Abstract: Methods and apparatus for programming a non-volatile memory array comprising addressable units are provided. The addressable units are configured to store at least a main portion and an error correction portion. An exemplary method for programming the non-volatile memory array includes, in response to a first condition, switching from an error correction enabled mode to an error correction disabled mode and programming at least the main portion of at least one addressable unit of the non-volatile memory array in the error correction disabled mode. The exemplary method further includes, in response to a second condition, switching from the error correction disabled mode to an error correction fill mode and programming at least the error correction portion of the at least one addressable unit of the non-volatile memory array in the error correction fill mode.

Abstract: A method and device for designing a semiconductor integrated circuit that easily reduces off leakage current. Wires connected to input terminals of a standard cell are exchanged with one another and a gate net list is changed so as to reduce off leakage current in accordance with a net probability and a current consumption table. The net probability is the probability of the state an input of the standard cell can take and is generated through an RTL function simulation and a gate level function simulation. The current consumption table is stored in a technology library storage.

Abstract: A method is provided which includes forming a first gate overlying a major surface of an electronic device substrate and forming a second gate overlying and spaced apart from the first gate. The method further includes forming a charge storage structure horizontally adjacent to, and continuous along, the first gate and the second gate, wherein a major surface of the charge storage structure is substantially vertical to the major surface of the substrate.

Abstract: An electronic device can include discontinuous storage elements that lie within a trench. The electronic device can include a substrate including a trench that includes a wall and a bottom and extends from a primary surface of the substrate. The electronic device can also include discontinuous storage elements, wherein a portion of the discontinuous storage elements lies at least within the trench. The electronic device can further include a first gate electrode, wherein at least a part of the portion of the discontinuous storage elements lies between the first gate electrode and the wall of the trench. The electronic device can still further include a second gate electrode overlying the first gate electrode and the primary surface of the substrate.

Abstract: A method for forming a dielectric layer is provided. The method may include providing a semiconductor surface and etching a thin layer of the semiconductor substrate to expose a surface of the semiconductor surface, wherein the exposed surface is hydrophobic. The method may further include treating the exposed surface of the semiconductor substrate with plasma to neutralize a hydrophobicity associated with the exposed surface, wherein the exposed surface is treated using plasma with a power in a range of 100 watts to 500 watts and for duration in a range of 1 to 60 seconds. The method may further include forming a metal-containing layer on a top surface of the plasma treated surface using an atomic layer deposition process.

Abstract: A varactor comprising a first layer separated from a second layer by an insulating layer, wherein the first layer is a first type of semiconductor material and the second layer is a second type of semiconductor material and the insulation layer is arranged to allow an accumulation region to be formed in the first layer and second layer when a positive bias is applied to the first layer and the second layer and a depletion region to be formed in the first layer and second layer when a negative bias is applied to the first layer and the second layer.

Abstract: An electronic device can include an inductor overlying a shock-absorbing layer. In one aspect, the electronic device can include a substrate, an interconnect level overlying the substrate, and the shock-absorbing layer overlying the interconnect level. The inductor can include conductive traces and looped wires. The conductive traces can be attached to the conductive traces over the shock-absorbing layer. In another aspect, a process can be used to form the electronic device including the inductor. In still another aspect, an electronic device can a toroidal-shaped inductor that includes linear inductor segments that are connected in series.

Abstract: A storage circuit has an input for receiving and storing data, a first power terminal coupled to a first conductor for receiving a first power supply voltage, and a second power terminal coupled to a second conductor. A power gate device has a first terminal coupled to the second conductor, a control terminal for receiving a bias voltage in response to a control signal, and a second terminal coupled to a terminal for receiving a second power supply voltage. A shorting device selectively electrically short circuits the first terminal of the power gate device to the control terminal of the power gate device in response to the control signal, thereby converting the power gate device from a transistor into a diode-connected device. The shorting device is smaller in size than the power gate device.

Abstract: An electronic data storage system uses current comparison to generate a voltage bias. In at least one embodiment, a voltage bias generator, that includes a current differential amplifier, generates a current that charges a load to a predetermined voltage bias level. The current comparison results in the comparison between two currents, Iref and Isaref. The current Isaref can be generated using components that match components in the load and memory circuits in the system. In one embodiment, multiple sense amplifiers represent the load. By using matched components, as physical characteristics of the load and memory circuits change, the current Isaref also changes. Thus, the voltage bias changes to match the changing characteristics of the load and memory circuits. The voltage bias generator can include a current booster that decreases the initial charging time of a reactive load.

Abstract: A process for forming an electronic device can include forming a trench within a substrate, wherein the trench includes a wall and a bottom. The process can also include including forming a portion of discontinuous storage elements that lie within the trench, and forming a first gate electrode within the trench after forming the discontinuous storage elements. At least one discontinuous storage element lies along the wall of the trench at an elevation between an upper surface of the first gate electrode and a primary surface of the substrate. The process can also include forming a second gate electrode overlying the first gate electrode and the primary surface of the substrate.

Abstract: A device that includes: a first bus, connected between a first logic and a first circuit; a group of second buses connected between the first logic and between multiple non-high impedance circuit access logics associated with multiple circuits; wherein each circuit access logic is adapted to: (i) provide to the first logic, a circuit write value during a circuit writing period and during an idle period that follows the circuit writing period and ends when another circuit is allowed to write; and (ii) provide a default value when another circuit is allowed to write; and wherein the first logic is adapted to alter a state of the first bus in response to a change between two consecutive circuit write values.

Abstract: A method for forming a capacitor includes providing a metal-containing bottom electrode, forming a capacitor insulator over the metal-containing bottom electrode, forming a metal-containing top electrode over the capacitor insulator, and forming a dielectric-containing field modification layer over the capacitor insulator and at least partially surrounding the metal-containing top electrode. Forming the dielectric-containing field modification layer may include oxidizing a sidewall of the metal-containing field modification layer. A barrier layer may be formed over the capacitor insulator prior to forming the metal-containing top electrode.

Abstract: For cases where one edge of a design feature is to be printed through a shifter mask and another one is to be printed through a binary trim mask, and where no upsizing can be performed due to the local density of the design, it is proposed to add shifters with respect to the shifter mask in such a way that all the edges are printed by the phase shift mask.

Abstract: A power supply voltage for a memory on an integrated circuit is dynamically adjusted during the operating of the memory. The operating of the memory includes powering the memory at a supply voltage. A test memory of the integrated circuit is concurrently powered while operating the memory. The test memory and the memory each include bit cells of a first bit cell configuration type. A voltage level of the supply voltage is adjusted, while operating the memory, based on the testing of the test memory. The voltage level is adjusted with external variations to assume a value that guarantees no failed operation of the memory but also accurately minimizes the supply voltage. The system and method may be implemented with any type of memory. The memory and test memory may be physically implemented either separated or interspersed on the integrated circuit.

Abstract: A device for error correction includes a memory control module to disable error processing for a memory location depending on the state of a status indicator. The status indicator can be set so that error processing is disabled when valid error correction and detection information for the memory location is not available, such as after a reset or power-on event. In addition, the memory control module can promote partial write requests to full write requests when error processing is disabled to ensure that valid error detection and correction data is calculated for the memory location. By disabling error processing until valid error detection and correction information is available, the number of unnecessary or invalid error processing operations is reduced, thereby conserving device resources.

Abstract: Forming a semiconductor structure includes providing a substrate having a strained semiconductor layer overlying an insulating layer, providing a first device region for forming a first plurality of devices having a first conductivity type, providing a second device region for forming a second plurality of devices having a second conductivity type, and thickening the strained semiconductor layer in the second device region so that the strained semiconductor layer in the second device region has less strain that the strained semiconductor layer in the first device region. Alternatively, forming a semiconductor structure includes providing a first region having a first conductivity type, forming an insulating layer overlying at least an active area of the first region, anisotropically etching the insulating layer, and after anisotropically etching the insulating layer, deposing a gate electrode material overlying at least a portion of the insulating layer.

Abstract: An identification tag is provided in which radio frequency (RF) circuitry and ultrawide bandwidth (UWB) circuitry are both provided on the same tag, along with some UWB-RF interface circuitry. The RF circuitry is used to detect when the identification tag must be accessed, and is used to connect the UWB circuitry with a power supply. The UWB circuitry then performs the necessary communication functions with a distant device and the power supply is again disconnected. In this way the power supply is only accessed when the UWB circuitry is needed and it's usable lifetime can be maximized.

Abstract: A semiconductor device has contact between the last interconnect layer and the bond pad that includes a barrier metal between the bond pad and the last interconnect layer. Both a passivation layer and a polyimide layer separate the last interconnect layer and the bond pad. The passivation layer is patterned to form a first opening to contact the last interconnect layer. The polyimide layer is also patterned to leave a second opening that is inside and thus smaller than the first opening through the passivation. The barrier layer is then deposited in contact with the last interconnect layer and bounded by the polyimide layer. The bond pad is then formed in contact with the barrier, and a wire bond is then made to the bond pad.

Abstract: An apparatus comprises a number of sub-systems and a control interface operably coupled to sub-systems for routeing data therebetween. A strobe generation function is operably coupled to the control interface and configured to generate a plurality of different strobe signals to differentiate between different intended receiving devices. Thus, different strobe signals may be multiplexed onto a single control interface link, based on a pulse width or voltage magnitude characteristics of the respective strobe signals. A strobe decoder function is operably coupled to the control interface and configured to decode a plurality of different strobe signals to differentiate between triggering sub-systems on receiving devices.

Abstract: A method for transmitting data, the method includes scanning at least a first memory unit to retrieve data segments associated with multiple TDM channels, in response to a definition of multiple TDM time frames, each TDM time frame includes multiple time slots; sending the retrieved data segments to an array of line shifters; multiplexing data segments provided from the array of line shifters, in response to the definition, such as to provide in a parallel manner multiple data segments to multiple TDM lines; and transmitting a group of time division multiples data frames over a group of TDM lines