiplexer under the control of a control unit. This provides the advantage of transferring the problem of fault containment from the output interface of a potentially faulty processing node to the input interface of fault-free processing nodes. By doing so, problems encountered by spatial proximity faults or functional dependencies within a faulty processing node that may jeopardize fault containment at its output interface are mitigated.

Abstract: An audio output driver includes an audio amplifier for generating an amplified signal. A virtual ground generator generates a virtual ground signal in response to a virtual ground reference. A combiner produces an output signal, based on the amplified signal and the virtual ground signal, that is coupled to an audio output device. A voltage equalizer equalizes the virtual ground reference and the output signal when the supply voltage compares unfavorably to a supply voltage threshold.

Abstract: High frequency performance of (e.g., silicon) bipolar devices (40, 100, 100?) is improved by reducing the capacitive coupling (Cbc) between the extrinsic base contact (46) and the collector (44, 44?, 44?). A dielectric ledge (453, 453?) is created during fabrication to separate the extrinsic base contract (46) from the collector (44, 44?, 44?) periphery (441). The dielectric ledge (453, 453?) underlies the transition region (461) where the extrinsic base contact (46) is coupled to the intrinsic base. (472) During device fabrication, a multi layer dielectric stack (45) is formed adjacent the intrinsic base (472) that allows the simultaneous creation of an undercut region (457, 457?) in which the intrinsic base (472) to extrinsic base contact (46) transition region (461) can be formed.

Abstract: A semiconductor array includes a matrix of cells, the matrix being arranged in rows and columns of cells, and a plurality of control lines. Each cell is coupled to a number of control lines allowing to select and read/write said cell. At least one of said control lines is coupled to cells of a plurality of columns and of at least two rows of the matrix.

Abstract: A method, computer program product, and data processing system for performing automated optimization of a control processing flow containing Boolean conditional expressions is disclosed. Each conditional expression is profiled using a representative set of test vectors to determine the probabilities of individual conditions and combinations of conditions in the expression. Next, the expression is restructured or reordered, including selective computation of subexpressions, based on the probability information, so as to maximize the probability of a short-circuit termination of evaluation of the expression and/or to minimize the statistical execution time of the expression. This process is performed for all Boolean conditional expressions related to the control processing flow.

Abstract: An electrostatic discharge (ESD) protected circuit is coupled to a power supply voltage rail and includes a multiple independent gate field effect transistor (MIGFET), a pre-driver, and a hot gate bias circuit. The MIGFET has a source/drain path coupled between an output pad and the power supply voltage rail and has a first gate terminal and a second gate terminal. The pre-driver circuit has an output. The hot gate bias circuit is coupled to the first gate terminal of the MIGFET, and the output of the pre-driver circuit is coupled to the second gate terminal of the MIGFET. The hot gate bias circuit is configured to apply a bias voltage to the first gate terminal of the MIGFET during an ESD event that increases the breakdown voltage of the MIGFET so as to better withstand the ESD event.

Abstract: A semiconductor device is made on a semiconductor substrate. A first insulating layer is formed on the semiconductor substrate for use as a gate dielectric for a high voltage transistor in a first region of the semiconductor substrate. After the first insulating layer is formed, a second insulating layer is formed on the semiconductor substrate for use as a gate dielectric for a non-volatile memory transistor in a second region of the substrate. After the second insulating layer is formed, a third insulating layer is formed on the semiconductor substrate for use as a gate dielectric for a logic transistor in a third region of the substrate.

Abstract: A device (110) includes a sensing element (26) having drive nodes (34, 36) and sense nodes (42, 44). Parasitic capacitance (22) is present between drive node (34) and sense node (42). Likewise, parasitic capacitance (24) is present between drive node (36) and sense node (44). When a drive signal (56) is applied between drive nodes (34, 36), a parasitic current (70) between drive and sense nodes (34, 42) and a parasitic current (72) between drive and sense nodes (36,44) is created due to the parasitic capacitances (22, 24). A capacitive network (112) is coupled between the drive node (36) and the sense node (42) to create a correction current (134) through capacitive network (112) that cancels parasitic current (70). Likewise, a capacitive network (114) is coupled between the drive node (34) and the sense node (44) to create a correction current (138) through capacitive network (112) that cancels parasitic current (72).

Abstract: A device includes a first test port coupled to a first test device, a second test port coupled to a second test device, a resource, and a security controller coupled to the first and second test ports. The security controller is operable to authenticate the first test device prior to authenticating the second test device, and, in response to authenticating the first test device, permit the first and second test devices to access the first resource.

Abstract: An electronic device can include an interconnect level (16) including a bonding pad region (110). An insulating layer (18) can overlie the interconnect level (16) and include an opening (112, 24) over the bonding pad region (110). In one embodiment, a conductive stud (34) can lie within the opening (112, 24) and can be substantially encapsulated. In another embodiment, the electronic device can include a barrier layer (22) lying along a side and a bottom of the opening (112, 24) and a conductive stud (34) lying within the opening (112, 24). The conductive stud (34) can substantially fill the opening (112, 24). A majority of the conductive stud (34) can lie within the opening (112, 24). In still another embodiment, a process for forming an electronic device can include forming a conductive stud (34) within the opening (112, 24) wherein the conductive stud (34) lies substantially completely within the opening (112, 24).

Abstract: A MIMO wireless communication system and method reduces the number of recursive operations when decoding received data symbols by decoding the data symbols in pairs rather than on a per symbol basis. Decoding in pairs is facilitated by the determination that errors between selected pairs of data symbols are uncorrelated and identically distributed with a determined variance. Additionally, the system and method can order the pairs and provide decoding rules that result in an insignificant loss of performance for a wide range of signal-to-noise ratios (SNRs). Furthermore, the system and method exploit the structure of the error covariance matrix to reduce computational demands.

Abstract: A method for simulating an integrated circuit having a plurality of clock control modules includes simulating the integrated circuit, and automatically receiving from each clock control model during simulation an indication of a simulated power state of the clock control model. Accordingly, the simulated power state of the portion of the integrated circuit model to be clocked by a clock control model can be monitored based on the indicator from the clock control model, rather than on a higher level analysis of the simulated input/output behavior of the integrated circuit model.

Abstract: A die-on-die assembly has a first die (10) and a second die (50). The first die (10) has a first contact extension (28,42) and a peg (32,44,45) extending a first height above the first die. The second die (50) has a second contact extension (68) connected to the first contact extension and has a containing feature (62) extending a second height above the second die surrounding the peg. The peg extends past the containing feature. Because the peg extends past the containing feature, lateral movement between the first and second die can cause the peg to come in contact with and be constrained by the containing feature. The peg and containing feature are thus useful in constraining movement between the first and second die.

Abstract: A semiconductor process and apparatus are disclosed for forming a split-gate thin film storage NVM device (10) by forming a select gate structure (3) on a first dielectric layer (2) over a substrate (1); forming a control gate structure (6) on a second dielectric layer (5) having embedded nanocrystals (15, 16) so that the control gate (6) is adjacent to the select gate structure (3) but separated therefrom by a gap (8); forming a floating doped region (4) in the substrate (1) below the gap (8) formed between the select gate structure and control gate structure; and forming source/drain regions (11, 12) in the substrate to define a channel region that includes the floating doped region (4).

Abstract: A wafer having a silicon layer that is strained is used to form transistors. The silicon layer is formed by first forming a silicon germanium (SiGe) layer of at least 30 percent germanium that has relaxed strain on a donor wafer. A thin silicon layer is epitaxially grown to have tensile strain on the relaxed SiGe layer. The amount tensile strain is related to the germanium concentration. A high temperature oxide (HTO) layer is formed on the thin silicon layer by reacting dichlorosilane and nitrous oxide at a temperature of preferably between 800 and 850 degrees Celsius. A handle wafer is provided with a supporting substrate and an oxide layer that is then bonded to the HTO layer. The HTO layer, being high density, is able to hold the tensile strain of the thin silicon layer. The relaxed SiGe layer is cleaved then etched away to expose the thin silicon layer.

Abstract: A fin field effect transistor (FinFET) memory cell and method of formation has a substrate for providing mechanical support. A first dielectric layer overlies the substrate. A fin structure overlies the dielectric layer and has a first current electrode and a second current electrode separated by a channel. A floating gate has a vertical portion that is adjacent to and electrically insulated from a side of the channel and has a horizontal portion overlying the first dielectric layer and extending laterally away from the channel. The floating gate stores electrical charge. A second dielectric layer is adjacent the floating gate. A control gate adjacent the second dielectric layer and physically separated from the floating gate by the second dielectric layer. The “L-shape” of the floating gate enhances capacitive coupling ratio between the control gate and the floating gate.

Abstract: A phase change memory cell has a first electrode, a plurality of pillars, and a second electrode. The plurality of pillars are electrically coupled with the first electrode. Each of the pillars comprises a phase change material portion and a heater material portion. The second electrode is electrically coupled to each of the pillars. In some examples, the pillars have a width less than 20 nanometers.

Abstract: A semiconductor process and apparatus uses a predetermined sequence of patterning and etching steps to etch a gate stack (30, 32) formed over a substrate (36), thereby forming an etched gate (33) having a vertical sidewall profile (35). By constructing the gate stack (30, 32) with a graded material composition of silicon-based layers, the composition of which is selected to counteract the etching tendencies of the predetermined sequence of patterning and etching steps, a more idealized vertical gate sidewall profile (35) may be obtained.